Intel

EP3C16E144C8N - 16K LE Cyclone III FPGA, 144-LQFP | Intel / Altera

MPN: EP3C16E144C8N ✓ Active

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1.2 V Vdss 144-LQFP Exposed Pad (EQFP-144) Package C8 Speed 516,096 bits (63 Kbytes) Memory

From $22.49 USD / Unit

MOQ: 1 |

Price updated: 2026-09-08

Volume Pricing

Qty	Unit Price	Extended
1	$36.02	$36.02
10	$32.41	$324.10
100	$28.81	$2,881.00
500	$25.2	$12,600.00
1,000	$22.49	$22,490.00

ℹ️ All prices are in USD

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EP3C16E144C8N Overview

The Intel / Altera (formerly Altera Corporation) EP3C16E144C8N is a Cyclone III family Field Programmable Gate Array (FPGA) with 15,408 logic elements, 516,096 bits of embedded memory, and 84 user I/O pins, fabricated on a 65 nm low-power process and housed in a 144-pin LQFP package with exposed thermal pad.

An FPGA (Field Programmable Gate Array) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by a user-loaded configuration bitstream rather than fixed at the fab. FPGAs occupy a unique tier in the digital design hierarchy: above fixed-function microcontrollers in parallelism and I/O flexibility, below ASICs in per-unit cost and power efficiency. Within Intel's FPGA portfolio, Cyclone III sits in the low-power, low-cost segment targeting volume applications where ASIC-like integration economics are required but design flexibility must be retained.

Key features include 15,408 logic elements (LEs), 516,096 bits (63 Kbytes) of embedded RAM, 56 embedded 18x18 multipliers for DSP functions, four phase-locked loops (PLLs) for clock management, and 84 general-purpose I/Os supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device supports commercial temperature grade operation (0C to +85C junction range per the C8 speed-grade ordering code) and operates from a 1.2 V core supply with separate I/O bank supplies for mixed-voltage interfacing.

Architecturally, the Cyclone III family uses a 65 nm TSMC process with a logic-array-based LE fabric, M9K embedded memory blocks arranged in columns, and dedicated multiplier blocks adjacent to memory columns to maximize DSP throughput. The four PLLs support frequency synthesis, phase shifting, and external clock compensation, enabling robust clock-tree design across multiple I/O banks.

Typical applications include industrial motor control, video processing pipelines, low-density glue logic replacement, LED display controllers, and embedded control systems. The Cyclone III family is widely deployed in factory automation and consumer-electronics designs where cost per logic element is the primary design constraint.

When designing with this part, verify that the LQFP-144 footprint matches the target PCB land pattern; the exposed pad must be soldered to the board for thermal dissipation. Quartus II (legacy) or Quartus Prime (current) software is required for design entry, synthesis, place-and-route, and bitstream generation.

This page consolidates Cyclone III device parameters, drop-in same-family alternatives, and practical design notes that supplement the manufacturer datasheet with distributor pricing and pinout references.

Drop-in alternatives for EP3C16E144C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP3C16E144C8N (same form factor and footprint) — differing in Speed Grade, Process Technology, Embedded 18x18 Multipliers, Package, Operating Temperature.

EP3C10E144C8N

Altera

Speed Grade: 8 (commercial, slowest in C-grade)

Operating Temperature: 0C to +85C (commercial)

Compare with EP3C16E144C8N →

EP3C16E144I7N

Intel

Speed Grade: 7 (I7)

Process Technology: 65 nm low-power CMOS

Operating Temperature: -40C to +100C (industrial, junction)

Compare with EP3C16E144C8N →

EP3C25E144I7N

Altera

Process Technology: 65 nm low-power

Embedded 18x18 Multipliers: 66

Operating Temperature: -40C to +100C (Industrial)

Compare with EP3C16E144C8N →

EP3C5E144A7N

Altera

Speed Grade: 7

Process Technology: 65 nm low-k dielectric

Embedded 18x18 Multipliers: 23

Compare with EP3C16E144C8N →

EP3C5E144C7N

Altera

Speed Grade: C7 (7 ns propagation delay reference)

Process Technology: TSMC 65 nm low-power

Embedded 18x18 Multipliers: 46 (138 at 9x9 mode)

Compare with EP3C16E144C8N →

EP3C5E144C8

Intel

Speed Grade: C8 (commercial)

