EP3C5U256C7 - Cyclone III FPGA, 5K LE, 256-UBGA | Altera
MPN: EP3C5U256C7 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $26.77 | $26.77 |
| 10 | $24.5 | $245.00 |
| 100 | $21.2 | $2,120.00 |
| 500 | $18.4 | $9,200.00 |
| 1,000 | $16.1 | $16,100.00 |
EP3C5U256C7 Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic functionality is defined by the user after manufacturing, rather than at the fab. FPGAs sit alongside microcontrollers, microprocessors, ASICs, and CPLDs in the programmable logic hierarchy, and they are the dominant solution when time-to-market, parallelism, hardware re-programmability, or high I/O bandwidth outweigh the absolute lowest unit cost of an ASIC. The Cyclone III family from Intel/Altera occupies the low-end, low-power segment of that hierarchy, optimized for high-volume consumer, industrial, automotive, communications, and broadcast applications.
The EP3C5U256C7 features 5,136 logic elements, 321 logic array blocks, 46 embedded 18x18 multipliers, 23 embedded M9K memory blocks (423,936 total RAM bits), and four general-purpose PLLs. Its 256-ball UBGA package provides 182 available user I/Os arranged in eight I/O banks supporting multiple I/O standards including LVDS, LVTTL, LVCMOS, PCI, and SSTL. The device supports Nios II embedded processor soft cores and is configured via serial or parallel flash using the active serial (AS) configuration scheme.
Typical applications for the EP3C5U256C7 span consumer video processing (display controllers, video bridging, low-end set-top boxes), industrial control and machine-to-machine (M2M) gateways, automotive infotainment and driver-assist subsystems, communications line cards and bridges, broadcast video encoding, and portable/mobile systems where the low-power 65nm process and wide I/O flexibility deliver the best price/performance balance.
When designing with this device, plan power sequencing carefully: the Cyclone III core and I/O banks operate from multiple supply rails (VCCINT, VCCIO per bank, VCCA, VCCD_PLL), and decoupling bulk capacitors must be placed adjacent to each power pin per the pin connection guidelines. Confirm Quartus II or Quartus Prime software support for the -7 speed grade and your target I/O standard before PCB fabrication.
This page synthesizes distributor pricing as of 2026-09-09, drop-in alternatives from the same Altera/Intel Cyclone III family, and practical design notes not aggregated on any single manufacturer or distributor page.
Drop-in alternatives for EP3C5U256C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C5U256C7 (same form factor and footprint) — differing in Speed Grade, Package, Process Technology, Logic Elements, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3C5U256C7N
✅ Drop-In✓ In Stock
$17.85 / Unit
View Datasheet →EP3C5U256C6N
✅ Drop-In✓ In Stock
$25.4 / Unit
View Datasheet →EP3C5U256C6
✅ Drop-In✓ In Stock
$10.85 / Unit
View Datasheet →EP3C5U256A7N
✅ Drop-In✓ In Stock
$16.2 / Unit
View Datasheet →EP3C5U256C7 Maximum Ratings & Electrical Characteristics
| Series | Cyclone III |
| Logic Elements | 5,136 |
| Total RAM Bits | 423,936 |
| Logic Array Blocks (LABs) | 321 |
| Embedded Multipliers (18x18) | 46 |
| Embedded Memory Blocks (M9K) | 23 |
| PLLs | 4 |
| Maximum User I/O | 182 |
| Package | 256-UBGA (Ultra FineLine BGA) |
| Maximum I/O Pins in Package | 256-LFBGA / 256-UBGA |
| Process Technology | 65 nm low-k CMOS |
| Speed Grade | -7 (commercial) |
| Operating Junction Temperature | 0C to 85C (commercial) |
| Supply Voltage - Core (VCCINT) | 1.15 V to 1.25 V |
| Supply Voltage - I/O (VCCIO per bank) | 1.2 V to 3.3 V (bank-dependent) |
| Configuration Mode | Active Serial (AS), Passive Serial (PS), JTAG |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
EP3C5U256C7 256-lfbga / 256-ubga Pin Configuration Guide
Pin configuration for EP3C5U256C7 (256-lfbga / 256-ubga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3C5U256C7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3C5U256C7 is suitable for 6 applications: Display Controllers and Video Bridging, Industrial Control and Machine-to-Machine Gateways, Automotive Infotainment and Telematics, Communications Line Cards and Protocol Bridging, Broadcast Video Encoding and Processing, Portable and Mobile Embedded Systems.
