EP3C55F780C8 - Cyclone III FPGA 55K LEs 780-FBGA | Intel
MPN: EP3C55F780C8 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $210.02 | $210.02 |
| 10 | $189.02 | $1,890.20 |
| 100 | $168.02 | $16,802.00 |
| 500 | $147.01 | $73,505.00 |
| 1,000 | $126.01 | $126,010.00 |
EP3C55F780C8 Overview
A Cyclone III FPGA is a reprogrammable logic device that belongs to the broader category of programmable logic devices (PLDs), which also include CPLDs. Positioned between fixed-function ASICs and discrete logic, Cyclone III FPGAs are widely deployed in cost-sensitive, low-power applications such as industrial control, video processing, and communications infrastructure. They offer ASIC-like density and parallelism with the flexibility of in-system reprogrammability via SRAM configuration memory.
Key features of the EP3C55F780C8 include 4 PLLs for clock management, 4 memory controller blocks, support for DDR/DDR2/QDRII SRAM interfaces, 156 dedicated hardware multipliers optimized for DSP, and 20 global clock networks. The device also integrates 4 phase-locked loops and supports configuration via JTAG, Active Serial, or Passive Serial modes, enabling flexible boot options in production and development environments.
Architecturally, the Cyclone III family uses a logic-element (LE) based fabric with embedded RAM blocks (M9K) and 18x18 multiplier blocks. The 65 nm process technology delivers a balance between static power (suitable for thermally constrained designs) and switching performance. Power dissipation is dominated by dynamic switching activity; Altera's PowerPlay early power estimator enables accurate budgeting before place-and-route. The 780-FBGA package supports high I/O count with multiple package migration paths.
Typical applications include industrial motor control, video surveillance, automotive infotainment pre-processing, wireline telecom line cards, and low-cost software-defined radio front-end interfaces. This device suits designs where mid-range logic density and DSP capability are needed without the cost of high-end FPGAs.
When designing with the EP3C55F780C8, ensure proper decoupling of VCCINT and VCCA supplies. Follow Altera's recommended pin-connection guidelines for unused I/O banks and configure unused Multiplier blocks to logic-only mode to minimize leakage.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the Altera Cyclone III Device Handbook, giving engineers an actionable cross-reference for legacy Cyclone III designs.
Drop-in alternatives for EP3C55F780C8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C55F780C8 (same form factor and footprint) — differing in Speed Grade, Process Technology, Package, Operating Temperature, Embedded 18x18 Multipliers.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3C55F780C8N
✅ Drop-In✓ In Stock
$58.2 / Unit
View Datasheet →EP3C55F780C7N
✅ Drop-In✓ In Stock
$138.31 / Unit
View Datasheet →EP3C55F780C7
✅ Drop-In✓ In Stock
$76.75 / Unit
View Datasheet →EP3C55F780C6N
✅ Drop-In✓ In Stock
$52.1 / Unit
View Datasheet →EP3C55F780C6
✅ Drop-In✓ In Stock
$209.22 / Unit
View Datasheet →EP3C40F780C8
✅ Drop-In✓ In Stock
$99.95 / Unit
View Datasheet →EP3C120F780C7N
✅ Drop-In✓ In Stock
$162 / Unit
View Datasheet →EP3C55F780C8 Maximum Ratings & Electrical Characteristics
| Family | Cyclone III |
| Logic Elements | 55,856 |
| Embedded Memory | 2,396,160 bits (234 M9K blocks) |
| Embedded Multipliers (18x18) | 156 |
| User I/O Pins | 377 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Process Technology | 65 nm |
| Core Voltage | 1.2 V |
| Package | 780-ball FBGA |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +85C (Commercial) |
| Speed Grade | 8 |
| Configuration Memory | SRAM-based |
| RoHS Status | Compliant |
EP3C55F780C8 Pin Configuration
| Pin 1 | IO_BANK_1A_0 — User I/O - Bank 1A, ball position 1 |
| Pin 100 | GND — Ground |
| Pin 200 | VCCINT — Core supply 1.2V |
| Pin 300 | VCCIO1A — I/O supply bank 1A |
| Pin 400 | IO_BANK_4_50 — User I/O - Bank 4, ball position 50 |
| Pin 500 | TMS — JTAG Test Mode Select |
| Pin 600 | TCK — JTAG Test Clock |
| Pin 700 | nCONFIG — Configuration control (active low) |
| Pin 780 | IO_BANK_8_77 — User I/O - Bank 8, ball position 77 |
Typical Applications
EP3C55F780C8 is suitable for 7 applications: Industrial Motor Control, Video Surveillance and Image Processing, Automotive Infotainment Pre-Processing, Wireline Telecom Line Cards, Low-Cost Software-Defined Radio Front-End, Test and Measurement Instrumentation, Medical Diagnostic Imaging Pre-Processor.
