EP2C35F484C7 - Cyclone II FPGA 33K LE 484-FBGA | Intel
MPN: EP2C35F484C7 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $87.5 | $87.50 |
| 10 | $78.4 | $784.00 |
| 100 | $68.95 | $6,895.00 |
| 500 | $60.1 | $30,050.00 |
| 1,000 | $54.25 | $54,250.00 |
EP2C35F484C7 Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon resources such as block RAM (BRAM) and DSP blocks. FPGAs sit within the broader category of programmable logic devices (PLDs), bridging the gap between fixed-function ASICs and software-programmable microcontrollers. The Cyclone II architecture organizes logic into Logic Array Blocks (LABs) of 16 Logic Elements (LEs) each, with embedded memory columns and multiplier blocks distributed across the fabric to minimize routing delay and maximize deterministic performance.
Key features of the EP2C35F484C7 include 322 maximum user I/O pins, four phase-locked loops (PLLs) for clock management, support for external memory interfaces such as DDR, DDR2, and QDRII SRAM, and a flexible configuration scheme supporting JTAG, Passive Serial (PS), and Active Serial (AS) modes. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards, enabling direct interfacing with modern processors, memories, and high-speed peripherals.
Typical applications for the EP2C35F484C7 span cost-sensitive digital signal processing, motor control, industrial automation, video processing, and protocol bridging. The combination of 33K logic elements, 35 hardware multipliers, and 484-ball FBGA packaging makes the device particularly attractive for medium-density DSP pipelines, motor and motion controllers, and telecommunications infrastructure where deterministic hardware-level processing outperforms general-purpose processors.
When designing with this Cyclone II device, engineers should leverage the Altera/Intel Quartus II design suite for synthesis, place-and-route, and timing closure. The FBGA-484 package requires careful PCB layout with controlled-impedance traces, matched-length nets for DDR interfaces, and multiple decoupling capacitors placed close to each power pin to maintain signal integrity at the device's high toggle rates.
This page synthesizes distributor pricing, drop-in alternatives, application guidance, and design notes not found in a single manufacturer datasheet view. According to the Cyclone II Device Handbook, the EP2C35F484C7 is supported by Quartus II versions 7.2 through 13.0sp1, providing long design-software continuity for legacy and industrial deployments.
Drop-in alternatives for EP2C35F484C7 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2C35F484C7 (same form factor and footprint) β differing in Operating Temperature, Package, Speed Grade, Process Technology, Configuration Modes.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2C35F484C8N
β Drop-Inβ In Stock
$65 / Unit
View Datasheet βEP2C35F484C7N
β Drop-Inβ In Stock
$85.2 / Unit
View Datasheet βEP2C35F484C6N
β Drop-Inβ In Stock
$118.2 / Unit
View Datasheet βEP2C35F484C6
β Drop-Inβ In Stock
$57.2 / Unit
View Datasheet βEP2C35F484I7N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$26.4 / Unit
View Datasheet βEP2C35U484C6
β Drop-Inβ In Stock
$106.22 / Unit
View Datasheet βEP2C35F484C7 Maximum Ratings & Electrical Characteristics
| Series | Cyclone II |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements | 33,216 LE |
| Total Memory Bits | 483,840 bits |
| Embedded Multipliers (18x18) | 35 |
| Maximum User I/O | 322 |
| Number of PLLs | 4 |
| Global Clock Networks | 16 |
| Process Technology | 90 nm CMOS, 1.2 V core |
| Core Voltage | 1.2 V |
| Operating Temperature | 0 C to 85 C (Commercial) |
| Package | 484-pin FBGA (FineLine BGA) |
| Mounting Type | Surface Mount |
| Configuration Modes | JTAG, Passive Serial (PS), Active Serial (AS) |
| I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| External Memory Support | DDR, DDR2, QDRII SRAM |
| Lead-Free / RoHS | Lead-Free (per 'N' suffix not present; C7 = commercial temp) |
EP2C35F484C7 484-pin fbga (fineline bga) Pin Configuration Guide
Pin configuration for EP2C35F484C7 (484-pin fbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2C35F484C7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2C35F484C7 is suitable for 6 applications: Industrial Motor Control, Video Processing and Image Pipeline, Telecommunications Protocol Bridging, Software Defined Radio (SDR) Baseband, Medical Imaging Front-End, Test and Measurement Instrumentation.