Display Controllers and Video Bridging
The EP3C5U256C7 is well-suited for mid-resolution display controllers and video format converters (e.g., RGB to LVDS, HDMI splitters up to 1080p60). Its 5,136 LEs and 46 hard 18x18 multipliers absorb pixel pipelines, color-space conversion matrices, and on-screen-display blending. The 256-UBGA package exposes 182 user I/Os across 8 banks, enabling simultaneous 24-bit parallel RGB, SPI flash control, and I2C side-channels. Estimated: a typical 720p60 input + scaler + dual-output design consumes ~70% LEs and ~50% block RAM, fitting comfortably within EP3C5 capacity.
Recommended
Industrial Control and Machine-to-Machine Gateways
Industrial controllers and M2M gateways benefit from the EP3C5U256C7's flexible I/O bank voltage support (1.2V to 3.3V per bank), allowing direct interface to legacy 5V-tolerant peripherals via level shifters and to modern 1.8V/2.5V sensors without external translation. The four general-purpose PLLs can synthesize the precise baud clocks for CAN, RS-485, and Profibus segments. Hard 18x18 multipliers accelerate FIR filters for vibration analysis and motor-control math. Industrial designers should still consider the EP3C5E144C8N for footprint-constrained PCBs and the I-grade variants for -40C to +100C operation.
Recommended
Automotive Infotainment and Telematics
For automotive infotainment head units, telematics control units, and instrument-cluster graphics, the EP3C5U256C7 (commercial 0C-85C) is positioned at the lower end. Designers targeting AEC-Q100 environments should migrate to the A7 speed-grade variants (e.g., EP3C5U256A7N) which use the automotive I/Q flow, or select the I-suffix (industrial -40C to +100C) parts when full AEC qualification is required. The device's CAN IP cores, MediaLB interfaces, and LVDS display links make it a flexible bridge between automotive ASICs and TFT panels.
Recommended
Communications Line Cards and Protocol Bridging
The Cyclone III family's low static power (industry-leading for its generation) makes the EP3C5U256C7 attractive for always-on communications line cards, low-density protocol bridges (e.g., SPI-to-I2C, UART-to-Ethernet), and TDM-over-Packet aggregation. The 4 PLLs drive multiple independent clock domains for E1/T1, I2S audio, and Ethernet PHYs simultaneously. With 23 M9K blocks (423 Kbits), designers can buffer multiple packet streams without external SRAM, simplifying board layout.
Recommended
Broadcast Video Encoding and Processing
Broadcast encoder modules, multiviewers, and small-format video mixers (SD/HD-SDI processing, frame synchronizers) often target Cyclone III devices for their DSP multiplier density and low-power operation. The EP3C5U256C7's 46 hard 18x18 multipliers implement multiple parallel chroma-luma conversion and scaling kernels; its high block-RAM bandwidth supports line buffers for deinterlacing. For 3G-SDI or full 4K workloads, migrate to the EP3C25 or larger Cyclone III variants.
Recommended
Portable and Mobile Embedded Systems
Because the Cyclone III family was designed on a 65nm low-power process, the EP3C5U256C7 is suitable for portable, battery-powered, or fan-less embedded systems where total power budget is critical. Designs can use the device's on-chip PLLs to gate clocks dynamically and instantiate multiple low-power MegaCore functions. The 256-UBGA package is 17 mm x 17 mm, fitting comfortably inside handheld enclosures, and supports JTAG boundary-scan for in-field firmware updates.
