Intel

EP3C55U484C7 - Cyclone III FPGA, 55K LEs, 484-FBGA | Intel

MPN: EP3C55U484C7 ✓ Active
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1.2 V Vdss 484-ball UBGA (Ultra-FineLine BGA) Package 437 MHz Speed 2,396,160 Memory
From $23.1 USD / Unit
MOQ: 1 |
Price updated: 2026-09-09
Volume Pricing
Qty Unit Price Extended
1 $38.5 $38.50
10 $34.2 $342.00
100 $29.85 $2,985.00
500 $26.4 $13,200.00
1,000 $23.1 $23,100.00
ℹ️ All prices are in USD

EP3C55U484C7 Overview

The Intel (Altera) EP3C55U484C7 is a low-power, high-volume Cyclone III FPGA offering 55,856 logic elements, 2,396,160 bits of embedded memory, and 156 embedded 18x18 multipliers in a 484-ball FineLine BGA package. The 'U' suffix denotes the UBGA (Ultra-fine BGA) 19x19 mm variant with 0.8 mm ball pitch, and the 'C7' speed grade delivers a maximum core performance around 437 MHz in the 65 nm CMOS process node. Operating voltage is 1.2 V core with a 1.2/2.5/3.0/3.3 V flexible I/O bank scheme.

A Field-Programmable Gate Array (FPGA) is a programmable logic device containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM (BRAM), DSP blocks, PLLs, and high-speed transceivers. Within the broader semiconductor taxonomy, FPGAs sit above general-purpose MCUs in design flexibility and below ASICs in unit-cost efficiency, making them ideal for parallel processing, custom datapaths, and hardware-accelerated computation. The Cyclone III family specifically targets cost-sensitive, power-conscious applications such as industrial control, video processing, and communications infrastructure where ASIC NRE costs are prohibitive.

Key features of the EP3C55U484C7 include 327 maximum user I/O pins, 4 PLLs, support for external memory interfaces including DDR/DDR, DDR2, and QDR II SRAM, and built-in configuration options such as Active Serial (AS), Passive Serial (PS), and JTAG. The device provides up to 20 global clock networks and supports hot-socketing for in-system reprogrammability without board-level shutdown.

Typical applications span industrial motor control, video surveillance and image processing pipelines, software-defined radio (SDR) baseband, low-cost ASIC prototyping, and embedded PCIe bridging. The high logic density combined with embedded DSP blocks and BRAM makes it suitable for digital signal processing functions where deterministic latency is required.

When designing with this FPGA, ensure proper power sequencing on the VCCINT (1.2 V) and VCCA/VCCIO rails, and place decoupling capacitors close to the BGA balls per Altera's recommended PCB layout guidelines. Designers must also provision for a JTAG download cable header for configuration and debugging. As of 2026-09-09, distributors including DigiKey and Octopart list the EP3C55U484C7 with active inventory.

Drop-in alternatives for EP3C55U484C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP3C55U484C7 (same form factor and footprint) — differing in Package, Logic Elements, Speed Grade, Family, Operating Temperature.

Intel
Logic Elements: 39,600
Family: Cyclone III (Low-Power FPGA)
Compare with EP3C55U484C7 →
Intel
Package: 484-FBGA (UBGA, 19x19 mm, 0.8 mm pitch)
Logic Elements: 39,600
Speed Grade: 8 (C8, slowest / lowest-cost)
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Intel
Package: 484-ball UBGA (FineLine BGA)
Logic Elements: 55,856 LE
Speed Grade: C6
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Intel
Package: 484-FBGA
Logic Elements: 55856 LE
Family: Cyclone III
Compare with EP3C55U484C7 →
Intel
Package: 484-pin UBGA (Ultra FineLine BGA), 19 mm × 19 mm
Logic Elements: 55,856
Operating Temperature: 0 °C to +85 °C (commercial)
Compare with EP3C55U484C7 →
Altera
Package: 484-FBGA (UBGA), 19x19 mm
Logic Elements: 55,856
Speed Grade: C8
Compare with EP3C55U484C7 →
Intel
Package: 484-UBGA (Ultra FineLine BGA), 19 x 19 mm, 1.0 mm pitch
Logic Elements: 55,856
Speed Grade: 8 (commercial, fastest)
Compare with EP3C55U484C7 →
Intel
Package: 484-FBGA (UBGA)
Logic Elements: 81,264
Speed Grade: -7 (commercial)
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Intel
Package: 484-ball UFBGA (UBGA-484), 19 x 19 mm, 0.8 mm pitch
Logic Elements: 100,448
Family: Cyclone III LS
Compare with EP3C55U484C7 →
Intel
Package: 484-ball UFBGA (U484, 19x19 mm)
Logic Elements: 70,208
Speed Grade: 7
Compare with EP3C55U484C7 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP3C55U484C8N

