EP3CLS200F780I7 - Cyclone III LS FPGA, 198K LE, 780-FBGA | Intel
MPN: EP3CLS200F780I7 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $220 | $220.00 |
| 10 | $198.5 | $1,985.00 |
| 100 | $175 | $17,500.00 |
| 500 | $158 | $79,000.00 |
| 1,000 | $142.5 | $142,500.00 |
EP3CLS200F780I7 Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric. After manufacture, the designer defines the digital function by loading a configuration bitstream into on-chip SRAM, making FPGAs ideal for prototyping, low-volume production, parallel DSP, and designs requiring frequent hardware revision. Cyclone III LS sits inside Intel's Cyclone III family hierarchy (Cyclone III -> Cyclone family -> low-cost FPGA -> FPGA -> programmable logic -> semiconductor), offering the lowest static power in the family while preserving the family's high logic density and DSP throughput.
Key features of the EP3CLS200F780I7 include 4 phase-locked loops (PLLs), up to 429 user I/O pins, and dedicated hardware multipliers for DSP blocks. The LS variant reduces static power compared to the standard Cyclone III device through optimized process tuning, while retaining the same logic capacity and I/O bandwidth. Configuration is supported through JTAG, Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP) modes for flexible design loading across production lines and field updates.
The 780-pin FBGA package provides dense interconnect for high I/O-count designs, with lanes capable of supporting LVDS signaling for chip-to-chip high-speed links. Each LAB (Logic Array Block) groups 16 logic elements and is the basic building block of the Cyclone III LS fabric. The device targets applications where low static power, deterministic timing, and large logic capacity must be balanced with industrial-grade temperature operation.
Typical applications include industrial motor and servo control, video processing and image buffering, automotive driver-assistance prototyping, telecommunications line-card glue logic, and software-defined radio front-ends. Designers select this device when deterministic latency, parallel DSP throughput, and flexible I/O standards are required.
When designing with the EP3CLS200F780I7, ensure proper decoupling with 100 nF ceramic capacitors placed close to each power pin, follow Intel's recommended FPGA PCB layout guidelines for BGA fanout and ground stitching, and verify the Quartus II design software version supports the device family revision. Industrial temperature grade ensures operation from -40 C to +85 C ambient.
This page synthesizes distributor inventory and pricing, drop-in alternatives sourced from the same Cyclone III LS family, application reference designs, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP3CLS200F780I7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3CLS200F780I7 (same form factor and footprint) — differing in Speed Grade, RoHS Status, Package, Process Technology, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3CLS200F780I7N
✅ Drop-In✓ In Stock
$240 / Unit
View Datasheet →EP3CLS200F780C8N
✅ Drop-In✓ In Stock
$943.88 / Unit
View Datasheet →EP3CLS200F780C8
✅ Drop-In✓ In Stock
$1995 / Unit
View Datasheet →EP3CLS200F780C8ES
✅ Drop-In✓ In Stock
$215 / Unit
View Datasheet →EP3CLS200F780C7N
✅ Drop-In✓ In Stock
$199.5 / Unit
View Datasheet →EP3CLS200F780C7
✅ Drop-In✓ In Stock
$102.4 / Unit
View Datasheet →EP3CLS200F780I7 Maximum Ratings & Electrical Characteristics
| Series | Cyclone III LS |
| Device Family | Cyclone III LS |
| Logic Elements | 198,464 |
| Logic Array Blocks (LABs) | 12,040 LAB |
| Total Memory Bits | 8,475 Kbits |
| Embedded 18x18 Multipliers | 396 |
| User I/O Pins | 429 |
| PLLs | 4 |
| Maximum Operating Frequency | 274 MHz |
| Core Supply Voltage | 1.15 V to 1.25 V |
| Package | 780-BGA (FBGA) |
| Package Pins | 780 |
| Mounting Type | Surface Mount (SMD/SMT) |
| Operating Temperature | -40 C to +85 C (Industrial) |
| Configuration Modes | JTAG, AS, PS, FPP |
| RoHS Status | Compliant |
| Moisture Sensitivity Level | MSL 3 |
EP3CLS200F780I7 780 Pin Configuration Guide
Pin configuration for EP3CLS200F780I7 (780 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3CLS200F780I7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3CLS200F780I7 is suitable for 6 applications: Industrial Motor and Servo Control, Video Processing and Image Buffering, Software-Defined Radio Front-End, Automotive Driver-Assistance Prototyping, Industrial Protocol Bridging and Gateways, Medical Imaging and Diagnostic Equipment.
