EP2SGX130GF1508C3N - Stratix II GX FPGA, 132K LEs, 20x Transceivers | Intel
MPN: EP2SGX130GF1508C3N β Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 100 | $1590 | $159,000.00 |
| 250 | $1480 | $370,000.00 |
| 500 | $1395 | $697,500.00 |
EP2SGX130GF1508C3N Overview
What is an FPGA? A Field Programmable Gate Array is a reconfigurable semiconductor device whose logic, interconnect, and I/O behavior can be defined by the user after manufacture. FPGAs occupy a position between standard logic ICs and ASICs in the hardware hierarchy: programmable logic > FPGA > high-speed serial interface > system-on-chip. The Stratix II GX family specifically targets designs that need hard IP for multi-gigabit transceivers and embedded memory, eliminating the silicon cost and risk of building those blocks from soft logic.
Key specifications include 132,540 logic elements, 6,627 LABs, 734 user I/Os, 6,747,840 embedded RAM bits, 56 (18x18) hardware multipliers, 12 PLLs, and 8.25 Mbits of TriMatrix memory. Internal clocking supports up to 717 MHz for fabric logic and 717 MHz for memory blocks, while the 20 transceiver channels each deliver up to 6.375 Gbps. Supply voltage operates at 1.15 V to 1.25 V for the core, with separate transceiver and auxiliary rails defined in the datasheet.
Architecturally, the device combines an 8-input adaptive logic module (ALM) fabric, dedicated DSP blocks for multiplication and accumulation, and physical coding sublayer (PCS) and physical medium attachment (PMA) hard IP per transceiver channel. The TriMatrix memory hierarchy (MLAB, M512, M4K, M-RAM) gives designers 6.75 Mbits of distributed and block RAM with port widths up to 144 bits, supporting high-throughput buffering for video, packet processing, and baseband datapaths.
Typical applications include 10G/40G Ethernet line cards, SONET/SDH framer/mapper ICs, HD-SDI and 3G-SDI broadcast video routers, high-end test and measurement equipment, medical imaging accelerators, and defense/aerospace signal processing platforms. The combination of transceivers, DSP blocks, and on-chip memory allows a single Stratix II GX to replace multi-chip ASIC + memory solutions while preserving reconfigurability for evolving protocols.
When designing with the EP2SGX130GF1508C3N, plan PCB power delivery for the 1.15-1.25 V core rail carefully; a 1508-ball FCBGA of this size typically requires a multi-phase VRM and extensive decoupling. Signal-integrity for the 6.375 Gbps transceiver channels demands controlled-impedance differential routing, length matching within the tolerance stated in the transceiver chapter, and AC-coupling capacitors at every serial link pin pair.
This page synthesizes distributor pricing, datasheet sources, parametric comparison, and practical design notes not found in the manufacturer datasheet alone, giving procurement and engineering teams a single decision-ready reference for the EP2SGX130GF1508C3N.
Drop-in alternatives for EP2SGX130GF1508C3N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX130GF1508C3N (same form factor and footprint) β differing in Package, RoHS Status, Operating Temperature Grade, Logic Elements, Logic Array Blocks (LABs).
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2SGX130GF1508C3
β Drop-Inβ In Stock
$1380 / Unit
View Datasheet βEP2SGX130GF1508C3ES
β Drop-Inπ Reference alternative (not in catalog)
EP2SGX130GF1508I3ES
β Drop-Inπ Reference alternative (not in catalog)
EP2SGX130GF1508I4N
β Drop-Inβ In Stock
$2050 / Unit
View Datasheet βEP2SGX130GF1508C5N
β Drop-Inβ In Stock
$3890 / Unit
View Datasheet βEP2SGX130GF1508C3N Maximum Ratings & Electrical Characteristics
| Series | Stratix II GX |
| Family | FPGA - Field Programmable Gate Array |
| Logic Elements | 132,540 |
| Logic Array Blocks (LABs) | 6,627 |
| User I/Os | 734 |
| Total RAM Bits | 6,747,840 (approximately 6.75 Mbit) |
| Number of Transceivers | 20 |
| Transceiver Data Rate (max) | 6.375 Gbps |
| Number of 18x18 Multipliers | 56 |
| Number of PLLs | 12 |
| Internal Fabric Clock (max) | 717 MHz |
| Memory Clock (max) | 717 MHz |
| Core Supply Voltage | 1.15 V to 1.25 V |
| Process Technology | 90 nm CMOS |
| Operating Temperature Range (TJ) | 0 Β°C to 85 Β°C (commercial) |
| Package | 1508-ball FBGA (FCBGA), 40 x 40 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount |
| RoHS Status | Lead-free / RoHS Compliant |
| Estimated EOL Date | 2023 (per GlobalSpec listing) |
EP2SGX130GF1508C3N 1508-ball fbga (fcbga), 40 x 40 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP2SGX130GF1508C3N (1508-ball fbga (fcbga), 40 x 40 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX130GF1508C3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX130GF1508C3N is suitable for 7 applications: 10G/40G Ethernet Line Cards, HD-SDI / 3G-SDI Broadcast Video Routers, High-End Test and Measurement Equipment, Medical Imaging Accelerators, Defense and Aerospace Signal Processing, SONET/SDH Framer and Mapper Equipment, High-Performance Computing Interconnects.
