EP2SGX30CF780I4N - 33.88K LE Stratix II GX FPGA, 780-FBGA | Intel
MPN: EP2SGX30CF780I4N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $198 | $19,800.00 |
| 500 | $162 | $81,000.00 |
| 1,000 | $138 | $138,000.00 |
EP2SGX30CF780I4N Overview
A Field Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks, routing interconnect, and dedicated hard IP into a single semiconductor die. FPGAs belong to the broader taxonomy of programmable logic devices (PLD), which also includes Complex Programmable Logic Devices (CPLD). Within digital semiconductors, FPGAs sit above fixed-function ASICs in flexibility and below them in per-unit cost. Stratix II GX sits within Intel's high-performance FPGA family, optimized for serial connectivity and DSP workloads.
Key features of the EP2SGX30CF780I4N include 33,880 logic elements, up to 2.5 Mb of embedded memory, embedded 18 x 18 multipliers, four 3.125 Gbps transceivers (C4 speed grade), and support for external DDR/DDR2/QDR memory interfaces. The industrial temperature grade (-40C to +85C) and lead-free 780-pin FC-FBGA package make it suitable for harsh-environment embedded computing. The 'I4N' suffix denotes the industrial temperature range, speed grade 4, and lead-free termination.
The architecture combines an ALM-based logic fabric with dedicated RAM blocks, DSP blocks, PLLs, and high-speed serial channels. This heterogeneous design lets the EP2SGX30CF780I4N implement both deeply pipelined datapath logic and low-latency control code simultaneously, while preserving multi-gigabit serial bandwidth for chip-to-chip links.
Typical applications include 3G/4G baseband processing, multi-gigabit serial backplane bridging, industrial machine vision pipelines, military radar signal processing, and high-speed data acquisition. The on-chip transceivers eliminate the need for external serializer/deserializer ICs, reducing BOM cost and board area.
When designing with the EP2SGX30CF780I4N, plan for Quartus II software support (13.0sp1 or earlier is recommended for legacy Stratix II GX devices), multi-rail decoupling per the pin connection guidelines, and thermal management of the 780-FBGA exposed die.
This page consolidates distributor pricing, same-family drop-in alternatives, and practical design notes that streamline Stratix II GX lifecycle decisions beyond the manufacturer datasheet.
Drop-in alternatives for EP2SGX30CF780I4N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX30CF780I4N (same form factor and footprint) — differing in Package, Speed Grade, RoHS Status, Logic Elements, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2SGX30CF780I4
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$195 / Unit
View Datasheet →EP2SGX30CF780I3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$171 / Unit
View Datasheet →EP2SGX30CF780C7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$171 / Unit
View Datasheet →EP2SGX30CF780C6
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$165 / Unit
View Datasheet →EP2SGX30CF780C5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$160 / Unit
View Datasheet →EP2SGX30CF780C5
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$248 / Unit
View Datasheet →EP2SGX30CF780C4N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$379 / Unit
View Datasheet →EP2SGX30CF780C4
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$138 / Unit
View Datasheet →EP2SGX30CF780I4N Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Logic Elements | 33,880 |
| Logic Cells / CLBs | 33,880 |
| Process Technology | 90 nm CMOS |
| Core Supply Voltage | 1.15 V to 1.25 V |
| Maximum Internal Frequency | 622.08 MHz |
| Embedded Transceivers | 4 channels (up to 3.125 Gbps at C4) |
| Package | 780-ball FC-FBGA, 29 x 29 mm, 1.0 mm pitch |
| Pin / Terminal Count | 780 |
| Operating Temperature | -40C to +85C (Industrial) |
| Mounting Type | Surface Mount (BGA) |
| Lead-Free | Yes |
| Memory Type | Embedded SRAM, external DDR/DDR2/QDR support |
| Configuration | JTAG / passive serial / fast passive parallel |
EP2SGX30CF780I4N 780-ball fc-fbga, 29 x 29 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP2SGX30CF780I4N (780-ball fc-fbga, 29 x 29 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX30CF780I4N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX30CF780I4N is suitable for 6 applications: Multi-Gigabit Backplane Aggregation, 3G/4G Baseband Processing, Industrial Machine Vision, Military Radar Signal Processing, High-Speed Data Acquisition, Software Defined Radio Front Ends.
