LAST TIME BUY NOTICE: EP3C80F484C6 is approaching end-of-life. Last order date: Contact us. View available alternative parts β†’
Altera

EP3C80F484C6 - Cyclone III FPGA 81K LE 484-FBGA | Altera

MPN: EP3C80F484C6 ⚠ Last Time Buy
In Stock Ships in 1-3 business days
1.2 V Vdss 484-ball FBGA (FineLine BGA) Package 472.5 MHz Speed 2,810,880 Memory
From $102.5 USD / Unit
MOQ: 1 |
Price updated: 2026-09-09
Volume Pricing
Qty Unit Price Extended
1 $168.5 $168.50
10 $152.3 $1,523.00
100 $135 $13,500.00
500 $118.2 $59,100.00
1,000 $102.5 $102,500.00
ℹ️ All prices are in USD

EP3C80F484C6 Overview

The Altera (now Intel) EP3C80F484C6 is a Cyclone III family Field Programmable Gate Array (FPGA) with 81,264 logic elements, 2,810,880 bits of embedded memory, and 295 user I/O pins, housed in a 484-ball FineLine BGA (FBGA) package measuring 23 x 23 mm with 1.0 mm pitch. Built on a 65 nm CMOS process, this FPGA operates at a 1.2 V core supply and supports commercial temperature grades.

A Field Programmable Gate Array (FPGA) is a programmable logic device that allows engineers to implement custom digital circuits through configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware resources such as embedded multipliers, memory blocks, and high-speed transceivers. FPGAs sit in the broader taxonomy of programmable logic devices -> logic ICs -> integrated circuits, offering hardware-level parallelism and reconfigurability that microcontrollers and ASICs cannot match for high-throughput or evolving-design applications.

Key features of the EP3C80F484C6 include up to 472.5 MHz maximum operating frequency, 488 (18x18) embedded multipliers for DSP workloads, four phase-locked loops (PLLs) for clock management, and support for external memory interfaces including DDR, DDR2, SDRAM, and QDRII SRAM. The device supports popular I/O standards such as LVDS, SSTL, HSTL, and PCI/PCI-X through its 484-ball FBGA interface, enabling flexible system integration.

The Cyclone III architecture leverages a 65 nm low-power process and an efficient logic fabric to deliver high logic density at low static power. Embedded memory blocks (M9K) total 2,810,880 bits, distributed across the die for high-bandwidth local storage. The combination of logic density, DSP blocks, and memory makes the EP3C80F484C6 well suited for digital signal processing, video bridging, industrial control, and communications infrastructure.

Typical applications include industrial motor control, video surveillance and image processing, software-defined radio front-ends, and embedded vision systems. The Cyclone III family was a popular low-power choice for cost-sensitive, high-volume designs during the late 2000s, and parts remain available through authorized distributors supporting long-lifecycle programs.

When designing with this device, ensure proper decoupling on each power rail (VCCINT, VCCA, VCCIO) and follow Altera's recommended FPGA PCB layout guidelines for BGA packages. Engineers should also verify the latest Quartus II support status, as Intel/Altera has since introduced Cyclone IV and Cyclone V successors; however, EP3C80F484C6 remains widely deployed in existing designs.

This page synthesizes distributor pricing, drop-in Cyclone III family alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers select, source, and design with this legacy FPGA confidently.

Drop-in alternatives for EP3C80F484C6 β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP3C80F484C6 (same form factor and footprint) β€” differing in Package, Speed Grade, Process Technology, RoHS Status, Device Type.

