EP3C55F484C6N - Cyclone III FPGA, 55K LE, 327 I/O | Altera
MPN: EP3C55F484C6N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $170.85 | $170.85 |
| 10 | $165.5 | $1,655.00 |
| 100 | $159.8 | $15,980.00 |
| 500 | $154.2 | $77,100.00 |
| 1,000 | $148.7 | $148,700.00 |
EP3C55F484C6N Overview
An FPGA (Field-Programmable Gate Array) is an integrated circuit whose logic fabric can be electrically reprogrammed in the field to implement arbitrary digital hardware. Unlike fixed-function ASICs, FPGAs contain programmable look-up tables, flip-flops, block RAM, multiplier blocks, and configurable I/O buffers connected by programmable routing. In the component taxonomy, an FPGA sits under Programmable Logic Device (PLD) and Integrated Circuit (IC); it is chosen when hardware flexibility, low non-recurring engineering cost, or massive parallel data processing is required.
The EP3C55F484C6N provides 2,396,160 bits of embedded SRAM for FIFOs and soft-core processor memory, supports 327 user I/O pins on multiple I/O banks, and includes embedded 18×18 multiplier resources for DSP tasks. The -6 speed grade is the highest-performance commercial timing grade in the Cyclone III family, while the N suffix denotes a lead-free, RoHS-compliant package. The FBGA-484 package is 23 mm × 23 mm, 2.60 mm maximum height, 1 mm ball pitch, and is designed for surface-mount assembly.
The device is built on a 65-nm low-power process and requires a 1.2 V VCCINT core supply, which reduces dynamic power compared to earlier 1.5 V/1.8 V FPGA families. Cyclone III architecture includes a hierarchical clock network and PLL-based clock management to distribute low-skew clocks across the device. I/O banks can be powered at different voltages to interface with a range of single-ended and differential standards. The C6N ordering code indicates commercial temperature operation from 0 °C to +85 °C.
Typical end applications include industrial motor control, medical diagnostic imaging, broadcast video processing, communications infrastructure, and multi-channel test instrumentation. The combination of 55K logic elements and 327 I/O pins allows implementation of soft processors, high-speed data acquisition interfaces, and custom protocol controllers in a single programmable device.
Designers using the EP3C55F484C6N must pay careful attention to power-supply decoupling on the 1.2 V VCC rails, correctly configure MSEL pins for the desired configuration scheme, and validate I/O assignments against the Cyclone III pin-out files before placing the part on a board.
This XAIPART page synthesizes distributor inventory data, representative current pricing, same-package drop-in speed and temperature variants, and practical PCB notes that supplement Intel/Altera's official product documentation with actionable procurement and design guidance.
Drop-in alternatives for EP3C55F484C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C55F484C6N (same form factor and footprint) — differing in Package, Process Technology, Speed Grade, Operating Temperature, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3C55F484C6
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$222 / Unit
View Datasheet →EP3C55F484C7N
✅ Drop-In✓ In Stock
$52.75 / Unit
View Datasheet →EP3C55F484C8N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$58.5 / Unit
View Datasheet →EP3C55F484I7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$205.4 / Unit
View Datasheet →EP3C55F484I8N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$61.5 / Unit
View Datasheet →EP3C55F484C6N Maximum Ratings & Electrical Characteristics
| Device Type | FPGA - Field Programmable Gate Array |
| Series | Cyclone III |
| Number of Logic Elements | 55856 |
| Number of User I/O | 327 |
| Total RAM Bits | 2396160 |
| Core Supply Voltage | 1.2 V |
| Package / Case | FBGA-484, 23 x 23 mm |
| Ball Count | 484 |
| Ball Pitch | 1 mm |
| Package Height | 2.60 mm |
| Mounting Type | Surface Mount |
| Speed Grade | 6 (C6) |
| Operating Temperature Range | 0°C to +85°C |
| Maximum Internal Frequency | 472 MHz |
| Process Technology | 65 nm |
| Lead-Free / RoHS | Lead-free (N suffix) |
EP3C55F484C6N 2.60 mm Pin Configuration Guide
Pin configuration for EP3C55F484C6N (2.60 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3C55F484C6N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3C55F484C6N is suitable for 6 applications: Industrial Automation and Motor Control, Medical Diagnostic Imaging, Broadcast Video Processing, Wired Communications Infrastructure, Test and Measurement Instrumentation, FPGA Prototyping and Digital Logic Education.