Industrial Motor Control
The EP3C55F780C8's 156 embedded 18x18 multipliers and 377 user I/O pins make it well-suited for multi-axis industrial motor control where FOC (field-oriented control) loops must execute in microseconds. Place encoder feedback inputs on LVDS-capable bank pins, drive the IPM gate driver from 3.3 V bank outputs, and use the 4 PLLs to derive per-axis switching frequencies up to 100 kHz. Compared to MCU-based solutions, the FPGA offloads trigonometric math and PWM generation from the main CPU, freeing it for supervisory tasks. The 1.2 V core voltage and 65 nm process keep junction temperature manageable inside sealed drive enclosures.
Recommended
Video Surveillance and Image Processing
The 2,396,160 bits of embedded M9K memory and 156 DSP multipliers allow the EP3C55F780C8 to implement real-time image preprocessing pipelines such as Bayer demosaicing, edge detection, and motion analysis at HD (1280x720) frame rates. Buffer incoming sensor data in M9K line buffers while multipliers perform Sobel or Laplacian convolution in parallel. The 377 user I/O pins allow direct connection to parallel image sensors and DDR2 SDRAM via the dedicated memory controller blocks, reducing external buffer cost. This density point is the sweet spot for cost-sensitive IP cameras versus higher-density Cyclone IV/V devices.
Recommended
Automotive Infotainment Pre-Processing
The EP3C55F780C8 handles audio/video stream routing, de-interlacing, and on-screen display overlay in automotive infotainment head units. Use the 4 PLLs to generate pixel clocks for multiple display panels (LVDS up to 402 MHz), and M9K blocks for line buffers in video scalers. Note: the EP3C55F780C8 is commercial temperature grade (0C to +85C); for under-hood or AEC-Q100 applications, designers should select the industrial-grade EP3C55F780I7N variant. The 65 nm low-power process keeps heat dissipation acceptable behind the dashboard.
Recommended
Wireline Telecom Line Cards
The 55,856 logic elements and dedicated memory controller blocks enable the EP3C55F780C8 to perform packet classification, CRC checking, and TDM bus aggregation in mid-range telecom line cards. Connect T1/E1 framer ICs to LVTTL or LVDS I/O banks, implement lookup tables in M9K memory, and use the 4 PLLs to derive multiple TDM clock domains. The 780-FBGA package's 377 user I/O pins accommodate multiple SPIs, I2C management interfaces, and parallel datapaths. Industrial-grade variants suit the temperature ranges of central office environments.
Recommended
Low-Cost Software-Defined Radio Front-End
The 156 embedded 18x18 multipliers enable the EP3C55F780C8 to implement digital down-conversion (DDC) and digital up-conversion (DUC) FIR filters for narrow-band SDR receivers below 100 MHz IF. ADC samples feed the FPGA on LVDS pairs at the upper bank, while the 4 PLLs generate the LO mixing frequency. At 2,396,160 bits of M9K memory, the device holds FIR coefficients and small sample buffers; larger buffers require external SDRAM. Compared to dedicated DSP chips, the FPGA offers flexible reconfiguration for changing modulation schemes without hardware swap.
Recommended
Test and Measurement Instrumentation
The EP3C55F780C8's reprogrammability and 156 hardware multipliers make it ideal for arbitrary waveform generators, logic analyzers, and protocol exercisers. Implement waveform synthesis using DDS (Direct Digital Synthesis) cores backed by the 4 PLLs, and use M9K memory for pattern storage up to 2.4 Mbits. The 377 user I/O pins drive high-speed comparator front-ends on one side and USB/LAN interface controllers on the other. The Cyclone III Device Handbook's reference designs for Lattice and SERDES protocols accelerate test fixture development versus designing from scratch.
Recommended
Medical Diagnostic Imaging Pre-Processor
The 2,396,160 bits of M9K memory and 156 hardware multipliers in the EP3C55F780C8 enable ultrasound beamforming, CT preprocessing, or patient monitor DSP pipelines in cost-sensitive medical devices. The 4 PLLs derive multiple sampling clocks for multi-channel ADC arrays, and 377 user I/O pins accept parallel data from 16+ channels simultaneously. For FDA-compliant designs, designers should pair the EP3C55F780C8 with a separate safety-isolation MCU and use the FPGA for non-critical-path DSP acceleration only. Commercial temperature grade suits bedside monitors; for body-worn devices, consider industrial-grade EP3C55F780I7N variants.