Multi-Gigabit Backplane Aggregation
The EP2SGX30CF780I4N's four embedded 3.125 Gbps transceivers make it a strong fit for serial backplane aggregation in legacy telecom and datacom switches. Each transceiver can carry Serial RapidIO, PCI Express Gen1, or custom 8b/10b protocols, and the 33,880 logic elements implement switch-fabric forwarding and MAC-layer processing without external glue logic. Designers typically place the FPGA between line-card PHY devices and a central ASIC, where it consolidates traffic onto a smaller number of high-speed links. The industrial temperature grade extends deployment to outdoor and uncontrolled cabinet environments, while the 780-ball FC-FBGA package supports the dense pinout required by 4-lane serial interfaces plus DDR2 memory for packet buffering.
Recommended
3G/4G Baseband Processing
Stratix II GX devices were widely adopted in 3G Node-B baseband cards and pre-LTE signal processing pipelines. The EP2SGX30CF780I4N delivers 33,880 logic elements plus dedicated 18x18 multipliers that map efficiently to chip-rate and symbol-rate DSP kernels. Combined with 2.5 Mb of embedded memory, it can hold multiple frames of soft-decision samples in pipeline buffers, and the on-chip transceivers stream digitized RF data into and out of the FPGA at rates that match common ADC/DAC interfaces. The 780-ball FC-FBGA package exposes enough user I/O for parallel ADC connections plus CPRI or OBSAI links to the base station controller.
Recommended
Industrial Machine Vision
Multi-camera machine vision systems rely on FPGAs to combine image signal processing, color space conversion, and feature extraction in a single device. The EP2SGX30CF780I4N's ALM logic fabric is well-suited to pipeline parallelism for line-scan and area-scan cameras, while its embedded transceivers accept CoaXPress or Camera Link HS serialized pixel streams at multi-gigabit rates. The industrial -40C to +85C temperature rating lets the FPGA sit inside a sealed factory-floor enclosure without thermal derating, and the 780-ball FC-FBGA offers the user I/O needed to drive DDR2 image buffers plus the GPIO that triggers strobes and conveyor synchronization.
Recommended
Military Radar Signal Processing
Phased-array radar systems demand deterministic latency, wide datapath bandwidth, and tolerance of harsh thermal environments, all characteristics that the EP2SGX30CF780I4N was designed to deliver. Its 33,880 logic elements implement beamforming weights, pulse compression, and CFAR detection kernels, while the embedded transceivers move digitized antenna samples into the FPGA at multi-gigabit rates from RF-digitizing ADCs. The industrial temperature grade and lead-free 780-ball FC-FBGA meet the long-life-cycle and environmental requirements of airborne and shipborne radar upgrades, where re-engineering a board is prohibitively expensive.
Recommended
High-Speed Data Acquisition
Test and measurement digitizers and oscilloscope front ends exploit the EP2SGX30CF780I4N's embedded transceivers to ingest multi-GSPS ADC data and its ALM fabric to perform real-time FFTs, decimation, and trigger logic. With 2.5 Mb of embedded memory the device can buffer transient capture windows without external SRAM, simplifying board layout. The 780-ball FC-FBGA package provides generous user I/O for parallel ADC lanes plus a high-speed serial link that streams processed data to a host controller. Industrial-grade temperature rating ensures operation in lab rack environments where airflow and ambient temperatures are uncontrolled.