Recommended
Recommended Products Summary
Engineering reference data for EP3C5U256C7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C5U256C7N | EP3C5U256C6N | EP3C5U256C6 | EP3C5U256A7N |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 256-UBGA (17x17 mm) | 256-UBGA - same | 256-UBGA - same | 256-UBGA - same | 256-UBGA - same |
| Logic Elements | 5,136 | 5,136 | 5,136 | 5,136 | 5,136 |
| Speed Grade | -7 (commercial) | -7 | -6 | -6 | -7 (automotive flow) |
| Terminal Finish (RoHS) | SnPb (non-N) | Lead-free (RoHS) | Lead-free (RoHS) | SnPb (non-N) | Lead-free (RoHS) |
| Logic Array Blocks | 321 | 321 | 321 | 321 | 321 |
| Embedded Multipliers (18x18) | 46 | 46 | 46 | 46 | 46 |
| Total RAM Bits | 423,936 | 423,936 | 423,936 | 423,936 | 423,936 |
| Maximum User I/O | 182 | 182 | 182 | 182 | 182 |
| PLLs | 4 | 4 | 4 | 4 | 4 |
| Configuration Mode | AS / PS / JTAG | AS / PS / JTAG | AS / PS / JTAG | AS / PS / JTAG | AS / PS / JTAG |
| Process / Family | 65 nm / Cyclone III | 65 nm / Cyclone III | 65 nm / Cyclone III | 65 nm / Cyclone III | 65 nm / Cyclone III |
Key Differentiators
- Lowest-cost 5K-LE Cyclone III in the largest I/O package (vs EP3C5F256C7)
- Commercial-grade C7 speed bin with the highest Fmax in this 5K-LE family (vs EP3C5U256C6N)
- Drop-in compatible with automotive I/Q test flow variants (vs EP3C5U256A7N)
Design Notes
The Cyclone III EP3C5U256C7 requires multiple supply rails: VCCINT (1.15-1.25 V core), VCCIO per bank (1.2-3.3 V), VCCA (analog 2.5 V), and VCCD_PLL (1.2 V). Per the Cyclone III device handbook pin connection guidelines, each VCCINT/VCCIO ball must have a 0.1 uF decoupling capacitor placed within ~50 mils of the ball and a bulk capacitor placed nearby. Estimated: with VCCINT at 1.2 V and typical dynamic power of ~200 mW plus static ~50 mW, the 1.2 V rail should be sourced with at least 500 mA headroom.
The 256-UBGA package uses a 1.0 mm ball pitch — within the range of standard SMT assembly but tighter than QFP packages. Use 0.5 mm via-in-pad with filled-and-capped plating for the inner rows to escape signals on a 4-layer board. Recommend microvia stack-up on 6+ layer boards. Per IPC-7351 and the Altera BGA layout guidelines, ball pads should be NSMD (non-solder-mask defined) with a 0.45 mm pad diameter for reliable assembly yield.
Do not leave configuration pins floating: MSEL[0..3] must be tied high or low through a resistor to select AS vs PS vs JTAG mode. CONF_DONE must be pulled high with a 10 kohm resistor to VCCIO of the configuration bank. nCONFIG must be tied to VCCIO through a 10 kohm resistor and debounced if exposed to a push-button. Forgetting these pull-ups is the single most common cause of 'bricked' Cyclone III boards that appear dead at first power-up.
Estimated thermal dissipation: at typical LE utilization (~70%) and 100 MHz internal clock, the EP3C5U256C7 dissipates roughly 250-400 mW. The 256-UBGA package has a theta_JA of approximately 25-30 C/W on a 4-layer JEDEC test board, giving a junction-temperature rise of ~10 C above ambient. For fan-less industrial enclosures, place the device on a continuous internal ground/power plane and avoid placing it adjacent to heat sources (LDOs, DC-DC converters) without copper thermal relief.
Compliance Information
EP3C5U256C7 is supplied in lead-free terminal finish per Altera/Intel product page; for the legacy SnPb-finish variant use the non-N suffix. AEC-Q100 qualification is NOT available for the C7 commercial speed grade — choose the A7 automotive I/Q flow or I7 industrial grade for harsh-environment designs.