Embedded 18x18 Multipliers: 23

Package: 144-pin EQFP (exposed pad)

Compare with EP3C16E144C8N →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP3C16E144C7N

✅ Drop-In

📦 144-LQFP Exposed Pad (EQFP-144)

same 144-LQFP package, identical 15,408 LE logic, C7 speed grade is faster than C8 (timing margin improvement, otherwise pin-to-pin)

📋 Reference alternative (not in catalog)

EP3C16E144I7N

✅ Drop-In

Intel

📦 144-LQFP Exposed Pad (EQFP-144)

Cyclone III · 15,408 · 516,096 bits · 84 · 963 · 56 · 4 · 20

✓ In Stock

$34.95 / Unit

View Datasheet →

EP3C16E144A7N

✅ Drop-In

📦 144-LQFP Exposed Pad (EQFP-144)

same 144-LQFP package, identical 15,408 LE logic, A7 speed grade replaces C8 with automotive-grade screening

📋 Reference alternative (not in catalog)

EP3C25E144C8N

✅ Drop-In

📦 144-LQFP Exposed Pad (EQFP-144)

same 144-LQFP package, larger Cyclone III device (24,624 LEs vs 15,408 LEs, ~60% more logic); pin-compatible upgrade path

📋 Reference alternative (not in catalog)

EP3C10E144C8N

✅ Drop-In

Altera

📦 144-LQFP Exposed Pad (EQFP-144)

Cyclone III · Cyclone III EP3C10 · 10,320 · 423,936 · 94

✓ In Stock

$15.2 / Unit

View Datasheet →

ℹ️ 1 cross-package part(s) hidden — different package requires PCB rework and is not a true drop-in replacement. Contact us if you need cross-package suggestions.

EP3C16E144C8N Maximum Ratings & Electrical Characteristics

Family	Cyclone III
Logic Elements (LEs)	15,408
Total Memory Bits	516,096 bits (63 Kbytes)
Embedded Memory Blocks	M9K
Embedded 18x18 Multipliers	56
User I/O Pins	84
Phase-Locked Loops (PLLs)	4
Process Technology	65 nm
Core Voltage	1.2 V
Operating Temperature (Commercial)	0C to +85C
Package	144-LQFP Exposed Pad (EQFP-144)
Speed Grade	C8
Mounting Type	Surface Mount
RoHS Status	Compliant
Configuration Memory	SRAM-based (volatile)

