EP2SGX30CF780C4N - Stratix II GX 30K FPGA, 780-FBGA | Intel
MPN: EP2SGX30CF780C4N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $558.25 | $558.25 |
| 10 | $502.43 | $5,024.30 |
| 100 | $446.6 | $44,660.00 |
| 250 | $412.71 | $103,177.50 |
| 500 | $379 | $189,500.00 |
EP2SGX30CF780C4N Overview
An FPGA (Field Programmable Gate Array) is a semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable routing that the designer can re-wire after manufacture using a hardware description language. FPGAs sit above microcontrollers and fixed-function ASICs in the design hierarchy: they trade unit cost for parallelism, time-to-market, and the ability to revise functionality in the field, while the transceiver-equipped Stratix II GX family specifically targets serial-link applications such as telecom backhaul, RAID controllers, and protocol bridging.
Key features include 33,880 logic elements organized into 1,694 Logic Array Blocks (LABs), 1,369,728 bits of embedded SRAM, and embedded multipliers supporting DSP functions such as FIR filtering and FFT butterflies. The 'C' speed grade and '-4' device-grade suffix denote a commercial temperature range and mid-speed timing closure, while 'N' indicates lead-free / Pb-free termination suitable for RoHS-compliant assemblies.
Architecturally, the Stratix II GX combines an adaptive logic module (ALM) structure with TriMatrix embedded memory (MLAB, M512, M4K, M-RAM) and dedicated DSP blocks. The integrated CDR/PHY-based transceivers support standard serial rates from 600 Mbps up to 6.375 Gbps, with dynamic reconfiguration between rates; this lets one Stratix II GX device replace multiple discrete PHY chips and a companion FPGA in line-card designs.
Typical applications include 10G Ethernet MAC/PHY bridging, SONET/SDH framer and mapper designs, PCIe Gen1 endpoint designs via soft IP, high-speed serial protocol analyzers, and broadcast video routing. The 780-FBGA package also makes it suitable for densely populated line cards where the 1.2 V core and dedicated PLL supply pins simplify multi-rail power design.
When designing with this device, ensure a controlled-impedance stack-up for the 6.375 Gbps serial links, provision proper PLL supply filtering, and consult the Quartus II design suite toolchain for transceiver configuration bitstreams. JTAG and serial configuration via EPC16 or EPC64 flash is the standard bring-up path.
This page synthesizes verified distributor stock, parametric equivalents, and Stratix II GX family design notes not found in the standalone manufacturer datasheet, giving the engineer an at-a-glance summary of pin compatibility, lifecycle risk, and packaging trade-offs.
Drop-in alternatives for EP2SGX30CF780C4N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX30CF780C4N (same form factor and footprint) β differing in Package, Speed Grade, Logic Elements, Operating Temperature, RoHS Status.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2SGX30CF780C4
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
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View Datasheet βEP2SGX30CF780C3N
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$195 / Unit
View Datasheet βEP2SGX30CF780C3
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$175.5 / Unit
View Datasheet βEP2SGX30CF780C3NGB
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$305 / Unit
View Datasheet βEP2SGX30DF780I4N
β Drop-Inβ In Stock
$171 / Unit
View Datasheet βEP2SGX300DF780C5N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$3500 / Unit
View Datasheet βEP2SGX30CF780C4N Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Logic Elements | 33,880 |
| Logic Array Blocks (LABs) | 1,694 |
| Total RAM Bits | 1,369,728 |
| User I/Os | 361 |
| Core Voltage | 1.2 V |
| Process Technology | 90 nm |
| Operating Frequency (max) | 732.1 MHz |
| Package | 780-ball FC-FBGA |
| Package Pin Count | 780 |
| Mounting Type | Surface Mount |
| Operating Temperature | Commercial (0C to +85C) - inferred from C grade |
| RoHS Status | Compliant (Pb-free, 'N' suffix) |
| Speed Grade | C4 (mid-speed, commercial) |
| Configuration Method | Serial / JTAG via EPC16 or EPC64 flash |
| Embedded Transceivers | Up to 20 multi-gigabit transceivers (600 Mbps - 6.375 Gbps) |
EP2SGX30CF780C4N 780 Pin Configuration Guide
Pin configuration for EP2SGX30CF780C4N (780 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX30CF780C4N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX30CF780C4N is suitable for 6 applications: 10G Ethernet Bridge / XAUI Aggregation, SONET/SDH Framer and Mapper, PCI Express Endpoint (Gen1, Soft IP), High-Speed Serial Protocol Analyzer / BERT, Broadcast Video Routing and Format Conversion, RAID / Storage Controller Acceleration.
10G Ethernet Bridge / XAUI Aggregation
The EP2SGX30CF780C4N fits 10G Ethernet bridge designs because its up-to-20 multi-gigabit transceivers directly drive XAUI / 10GBASE-CX4 lanes at 3.125 Gbps per channel, while the 33,880 logic elements provide ample capacity to instantiate a 10G MAC soft IP plus protocol-bridging glue logic on a single die. The 780-FBGA package offers controlled-impedance escape for the high-speed serial links, and the 1.2 V core simplifies multi-rail power design. Designers get a one-chip solution for switch-fabric aggregation and bridge ASIC replacement, with Quartus II IP cores accelerating time-to-market versus an ASIC respin.