Recommended
Software Defined Radio Front Ends
Software defined radio (SDR) platforms use the EP2SGX30CF780I4N to perform channelization, digital down-conversion, and modulation/demodulation in reconfigurable hardware. The four transceivers cover common IF frequencies and provide multi-band aggregation, while 33,880 logic elements host complete waveforms in firmware that can be updated as standards evolve. The 780-ball FC-FBGA exposes enough user I/O to interface with RF front-end DAC/ADC pairs and to drive external DDR2 sample buffers. Industrial temperature grade enables portable tactical SDR systems where ambient temperatures swing widely, and lead-free termination satisfies RoHS-compliant assembly lines.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX30CF780I4N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX30CF780I4 | EP2SGX30CF780I3 | EP2SGX30CF780C7 | EP2SGX30CF780C6 | EP2SGX30CF780C5N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FC-FBGA, 29x29 mm | 780-ball FC-FBGA, 29x29 mm (same) | 780-ball FC-FBGA, 29x29 mm (same) | 780-ball FC-FBGA, 29x29 mm (same) | 780-ball FC-FBGA, 29x29 mm (same) | 780-ball FC-FBGA, 29x29 mm (same) |
| Logic Elements | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Commercial (0C to 85C) | Commercial (0C to 85C) | Commercial (0C to 85C) |
| Speed Grade | 4 (C4 = 3.125 Gbps transceivers) | 4 | 3 (faster) | 7 (slower) | 6 | 5 (faster) |
| Transceiver Rate (max) | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | ~2.5 Gbps | ~2.8 Gbps | ~3.0 Gbps |
| Core Voltage | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Industrial temperature grade with lead-free termination in one part (vs EP2SGX30CF780I4)
- Balanced speed grade for high transceiver throughput (vs EP2SGX30CF780C7)
- 33,880 logic elements in compact 29x29 mm BGA (vs EP2S60F1020C5)
Design Notes
Estimated: The EP2SGX30CF780I4N Stratix II GX device requires multiple supply rails - VCCINT core (1.15 V to 1.25 V), VCCIO bank voltages (1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V) per bank, PLL analog supply VCCPLL, and transceiver supplies VCCA, VCCP, VCCR for the SERDES blocks. Decoupling must follow the Stratix II GX pin connection guidelines: 1 uF and 0.1 uF ceramic capacitors within 100 mil of each power pin, plus bulk tantalum or polymer capacitors on each rail. Underestimating decoupling leads to JTAG failures and unreliable configuration.
The 780-ball FC-FBGA package has an exposed die that conducts heat directly to the PCB. For a fully-utilized EP2SGX30CF780I4N with all four transceivers active and high logic utilization, the junction temperature can approach 95C in still air. Estimate: thermal resistance theta_JA of approximately 12 C/W with a 4-layer 1 oz copper PCB. Designers should allocate at least 16 via-array thermal pads beneath the package and consider an active heatsink if the device operates continuously above 70C ambient.
Configuration bitstream compatibility: the EP2SGX30CF780I4N requires a Quartus II 13.0sp1-or-earlier compiled SOF or JIC file. Quartus II 13.1 and later (including Quartus Prime Standard) dropped Stratix II GX device support. Locking the toolchain at Quartus II 13.0sp1 with its associated ModelSim-Altera simulator is the safest path for legacy designs. Migrating designs to Stratix IV or later requires both hardware rework and a Quartus re-compile, and is not a drop-in transition.
PCB layout for the 780-ball FC-FBGA must use 0.5 mm or smaller via-pad geometries with 1.0 mm pitch BGA fan-out. Stack-up should be high-density interconnect (HDI) with at least 6 layers to escape all signals without dog-bone fanouts. Matched-impedance differential traces for the SERDES channels should reference the Stratix II GX transceiver layout guidelines: 100 ohm differential with skew less than 5 ps. Place the FPGA centered on the board with SERDES routed on the top layer beneath balls and adjacent GND return paths.
The four embedded transceivers share a common PLL and reference clock distribution network. Use a low-jitter LVDS or LVPECL reference clock of 100 MHz to 156.25 MHz with jitter under 1 ps RMS to meet 3.125 Gbps link budget. Each transceiver channel requires its own AC-coupling capacitor (typically 100 nF X7R) on both TX and RX serial lines. Reference clock traces must be routed as 50 ohm single-ended lines with continuous ground reference, never crossing a power plane split.
Compliance Information
Lead-free (N suffix) per ordering code, but full RoHS compliance status not stated in the verified web data. Not AEC-Q100 qualified - this is a commercial/industrial FPGA, not an automotive part. REACH, halogen-free, and conflict-minerals status not provided in the source data.