✅ Drop-In
Intel
📦 UBGA-484 (19x19 mm)
Cyclone III · EP3C55 · 55,856 · 2,396,160 · 3,491 · 250 · 156 · 4

✓ In Stock

$119.85 / Unit

View Datasheet →

EP3C55U484C6N

✅ Drop-In
Intel
📦 UBGA-484 (19x19 mm)
Field Programmable Gate Array (FPGA) · Cyclone III · 55856 LE · 55856 cells · 2396160 bit · 327 I/O · 1.2 V · 65 nm

✓ In Stock

$274.0589 / Unit

View Datasheet →

EP3C55U484C6

✅ Drop-In
Intel
📦 UBGA-484 (19x19 mm)
Cyclone III · 55,856 LE · 2,396,160 bits · 156 · 327 · 4 · 65 nm · 1.15 V to 1.25 V

✓ In Stock

$102.4 / Unit

View Datasheet →

EP3C40U484C8N

✅ Drop-In
Intel
📦 UBGA-484 (19x19 mm)
Cyclone III · Cyclone III (65 nm low-power FPGA) · 39,600 · 1,161,216 bits · 126 · 331 · 4 · 20

✓ In Stock

$71.04 / Unit

View Datasheet →

EP3C40U484C7N

✅ Drop-In
Intel
📦 UBGA-484 (19x19 mm)
Cyclone® III · Cyclone III (Low-Power FPGA) · 39,600 · 1,161,216 · 331 (maximum user I/O) · 2,481 · 39,600 · 1161216 bit

✓ In Stock

$119.4 / Unit

View Datasheet →

EP3C55U484C7 Maximum Ratings & Electrical Characteristics

Series Cyclone III
Logic Elements (LEs) 55,856
Logic Array Blocks (LABs) 3,488
Embedded Memory (bits) 2,396,160
Embedded Multipliers (18x18) 156
Maximum User I/O Pins 327
Number of PLLs 4
Maximum Operating Frequency 437 MHz
Process Technology 65 nm CMOS
Core Voltage 1.2 V
I/O Bank Voltages 1.2 V / 2.5 V / 3.0 V / 3.3 V
Package 484-ball UBGA (Ultra-FineLine BGA)
Package Dimensions 19 x 19 mm
Ball Pitch 0.80 mm
Speed Grade C7 (Commercial)
Operating Temperature 0C to +85C (Commercial)
Mounting Type Surface Mount (BGA)
RoHS Status Compliant

EP3C55U484C7 Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin A1 I/O — User I/O bank 1
Pin B1 I/O — User I/O bank 1
Pin AA1 I/O — User I/O bank 8
Pin AB1 I/O — User I/O bank 8
Pin AA22 I/O — User I/O bank 8
Pin AB22 I/O — User I/O bank 8
Pin VCCINT_PINS VCCINT — Core 1.2 V supply pins
Pin VCCA_PINS VCCA — Analog PLL 2.5 V supply pins
Pin VCCIO_BANK1 VCCIO1 — I/O bank 1 supply (1.2/2.5/3.0/3.3 V)
Pin VCCIO_BANK8 VCCIO8 — I/O bank 8 supply (1.2/2.5/3.0/3.3 V)
Pin GND_PINS GND — Common ground
Pin TCK TCK — JTAG clock
Pin TMS TMS — JTAG mode select
Pin TDI TDI — JTAG data in
Pin TDO TDO — JTAG data out
Pin nCONFIG nCONFIG — Configuration reset (active low)
Pin nSTATUS nSTATUS — Configuration status (active low)
Pin CONF_DONE CONF_DONE — Configuration complete
Pin MSEL0 MSEL0 — Configuration mode select bit 0
Pin MSEL1 MSEL1 — Configuration mode select bit 1
Pin MSEL2 MSEL2 — Configuration mode select bit 2
Pin DCLK DCLK — Configuration clock input
Pin DATA0 DATA0 — Configuration data bit 0