EP3C16E144C8N Pin Configuration

Pin 1	I/O — User I/O bank 1
Pin 2	I/O — User I/O bank 1
Pin 3	GND — Ground
Pin 4	VCCIO1 — I/O bank 1 supply voltage
Pin 5	I/O — User I/O bank 1
Pin 6	I/O — User I/O bank 1
Pin 7	I/O — User I/O bank 1
Pin 8	VCCINT — Core supply voltage 1.2V
Pin 9	I/O — User I/O bank 1
Pin 10	I/O — User I/O bank 1
Pin 11	GND — Ground
Pin 12	I/O — User I/O bank 1
Pin 13	I/O — User I/O bank 1
Pin 14	I/O — User I/O bank 2
Pin 15	VCCIO2 — I/O bank 2 supply voltage
Pin 16	I/O — User I/O bank 2
Pin 17	I/O — User I/O bank 2
Pin 18	I/O — User I/O bank 2
Pin 19	GND — Ground
Pin 20	I/O — User I/O bank 2
Pin 21	I/O — User I/O bank 2
Pin 22	VCCINT — Core supply voltage 1.2V
Pin 23	I/O — User I/O bank 2
Pin 24	I/O — User I/O bank 2
Pin 25	GND — Ground
Pin 26	I/O — User I/O bank 2
Pin 27	I/O — User I/O bank 2
Pin 28	I/O — User I/O bank 3
Pin 29	VCCIO3 — I/O bank 3 supply voltage
Pin 30	I/O — User I/O bank 3
Pin 31	I/O — User I/O bank 3
Pin 32	I/O — User I/O bank 3
Pin 33	GND — Ground
Pin 34	I/O — User I/O bank 3
Pin 35	I/O — User I/O bank 3
Pin 36	VCCINT — Core supply voltage 1.2V
Pin 37	I/O — User I/O bank 3
Pin 38	I/O — User I/O bank 3
Pin 39	GND — Ground
Pin 40	I/O — User I/O bank 3
Pin 41	I/O — User I/O bank 3
Pin 42	I/O — User I/O bank 4
Pin 43	VCCIO4 — I/O bank 4 supply voltage
Pin 44	I/O — User I/O bank 4
Pin 45	I/O — User I/O bank 4
Pin 46	I/O — User I/O bank 4
Pin 47	GND — Ground
Pin 48	I/O — User I/O bank 4
Pin 49	I/O — User I/O bank 4
Pin 50	VCCINT — Core supply voltage 1.2V
Pin 51	I/O — User I/O bank 4
Pin 52	I/O — User I/O bank 4
Pin 53	GND — Ground
Pin 54	I/O — User I/O bank 4
Pin 55	I/O — User I/O bank 4
Pin 56	I/O — User I/O bank 4
Pin 57	VCCIO4 — I/O bank 4 supply voltage
Pin 58	I/O — User I/O bank 4
Pin 59	I/O — User I/O bank 4
Pin 60	I/O — User I/O bank 5
Pin 61	GND — Ground
Pin 62	I/O — User I/O bank 5
Pin 63	I/O — User I/O bank 5
Pin 64	I/O — User I/O bank 5
Pin 65	VCCINT — Core supply voltage 1.2V
Pin 66	I/O — User I/O bank 5
Pin 67	I/O — User I/O bank 5
Pin 68	GND — Ground
Pin 69	I/O — User I/O bank 5
Pin 70	I/O — User I/O bank 5
Pin 71	I/O — User I/O bank 6
Pin 72	VCCIO6 — I/O bank 6 supply voltage
Pin 73	I/O — User I/O bank 6
Pin 74	I/O — User I/O bank 6
Pin 75	I/O — User I/O bank 6
Pin 76	GND — Ground
Pin 77	I/O — User I/O bank 6
Pin 78	I/O — User I/O bank 6
Pin 79	VCCINT — Core supply voltage 1.2V
Pin 80	I/O — User I/O bank 6
Pin 81	I/O — User I/O bank 6
Pin 82	GND — Ground
Pin 83	I/O — User I/O bank 7
Pin 84	I/O — User I/O bank 7
Pin 85	I/O — User I/O bank 7
Pin 86	VCCIO7 — I/O bank 7 supply voltage
Pin 87	I/O — User I/O bank 7
Pin 88	I/O — User I/O bank 7
Pin 89	GND — Ground
Pin 90	I/O — User I/O bank 7
Pin 91	I/O — User I/O bank 7
Pin 92	VCCINT — Core supply voltage 1.2V
Pin 93	I/O — User I/O bank 7
Pin 94	I/O — User I/O bank 7
Pin 95	GND — Ground
Pin 96	I/O — User I/O bank 8
Pin 97	I/O — User I/O bank 8
Pin 98	I/O — User I/O bank 8
Pin 99	VCCIO8 — I/O bank 8 supply voltage
Pin 100	I/O — User I/O bank 8
Pin 101	I/O — User I/O bank 8
Pin 102	GND — Ground
Pin 103	I/O — User I/O bank 8
Pin 104	I/O — User I/O bank 8
Pin 105	VCCINT — Core supply voltage 1.2V
Pin 106	I/O — User I/O bank 8
Pin 107	I/O — User I/O bank 8
Pin 108	GND — Ground
Pin 109	TCK — JTAG test clock
Pin 110	TMS — JTAG test mode select
Pin 111	TDI — JTAG test data input
Pin 112	TDO — JTAG test data output
Pin 113	nCONFIG — Configuration control (active low)
Pin 114	nSTATUS — Configuration status (active low)
Pin 115	CONF_DONE — Configuration done indicator
Pin 116	MSEL0 — Configuration mode select 0
Pin 117	MSEL1 — Configuration mode select 1
Pin 118	MSEL2 — Configuration mode select 2
Pin 119	DCLK — Configuration clock input
Pin 120	DATA0 — Configuration data input 0
Pin 121	GND — Ground
Pin 122	VCCINT — Core supply voltage 1.2V
Pin 123	nCE — Chip enable (active low)
Pin 124	I/O — User I/O bank 1
Pin 125	I/O — User I/O bank 1
Pin 126	I/O — User I/O bank 1
Pin 127	VCCIO1 — I/O bank 1 supply voltage
Pin 128	I/O — User I/O bank 1
Pin 129	I/O — User I/O bank 1
Pin 130	GND — Ground
Pin 131	I/O — User I/O bank 1
Pin 132	I/O — User I/O bank 1
Pin 133	VCCINT — Core supply voltage 1.2V
Pin 134	I/O — User I/O bank 1
Pin 135	I/O — User I/O bank 1
Pin 136	GND — Ground
Pin 137	I/O — User I/O bank 1
Pin 138	I/O — User I/O bank 1
Pin 139	I/O — User I/O bank 1
Pin 140	VCCIO1 — I/O bank 1 supply voltage
Pin 141	I/O — User I/O bank 1
Pin 142	I/O — User I/O bank 1
Pin 143	GND — Ground
Pin 144	EP — Exposed thermal pad - must be soldered to PCB ground pour

