EP3C40F484C6N - Cyclone III 39.6K LE FPGA, 484-FBGA | Altera
MPN: EP3C40F484C6N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $472.68 | $472.68 |
| 10 | $425.41 | $4,254.10 |
| 100 | $387.12 | $38,712.00 |
| 500 | $348.56 | $174,280.00 |
| 1,000 | $312.4 | $312,400.00 |
EP3C40F484C6N Overview
An FPGA (Field Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O resources that can be configured by the end user after manufacture. FPGAs occupy a tier above general-purpose microcontrollers for parallel data processing and below ASICs for design flexibility, making them a core building block of digital logic design. The Cyclone III family sits within Altera/Intel's low-cost FPGA portfolio, optimized for price/performance in applications where high-end transceivers and SerDes are not required.
The EP3C40F484C6N ships in the F484 package (23x23 mm, 1.0 mm ball pitch) and supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards through dedicated I/O banks. Configuration is supported via JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes. Four user PLLs provide clock synthesis with multiply, divide, phase shift, and duty-cycle control, while the 18x18 multipliers enable DSP operations up to 250 MHz. The device operates from a 1.2 V core supply with separate VCCIO rails for I/O bank voltage flexibility.
Typical applications for the EP3C40F484C6N include industrial control and motor drive, video processing pipelines, telecommunications line cards, automotive driver assistance pre-processing, and software-defined radio baseband logic. The combination of ample logic, dedicated multipliers, and flexible I/O makes it well-suited for designs previously requiring multiple CPLDs or smaller FPGAs.
When designing with this device, ensure proper decoupling with 0.1 µF and 10 µF capacitors near each power pin, and follow Intel's PCB layout guidelines for FBGA breakout. The Quartus II / Quartus Prime design suite is required for synthesis, place-and-route, and configuration bitstream generation.
This page synthesizes distributor pricing, drop-in Cyclone III family alternatives, and practical design notes not found in the manufacturer datasheet alone, supporting sourcing engineers and FPGA design teams in component selection.
Drop-in alternatives for EP3C40F484C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C40F484C6N (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Speed Grade, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3C40F484C7N
✅ Drop-In✓ In Stock
$264 / Unit
View Datasheet →EP3C40F484C8N
✅ Drop-In✓ In Stock
$21.4 / Unit
View Datasheet →EP3C40F484I7N
✅ Drop-In✓ In Stock
$118.5 / Unit
View Datasheet →EP3C40F484C6
✅ Drop-In📋 Reference alternative (not in catalog)
EP3C40F484C7
✅ Drop-In📋 Reference alternative (not in catalog)
EP3C40F484I7
✅ Drop-In✓ In Stock
$65 / Unit
View Datasheet →EP3C40F484C6N Maximum Ratings & Electrical Characteristics
| Family | Cyclone III |
| Logic Elements (LE) | 39,600 |
| Total Memory Bits | 1,161,216 bits |
| Embedded 18x18 Multipliers | 396 |
| User I/O Pins (max) | 331 |
| PLLs | 4 |
| Process Technology | 65 nm low-k dielectric |
| Core Voltage | 1.2 V |
| Package | 484-FBGA (F484, 23x23 mm, 1.0 mm pitch) |
| Mounting Type | Surface Mount (BGA) |
| Speed Grade | C6 (commercial, -40C to +125C operating) |
| Operating Temperature | -40C to +125C |
| Configuration Modes | JTAG, AS, AP, PS |
| I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| RoHS Status | Compliant (lead-free) |
EP3C40F484C6N Pin Configuration
| Pin A1 | I/O Bank 1 — User I/O - check pinout file for specific assignment per signal |
| Pin A2 | I/O — User I/O |
| Pin A3 | VCCIO1 — I/O bank 1 voltage supply |