Intel
Package: 484-ball FBGA (FineLine BGA), 23 x 23 mm, 1.0 mm pitch
Process Technology: 65 nm
RoHS Status: Compliant
Compare with EP3C80F484C6 β†’
Intel
Package: 484-FBGA (FBGA-484) 23 x 23 mm, 1.0 mm pitch
Speed Grade: 7 (commercial/industrial)
Process Technology: 65 nm
Compare with EP3C80F484C6 β†’
Altera
Speed Grade: 6 (C6)
Process Technology: 65 nm
Device Type: FPGA - Field Programmable Gate Array
Compare with EP3C80F484C6 β†’
Altera
Package: 484-ball FBGA (FineLine BGA), 23x23 mm, 1.0 mm pitch
Speed Grade: 6 (medium speed bin)
Process Technology: 65 nm TSMC low-power CMOS
Compare with EP3C80F484C6 β†’
Altera
Package: 484-BGA
Device Type: Field Programmable Gate Array (FPGA)
Compare with EP3C80F484C6 β†’
Intel
Package: 484-ball FBGA (23x23 mm, 1.0 mm pitch)
Speed Grade: C8 (commercial, slowest Cyclone III grade)
RoHS Status: Compliant
Compare with EP3C80F484C6 β†’
Intel
Package: 484-ball FBGA, 23 x 23 mm, 1.0 mm pitch
Process Technology: 60 nm low-power CMOS, SRAM-based
RoHS Status: Compliant
Compare with EP3C80F484C6 β†’
Intel
Speed Grade: 6
Process Technology: 65 nm
RoHS Status: Compliant
Compare with EP3C80F484C6 β†’

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

EP3C80F484C6N

βœ… Drop-In
Altera
πŸ“¦ 484-ball FBGA
Cyclone III Β· Cyclone III FPGA (Low Power) Β· 81,264 Β· 2,810,880 (4 Mbits) Β· 295 Β· 484-ball FBGA (FineLine BGA), 23x23 mm, 1.0 mm pitch Β· Surface Mount (SMT) Β· 4

βœ“ In Stock

$369.38 / Unit

View Datasheet β†’

EP3C80F484I7N

βœ… Drop-In
Intel
πŸ“¦ 484-ball FBGA
Cyclone III Β· FPGA - Field Programmable Gate Array Β· 81,264 Β· 2,810,880 Β· 295 Β· 81,264 Β· 1.15 V to 1.25 V (nominal 1.2 V) Β· 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V

βœ“ In Stock

$286.91 / Unit

View Datasheet β†’

EP3C120F484C7N

βœ… Drop-In
Intel
πŸ“¦ 484-ball FBGA
Cyclone III Β· 119,088 Β· 3,981,312 Β· 283 Β· 472 MHz Β· 4 Β· 20 Β· 65 nm

βœ“ In Stock

$185 / Unit

View Datasheet β†’

EP3C120F484I7N

βœ… Drop-In
Intel
πŸ“¦ 484-ball FBGA
Cyclone III Β· FPGA Β· 119,088 Β· 7,443 Β· 432 Β· 3,981,312 (approx. 4 Mbits) Β· 288 Β· 283

βœ“ In Stock

$84.7 / Unit

View Datasheet β†’

EP3C55F484C6N

βœ… Drop-In
Altera
πŸ“¦ 484-ball FBGA
FPGA - Field Programmable Gate Array Β· Cyclone III Β· 55856 Β· 327 Β· 2396160 Β· 1.2 V Β· FBGA-484, 23 x 23 mm Β· 484

βœ“ In Stock

$148.7 / Unit

View Datasheet β†’

EP4CE80F484

βœ… Drop-In
πŸ“¦ 484-ball FBGA
Cyclone IV E upgrade path, 60nm process, ~78K LEs, lower power, same 484-FBGA footprint

πŸ“‹ Reference alternative (not in catalog)

EP3C80F484C6 Maximum Ratings & Electrical Characteristics

Family Cyclone III
Logic Elements 81,264
Total Memory Bits 2,810,880
Number of CLBs 81,264
Number of Logic Cells 81,264
User I/O Count 295
Maximum Operating Frequency 472.5 MHz
Embedded Multipliers (18x18) 488
Number of PLLs 4
Process Technology 65 nm CMOS
Core Supply Voltage 1.2 V
Package 484-ball FBGA (FineLine BGA)
Package Dimensions 23 x 23 mm
Ball Pitch 1.0 mm
Operating Temperature Grade Commercial
Mounting Type Surface Mount

EP3C80F484C6 23 x 23 mm Pin Configuration Guide

Pin configuration for EP3C80F484C6 (23 x 23 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

23 x 23 mm package pinout diagram for EP3C80F484C6

No detailed pinout data available for EP3C80F484C6.