Typical Applications

EP3C55U484C7 is suitable for 6 applications: Industrial Motor Control, Video Surveillance and Image Processing, Software-Defined Radio (SDR) Baseband, ASIC Prototyping and Emulation, Embedded Display and Touch Controllers, Industrial Communication Gateways.

🏭

Industrial Motor Control

The EP3C55U484C7 fits industrial motor control due to its 156 embedded 18x18 multipliers for field-oriented control (FOC) math and 327 user I/O pins to interface PWM outputs, encoder feedback (QEP), and resolver inputs. The 55K logic elements and 2.4 Mbit BRAM handle multi-axis control loops with deterministic cycle times. Its 65 nm low-power CMOS process reduces heat dissipation in enclosed IP65 enclosures, while the industrial 0-85C temperature grade tolerates factory-floor environments. The 4 PLLs generate the precise clock trees required for synchronized multi-axis sampling at 10-20 kHz, and 437 MHz maximum frequency enables single-cycle MAC operations at the control loop rate. The 19x19 mm UBGA footprint suits compact integrated drive electronics (IDE) form factors.

🎥

Video Surveillance and Image Processing

The EP3C55U484C7 is well-suited to multi-channel video surveillance systems processing D1 to 720p streams from multiple cameras. Its 55K logic elements handle H.264 baseline encode at 30 fps per channel with 4-channel simultaneous capability, while the 156 DSP blocks accelerate DCT/IDCT and motion estimation kernels. The 2.4 Mbit embedded memory functions as line buffers and reference frame cache, eliminating external SRAM in compact designs. DDR/DDR2 external memory interfaces support main-stream video frame buffers. The 327 user I/O pins accommodate parallel video input from CMOS sensors, HDMI/DVI outputs, and Ethernet MAC connections for IP cameras. Low-power 65 nm technology is critical for fanless PoE-powered designs where the FPGA shares thermal budget with image sensor and power supply.

🌐

Software-Defined Radio (SDR) Baseband

The EP3C55U484C7 serves as an SDR baseband processor for narrowband to mid-bandwidth waveforms up to 20 MHz instantaneous bandwidth. Its 156 18x18 multipliers implement FFT (up to 1024-point) and channelization filters, while 2.4 Mbit BRAM holds FFT working sets and channelization filter taps. 437 MHz core clock rate supports real-time DDC/DUC at typical LTE/WiFi symbol rates. The 4 PLLs derive sample clocks for ADC/DAC interfaces and symbol-rate clocks independently. The device supports LVDS and LVPECL I/O standards on the 327 user I/Os for direct ADC/DAC connection. Low static power of the 65 nm Cyclone III process is advantageous in battery-backed tactical and portable SDR equipment where total system energy budget is constrained.

🖥️

ASIC Prototyping and Emulation

The EP3C55U484C7 provides a high-volume, low-cost platform for ASIC prototyping and pre-silicon validation of moderate-complexity ASIC designs. With 55K logic elements, 2.4 Mbit embedded memory, and 156 DSP blocks, it accommodates RTL designs of approximately 20-25K ASIC gates with full visibility through JTAG. The 327 user I/O pins enable breakout of standard interfaces (DDR2, USB, Ethernet MAC) for system-level test. Multi-FPGA partitioning with EP3C55 devices creates scalable ASIC prototypes that run at 50-100 MHz for software bring-up and verification. Quartus Prime supports incremental compilation and time-budget closure for iterative refinement. The mature Cyclone III tooling ecosystem includes reference flows for ARM Cortex-M and Cortex-R emulation used in IoT ASIC development.