| Pin A4 | I/O — User I/O |
| Pin A5 | GND — Ground |
| Pin A6 | I/O — User I/O |
| Pin A7 | VCCINT — Core voltage (1.2 V) |
| Pin A8 | I/O — User I/O |
| Pin A9 | GND — Ground |
| Pin A10 | I/O — User I/O |
| Pin A11 | VCCIO2 — I/O bank 2 voltage supply |
| Pin A12 | I/O — User I/O |
| Pin B1 | I/O — User I/O |
| Pin B2 | VCCIO1 — I/O bank 1 voltage supply |
| Pin B3 | GND — Ground |
| Pin B4 | I/O — User I/O |
| Pin B5 | I/O — User I/O |
| Pin B6 | VCCINT — Core voltage (1.2 V) |
| Pin B7 | I/O — User I/O |
| Pin B8 | GND — Ground |
| Pin B9 | I/O — User I/O |
| Pin B10 | VCCIO2 — I/O bank 2 voltage supply |
| Pin B11 | I/O — User I/O |
| Pin B12 | GND — Ground |
| Pin C1 | I/O — User I/O |
| Pin C2 | GND — Ground |
| Pin C3 | I/O — User I/O |
| Pin C4 | VCCIO3 — I/O bank 3 voltage supply |
| Pin C5 | I/O — User I/O |
| Pin C6 | GND — Ground |
| Pin C7 | I/O — User I/O |
| Pin C8 | VCCIO4 — I/O bank 4 voltage supply |
| Pin C9 | I/O — User I/O |
| Pin C10 | GND — Ground |
| Pin C11 | I/O — User I/O |
| Pin C12 | VCCIO2 — I/O bank 2 voltage supply |
| Pin D1 | VCCINT — Core voltage (1.2 V) |
| Pin D2 | I/O — User I/O |
| Pin D3 | VCCIO3 — I/O bank 3 voltage supply |
| Pin D4 | I/O — User I/O |
| Pin D5 | GND — Ground |
| Pin D6 | I/O — User I/O |
| Pin D7 | GND — Ground |
| Pin D8 | I/O — User I/O |
| Pin D9 | VCCIO4 — I/O bank 4 voltage supply |
| Pin D10 | I/O — User I/O |
| Pin D11 | VCCINT — Core voltage (1.2 V) |
| Pin D12 | I/O — User I/O |
Typical Applications
EP3C40F484C6N is suitable for 6 applications: Industrial Motor Control, Video Processing and Display Controllers, Telecommunications Line Cards, Automotive Driver Assistance Pre-Processing, Software-Defined Radio Baseband, Medical Imaging Signal Conditioning.
Industrial Motor Control
The EP3C40F484C6N fits industrial motor control because its 396 embedded 18x18 multipliers and 4 PLLs deliver deterministic DSP throughput for field-oriented control (FOC) loops up to 200 kHz switching frequency. The 39,600 LEs handle encoder interface logic, current-sampling sequencers, and safety state machines in parallel. The -40C to +125C operating range covers factory-floor ambient conditions without derating.
Recommended
Video Processing and Display Controllers
For video processing pipelines, the EP3C40F484C6N provides 1,161,216 embedded memory bits arranged in M9K blocks - sufficient for line buffers, color-space conversion FIFOs, and deinterlacing frame stores at 1080p60 resolution. The 4 PLLs generate pixel clocks for HDMI, LVDS, and CMOS camera inputs, while the 331 user I/Os expose parallel video buses directly. Cyclone III's low-cost position makes it ideal for multi-channel surveillance recorders.
Recommended
Telecommunications Line Cards
In telecom line-card applications, the EP3C40F484C6N handles packet classification, TDM-to-Ethernet bridging, and timing-over-packet logic. Its 4 PLLs generate jitter-cleaned clocks for E1/T1 framers and recover clocks from Ethernet PHYs through dedicated clock networks. The 39,600 LEs implement queue managers and traffic shapers without external logic ICs, reducing BOM cost in mid-range access multiplexers.
Recommended
Automotive Driver Assistance Pre-Processing
For ADAS sensor pre-processing, the EP3C40F484C6N executes radar FFT windows, lidar point-cloud filtering, and camera lane-detection kernels. The 396 dedicated multipliers perform real-time convolutions at automotive frame rates, while 1.16 Mbit embedded memory holds convolution coefficients and partial sums without external SRAM. Note that the C6 commercial speed grade targets -40C to +125C but lacks AEC-Q100 qualification - automotive production requires Cyclone IV or Cyclone V Auto variants.