Industrial Motor and Servo Control
The EP3CLS200F780I7 fits industrial multi-axis motor and servo control designs because its 198,464 logic elements and 396 embedded 18x18 multipliers can run several closed-loop control algorithms in parallel, while the 4 PLLs generate independent PWM carrier frequencies per axis. Cyclone III LS static-power optimization enables fan-less inverter designs. Placed on a motor-control PCB with isolated gate drivers and the 780-FBGA package delivering 429 user I/O, the device interfaces to position encoders, resolver-to-digital converters, and EtherCAT MAC cores. Compared to a discrete DSP+MCU architecture, the EP3CLS200F780I7 reduces BOM count and enables late-stage algorithm updates via JTAG bitstream reload.
Recommended
Video Processing and Image Buffering
The EP3CLS200F780I7 is well suited to video processing, format conversion, and frame buffering applications because its 8,475 Kbits of embedded RAM supports multiple line buffers and lookup tables for color-space conversion. The 780-FBGA package provides enough I/O bandwidth for parallel RGB/YCbCr interfaces up to 1080p, and the 396 dedicated multipliers accelerate convolution and scaling kernels. Deployed between a video decoder ASIC and an LCD controller, the device runs scalers, de-interlacers, and on-screen display overlays in real time. The static-power advantage of Cyclone III LS is meaningful in fan-less flat-panel TV and signage designs where thermal budget is constrained.
Recommended
Software-Defined Radio Front-End
The EP3CLS200F780I7 supports software-defined radio (SDR) baseband processing because its 396 18x18 multipliers handle FIR filtering, FFT butterflies, and channelization DSP, while the embedded RAM stores window coefficients and FFT twiddle factors. The 4 PLLs generate the multiple sample-rate clocks needed for ADC/DAC interfaces. Compared to ASIC DSP implementations, the FPGA enables protocol upgrades (LTE, 5G NR) without silicon respin. Placed between an ADC and a host processor, the EP3CLS200F780I7 implements digital down-conversion, decimation, and demodulation. The 780-FBGA package supports high-pin-count LVDS interconnect to high-speed converters.
Recommended
Automotive Driver-Assistance Prototyping
The EP3CLS200F780I7 fits advanced driver-assistance system (ADAS) prototyping because its 198K logic elements accommodate parallel image-processing pipelines for camera-based lane detection, object recognition, and sensor fusion. Industrial temperature grade (-40C to +85C) handles cabin and engine-bay thermal environments. Embedded multipliers accelerate Sobel, Canny, and HOG feature-extraction kernels. Mounted on an evaluation board with MIPI CSI-2 deserializer bridges and automotive Ethernet PHYs, the FPGA pre-processes multi-camera streams before forwarding them to an application processor. Designers can iterate perception algorithms via JTAG bitstream updates without retooling the PCB.
Recommended
Industrial Protocol Bridging and Gateways
The EP3CLS200F780I7 is suitable for industrial protocol bridges because its 198K logic elements and 429 user I/O pins simultaneously support PROFINET, EtherCAT, Modbus, CAN, and RS-485 interfaces in a single device. The embedded RAM buffers protocol frames, while the PLLs generate independent baud-rate clocks for each interface. Deployed in factory-floor gateways and PLC backplanes, the FPGA translates between incompatible industrial networks without external ASIC bridges. The industrial temperature grade ensures reliable operation in unheated cabinets and outdoor enclosures.
Recommended
Medical Imaging and Diagnostic Equipment
The EP3CLS200F780I7 supports medical imaging prototyping including ultrasound beamforming, endoscopy processing, and patient-monitoring data aggregation because its 198K logic elements and 396 multipliers run parallel DSP pipelines required for real-time image reconstruction. The 8,475 Kbits of embedded RAM stores beamforming samples and frame buffers. The 780-FBGA package provides the I/O bandwidth to interface with high-speed ADCs and LVDS displays. Industrial temperature grade supports stable operation in equipment-room thermal envelopes, and the FPGA's reconfigurability enables late-stage clinical-trial parameter updates without hardware changes.