Industrial Automation and Motor Control
The EP3C55F484C6N is well-suited for industrial motor control because its 55,856 logic elements can run multiple parallel PWM generators, encoder decoding blocks, and high-speed current-loop PID controllers simultaneously. With 327 user I/Os, the device connects directly to 12-bit ADCs for phase-current sensing, gate-driver ICs for IGBT/MOSFET stages, and encoder inputs without external FPGA-based glue logic. The -6 speed grade gives low-latency loop closure, while the wide FBGA-484 package enables compact controller cards. Designers should use the 1.2 V core rail with multiple ceramic decoupling caps near each VCC ball and add isolated gate-driver supplies to avoid noise coupling into the FPGA. The commercial temperature range covers most industrial cabinet environments, and the I7N variant is available if the board must be rated for -40 °C operation.
Recommended
Medical Diagnostic Imaging
Medical imaging systems such as ultrasound front-end processing and CT data acquisition rely on high I/O count and parallel processing. The EP3C55F484C6N provides 2,396,160 RAM bits for image line buffers and 327 I/Os for multiple ADC channels and LVDS serial links, enabling real-time filtering, beamforming, and data aggregation in one FPGA. Its 472 MHz internal clock capability supports high-throughput DSP chains, while the 65-nm process keeps power manageable in fan-cooled medical enclosures. Designers must perform signal integrity analysis on the 484-ball 1 mm pitch BGA to manage crosstalk between the many high-speed ADC inputs. The commercial temperature grade is suitable for controlled medical operating rooms. For patient-connected safety, additional isolation and EMC filtering are required beyond the FPGA power rails.
Recommended
Broadcast Video Processing
Broadcast video infrastructure demands reliable, deterministic processing of multiple 1080p or 4K streams. The EP3C55F484C6N has enough logic elements for color space conversion, scaling, frame synchronization, and three-dimensional noise reduction on multiple channels. The 327 I/O pins can be split among SDI serial inputs, DDR3 memory interfaces, and host processor buses. Cyclone III's block RAM is ideal for line buffers and TV scan conversion. When using a commercial FPGA in broadcast equipment, ensure a stable 1.2 V core supply and clean clock sources from PLLs; video timing requires careful clock region planning. The FBGA-484 package fits standard professional video cards. For systems needing wider operating temperature, select the industrial-temperature I variant.
Recommended
Wired Communications Infrastructure
The EP3C55F484C6N can implement packet parsing, queue management, and custom MAC/PHY interfaces for wired communications systems. With 55,856 LEs and 327 I/Os, it can connect to multiple gigabit Ethernet PHYs, PCIe bridges, and memory controllers, making it useful for switches, gateways, and industrial network appliances. The device's 1.2 V core and 65-nm process reduce power in always-on line cards. Designers should allocate sufficient FPGA resources for clock recovery, FIFO buffering, and protocol state machines; the 2.4 Mb embedded RAM is often shared among packet buffers and statistics counters. For high-speed serial interconnects, external transceivers may be needed because Cyclone III does not integrate multi-gigabit transceivers on every variant. Verify I/O standards and slew rates during board bring-up.
Recommended
Test and Measurement Instrumentation
Test equipment such as data acquisition cards, logic analyzers, and protocol analyzers benefit from the parallel acquisition capability and high pin count of the EP3C55F484C6N. The FPGA can capture many digital channels simultaneously, implement pattern generation, and perform real-time triggering without CPU intervention. The 327 user I/Os connect directly to comparators, ADCs, DACs, and front-panel connectors, while block RAM buffers the captured data before transferring to a host. The -6 speed grade supports sample rates in the hundreds of megahertz when the input stage and data path are pipelined. Instrument integrators should decouple every 1.2 V rail group and place series termination resistors near the BGA output pins to maintain signal integrity across a backplane. Commercial temperature is adequate for benchtop instruments, and fan airflow reduces thermal stress on the fine-pitch package.