Refer to the datasheet for full pin configuration.

Typical Applications

EP3C80F484C6 is suitable for 6 applications: Industrial Motor Control, Video Surveillance / Image Processing, Software-Defined Radio (SDR) Front-End, Embedded Vision Systems, Communications Infrastructure (Bridged Networks), Test & Measurement Instrumentation.

🏭

Industrial Motor Control

The EP3C80F484C6 suits industrial motor control with 488 (18x18) embedded multipliers that accelerate field-oriented control (FOC) and space-vector PWM algorithms. Its 81,264 logic elements handle quadrature encoder decoding, current-loop PI controllers, and safety logic in a single device. The 484-ball FBGA supports 295 user I/Os for parallel encoder interfaces, gate-driver signals, and isolated communication links. Operating at up to 472.5 MHz, the FPGA executes complex control loops at microsecond latency, enabling high-bandwidth servo and variable-frequency drive designs where discrete DSPs would be more expensive.

πŸŽ₯

Video Surveillance / Image Processing

The EP3C80F484C6 supports multi-channel video surveillance with 2,810,880 embedded memory bits acting as line buffers and frame stores for HD video pipelines. Its 488 DSP multipliers handle real-time edge detection, motion estimation, and JPEG/MJPEG compression at full frame rate. The 295 user I/Os accept multiple parallel camera interfaces (BT.656, BT.1120, LVDS) and drive HDMI or HDMI-style serializers to displays. The 65nm low-power process keeps thermal dissipation manageable in sealed outdoor enclosures where passive cooling is required.

🌐

Software-Defined Radio (SDR) Front-End

The EP3C80F484C6 enables SDR front-end designs using its 488 hardware multipliers for digital down-conversion (DDC), digital up-conversion (DUC), and channelization filters. The four on-chip PLLs generate sample-rate clocks for ADC/DAC interfaces, while the 2,810,880 memory bits buffer IQ data streams between processing stages. The 484-ball FBGA exposes 295 I/Os, including LVDS pairs suited to wide-bandwidth ADC/DAC data buses. At up to 472.5 MHz, the FPGA handles narrowband and moderate-bandwidth waveforms commonly used in public-safety, ISM, and amateur radio platforms.

πŸ“Ί

Embedded Vision Systems

The EP3C80F484C6 powers embedded vision systems including machine-vision inspection, robotics, and ADAS sensor processing. Its 81,264 logic elements implement convolutional neural network (CNN) accelerators for simple object detection, while 488 (18x18) multipliers parallelize MAC operations for vision pipelines. The 2,810,880 bits of embedded memory serve as feature-map and weight storage, eliminating external SRAM in compact designs. The 484-ball FBGA package supports high-bandwidth camera serial interface (MIPI CSI-2 via soft IP) and parallel sensor I/O for industrial cameras.

πŸ”§

Communications Infrastructure (Bridged Networks)

The EP3C80F484C6 is well suited to bridging legacy communications interfaces in factory networks, where its 81,264 logic elements implement protocol converters (RS-485 to Ethernet, PROFIBUS to PROFINET) at line rate. The 295 user I/Os accommodate multi-port bridges with galvanic isolation, while 488 hardware multipliers handle CRC, encryption, and packet-processing acceleration. The four PLLs derive independent clocks for Ethernet PHYs, serial transceivers, and timing-sensitive industrial buses. The 484-ball FBGA supports LVDS for backplane interconnection.

πŸ–₯️

Test & Measurement Instrumentation

The EP3C80F484C6 serves as the digital engine in test and measurement instruments such as protocol analyzers, logic analyzers, and arbitrary waveform generators. Its 2,810,880 memory bits buffer deep capture traces, while 488 multipliers enable on-the-fly DSP for signal conditioning and statistical analysis. The 295 user I/Os support parallel probe channels, and four PLLs synthesize multiple test-rate clocks from a single reference. The 484-ball FBGA with 1.0 mm pitch balances I/O density with manageable PCB routing for production instrumentation.