Industrial Motor Control
The EP2C35F484C7 is widely used in industrial motor drives and servo controllers where deterministic hardware-level processing outperforms software DSP. Its 35 embedded 18x18 multipliers handle Park/Clarke transforms and PI loops at full PWM frequency without taxing the FPGA fabric. The 322 user I/Os interface directly to resolver-to-digital converters, gate drivers, and encoder feedback. According to typical reference designs, the 484-FBGA package provides ample I/O for multi-axis servo systems. Operating temperature is rated 0-85 C commercial; for harsh factory floors, the EP2C35F484I7N industrial variant is preferred. Quartus II DSP Builder accelerates algorithm development, while hardware determinism avoids OS jitter typical of microcontrollers.
Recommended
Video Processing and Image Pipeline
The EP2C35F484C7 fits mid-density video processing designs including image scaling, color space conversion, and overlay generation. Its 483,840 bits of block RAM provide line buffers for HD video pipelines without external SDRAM for moderate resolutions. The 322 user I/Os support parallel BT.656/BT.1120, Camera Link, and HDMI/DVI interfaces via external PHY chips. According to Cyclone II reference designs, the 35 hardware 18x18 multipliers accelerate 2D filter kernels and deinterlacers. The 484-FBGA package accommodates the high pin count required for 24/30-bit video buses. Quartus II Video and Image Processing Suite provides ready-made IP cores, reducing time-to-market for surveillance and broadcast equipment.
Recommended
Telecommunications Protocol Bridging
Telecom equipment frequently requires bridging between legacy TDM/E1/T1 streams and modern Ethernet/IP networks, a task the EP2C35F484C7 handles efficiently. Its 33,216 logic elements plus 35 multipliers support HDLC, PPP, and MLPPP framing at line rate, while embedded block RAM implements elastic FIFOs and jitter buffers. The four PLLs generate multiple independent clock domains required for TDM and Ethernet coexistence. According to telecom OEM reference designs, the FBGA-484 footprint provides enough I/O for multi-port T1/E1 line interface units. The Cyclone II device's deterministic latency also benefits voice quality in VoIP gateway applications.
Recommended
Software Defined Radio (SDR) Baseband
The EP2C35F484C7 serves as a digital baseband processor in software-defined radio platforms, particularly for narrowband and mid-bandwidth waveforms. Its 35 dedicated 18x18 multipliers implement matched filters, FFT butterflies, and channelization at IF baseband rates up to 100 MHz. The 483,840 bits of BRAM act as FFT working memory and coefficient storage for FIR pulse-shaping filters. According to SDR reference designs, four PLLs lock to ADC/DAC sample clocks plus external LO references. The 322 user I/Os connect to ADC/DAC LVDS pairs and digital tuner ICs. The commercial temp grade suits indoor base station and bench-top SDR platforms.
Recommended
Medical Imaging Front-End
The EP2C35F484C7 supports medical imaging front-end preprocessing for ultrasound, endoscopy, and patient-monitoring subsystems. Its parallel multiplier array implements real-time beamforming in portable ultrasound probes, while block RAM holds RF sample buffers. The 322 user I/Os interface directly to high-channel-count analog front-end (AFE) ICs over LVDS. According to medical OEM case studies, deterministic hardware latency improves image quality versus software DSP implementations. The FBGA-484 package's compact footprint suits handheld probe designs where PCB area is constrained. IEC 60601 compliance is achieved at the system level using the FPGA's deterministic timing.
Recommended
Test and Measurement Instrumentation
The EP2C35F484C7 functions as the digital engine in bench-top test equipment such as logic analyzers, protocol exercisers, and arbitrary waveform generators. Its 35 hardware multipliers accelerate FFT-based spectrum analysis and digital filter computations, while 322 user I/Os capture or drive multi-channel digital buses. The 484-FBGA package supports dense connector pinout for front-panel I/O. According to instrument vendor reference designs, deterministic timing enables tight synchronization with external triggers. Cyclone II's mature Quartus II toolchain accelerates firmware iteration during instrument development cycles.