📺

Embedded Display and Touch Controllers

The EP3C55U484C7 is suitable for embedded display controllers driving TFT-LCD panels up to 1366x768 (WXGA) resolution with capacitive touch overlay processing. Its 55K logic elements implement timing controller (TCON) signal generation, color depth enhancement, and adaptive backlight dimming algorithms. The 2.4 Mbit BRAM serves as frame buffer for partial-screen updates and gesture recognition scratch memory. 327 user I/Os handle RGB/LVDS panel interfaces, I2C/SPI touch controller links, and backlight driver control. Low power consumption supports always-on display applications in industrial HMI panels. The C7 speed grade supports 60-75 Hz refresh rates at WXGA resolution through the dedicated PLLs that generate pixel clocks independently from the system control logic.

🔧

Industrial Communication Gateways

The EP3C55U484C7 functions as a multi-protocol industrial gateway supporting EtherCAT, PROFINET, EtherNet/IP, and Modbus TCP simultaneously. Its 55K logic elements implement the protocol stacks in hardware for deterministic cycle times below 100 us, critical for industrial automation. The 4 PLLs generate independent clocks for each Ethernet MAC interface running at 100 Mbit/s or 1 Gbit/s. The 156 DSP blocks accelerate any signal processing for line monitoring and predictive maintenance. The 327 user I/Os interface to RS-485, RS-232, CAN, and SPI-based sensor buses. Extended 0-85C temperature range and mature 65 nm technology ensure long-term availability for factory-automation OEMs requiring 10-15 year product lifecycles.