10G/40G Ethernet Line Cards
The EP2SGX130GF1508C3N is a strong fit for 10G/40G Ethernet line cards because it integrates 20 multi-gigabit transceivers at up to 6.375 Gbps each, sufficient to bond multiple 10G lanes or terminate a single 40G link with XLAUI/CAUI-style aggregation. Its 132,540 logic elements and 6.75 Mbit of TriMatrix memory allow MAC framing, statistics counters, and packet buffering on-chip, replacing what would otherwise require an external TCAM plus SRAM. Designers typically place the FPGA between PHY devices and the network processor, using the embedded PCS/PMA hard IP to handle 8b/10b or 64b/66b encoding and clock recovery. Compared with a discrete SERDES plus ASIC approach, the Stratix II GX reduces board area and gives flexibility to support evolving Ethernet features post-deployment.
Recommended
HD-SDI / 3G-SDI Broadcast Video Routers
Broadcast video routers benefit from the EP2SGX130GF1508C3N's combination of transceivers, DSP blocks, and on-chip memory. Each 3G-SDI link runs below 3 Gbps, well within the 6.375 Gbps transceiver ceiling, so a single device can ingest and re-clock many SDI streams in parallel. The 56 hardware 18x18 multipliers accelerate color-space conversion and scaling, while the 6.75 Mbit TriMatrix memory buffers line and frame data without external SRAM. In a typical 144x144 router fabric, the Stratix II GX handles input equalization, clock recovery, and crosspoint switching entirely in silicon, dropping BOM cost relative to discrete equalizer plus crosspoint designs. The 90 nm CMOS process and 1.15-1.25 V core supply keep per-port power manageable in dense frames.
Recommended
High-End Test and Measurement Equipment
Test and measurement instruments such as logic analyzers, protocol testers, and bit-error-rate testers require both deep memory and high-speed serial capture. The EP2SGX130GF1508C3N delivers 6.75 Mbit of TriMatrix RAM with port widths up to 144 bits, which is ideal for circular capture buffers, and 20 transceivers at 6.375 Gbps that let one FPGA aggregate multiple instrument channels. Its 734 user I/Os also drive high-density probe pin electronics directly. Compared with discrete ASIC + external memory solutions, the Stratix II GX enables rapid protocol changes via firmware, which is critical for compliance test platforms supporting multiple standards. Designers should leverage the 12 PLLs to derive per-channel reference clocks and use the 8-input ALM fabric for state-based trigger sequencers.
Recommended
Medical Imaging Accelerators
Ultrasound beamformers, CT reconstruction pipelines, and MRI RF receivers use FPGAs to process high-bandwidth data streams in real time. The EP2SGX130GF1508C3N fits because its 56 hardware multipliers accelerate FIR filtering and FFT kernels, and its 20 transceivers aggregate data from multiple probe or sensor channels at up to 6.375 Gbps per lane. The 6.75 Mbit embedded memory holds filter coefficients and intermediate FFT stages without external SRAM, simplifying medical-safety certification by reducing component count. Designers typically pair the Stratix II GX with high-precision ADCs, using the transceiver's clock-data recovery to simplify board-level clock trees. The commercial 0-85 C temperature grade suits most clinical imaging rooms without industrial-grade upgrade.
Recommended
Defense and Aerospace Signal Processing
Defense and aerospace platforms need reconfigurable compute for radar, electronic warfare, and software-defined radio. The EP2SGX130GF1508C3N provides 132,540 logic elements for waveform synthesis, 56 hardware multipliers for digital down-conversion, and 20 transceivers that handle links to RF data converters and inter-board gigabit serial backplanes. When paired with the industrial-grade EP2SGX130GF1508I4N variant, the same PCB design can serve avionics bays with wider temperature swing. The TriMatrix memory hierarchy supports multi-rate buffering critical for matched-filter and pulse-compression stages, while the 12 PLLs let designers align multiple converter sample clocks with low jitter. Long-term availability through channel stock matters in this segment because design cycles span many years.
Recommended
SONET/SDH Framer and Mapper Equipment
Legacy and hybrid carrier-grade systems still rely on SONET/SDH framing with OC-192/STM-64 at 9.95 Gbps and below. A single EP2SGX130GF1508C3N supports multiple OC-48 (2.488 Gbps) or OC-192 tributaries by mapping each onto its own 6.375 Gbps transceiver channel, then handling framing, scrambling, and pointer processing in fabric. Its 6.75 Mbit embedded memory provides payload buffering for path overhead insertion, while 734 user I/Os expose backplane buses to network processors. Designers commonly combine the FPGA with external clock-cleanup PLLs to meet SONET jitter requirements, leveraging the device's 12 PLLs to fan out line-rate references. Compared with an ASIC framer, the Stratix II GX supports multi-standard operation (SONET plus Ethernet) on the same silicon.
