EP3C80U484C6 - Cyclone III FPGA, 81K LE, 484-UBGA | Intel
MPN: EP3C80U484C6 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72.3 | $723.00 |
| 100 | $64.9 | $6,490.00 |
| 500 | $58.2 | $29,100.00 |
| 1,000 | $52.4 | $52,400.00 |
EP3C80U484C6 Overview
A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware such as block RAM and DSP blocks. FPGAs belong to the broader class of programmable logic devices (PLDs) within the digital IC hierarchy, sitting between fixed-function ASICs (lower NRE, lower flexibility) and software-driven microcontrollers (lower density, sequential execution). The Cyclone III family specifically targets the "low-cost, low-power" segment of this hierarchy, displacing ASICs and DSP+microcontroller combinations in high-volume industrial, consumer, and automotive designs.
Key features of the EP3C80U484C6 include four phase-locked loops (PLLs) for clock management, up to 295 user I/Os supporting LVDS, LVTTL, and other single-ended I/O standards, dedicated 18x18 hardware multipliers (244 total) for DSP workloads, and Cyclone III's signature low static power architecture. The C6 speed grade places this part in the mid-speed tier for the family, while the commercial (0C to 85C) temperature rating keeps cost below industrial equivalents.
Architecture-wise, the Cyclone III device is fabricated on a 65nm TSMC process and uses a logic-structure of LABs (Logic Array Blocks) containing 16 logic elements each. The Memory blocks total 4,488,888 bits when M9K memories are fully utilized, and embedded memory supports true dual-port, simple dual-port, and single-port modes at up to 315 MHz. JTAG and passive serial configuration interfaces are standard, with optional on-chip configuration decompression and decompression acceleration.
Typical applications include industrial motor control, video surveillance and image processing, telecom line cards, USB/Ethernet bridging, low-cost ASIC prototyping, and embedded automotive infotainment pre-production. The 484-UBGA package suits designs that need maximum I/O count while accepting BGA assembly costs.
When designing with the EP3C80U484C6, ensure PCB layout uses microvia-compatible stackup for the 1.0mm pitch BGA and that all four PLL analog supplies are properly filtered. Designers migrating from Cyclone II can reuse most RTL with Quartus II version 9.0 or later, but should re-verify timing closure because the LAB architecture changed.
This page synthesizes current distributor pricing, drop-in same-package alternatives within the Cyclone III family, and practical design notes that complement the manufacturer datasheet.
Drop-in alternatives for EP3C80U484C6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C80U484C6 (same form factor and footprint) — differing in Package, Process Technology, Speed Grade, Family, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3C80F484C6N
✅ Drop-In✓ In Stock
$369.38 / Unit
View Datasheet →EP3C80F484C6
✅ Drop-In✓ In Stock
$102.5 / Unit
View Datasheet →EP3C80F484C7N
✅ Drop-In✓ In Stock
$306.54 / Unit
View Datasheet →EP3C80F484C7
✅ Drop-In✓ In Stock
$215 / Unit
View Datasheet →EP3C80F484C8N
✅ Drop-In✓ In Stock
$208.75 / Unit
View Datasheet →EP3C80F484I7N
✅ Drop-In✓ In Stock
$286.91 / Unit
View Datasheet →EP3C80U484C6 Maximum Ratings & Electrical Characteristics
| Family | Cyclone III |
| Logic Elements | 81,264 |
| Total RAM Bits | 2,810,880 |
| Number of LABs/CLBs | 5079 |
| Number of Logic Elements/Cells | 81264 |
| Total Memory Bits | 2810880 |
| Number of I/O | 295 |
| Number of Gates | Not specified in provided data |
| Voltage - Supply | 1.15 V to 3.3 V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +85C (Commercial) |
| Package / Case | 484-FBGA / 484-UBGA |
| Supplier Device Package | 484-UBGA (19x19 mm) |
| Speed Grade | 6 |
| Number of PLLs | 4 |
| Number of 18x18 Multipliers | 244 |
| Process Technology | 65 nm |
| RoHS Status | Compliant |
| Configuration Interface | JTAG, Passive Serial |
EP3C80U484C6 484-ubga (19x19 mm) Pin Configuration Guide
Pin configuration for EP3C80U484C6 (484-ubga (19x19 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3C80U484C6.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3C80U484C6 is suitable for 6 applications: Industrial Motor Control, Video Surveillance and Image Processing, Telecom Line Cards and Protocol Bridging, USB and Ethernet Bridging, ASIC Prototyping and Pre-Silicon Validation, Automotive Infotainment Pre-Production.
Industrial Motor Control
The EP3C80U484C6 fits industrial motor control because 81,264 logic elements and 244 dedicated 18x18 multipliers handle multi-axis field-oriented control (FOC) algorithms with closed-loop PID and encoder feedback. Its 295 user I/Os support multiple PWM channels, quadrature decoders, and analog feedback paths. Industrial-grade variants exist within the same FBGA package. Designers benefit from Quartus II DSP Builder integration and low static power consumption.
Recommended
Video Surveillance and Image Processing
The EP3C80U484C6 suits video surveillance applications with 2,810,880 bits of embedded RAM supporting line buffering for HD video pipelines at 720p and 1080p. The 244 hardware multipliers accelerate motion estimation and edge-detection algorithms. LVDS I/O support enables direct connection to CMOS image sensors without external bridge chips. Quartus II Video and Image Processing Suite provides ready IP cores for H.264 encoding and JPEG compression.