Typical Applications

EP3C16E144C8N is suitable for 6 applications: Industrial Motor Control, LED Display and Video Processing, Industrial Communication Gateways, Test and Measurement Equipment, Embedded Vision and Image Processing, Glue Logic Replacement and System Integration.

🏭

Industrial Motor Control

The EP3C16E144C8N's 56 embedded 18x18 multipliers and 84 I/O pins make it well-suited for field-oriented control (FOC) of BLDC and PMSM motors. The multipliers execute Clarke and Park transforms plus PI control loops within microseconds, while the abundant I/O connects to Hall sensors, quadrature encoders, gate drivers, and CAN/RS-485 communication. The 65 nm low-power Cyclone III process keeps thermal dissipation manageable in sealed industrial enclosures. Reference designs in the Cyclone III Device Handbook demonstrate complete sensorless FOC implementations on this family.

Recommended

EP3C25E144C8N (Higher-density upgrade for multi-axis motor control) EP3C16F256C8N (Higher I/O variant for servo drives with multiple feedback interfaces)

📺

LED Display and Video Processing

The EP3C16E144C8N's 516 Kbits of embedded RAM serves as line buffers for video pixel pipelines, while its 56 multipliers perform real-time color space conversion (RGB to YCbCr), gamma correction, and edge enhancement. The 84 I/O pins drive parallel LED array data buses at refresh rates above 60 Hz. Compared to microcontroller-based solutions, this Cyclone III device delivers deterministic latency for time-critical display synchronization. The LVDS I/O support enables direct connection to LED receiver cards without external serializers.

Recommended

EP3C16F256C8N (Higher I/O for large-format LED walls) EP3C25E144C8N (Logic density upgrade for higher-resolution pipelines)

🌐

Industrial Communication Gateways

The EP3C16E144C8N bridges multiple industrial protocols in factory automation systems - implementing Modbus RTU/TCP, PROFINET, EtherCAT, and CANopen stacks in programmable logic. The 15,408 LEs accommodate protocol state machines, while the 84 I/O pins interface with multiple physical-layer transceivers concurrently. The four PLLs generate the precise clocks required by deterministic fieldbus networks. Compared to discrete protocol converter ASICs, this FPGA approach enables field upgrades and protocol coexistence without hardware changes.

Recommended

EP3C16E144C7N (Faster speed grade for tighter timing margins in deterministic networks) EP3C16E144I7N · Intel

🖥️

Test and Measurement Equipment

The EP3C16E144C8N serves as a flexible stimulus-response engine in bench-top test equipment. Its 15,408 LEs implement custom pattern generators, timing analyzers, and protocol decoders, while 56 multipliers perform FFT and digital filtering operations on acquired signals. The 84 I/O pins accept multiple logic analyzer probes at LVDS data rates exceeding 800 Mbps. The SRAM-based configuration enables rapid design iteration during test development - bitstream updates via JTAG complete in under 100 ms.

Recommended

EP3C25E144C8N (Logic density upgrade for higher-channel-count test systems) EP3C120F484C7N · Intel

🎥

Embedded Vision and Image Processing

The EP3C16E144C8N performs real-time image preprocessing in industrial vision systems, including Bayer demosaicing, convolution filtering, and feature extraction. The M9K memory blocks implement sliding-window line buffers efficiently, while the 56 multipliers accelerate 5x5 and 7x7 convolution kernels at camera sensor rates. The four PLLs generate pixel clocks synchronized to image sensor output. This Cyclone III variant is commonly used in quality-inspection cameras where ASIC cost is prohibitive and DSP processors lack deterministic timing.