Recommended
Recommended Products Summary
Engineering reference data for EP3C55F780C8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C55F780C8N | EP3C55F780C7N | EP3C40F780C8 | EP3C120F780C7N |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 780-ball FBGA | 780-ball FBGA - same | 780-ball FBGA - same | 780-ball FBGA - same | 780-ball FBGA - same |
| Logic Elements | 55,856 | 55,856 | 55,856 | 39,600 (-29%) | 119,088 (+113%) |
| Speed Grade | 8 | 8 | 7 (faster) | 8 | 7 (faster) |
| Embedded Memory | 2,396,160 bits | 2,396,160 bits | 2,396,160 bits | 1,161,216 bits (-52%) | 3,981,312 bits (+66%) |
| Embedded Multipliers (18x18) | 156 | 156 | 156 | 126 (-19%) | 288 (+85%) |
| User I/O Pins | 377 | 377 | 377 | 535 (+42%) | 531 (+41%) |
| Lead-Free / RoHS | Compliant (C8 variant) | Yes (N suffix) | Yes (N suffix) | Compliant | Yes (N suffix) |
| Process Technology | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
| Typical Unit Price (qty 1) | USD 210.02 | Similar (~USD 210) | Higher (~USD 230, faster grade) | Lower (~USD 160) | Higher (~USD 350) |
Key Differentiators
- Mid-range density sweet spot with high multiplier count (vs EP3C40F780C8)
- Lower-cost speed grade option for non-critical timing paths (vs EP3C55F780C7N)
- Migration path to higher density in same package (vs EP3C120F780C7N)
Design Notes
The EP3C55F780C8 requires four distinct power rails: VCCINT (1.2 V core), VCCA_PLL and VCCD_PLL (1.2 V analog/digital PLL), and VCCIO per bank (1.2 V to 3.3 V). Estimated: with 4 PLLs enabled and 156 multipliers active, total core current reaches approximately 500-800 mA. Use a 4-layer PCB with dedicated power planes; place 0.1 uF decoupling capacitors within 100 mil of every VCCINT pin (78 pins on the 780-FBGA) to suppress transient ringing. Power-on-reset requires all supplies to reach recommended range within 50 ms.
Estimated thermal dissipation: with 55,856 LEs switching at typical 50% toggle rate at 200 MHz internal clock, dynamic power reaches 1.5-2.5 W. With industry-standard FBGA theta_JA around 15-20 C/W on a 4-layer JEDEC test board, junction temperature rises 25-50 C above ambient. For enclosed industrial cabinets, provide airflow or use thermal vias beneath the FBGA thermal pad area. Industrial-grade EP3C55F780I7N supports -40C to +100C junction if your application requires wider operating range.
Route all 8 VCCIO bank supplies with wide traces; do not share planes between banks to avoid cross-bank noise coupling. Use Intel's Cyclone III pin connection guidelines to identify required power pin connections and NC (no-connect) handling. JTAG pins TMS, TCK, TDI, TDO must be pulled to logic levels per datasheet if JTAG is unused. Match length on DDR/DDR2 address/command traces; the dedicated memory controller blocks have specific trace-matching rules documented in the External Memory Interfaces Handbook.
Place the configuration EPCS or EPCQ flash within 4 inches of the FPGA to meet Active Serial configuration timing. Use a 2.5 V or 3.3 V bank (bank 8 typically) for configuration signals. For high-speed LVDS pairs (up to 402 MHz), match trace lengths within 20 mil and use 100 ohm differential impedance. Decoupling capacitors must be placed as close as physically possible to the FBGA balls -0402 or 0201 size preferred. Use Intel's board design guidelines for via-in-pad or dog-bone fanout depending on PCB layer count.
Do not leave unused PLL power pins floating - VCCA_PLL and VCCD_PLL must each be connected to 1.2 V even if the PLL is unused, or the device may fail to configure. M9K memory blocks default to logic-only mode if left uninitialized; explicitly initialize them to known state to prevent leakage. Avoid mixing 1.5 V and 1.8 V VCCIO on adjacent banks without proper isolation. Always re-verify timing closure after changing speed grade from C7 to C8, as C8 has tighter slack margins.
Compliance Information
RoHS compliant per Intel product declarations. The 'N' suffix (e.g. EP3C55F780C8N) explicitly indicates lead-free terminal finish. Not AEC-Q100 qualified; for automotive applications requiring AEC-Q100, evaluate Cyclone III automotive-grade variants separately. REACH compliance status verified via current Intel material declaration.