Recommended
Telecom Line Cards and Protocol Bridging
The EP3C80U484C6 handles telecom line card glue logic, TDM-to-Ethernet bridging, and HDLC/PPP framing with ample logic density and 4 PLLs for independent clock domain generation. Its 295 I/Os accommodate multiple SERDES-less serial interfaces (SPI, I2C, UART, parallel RapidIO) and LVDS backplane connections. Designers use MegaWizard IP functions in Quartus II for quick protocol stack implementation.
Recommended
USB and Ethernet Bridging
The EP3C80U484C6 serves as a USB-to-Ethernet or USB-to-multiple-interface bridge controller, using soft IP cores for USB 2.0 device/host stacks and 10/100 Ethernet MACs. The 65nm process and Cyclone III low-power architecture keep idle consumption low, suitable for bus-powered designs. With 81,264 LE, the FPGA can run protocol stacks alongside custom application logic in a single chip.
Recommended
ASIC Prototyping and Pre-Silicon Validation
The EP3C80U484C6 is widely used for ASIC prototyping because 81,264 LE plus 244 dedicated multipliers can map most medium-complexity ASIC RTL blocks. The 484-ball FBGA supports high pin-count designs, and Quartus II supports incremental compilation for fast design iteration. Engineers typically partition large ASIC designs across multiple FPGAs using this part as the high-density node.
Recommended
Automotive Infotainment Pre-Production
The EP3C80U484C6 supports pre-production automotive infotainment designs including head-unit display controllers, rear-seat entertainment hubs, and CAN/LIN gateway modules. The Cyclone III family has AEC-Q100 qualified variants within the same package family, and the commercial variant suits development and pre-production fleets. Designers migrate to industrial temp or AEC-Q100 parts for production deployment.
Recommended
Recommended Products Summary
Engineering reference data for EP3C80U484C6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C80F484C6N | EP3C80F484C7N | EP3C80F484C8N | EP3C80F484I7N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 484-UBGA (19x19 mm) | 484-FBGA - same footprint | 484-FBGA - same footprint | 484-FBGA - same footprint | 484-FBGA - same footprint |
| Logic Elements | 81,264 | 81,264 | 81,264 | 81,264 | 81,264 |
| Total RAM Bits | 2,810,880 | 2,810,880 | 2,810,880 | 2,810,880 | 2,810,880 |
| User I/O Count | 295 | 295 | 295 | 295 | 295 |
| Speed Grade | 6 | 6 | 7 | 8 | 7 |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| Number of PLLs | 4 | 4 | 4 | 4 | 4 |
| Lead-Free / RoHS | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Largest logic density in Cyclone III family with U484 (UBGA) package (vs EP3C55U484C6)
- Same 484-FBGA footprint across multiple temperature and speed variants (vs EP3C120F780C7N)
- Four PLLs versus two in smaller Cyclone III devices (vs EP3C16F484C8N)
Design Notes
The 484-UBGA package uses 1.0 mm ball pitch on a 19x19 mm body. PCB stackup should include microvia-compatible layers (laser-drilled microvias preferred) for fanout routing. Use a 4-layer minimum stackup with continuous GND plane beneath the BGA to control impedance and provide thermal dissipation. Decoupling: place 0.1uF and 10uF capacitors on every VCCINT, VCCA, and VCCIO bank supply pin within 5mm trace length.
The EP3C80U484C6 requires three supplies: VCCINT (1.2 V core), VCCIO (1.2 V to 3.3 V per bank), and VCCA (2.5 V for PLLs). Use a low-noise LDO or DC-DC for VCCA because PLL jitter is sensitive to analog supply noise. Power sequencing is not required (hot-socketable), but Intel recommends VCCIO come up before VCCINT transitions to avoid latch-up. Typical ICCINT at 81K LE utilization is approximately 1.5-2.0 A.
Estimated: at typical 65nm Cyclone III utilization (60-70% LE) and 100 MHz operation, junction power dissipation is approximately 1.5-2.5 W. The 484-UBGA package theta-JA is approximately 15 C/W with proper PCB thermal vias (9-16 thermal vias under the package center). At maximum logic utilization with high toggle rates, power can reach 4 W - in this case, attach a small heatsink or use 2oz copper inner layers for spreading.
Differential pair routing (LVDS): maintain 100 ohm differential impedance with 8-10 mil trace width and 6-8 mil spacing on a 4-layer stackup. Match intra-pair length to within 10 mils and pair-to-pair length to within 50 mils. Clock traces should be length-matched to within 25 mils across all PLL-driven outputs. Place series termination resistors within 200 mils of the driver pin.
Common pitfalls: (1) Using the U484 (UBGA) package but routing for F484 (FBGA) - the ball patterns differ, confirm exact package code. (2) Exceeding 295 user I/O without accounting for bank restrictions - I/O standards must be uniform per bank. (3) Skipping configuration mode selection - leave MSEL pins tied to the right logic levels for the desired configuration scheme (AS, PS, JTAG). (4) Forgetting that NRND parts may have reduced long-term availability - plan second-source now.
Compliance Information
RoHS and lead-free per Intel product page. Commercial temperature grade; AEC-Q100 qualified variants exist in the same Cyclone III family (EP3C80F484 automotive variants). Part is NRND as of 2026-09-09.