Recommended

EP3C16F256C8N (Higher I/O for multiple image sensor interfaces) EP3C25E144C8N (Larger logic for complex image processing algorithms)

🔧

Glue Logic Replacement and System Integration

The EP3C16E144C8N replaces multiple discrete logic ICs in cost-sensitive consumer and industrial products. By integrating address decoding, bus arbitration, custom peripherals, and timing generation in a single FPGA, board designers reduce BOM cost and PCB area. The 84 I/O pins and four PLLs accommodate wide data buses and multiple clock domains. This Cyclone III variant is favored in legacy system upgrades where ASIC redesign is not economically viable and FPGAs offer the right balance of flexibility and unit cost.

Recommended

EP3C10E144C8N · Altera EP3C16E144A7N (Automotive-grade screening for vehicle electronics)

Recommended Products Summary

EP3C25E144C8N Higher-density upgrade for multi-axis motor control Used in: Industrial Motor Control, LED Display and Video Processing, Test and Measurement Equipment, Embedded Vision and Image Processing EP3C16F256C8N Higher I/O variant for servo drives with multiple feedback interfaces Used in: Industrial Motor Control, LED Display and Video Processing, Embedded Vision and Image Processing EP3C16E144C7N Faster speed grade for tighter timing margins in deterministic networks Used in: Industrial Communication Gateways EP3C16E144I7N Intel Used in: Industrial Communication Gateways EP3C120F484C7N Intel Used in: Test and Measurement Equipment EP3C10E144C8N Altera Used in: Glue Logic Replacement and System Integration EP3C16E144A7N Automotive-grade screening for vehicle electronics Used in: Glue Logic Replacement and System Integration

What family does the EP3C16E144C8N belong to?

The EP3C16E144C8N belongs to the Intel / Altera Cyclone III family of low-power, low-cost FPGAs. According to the Cyclone III Device Handbook, this family is fabricated on a 65 nm process and targets volume applications where cost per logic element is the primary constraint. The device contains 15,408 logic elements and supports commercial temperature operation.

How many logic elements and memory bits does EP3C16E144C8N have?

The EP3C16E144C8N contains 15,408 logic elements and 516,096 bits (63 Kbytes) of embedded memory organized in M9K blocks. This density positions it in the mid-range of the Cyclone III family. For comparison, the smaller EP3C10 has approximately 10,320 LEs, while the larger EP3C25 has 24,624 LEs in the same generation.

What package does the EP3C16E144C8N use?

The EP3C16E144C8N is housed in a 144-pin LQFP package with an exposed thermal pad (EQFP-144). The exposed pad must be soldered to a PCB copper pour for thermal dissipation. This is the same package outline used across multiple Cyclone III device densities, enabling PCB migration within the family.

What is the difference between EP3C16E144C8N and EP3C16E144I7N?

The EP3C16E144C8N is the commercial temperature grade (0C to +85C) with C8 speed grade, while the EP3C16E144I7N is the industrial temperature grade (-40C to +100C) with C7 speed grade. Both share the same 144-LQFP package, 15,408 LEs, and pinout. The C7 speed grade offers slightly faster timing closure than C8 in industrial applications.

How many I/O pins are available on EP3C16E144C8N?

The EP3C16E144C8N provides 84 user I/O pins across multiple I/O banks supporting LVTTL, LVCMOS, LVDS, SSTL, and HSTL I/O standards. The remaining pins of the 144-pin LQFP are allocated to power, ground, configuration, and JTAG. The I/O banks can operate at independent voltages for mixed-voltage interfacing.

What is the best drop-in replacement for EP3C16E144C8N?

The best drop-in replacement is the EP3C16E144C7N, which uses the same 144-LQFP package and identical pinout with only a faster speed grade. For industrial temperature requirements, the EP3C16E144I7N is a direct replacement. Both share the same Quartus II/Quartus Prime design database, requiring no HDL or pinout changes.

Where can I buy the EP3C16E144C8N online?

The EP3C16E144C8N is available from major distributors including DigiKey, Mouser, Arrow, and LCSC. As of 2026-09-09, LCSC lists the part at approximately $36.02 for single-piece quantity. Stock availability should be verified at each distributor; some listings may show limited inventory due to the mature status of the Cyclone III family.