Recommended Products Summary

EP3C55U484C8N Intel Used in: Industrial Motor Control EP4CE55F23I7N Intel Used in: Industrial Motor Control EP3C55F484C7N Intel Used in: Video Surveillance and Image Processing ADV7180 Video decoder companion chip Used in: Video Surveillance and Image Processing AD9648 14-bit 125 MSPS ADC companion Used in: Software-Defined Radio (SDR) Baseband AD9122 16-bit 1230 MSPS DAC companion Used in: Software-Defined Radio (SDR) Baseband EP3C120F780C7N Intel Used in: ASIC Prototyping and Emulation MT48LC16M16A2 External SDRAM for prototype memory expansion Used in: ASIC Prototyping and Emulation TFP401 DVI/HDMI receiver companion chip Used in: Embedded Display and Touch Controllers AR1021 Capacitive touch controller companion Used in: Embedded Display and Touch Controllers DP83848I Industrial Ethernet PHY companion Used in: Industrial Communication Gateways MAX3162E Multi-protocol serial transceiver companion Used in: Industrial Communication Gateways
What is the logic element count of EP3C55U484C7?
The EP3C55U484C7 contains 55,856 logic elements, with 2,396,160 bits of embedded memory and 156 embedded 18x18 multipliers. According to the Cyclone III device handbook, this positions the EP3C55 in the mid-density tier of the family, suitable for medium-complexity logic designs including video pipelines, motor control, and DSP functions.
How many user I/O pins does the EP3C55U484C7 have?
The EP3C55U484C7 supports a maximum of 327 user I/O pins in its 484-ball UBGA package. The actual usable I/O count depends on configuration scheme and pin assignments; users should refer to the pin tables in the Cyclone III device handbook for exact pinout by configuration mode.
What is the maximum operating frequency of EP3C55U484C7?
The EP3C55U484C7 in the C7 speed grade supports a maximum core frequency of approximately 437 MHz, per the Cyclone III datasheet. Actual operating frequency depends on design logic depth, routing, and I/O standard selected, and is typically constrained below this theoretical maximum.
Is the EP3C55U484C7 still in production as of 2026?
Yes, the EP3C55U484C7 remains active as of 2026-09-09, with inventory confirmed at distributors including DigiKey, Octopart-listed suppliers, and AIChipLink. Although the Cyclone III family is a mature 65 nm node product line, Intel continues to support the device for industrial and embedded applications.
What package does the EP3C55U484C7 use?
The EP3C55U484C7 uses a 484-ball Ultra-FineLine BGA (UBGA) package measuring 19 x 19 mm with a 0.80 mm ball pitch. The 'U' suffix in the part number designates the UBGA variant within the Cyclone III family, distinguishing it from other 484-ball FBGAs in the same pin count.
Where can I buy EP3C55U484C7 online?
The EP3C55U484C7 can be purchased through authorized distributors including DigiKey, Mouser, and secondary suppliers listed on Octopart. Pricing as of 2026-09-09 starts at approximately $38.50 for single-unit purchases, with tiered volume discounts available for production orders.
What is the price of EP3C55U484C7?
The unit price of EP3C55U484C7 as of 2026-09-09 starts at approximately $38.50 for quantity 1, dropping to about $29.85 at 100 units and $23.10 at 1000 units. Volume pricing reflects the mature Cyclone III product positioning and current distributor inventory levels.
What is the lead time for EP3C55U484C7 orders?
Lead time for EP3C55U484C7 as of 2026-09-09 typically ranges from 6 to 12 weeks for new production orders, depending on distributor stock. Authorized distributors including DigiKey and Mouser often have limited inventory for immediate shipment; engineering samples and small quantities are usually available from stock.
Is EP3C55U484C7 in stock at distributors?
As of 2026-09-09, the EP3C55U484C7 is listed as in stock at multiple distributors per Octopart aggregator data, including DigiKey and AIChipLink. Stock levels fluctuate; engineers should check real-time distributor inventories before placing production orders.
EP3C55U484C7 vs EP3C55F484C7N - which is better for industrial use?
The EP3C55U484C7 uses the 19x19 mm UBGA package while the EP3C55F484C7N uses the 23x23 mm FBGA package, but both share the same 484-ball footprint class. Both are commercial temperature grade; the F-suffix variant may be preferred when larger package with better thermal dissipation is needed, while the U-suffix variant suits space-constrained designs.
What is the difference between EP3C55U484C7 and EP3C55U484C8N?
The EP3C55U484C7 has a C7 speed grade (~437 MHz max), while the EP3C55U484C8N has a C8 speed grade (slower). The C7 is the faster grade and preferred when maximum performance is required; C8 may be available at lower cost or with relaxed timing closure requirements.
When should I choose EP3C55U484C7 over a Cyclone IV FPGA?
Choose the EP3C55U484C7 when designing for a mature, stable platform with extensive reference designs, or when matching existing inventory/PCB footprint. Choose Cyclone IV (e.g., EP4CE55) when lower static power, slightly higher performance, or newer tooling support is required - Cyclone IV offers process improvements at similar logic density.
What is the best drop-in replacement for EP3C55U484C7?
The EP3C55F484C7N is the closest drop-in equivalent, sharing the 484-ball BGA class with the same Cyclone III logic resources but in a slightly larger FBGA package. For same-package UBGA drop-in, the EP3C55U484C6N (lower speed grade) and EP3C55U484C8N (slower speed grade) are alternative choices within the same UBGA 484-ball footprint.
Where to download EP3C55U484C7 datasheet PDF?
The official Cyclone III device handbook and EP3C55 datasheet can be downloaded from the Intel FPGA documentation center at intel.com. Distributors including DigiKey and Mouser also host the PDF datasheet on their product pages for direct download.
Where to find EP3C55U484C7 pinout?
The EP3C55U484C7 pinout is documented in the Cyclone III device handbook available at intel.com. The 484-ball UBGA pin assignment table specifies ball coordinates, I/O bank grouping, and pin function for each ball, and is essential for PCB layout and signal integrity verification.
What are the key specifications of EP3C55U484C7 that engineers should know?
The EP3C55U484C7 features 55,856 logic elements, 2,396,160 bits of embedded memory (BRAM), 156 embedded 18x18 multipliers, 4 PLLs, 327 maximum user I/O, 1.2 V core voltage, and a 437 MHz maximum internal frequency. The 484-ball UBGA package at 19x19 mm with 0.8 mm pitch suits space-constrained industrial and embedded designs in the Cyclone III family.
Hey Google, what can replace EP3C55U484C7?
Drop-in replacements for EP3C55U484C7 include EP3C55F484C7N (FBGA variant, same Cyclone III die), EP3C55U484C6N (C6 speed grade, same UBGA package), and EP3C55U484C8N (C8 speed grade, same UBGA package). For migration to newer families, the Cyclone IV EP4CE55F23 (similar LE count) is a functional successor but requires PCB redesign due to different package.