Recommended
SONET/SDH Framer and Mapper
Telecom line cards benefit from the EP2SGX30CF780C4N because its 6.375 Gbps multi-gigabit transceivers directly support OC-192/STM-64 payload rates, and the 1,369,728 bits of embedded TriMatrix SRAM buffer framer overhead without external SSRAM. The C4 speed grade and commercial temperature range suit central-office equipment with controlled airflow, while the 780-FBGA package enables high-density line-card layouts with 361 user I/Os feeding backplane connectors. Designers can integrate framing, scrambling, and pointer-processing logic on one device, retiring legacy ASIC + companion FPGA stacks.
Recommended
PCI Express Endpoint (Gen1, Soft IP)
The EP2SGX30CF780C4N implements a single-lane PCIe Gen1 endpoint (2.5 Gbps) using a soft IP core from Altera, leveraging one of the integrated transceivers and the 33,880 logic elements to instantiate the PIPE and transaction-layer logic. The 780-FBGA package provides the controlled-impedance lanes needed for PCIe compliance, and the 1.2 V core plus dedicated PLL supply rails simplify the four-rail power tree. This makes the device ideal for add-in cards, instrumentation backplanes, and embedded computing modules that need a standards-based host interface without the cost of an external bridge chip.
Recommended
High-Speed Serial Protocol Analyzer / BERT
Test-and-measurement gear uses the EP2SGX30CF780C4N as the heart of a multi-channel BERT or protocol analyzer because its 20 transceivers fan out to dozens of probe channels and its 33,880 logic elements pattern-match and statistics-count at line rate. The 1,369 Kbits of embedded SRAM store per-channel counters and pattern history without external memory, while the 780-FBGA package's 361 user I/Os feed front-panel displays and trigger I/O. Compared to ASIC-based analyzers, this FPGA path lets the OEM ship firmware updates when new protocols appear.
Recommended
Broadcast Video Routing and Format Conversion
Broadcast routers use the EP2SGX30CF780C4N for SDI crosspoint and format-conversion tiles because the multi-gigabit transceivers carry SD-SDI, HD-SDI, and 3G-SDI rates up to 2.97 Gbps directly, while the logic capacity and embedded RAM hold line and frame buffers. The 780-FBGA package keeps the routing matrix compact, and the commercial temperature range suits controlled studio environments. Designers integrate de-embedders, frame-sync, and color-space conversion in a single device, replacing multi-chip ASIC + FPGA stacks common in legacy routers.
Recommended
RAID / Storage Controller Acceleration
Storage controllers leverage the EP2SGX30CF780C4N to accelerate XOR/parity computation and SAS expander fan-out because the embedded DSP blocks implement multi-channel XOR at line rate, and the multi-gigabit transceivers connect directly to 6 Gbps SAS/SATA PHYs. The 780-FBGA package's 361 user I/Os drive DIMM-style DDR2 memory for write-back caching, and the 1,369 Kbits of embedded SRAM absorb command-queue bursts. Compared to discrete XOR ASICs, this FPGA path lets OEMs ship new RAID levels via firmware without board respins.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX30CF780C4N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX30CF780C4 | EP2SGX30CF780C3N | EP2SGX30CF780C3 | EP2SGX30DF780I4N | EP2SGX300DF780C5N |
|---|---|---|---|---|---|---|
| Package | 780-ball FC-FBGA | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Logic Elements | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 | 300,000 |
| Speed Grade | C4 | C4 | C3 | C3 | I4 | C5 |
| Temperature Grade | Commercial (C) | Commercial | Commercial | Commercial | Industrial | Commercial |
| RoHS / Pb-Free Finish | Yes (N suffix) | No (no N suffix) | Yes | No | Yes | Yes |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Key Differentiators
- Sole 30K Stratix II GX tier with mid-speed C4 grade and RoHS lead-free finish (vs EP2SGX30CF780C3N)
- Commercial-temperature lower cost vs the industrial equivalent (vs EP2SGX30DF780I4N)
- Footprint-compatible with the larger 300K Stratix II GX variant (vs EP2SGX300DF780C5N)
Design Notes
The 780-FBGA package requires a controlled-impedance stack-up with matched-length routing for the multi-gigabit transceiver lanes. Recommended: 100-ohm differential impedance for the XAUI / PCIe pairs, AC-coupling capacitors placed within 1 inch of the FPGA transmitter balls, and a continuous reference plane on layer 2 to suppress return-path discontinuities. Maintain at least 4 vias between transceiver balls and the first routing layer to keep inductance below 0.5 nH per transition.
Estimated: a fully populated EP2SGX30CF780C4N with all 20 transceivers running at 6.375 Gbps and 50% logic utilization draws roughly 15-20 W from the 1.2 V VCC, VCCPT, and VCCA rails combined. Decouple each transceiver bank with 0.1 uF X7R + 10 uF bulk placed within 0.25 inch of the balls, and add a ferrite bead on each analog supply (VCCA_PLL, VCCA_TX, VCCA_RX) to isolate switching noise from the analog front-end per Stratix II GX handbook guidance.
Do not assume all 780-FBGA Stratix II GX parts share bitstreams across speed grades - the C3, C4, and I4 variants have different fMAX timing models in Quartus II and require recompiled SOF/POF files. Also, the 'N' suffix is mandatory for RoHS-compliant assemblies; the non-N suffix (e.g. EP2SGX30CF780C4) uses a SnPb finish that will fail Pb-free reflow profiles. Always re-verify the configuration flash image when substituting across speed or temperature grades.
Compliance Information
RoHS compliance per 'N' suffix and distributor listings on DigiKey, Mouser, and Arrow. AEC-Q100 is not applicable - this is a commercial FPGA, not an automotive-qualified part. Halogen-free and conflict-minerals status are not explicitly stated in the verified web data.