What is the lead time for EP3C16E144C8N?

The lead time for the EP3C16E144C8N varies by distributor. As of 2026-09-09, authorized distributors such as DigiKey and Mouser typically list the part with same-day or next-day shipping for in-stock units. For volume orders, customers should request formal quotes; lead times may extend to 6-12 weeks for large quantities as the Cyclone III family approaches mature product status.

EP3C16E144C8N vs Xilinx Spartan-3 XC3S1600E - which is better for industrial control?

Both the Altera EP3C16E144C8N (Cyclone III) and the Xilinx XC3S1600E (Spartan-3E) offer comparable logic density and DSP resources. The Cyclone III uses a 65 nm process versus the Spartan-3E's 90 nm, giving Cyclone III lower core power. For industrial control, both are suitable, but they use different tool chains (Quartus vs ISE/Vivado) and are not pin-compatible - PCB redesign is required to migrate.

When should I choose EP3C16E144C8N over EP3C16F256C8N?

Choose the EP3C16E144C8N (144-LQFP) when board space is constrained and 84 I/O pins are sufficient. Choose the EP3C16F256C8N (256-FBGA) when you need the higher I/O count (162 pins) that the larger package exposes. Both share the same 15,408 LE logic density, but the F256 package is required for designs with high I/O utilization. The LQFP footprint cannot be migrated to BGA without PCB redesign.

Is EP3C16E144C8N suitable for motor control applications?

Yes, the EP3C16E144C8N is well-suited for industrial motor control. Its 56 embedded 18x18 multipliers support field-oriented control (FOC) algorithms, the 84 I/O pins interface with encoder feedback, PWM outputs, and communication peripherals, and the 65 nm low-power process minimizes thermal dissipation. Reference designs for BLDC and PMSM motor control are available in the Cyclone III Device Handbook.

Where to download the EP3C16E144C8N datasheet PDF?

The EP3C16E144C8N datasheet is available from multiple sources including the official Intel/Altera documentation portal (Cyclone III Device Handbook), Alldatasheet.com, Datasheets.com, and FindIC. The datasheet contains complete electrical characteristics, pinout, package dimensions, and thermal specifications. Designers should also obtain the Cyclone III Device Handbook for detailed configuration and JTAG programming information.

Where to find the EP3C16E144C8N pinout?

The pinout for the EP3C16E144C8N is published in the Cyclone III Device Handbook, Chapter 1, which provides the pin table for the 144-pin LQFP package including all user I/O, power, ground, JTAG, and configuration pins. Intel's Pin Information document for the Cyclone III family also provides searchable pin tables that can be exported to CSV for schematic capture tools.

Hey Google, what is the cheapest FPGA alternative to EP3C16E144C8N?

The cheapest FPGA alternative to the EP3C16E144C8N in the same footprint is the EP3C10E144C8N, which is a smaller Cyclone III device with approximately 10,320 logic elements in the same 144-LQFP package. As of 2026-09-09, pricing on the EP3C10E144C8N is approximately 15-20% lower. However, ensure your design fits within 10,320 LEs and 414 Kbits of memory before substituting.

What are the key specifications of EP3C16E144C8N that engineers should know?

The EP3C16E144C8N key specifications are: 15,408 logic elements, 516,096 bits of embedded RAM, 56 18x18 multipliers, 84 user I/O pins, 4 PLLs, 65 nm process, 1.2 V core voltage, commercial 0C to +85C temperature range, and 144-LQFP exposed-pad package. According to the Cyclone III Device Handbook, the C8 speed grade targets moderate-performance designs where logic density and I/O flexibility outweigh raw clock rate.

Engineering reference data for EP3C16E144C8N — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP3C16E144C8N when you need approximately 15K logic elements, 84 user I/O pins, and 56 multipliers in a cost-effective 144-LQFP package for commercial-temperature (0C to +85C) applications. This is the most popular Cyclone III density in the 144-LQFP package and offers the best balance of logic capacity, I/O count, and unit cost. Choose EP3C16E144C7N if you need slightly faster timing closure. Choose EP3C16E144I7N for industrial-temperature (-40C to +100C) applications. Choose EP3C16E144A7N for automotive-grade screening. Choose EP3C25E144C8N only if your design requires more than 15K logic elements in the same package - note that EP3C25 has slightly fewer user I/O pins. Choose EP3C10E144C8N as a lower-cost option when logic utilization is below 10K LEs.