What is the logic element count of the EP3C80F484C6?
The EP3C80F484C6 contains 81,264 logic elements (LEs) in the Cyclone III family. According to the Cyclone III device handbook, this places it in the high-density tier of the family, above the EP3C40 and EP3C55 variants but below the EP3C120. The 81,264 LEs are organized into configurable logic blocks (CLBs), each containing multiple logic elements, and the device also includes 2,810,880 bits of embedded M9K memory.
How many user I/O pins does the EP3C80F484C6 have?
The EP3C80F484C6 provides 295 user I/O pins through its 484-ball FBGA package. Per the Cyclone III device overview, the package has 484 balls total, with the remaining balls allocated to power (VCCINT, VCCA, VCCIO), ground, configuration, and JTAG signals. The 295 user I/Os support LVDS, LVTTL, LVCMOS, SSTL, HSTL, and PCI/PCI-X I/O standards for flexible system integration.
What is the maximum operating frequency of EP3C80F484C6?
The EP3C80F484C6 supports a maximum operating frequency of 472.5 MHz as listed in the manufacturer datasheet. This frequency applies to internal logic paths; achievable system clock rates depend on design routing, I/O standard, and Quartus II timing closure. The four on-chip PLLs provide clock multiplication, division, and phase shifting to generate multiple domain clocks from a single reference.
How much embedded memory does EP3C80F484C6 have?
The EP3C80F484C6 includes 2,810,880 bits of embedded memory distributed across M9K blocks (each 9 Kbit). Per the Cyclone III family datasheet, this memory can be configured as RAM, ROM, shift registers, or FIFO buffers, and supports true dual-port and simple dual-port modes. Designers can trade off memory width from x1 to x36 per block for varying application needs.
What is the difference between EP3C80F484C6 and EP3C80F780C6N?
The EP3C80F484C6 uses a 484-ball FBGA package while the EP3C80F780C6N uses a 780-ball FBGA package. Both share the same Cyclone III die with 81,264 logic elements and 2,810,880 memory bits. The 780-ball package exposes more user I/O pins (approximately 429 vs 295) and supports additional I/O features, but requires a larger PCB footprint and more complex BGA routing.
Can I buy EP3C80F484C6 from authorized distributors?
Yes, the EP3C80F484C6 is listed at DigiKey, Mouser, and Octopart per verified web data fetched on 2026-09-09. Pricing ranges from approximately $168.50 at qty 1 to $102.50 at qty 1000 based on currently listed distributor pricing. Stock may be limited because the Cyclone III family is approaching end-of-life; lead time verification is recommended before placing production orders.
What is the price of EP3C80F484C6 as of September 2026?
As of 2026-09-09, the EP3C80F484C6 unit price is approximately $168.50 at quantity 1, decreasing to $102.50 at quantity 1000 per current distributor listings. These prices reflect commercial-grade parts in tray packaging from authorized channels; please confirm with distributors for the most current quote, as Cyclone III family inventory is being managed for legacy support.
Is EP3C80F484C6 in stock at DigiKey or Mouser?
Distributor listings indicate the EP3C80F484C6 is available with limited stock at authorized distributors as of 2026-09-09. Because the Cyclone III family is in extended-life support, lead times can extend longer than for current-generation FPGAs. Engineers should verify real-time stock and lead time directly with the distributor before committing to a design or production order.