Recommended
High-Performance Computing Interconnects
Cluster computing nodes benefit from the EP2SGX130GF1508C3N when used as a glue layer between processors and high-speed fabrics such as Serial RapidIO or proprietary backplanes. Twenty transceivers at 6.375 Gbps deliver up to 127.5 Gbps of aggregate I/O bandwidth, enough to handle multi-link inter-processor connections or direct FPGA-to-FPGA mesh channels. The 6.75 Mbit embedded memory holds command queues and credit-based flow control state, while the 132,540 logic elements implement custom coherency or compression offload. Designers typically pair the FPGA with host CPUs in PCIe-over-transceiver configurations, using the embedded PCS to handle serialization. The commercial temperature range covers most data-center deployments.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX130GF1508C3N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX130GF1508C3 | EP2SGX130GF1508C3ES | EP2SGX130GF1508I3ES | EP2SGX130GF1508I4N | EP2SGX130GF1508C5N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1508-ball FBGA (FCBGA), 40 x 40 mm, 1.0 mm pitch | 1508-ball FBGA - same | 1508-ball FBGA - same | 1508-ball FBGA - same | 1508-ball FBGA - same | 1508-ball FBGA - same |
| Logic Elements | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 |
| Number of Transceivers | 20 | 20 | 20 | 20 | 20 | 20 |
| Transceiver Data Rate (max) | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps |
| Speed Grade | -3 (commercial) | -3 (commercial) | -3 (commercial, enhanced spec) | -3 (industrial, enhanced spec) | -4 (industrial) | -5 (commercial, slower Fmax) |
| Operating Temperature (TJ) | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | -40 C to 100 C | -40 C to 100 C | 0 C to 85 C |
| Embedded Memory | 6,747,840 bits | 6,747,840 bits | 6,747,840 bits | 6,747,840 bits | 6,747,840 bits | 6,747,840 bits |
Key Differentiators
- 20 embedded multi-gigabit transceivers vs none in non-GX Stratix II family (vs EP2S130F1508C3N)
- Higher speed grade (-3) than the EP2SGX130GF1508C5N (vs EP2SGX130GF1508C5N)
- Commercial 0-85 C operating range with same footprint as industrial variants (vs EP2SGX130GF1508I4N)
Design Notes
Estimated: at typical 90 nm Stratix II GX activity factors, the EP2SGX130GF1508C3N core can draw in the multi-amp range from the 1.15-1.25 V rail with 20 transceivers active, so the PCB must allocate a multi-phase VRM with bulk polymer capacitors near each supply pin group plus high-frequency ceramic decoupling. A 1508-ball FCBGA of this size requires multi-layer PCB stack-up with dedicated power/ground planes; a single-plane approach will fail timing and signal-integrity analysis. Refer to the Stratix II GX device datasheet power chapter for pin-group current budgets.
Each of the 20 transceiver channels operates up to 6.375 Gbps, demanding controlled-impedance (typically 100 ohm differential) stripline routing with length matching within the tolerance stated in the transceiver chapter (often < 150 mil intra-pair skew). AC-coupling capacitors must be placed near the transmitter pins per the datasheet reference design, and vias should be back-drilled or avoided where possible to limit stub effects. Receiver-side eye margins must be verified across temperature with BERT measurements.
The 1508-ball FCBGA has a moderate junction-to-ambient thermal resistance depending on PCB copper area; in commercial 0-85 C deployments the device typically requires a heat spreader or forced-air cooling when transceiver utilization is high. Industrial variants (I3ES, I4N) shift the upper TJ bound upward but do not change the underlying dissipation, so thermal design should be validated against worst-case activity. Use Quartus II PowerPlay early estimates to budget cooling before layout commitment.
Do not assume different speed grades of the same die (C3N vs C5N) will close timing identically; always re-run Quartus II fitter with the new speed-grade setting and inspect worst-case slack on each transceiver channel. Mixing commercial and industrial grades on the same PCB also requires I/O bank voltage re-validation, because reference voltages can shift between grades. Finally, when migrating from a Stratix II (non-GX) member such as EP2S130F1508C3N, confirm that any external SERDES PHYs are no longer required, because the GX part provides them on-die.
Compliance Information
RoHS compliant and lead-free confirmed by Bettlink and Jotrin distributor listings for the EP2SGX130GF1508C3N. REACH and conflict-mineral declarations not surfaced in retrieved web data; AEC-Q100 not applicable for an FPGA in this category.