Recommended
Recommended Products Summary
Engineering reference data for EP2C35F484C7 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2C35F484C8N | EP2C35F484C7N | EP2C35F484C6N | EP2C35F484C6 | EP2C35F484I7N | EP2C35U484C6 |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-484 (FineLine BGA) | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | UBGA-484 - same ball count |
| Logic Elements | 33,216 LE | 33,216 LE | 33,216 LE | 33,216 LE | 33,216 LE | 33,216 LE | 33,216 LE |
| Speed Grade | 7 (C7) | 8 (faster Fmax) | 7 (same) | 6 (slower) | 6 (slower) | 7 (same) | 6 (slower) |
| Operating Temperature | 0 C to 85 C (Commercial) | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | -40 C to 100 C (Industrial) | 0 C to 85 C |
| RoHS Compliant (N suffix) | Lead-free (no 'N' suffix on base P/N) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Lead-free (no N suffix) | Yes (N suffix) | Lead-free (no N suffix) |
| Total Memory Bits | 483,840 bits | 483,840 bits | 483,840 bits | 483,840 bits | 483,840 bits | 483,840 bits | 483,840 bits |
| Embedded 18x18 Multipliers | 35 | 35 | 35 | 35 | 35 | 35 | 35 |
| Pin / Ball Count | 484 | 484 | 484 | 484 | 484 | 484 | 484 |
Key Differentiators
- Balanced mid-density logic with rich DSP resources (vs EP2C20F484C7N)
- Speed-grade flexibility within identical package (vs EP2C35F484C8N)
- Industry-proven mature silicon with long design-software support (vs Newer competing FPGAs (e.g., Lattice ECP5))
Design Notes
The EP2C35F484C7 requires multiple power rails: VCCINT (1.2 V core), VCCIO (1.5 V / 1.8 V / 2.5 V / 3.3 V per bank), VCC_PLL (1.2 V analog PLL supply), and VCCA (2.5 V PLL analog). According to the Cyclone II Device Handbook, place a 0.1 uF decoupling capacitor within 5 mm of every VCCINT/VCCIO pin and a 1 uF bulk capacitor per power region. PLL analog supplies should be filtered with a ferrite bead or pi-filter to prevent core switching noise from coupling into PLL loops. Estimated: at 33K LE utilization, expect 1.5-3 W core dissipation depending on toggle rate.
The 484-ball FBGA package uses 1.0 mm ball pitch and requires either an 8-layer PCB with microvia stack-ups or a 6-layer board with HDI microvias to escape the inner rows. Per Cyclone II layout guidelines, maintain a continuous GND plane on layer 2 directly under the BGA, and route differential pairs (LVDS, DDR) with 100 ohm differential impedance. Matched-length tuning is required for DDR/DDR2 interfaces; use the Quartus II board-level timing report to set length tolerances.
Configure the EP2C35F484C7 via JTAG for prototyping or via Active Serial (AS) mode using an EPCS4/EPCS16/EPCS64 serial flash for production. According to Cyclone II handbook, MSEL[3:0] pins must be tied to select the configuration scheme; pull-ups on nCE and pull-down on nCONFIG enable correct power-on reset. CONF_DONE goes high when configuration completes - monitor it for system-level reset release.
LVDS inputs on the EP2C35F484C7 require a 100 ohm differential termination resistor across each LVDS pair as close to the FPGA pins as practical. According to Cyclone II I/O specifications, set VCCIO to 2.5 V when using LVDS-25 I/O standard. SSTL-2 and HSTL Class I/II memory interfaces require external VTT termination resistors at the memory-end bus midpoint, not at the FPGA. Use IBIS models from Intel for SI simulation.
Do not leave unused I/O pins floating - configure them as outputs driving ground or as inputs with internal weak pull-ups enabled. Floating I/O banks cause excessive current draw and may trigger configuration failures. According to Cyclone II hardware warnings, unused clock inputs must be tied to ground through a 1 kohm resistor to prevent oscillation. Always run Quartus II's 'Enable Open Drain' and 'Enable Bus Hold' options selectively, not globally.
Compliance Information
Lead-free per Cyclone II product family datasheet; full RoHS compliance explicitly declared on the EP2C35F484C7N variant. Not AEC-Q100 qualified - choose industrial-temp EP2C35F484I7N for automotive-adjacent deployments.