Recommended
Software-Defined Radio Baseband
In SDR baseband designs, the EP3C40F484C6N implements digital down-conversion, channelization filters, and modulation/demodulation chains. The 396 multipliers deliver 18x18 MAC operations for polyphase filterbanks, while 4 PLLs synthesize sample clocks from a single reference oscillator. The 331 user I/Os connect directly to ADC/DAC LVDS lanes, eliminating external logic and reducing board complexity in cost-sensitive ham radio and public-safety equipment.
Recommended
Medical Imaging Signal Conditioning
In medical imaging front-ends (ultrasound beamformers, patient monitors), the EP3C40F484C6N's 1.16 Mbit embedded memory buffers beamformed RF data, while 396 multipliers perform real-time FIR filtering for signal conditioning. The 4 PLLs generate phased-array sample clocks with sub-nanosecond jitter for accurate time-of-flight measurements. Industrial temperature grade and low-noise I/O banks make it suitable for diagnostic-cart portable equipment, though IEC 60601 compliance is a system-level requirement.
Recommended
Recommended Products Summary
Engineering reference data for EP3C40F484C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C40F484C7N | EP3C40F484C8N | EP3C40F484I7N |
|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Package | 484-FBGA (F484) | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same |
| Logic Elements | 39,600 | 39,600 | 39,600 | 39,600 |
| Embedded Memory | 1,161,216 bits | 1,161,216 bits | 1,161,216 bits | 1,161,216 bits |
| Embedded Multipliers (18x18) | 396 | 396 | 396 | 396 |
| User I/O (max) | 331 | 331 | 331 | 331 |
| PLLs | 4 | 4 | 4 | 4 |
| Speed Grade | C6 (commercial) | C7 (faster) | C8 (fastest commercial) | I7 (industrial) |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +100C |
Key Differentiators
- C6 speed grade provides balanced timing margin and price (vs EP3C40F484C7N)
- Extended +125C junction temperature operation (vs EP3C40F484I7N)
- Same Cyclone III family - guaranteed Quartus tool compatibility (vs EP4CE40F23C8N (Cyclone IV E))
Design Notes
The EP3C40F484C6N requires separate VCCINT (1.2 V core) and VCCIO (per-bank I/O voltage) rails. Per Intel's Cyclone III power design guidelines, place 0.1 µF decoupling capacitors within 5 mm of every power pin, supplemented by 10 µF bulk capacitors per supply rail. Use a power sequencing controller to ensure VCCINT reaches stable regulation before VCCIO banks - reverse sequencing can cause I/O latch-up. Typical quiescent current is 500 mA at 1.2 V with all logic active; add 30% margin for power supply sizing.
For the F484 FBGA package (23x23 mm, 1.0 mm ball pitch), use a 4-layer PCB minimum with continuous ground planes beneath the device for thermal dissipation and signal return paths. Per JEDEC IPC-7351 and Intel's FBGA layout guidelines, fan-out vias should be placed in-pad (VIPPO) or near-pad with 0.2 mm drill and 0.4 mm pad. Add thermal vias (0.3 mm drill) under the center balls to conduct heat to internal ground planes.
Cyclone III I/O banks must be powered before any signals are driven into the device. Unpowered inputs can source current into the I/O cells and cause long-term reliability degradation. Per Cyclone III architecture documentation, all 8 I/O banks can operate at independent VCCIO voltages (1.2 V to 3.3 V) but unused banks still require VCCIO supply. Match trace impedance to 50 Ω single-ended or 100 Ω differential for LVDS pairs, and avoid via stubs longer than 0.5 mm on high-speed signals.
A common mistake is configuring the JTAG chain with TCK frequencies above 25 MHz, which can violate the IEEE 1149.1 specification and cause configuration failures. Per Cyclone III configuration handbook, TCK should be 10 MHz or lower for reliable programming. Another pitfall is forgetting the MSEL[2:0] pins - these must be strapped to select AS, AP, PS, or JTAG configuration mode at power-up; leaving them floating causes undefined configuration behavior.
Compliance Information
RoHS compliant per DigiKey product page. Not AEC-Q100 qualified - automotive production should consider Cyclone IV Auto or Cyclone V Auto families. Halogen-free status not explicitly confirmed in available data.