Recommended
Recommended Products Summary
Engineering reference data for EP3CLS200F780I7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3CLS200F780I7N | EP3CLS200F780C8N | EP3CLS200F780C8 | EP3CLS200F780C8ES | EP3CLS200F780C7N | EP3CLS200F780C7 |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Logic Elements | 198,464 | 198,464 | 198,464 | 198,464 | 198,464 | 198,464 | 198,464 |
| Embedded Multipliers (18x18) | 396 | 396 | 396 | 396 | 396 | 396 | 396 |
| Embedded Memory (Kbits) | 8,475 | 8,475 | 8,475 | 8,475 | 8,475 | 8,475 | 8,475 |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Commercial (0C to 85C) | Commercial (0C to 85C) | Commercial (0C to 85C) | Commercial (0C to 85C) | Commercial (0C to 85C) |
| User I/O Pins | 429 | 429 | 429 | 429 | 429 | 429 | 429 |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Lead-Free Finish | Standard (with lead) | Yes (lead-free) | Yes (lead-free) | No | No | Yes (lead-free) | No |
Key Differentiators
- Highest-density Cyclone III LS option in the 780-FBGA package (vs EP3CLS150F780I7N)
- Industrial temperature grade across the full density range (vs EP3CLS200F780C8N)
- Drop-in identical-package variant for lead-free production (vs EP3CLS200F780I7N)
Design Notes
BGA fanout is critical for the 780-FBGA package. Use microvia-in-pad or dog-bone fanout with controlled impedance routing for high-speed LVDS pairs. Place 100 nF ceramic decoupling capacitors within 5 mm of each VCCINT and VCCA power pin, and add bulk 47 uF to 100 uF tantalum or polymer capacitors near the FPGA. Stitch the ground plane with 0.5 mm-spaced vias around the BGA perimeter to suppress return-path discontinuities.
Core supply (VCCINT) is 1.15 V to 1.25 V with tight tolerance (typically 1.2 V +/- 3%). Use a low-noise DC-DC regulator followed by an LDO for the final stage, with sequencing ensuring VCCINT rises no faster than 50 ms and no slower than 100 ms per Intel power-up specifications. I/O supply (VCCIO) supports multiple standards (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V) and must be configured before I/O operation.
Estimated: Cyclone III LS static-power reduction versus standard Cyclone III is meaningful, but the EP3CLS200F780I7 at full resource utilization can still dissipate 2 W to 3 W depending on toggle rate. At 85 C ambient industrial temperature, ensure the FBGA package thermal resistance (theta_JA approximately 12 C/W with adequate PCB copper) keeps junction temperature below 100 C. Use thermal vias under the BGA thermal balls and a continuous ground/power pour for heat spreading.
Do not confuse Cyclone III LS (low static power) with Cyclone III GX (transceiver-equipped). The 'LS' variant lacks transceivers and is for cost-sensitive glue-logic and DSP only. Always verify configuration mode selection (AS vs PS vs JTAG vs FPP) before board bring-up - a wrong MSEL pin setting will prevent bitstream loading. Configuration errors are the most common EP3CLS200F780I7 bring-up failure.
LVDS pairs on the EP3CLS200F780I7 require 100 ohm differential impedance and length matching within +/- 10 ps. Route LVDS signals on inner PCB layers with continuous reference planes; avoid routing across plane splits. Use the Quartus II TimeQuest timing analyzer to validate setup/hold margins after place-and-route. Series-dampening resistors (10 ohm to 33 ohm) on high-speed outputs reduce ringing on long traces.
Compliance Information
RoHS compliant per Intel product environmental documentation. Not AEC-Q100 qualified - Cyclone III LS family targets industrial, not automotive. The -I7N variant is lead-free; the -I7 standard variant contains lead finish. Confirm specific REACH SVHC and halogen-free status with distributor documentation at order time.