Recommended
FPGA Prototyping and Digital Logic Education
The EP3C55F484C6N is a popular device for FPGA development boards used in digital design courses and rapid hardware prototyping. Its 55,856 logic cells accommodate large RTL projects including soft processors such as Nios II, memory controllers, and custom peripherals. The FBGA-484 land pattern is available on many standard development boards, and the 327 I/O pins connect to expansion connectors for user-designed daughter boards. Because the part is SRAM-based, each power-up requires loading a configuration from flash or JTAG; educational boards typically include an EPCS serial configuration device. The commercial temperature range is fine for laboratory use, and the through-board thermal pad plus low 1.2 V core voltage simplify heat management. Students can gain practical BGA layout experience while evaluating Cyclone III architecture before production.
Recommended
Recommended Products Summary
Engineering reference data for EP3C55F484C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C55F484C6 | EP3C55F484C7N | EP3C55F484C8N |
|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera |
| Package | FBGA-484 | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same |
| Number of Logic Elements | 55856 | 55856 | 55856 | 55856 |
| Number of User I/O | 327 | 327 | 327 | 327 |
| Total RAM Bits | 2396160 | 2396160 | 2396160 | 2396160 |
| Speed Grade | 6 | 6 | 7 | 8 |
| Operating Temperature Grade | Commercial (0 to +85C) | Commercial (0 to +85C) | Commercial (0 to +85C) | Commercial (0 to +85C) |
| RoHS / Lead-Free Finish | Yes (N suffix) | No (missing N suffix) | Yes (N suffix) | Yes (N suffix) |
Key Differentiators
- Top speed grade among commercial FBGA-484 Cyclone III parts (vs EP3C55F484C7N)
- RoHS-compliant N suffix in a 1.0 mm pitch package (vs EP3C55F484C6)
- Broad availability and active lifecycle (vs EP3C55F484C8N)
Design Notes
The EP3C55F484C6N requires a clean 1.2 V VCCINT core supply. Estimate: a mid-density Cyclone III with 55K LEs and 30% toggle rate may dissipate 0.5 to 1.5 W; at 1.2 V this means 0.4 to 1.25 A from the core regulator. Use one 100 nF ceramic capacitor per VCC pin, a 4.7 µF bulk capacitor per supply plane corner, and mount the low-dropout or DC-DC module close to the BGA. Connect all VCCA and VCCD_PLL pins to filtered analog supplies for PLL noise immunity.
The FBGA-484 package has a 1 mm ball pitch and 23 × 23 mm body. Use a four-layer or higher stack-up with microvias or small 0.2 mm laser vias for fan-out. Add thermal vias under the package center if the Cyclone III has an exposed pad or thermal relief pad. Route differential I/O pairs with matched lengths and maintain 50 Ω single-ended impedance for LVCMOS lines crossing high-speed interfaces. Reference the VCCIO plane cleanly for each I/O bank to avoid SSO noise.
Do not leave unused configuration pins floating. Set MSEL pins to the selected configuration mode via pull-up/pull-down resistors, and terminate nCONFIG, DCLK, and DATA0 according to the Cyclone III handbook when using active serial configuration. All unused I/O pins should be tri-stated or configured as inputs with internal pull-ups in the Quartus software. Unconnected VCCIO pins should not be left floating; each bank must be powered to the voltage of its interfacing logic.
When using hundreds of parallel I/Os at high clock rates, simultaneous switching output (SSO) noise can corrupt signals. Minimize the number of outputs driven at the same edge or use the device's on-chip termination and slew-rate control. Keep trace lengths short between the FPGA and memory devices, and add series terminations for point-to-point high-speed outputs. Refer to the Cyclone III pin connection guidelines for per-bank current limits and power supply pin counts to prevent excessive ground bounce.
Compliance Information
The N suffix in the ordering code indicates a lead-free package and RoHS-compliance per Altera/Intel naming conventions. AEC-Q100 is not applicable because Cyclone III FPGAs are not automotive-qualified.