Engineering reference data for EP3C55U484C7 — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP3C55U484C7 when your design requires 40-55K logic elements, 2+ Mbit embedded memory, and 100+ DSP multipliers within the cost-sensitive Cyclone III family, and you need the 0.8 mm pitch UBGA-484 footprint for space-constrained PCBs. Choose EP3C55U484C8N (C8 grade) when timing closure can be achieved at 300-350 MHz and you want the lowest unit cost within the 55K family. Choose EP3C55U484C6N (C6 grade) only when you need maximum headroom above 437 MHz, although C6 is rarely stocked. Choose EP3C40U484C7N when 40K LEs suffices - the same UBGA-484 footprint is preserved, simplifying PCB layout reuse. For migration to newer families, consider Cyclone IV EP4CE55F23 as a functional successor but plan for PCB redesign and tool migration.

Comparison with Alternatives

Parameter This Product EP3C55U484C8N EP3C55U484C6N EP3C55U484C6 EP3C40U484C8N EP3C40U484C7N
Package UBGA-484 (19x19 mm) UBGA-484 (19x19 mm) - same UBGA-484 (19x19 mm) - same UBGA-484 (19x19 mm) - same UBGA-484 (19x19 mm) - same UBGA-484 (19x19 mm) - same
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Logic Elements 55,856 55,856 55,856 55,856 39,600 39,600
Embedded Memory (bits) 2,396,160 2,396,160 2,396,160 2,396,160 1,161,216 1,161,216
18x18 Multipliers 156 156 156 156 126 126
Max User I/O 327 327 327 327 331 331
Speed Grade C7 (~437 MHz) C8 (~370 MHz) C6 (~500 MHz) C6 (~500 MHz) C8 (~370 MHz) C7 (~437 MHz)
PLLs 4 4 4 4 4 4
Core Voltage 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V

Key Differentiators

  • Highest available performance within same-package UBGA-484 family (vs EP3C55U484C8N)
  • Maximum logic resources for UBGA-484 footprint (vs EP3C40U484C7N)
  • Lower power versus Cyclone IV/10LP at similar density (vs EP4CE55F23I7N)

Design Notes

The EP3C55U484C7 requires separate supply rails for VCCINT (1.2 V core), VCCA (2.5 V analog PLL), and VCCIO (1.2/2.5/3.0/3.3 V per bank). Power sequencing must follow Altera's recommended sequence: VCCINT first, then VCCA, then VCCIO. Each VCCINT ball should have a 0.1 uF decoupling capacitor placed within 50 mil trace length, plus bulk decoupling per Altera's PDN design guide. Estimated quiescent current at 1.2 V core is approximately 350-450 mA depending on logic utilization.

The 484-ball UBGA at 0.80 mm pitch requires PCB design rules with via-in-pad recommended for breakout routing. Use 4-6 layer stack-up with dedicated ground and power planes. Escape routing must use dog-bone or via-in-pad patterns; signal trace impedance of 50 ohm single-ended should be maintained for LVDS pairs. Power plane islands should be created for VCCINT and VCCA domains to reduce switching transients. Thermal vias under the BGA are recommended even for commercial temperature designs.

Common pitfalls with the EP3C55U484C7 include: (1) forgetting to strap MSEL pins for the correct configuration mode (AS/PS/JTAG), which causes configuration failures; (2) neglecting configuration CRC and error checking, leading to silent bit errors; (3) undersized cooling for designs using >60% logic utilization with sustained switching; (4) using nCONFIG reset without proper pull-up to VCCIO; (5) failing to enable the JTAG IDCODE instruction before board bring-up, complicating debug. Always verify configuration mode and JTAG chain integrity before logic debug.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS compliant per Intel/Altera product page. Not AEC-Q100 qualified - not intended for automotive. Lead-free ball finish.

Data verified on: 2026-09-09 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Intel Altera EP3C55U484C7 EP3C55U484C8N EP3C55U484C6N EP3C55U484C6 EP3C40U484C8N EP3C40U484C7N Cyclone III FPGA Field-Programmable Gate Array Logic Elements Embedded Memory BRAM DSP block 18x18 multiplier PLL UBGA-484 FineLine BGA 65 nm CMOS Quartus Prime JTAG DDR2 AEC-Q100 RoHS
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