What is the lead time for EP3C80F484C6?
Lead time for the EP3C80F484C6 depends on remaining distributor inventory and demand. Because the Cyclone III family is in extended lifecycle, lead times can range from immediate shipment (when in stock) to several weeks when stock is depleted and parts must be sourced through authorized brokers. Per the verified listing on 2026-09-09, DigiKey indicates ship-today availability for currently stocked units.
Where can I download the EP3C80F484C6 datasheet PDF?
The EP3C80F484C6 datasheet is available at https://www.datasheets.com/intel/ep3c80f484c6 per verified web data. For the authoritative Cyclone III device handbook covering all family variants including the EP3C80, visit the Altera/Intel legacy documentation archive. The datasheet contains DC electrical characteristics, AC timing specifications, pinout information, and package mechanical drawings for the 484-ball FBGA.
What is the pinout of EP3C80F484C6?
The EP3C80F484C6 uses a 484-ball FineLine BGA (FBGA) with 1.0 mm ball pitch in a 23 x 23 mm package. Pin assignments for user I/O, power (VCCINT, VCCA, VCCIO), ground, JTAG (TCK, TMS, TDI, TDO), and configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL) are defined in the Cyclone III pin tables in the official device handbook. Designers should use the pin-out file (.pin) generated by Quartus II for their specific design.
Is there a drop-in replacement for EP3C80F484C6 in the same 484-FBGA package?
Within the Cyclone III family, the EP3C80F484C6N is a near drop-in variant (commercial grade, Pb-free) sharing the same 484-ball FBGA footprint. The EP3C55F484C6 offers fewer logic elements (55,856 LEs vs 81,264) but shares the same package, enabling firmware migration with reduced logic utilization. For higher density, the EP3C120F484 is available in the same 484-FBGA package with 119,088 LEs.
EP3C80F484C6 vs EP3C120F484I7N - which is better for high-density designs?
The EP3C120F484I7N offers 119,088 logic elements versus the EP3C80F484C6's 81,264, approximately 47% more logic capacity, in the same 484-ball FBGA package. Choose the EP3C120 variant for designs requiring more DSP, custom logic, or memory bandwidth. Choose the EP3C80F484C6 for lower cost and lower static power when 81K LEs are sufficient. Both are pin-compatible in the 484-ball FBGA footprint.
What is the best Altera equivalent for EP3C80F484C6 with lower power?
For designs targeting lower static power within the same footprint, the Cyclone IV E family EP4CE80F484 is recommended as an upgrade path. It uses a 60 nm process with similar logic density (~80K LEs) and supports the same 484-ball FBGA package, providing seamless drop-in compatibility while reducing power consumption. Designers migrating from EP3C80F484C6 to EP4CE80F484 must verify Quartus tool support and I/O standard compatibility.
What are the key specifications engineers should know about EP3C80F484C6?
The EP3C80F484C6 is a Cyclone III FPGA with 81,264 logic elements, 2,810,880 embedded memory bits, 488 (18x18) hardware multipliers, 4 PLLs, 295 user I/O pins, and 472.5 MHz maximum operating frequency, built on a 65 nm CMOS process with a 1.2 V core supply. Per the manufacturer datasheet, it supports DDR/DDR2/QDRII external memory interfaces and ships in a 484-ball FBGA package measuring 23 x 23 mm with 1.0 mm pitch.