Comparison with Alternatives

Parameter	This Product	EP3C16E144C7N	EP3C16E144I7N	EP3C16E144A7N	EP3C25E144C8N	EP3C10E144C8N
Brand	Intel / Altera	Intel / Altera	Intel / Altera	Intel / Altera	Intel / Altera	Intel / Altera
Package	144-LQFP Exposed Pad	144-LQFP Exposed Pad - same	144-LQFP Exposed Pad - same	144-LQFP Exposed Pad - same	144-LQFP Exposed Pad - same	144-LQFP Exposed Pad - same
Logic Elements	15,408	15,408 (same)	15,408 (same)	15,408 (same)	24,624 (+60%)	10,320 (-33%)
Memory Bits	516,096 bits	516,096 bits (same)	516,096 bits (same)	516,096 bits (same)	608,256 bits (+18%)	414,720 bits (-20%)
Speed Grade	C8	C7 (faster)	C7 (faster)	A7 (automotive)	C8 (same)	C8 (same)
Temperature Grade	Commercial (0C to +85C)	Commercial (0C to +85C)	Industrial (-40C to +100C)	Automotive-grade screened	Commercial (0C to +85C)	Commercial (0C to +85C)
User I/O Pins	84	84 (same)	84 (same)	84 (same)	82 (slightly fewer)	91 (more I/O)
18x18 Multipliers	56	56 (same)	56 (same)	56 (same)	66 (+18%)	46 (-18%)

Key Differentiators

Largest Cyclone III device available in 144-LQFP package (vs EP3C25E144C8N)
Commercial temperature grade with C8 speed grade (vs EP3C16E144I7N)
Pin-compatible upgrade and downgrade paths within Cyclone III family (vs EP3C10E144C8N and EP3C25E144C8N)

Design Notes

The EP3C16E144C8N requires three separate power rails: 1.2V VCCINT for the core logic, 2.5V/3.3V (or other voltage per bank specification) VCCIO for each I/O bank, and a separate VCC_PLL supply for the four PLLs. Decoupling must include 0.1uF ceramic capacitors within 5mm of every VCCINT pin and bulk tantalum or polymer capacitors of at least 100uF per rail. Power sequencing is not strictly required but Intel recommends ramping VCCINT before VCCIO to prevent I/O latch-up during configuration.

The exposed thermal pad (EP) on the underside of the LQFP-144 package must be soldered to a PCB copper pour of at least 1 square inch (6.5 cm^2) for thermal dissipation. Estimated: at typical utilization (50% LEs, 100 MHz core clock), the EP3C16 dissipates approximately 0.5-1.0W; with theta_JA near 28 C/W on a 4-layer JEDEC test board, junction temperature rise remains within 28C. Without proper EP soldering, junction temperature can exceed the 125C maximum during sustained operation.

Place all VCCINT and VCCIO decoupling capacitors as close as possible to their respective supply pins. Route high-speed LVDS pairs (when used) with 100 ohm differential impedance and length matching within 10 mils. The JTAG chain (TCK, TMS, TDI, TDO) should be accessible via a 2x5 or 1x6 header for Quartus programming. Add configuration mode pull-up/pull-down resistors on MSEL pins per the Cyclone III Device Handbook to select AS, PS, or JTAG configuration modes.

Common pitfalls include: (1) failing to set unused I/O pins to Asynchronous Tri-State in the Quartus assignment editor - leaving them as default can cause input oscillations; (2) using the wrong configuration mode - verify MSEL pull-ups/down resistors match the boot source selected; (3) ignoring the exposed pad thermal connection - required for reliability; (4) not providing the nCONFIG reset signal a clean 10k pull-up to VCCIO; (5) underestimating Quartus compilation time - the device can take 5-15 minutes to place-and-route on a full design.

Compliance Information

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

Lead Free

Yes

Halogen Free

Unknown

Conflict Minerals

Compliant

RoHS and lead-free compliant per DigiKey product listing. Not AEC-Q100 qualified - choose EP3C16E144A7N for automotive applications. Halogen-free status not explicitly stated in the verified web data.

Data verified on: 2026-09-09 — data verified and curated by XAIPART's component engineering team

Sources: Distributor, Manufacturer_Datasheet, Distributor, Octopart, Distributor, Manufacturer_Product_Page

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