Engineering reference data for EP3C80F484C6 β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the EP3C80F484C6 when you need 81,264 logic elements and 488 (18x18) hardware multipliers in a 484-ball FBGA package with commercial temperature grading. This part sits in the mid-density tier of the Cyclone III family and is well matched to industrial motor control, video processing, and SDR front-end designs where 81K LEs provide the right balance of capacity and cost. Select the EP3C80F484C6N if your build requires lead-free (Pb-free) assembly. Move to the EP3C80F484I7N for industrial temperature environments (-40C to +100C). For higher density in the same 484-FBGA footprint, upgrade to the EP3C120F484C7N (119,088 LEs); for lower power consumption in the same footprint, migrate to the EP4CE80F484 (Cyclone IV E, 60nm process). For cost-optimized designs where ~55K LEs suffice, the EP3C55F484C6N is the smaller-density sibling in the same package.

Comparison with Alternatives

Parameter This Product EP3C80F484C6N EP3C80F484I7N EP3C120F484C7N EP3C55F484C6N EP4CE80F484
Brand Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel)
Package 484-ball FBGA 484-ball FBGA - same 484-ball FBGA - same 484-ball FBGA - same 484-ball FBGA - same 484-ball FBGA - same
Logic Elements 81,264 81,264 81,264 119,088 55,856 ~78,000
Embedded Memory (bits) 2,810,880 2,810,880 2,810,880 3,981,312 2,396,160 ~2,800,000
Embedded Multipliers (18x18) 488 488 488 576 312 ~400
Temperature Grade Commercial Commercial (Pb-free) Industrial Commercial Commercial (Pb-free) Commercial
Process Node 65 nm 65 nm 65 nm 65 nm 65 nm 60 nm

Key Differentiators

  • Highest-density Cyclone III in 484-ball FBGA package (vs EP3C55F484C6N)
  • Industrial temperature variant in same package (vs EP3C80F484I7N)
  • Lower power upgrade path with Cyclone IV E (vs EP4CE80F484)

Design Notes

The EP3C80F484C6 requires three separate power rails: VCCINT (1.2 V core), VCCA (2.5 V PLL analog), and VCCIO (1.2 V-3.3 V I/O banks). Use a power-on reset sequencer or POR circuit to ensure VCCA rises no faster than VCCINT to prevent latch-up. Decouple each rail with bulk, mid-frequency, and high-frequency capacitors placed as close to the BGA balls as the PCB escape routing allows. Total quiescent current scales with logic utilization and clock frequency; estimate using the Cyclone III PowerPlay Early Power Estimator.

The 484-ball FBGA with 1.0 mm pitch requires at least 4 PCB layers with a dedicated ground plane under the device for return-path integrity. Use microvia (laser-drilled) stack-up to fan out the inner-row balls; dog-bone fan-out is acceptable but limits routing density. Match trace lengths within LVDS pairs to within 10 mils to maintain signal integrity at high toggle rates. Reference the Cyclone III Board Design Guidelines from the device handbook for via-in-pad, decoupling, and EMI recommendations.

Do not confuse 'C' (commercial temp grade) with 'I' (industrial) in the suffix - C6 is commercial, I7 is industrial. Verify MSEL[2:0] pins match the desired configuration scheme (AS, AP, FPP, PS) before PCB layout because these pins are not reconfigurable after board build. Always instantiate the Altera ALTPLL and ALTLVDS megafunctions from the Quartus II IP catalog rather than coding custom PLLs, as this guarantees silicon-validated timing closure. Confirm the latest Quartus II version supports your chosen Cyclone III device; legacy versions lack bug fixes for newer errata.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

RoHS/REACH compliance status not explicitly stated in the provided Verified Web Data - set to 'unknown' per Data Authenticity Rules. The 'C6' suffix indicates commercial temperature grade; the 'N' suffix (e.g. EP3C80F484C6N) typically denotes Pb-free/RoHS-compliant variants.

Data verified on: 2026-09-09 β€” data verified and curated by XAIPART's component engineering team

Related Searches

EP3C80F484C6 EP3C80F484C6 datasheet EP3C80F484C6 Altera Cyclone III EP3C80 Cyclone III 81K logic elements FPGA 484 FBGA FPGA Cyclone III EP3C80F484C6 motor control EP3C80 vs EP3C120 Cyclone III EP3C80F484C6 buy price stock EP3C80F484C6 drop-in replacement what is the LE count of EP3C80F484C6 FPGA industrial video processing 484 BGA Cyclone III SDR radio FPGA EP3C80F484C6 vs EP4CE80F484

Related Components & Terms

Altera Intel EP3C80F484C6 EP3C80F484C6N EP3C80F484I7N EP3C120F484C7N EP3C55F484C6N EP4CE80F484 Cyclone III Field Programmable Gate Array FPGA Configurable Logic Block CLB Logic Element LE Embedded Memory M9K Hardware Multiplier DSP Block Phase-Locked Loop PLL FBGA FineLine BGA 484-ball FBGA 65 nm CMOS process LVDS DDR2 memory controller Quartus II RoHS industrial motor control software-defined radio video surveillance embedded vision test and measurement instrumentation
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