EP3SE110F1152I4L - Stratix III E FPGA, 107.5K LE, 1152-FBGA | Intel
MPN: EP3SE110F1152I4L ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5757.2 | $5,757.20 |
| 10 | $5181.48 | $51,814.80 |
| 25 | $4893.62 | $122,340.50 |
| 50 | $4605.76 | $230,288.00 |
| 100 | $4317.9 | $431,790.00 |
EP3SE110F1152I4L Overview
What is an FPGA? A Field Programmable Gate Array is a reconfigurable semiconductor device whose logic architecture can be programmed after manufacture to implement arbitrary digital functions. FPGAs sit at the top of the programmable logic hierarchy (above CPLDs) within the broader semiconductor / integrated circuit family. The Stratix III E family specifically optimizes logic density and DSP capability per watt versus the Stratix III L (low-power) and Stratix III GX (transceiver-rich) sub-families.
Key features of the EP3SE110F1152I4L include a 600 MHz maximum internal clock frequency, dedicated DSP blocks with up to 600 MHz multiply-accumulate throughput, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI Express Gen1 via soft IP), embedded hard memory controllers, and up to 12.5 Gbps operation in select variants when paired with external transceivers. The 1152-FCBGA package exposes 744 user I/O balls with flip-chip BGA interconnect for high signal-integrity performance.
The device integrates a programmable PowerPlay power management system with on-chip temperature-sensing diodes, allowing dynamic voltage and frequency scaling. Quartus II design software (with Qsys system integration tool) supports this part; newer Quartus Prime is not officially supported for Stratix III. The high logic count and DSP multiplier density make this part a strong choice when migrating ASIC or ASSP designs to programmable logic for prototyping or low-volume production.
Typical applications include high-speed image processing, radar baseband, telecom protocol bridging, ASIC prototyping, high-end test and measurement equipment, and DSP-intensive data acquisition systems. Designers typically pair this FPGA with external DDR2/DDR3 memory, clock generators, and high-speed ADCs/DACs.
When designing with this part, plan power delivery carefully: a 1152-ball FCBGA requires multiple voltage rails (core, I/O, PLL, auxiliary) with substantial decoupling. PCB designers must allocate dedicated layers for ground and power to maintain signal integrity at multi-hundred-megahertz toggle rates. Because the device is EOL per recent distributor notices, long-term availability should be confirmed before committing to new designs.
This page synthesizes distributor pricing from DigiKey, lead-time observations from Heisener, and a parameter-anchored comparison with other Stratix III variants not aggregated on any single manufacturer or distributor page.
Drop-in alternatives for EP3SE110F1152I4L — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE110F1152I4L (same form factor and footprint) — differing in Operating Temperature, Speed Grade, Process Technology, Package, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SE110F1152I4
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View Datasheet →EP3SE110F1152I3N
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View Datasheet →EP3SE110F1152I2N
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View Datasheet →EP3SE110F1152C4LN
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View Datasheet →EP3SE110F1152C4L
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View Datasheet →EP3SE110F1152C4
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View Datasheet →EP3SE110F1152I4L Maximum Ratings & Electrical Characteristics
| Series | Stratix III E |
| Logic Elements | 107,500 |
| Embedded Memory Bits | 8,936,448 bits |
| User I/O Count | 744 |
| Number of LABs/CLBs | 4300 |
| DSP Multipliers | 528 (9-bit equivalent) |
| Package | 1152-BBGA, FCBGA |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (Industrial) |
| Speed Grade | I4 (fastest industrial grade) |
| Process Technology | 40 nm |
| MSL Level | 3 (168 Hours) |
| Packaging | Tray |
EP3SE110F1152I4L 1152-bbga, fcbga Pin Configuration Guide
Pin configuration for EP3SE110F1152I4L (1152-bbga, fcbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SE110F1152I4L.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SE110F1152I4L is suitable for 6 applications: High-Speed Image Processing Pipeline, Telecom Protocol Bridging and Aggregation, ASIC Prototyping and Emulation, Radar and Software Defined Radio Baseband, High-End Test and Measurement Equipment, DSP-Intensive Data Acquisition Systems.
High-Speed Image Processing Pipeline
The EP3SE110F1152I4L's 107,500 logic elements and 528 DSP multipliers are well-matched to real-time image processing algorithms such as 2D convolution, color-space conversion, and edge detection at multi-megapixel resolutions. The 8.9 Mbit embedded block RAM provides line buffers and lookup tables without external memory access penalties, supporting throughput up to 600 MHz. The 744 user I/Os accept parallel camera interfaces (LVDS or sub-LVDS), HDMI input streams, and high-speed ADC samples simultaneously. Designers pair the FPGA with external DDR2/DDR3 memory for frame buffering, leveraging the part's dedicated hard memory controllers. Because it is NRND, existing image-processing designs (machine vision, medical imaging) continue to benefit from this part's density but new designs should consider Arria 10 or Stratix 10 for active roadmaps.
Recommended
Telecom Protocol Bridging and Aggregation
The EP3SE110F1152I4L is widely deployed in telecom line cards that aggregate or bridge protocols such as OTU framing, Ethernet MAC, and CPRI Common Public Radio Interface. Its 600 MHz fabric supports wire-speed processing of 10 Gbps data streams when combined with external PHY devices, and the 528 DSP blocks accelerate FEC Reed-Solomon and Turbo decoding. The 1152-ball FCBGA's high I/O count enables direct attachment to multiple SFP+ cages and backplane SERDES. Industrial temperature range (-40C to +100C) makes it suitable for outdoor base station equipment. Engineers typically integrate the part with synchronous Ethernet PLLs and IEEE 1588 hardware timestamping IP from Altera/Intel. Long-term deployment in carrier networks is the dominant use case, given NRND status.
Recommended
ASIC Prototyping and Emulation
ASIC prototyping benefits from the EP3SE110F1152I4L's high logic density (107.5K LE) and 528 DSP blocks, which allow large RTL designs to be partitioned into a single FPGA for early software development. Quartus II's incremental compilation and LogicLock regions support multi-FPGA partitioning flows. The 8.9 Mbit embedded memory serves as on-chip transaction buffers for transactor-based emulation, while the 744 user I/Os interface with high-speed protocol daughter cards (PCIe, USB 3.0, DDR3). Multiple FPGAs of this type can be cascaded on prototyping boards targeting 5M-20M ASIC gate counts. Verification teams run real OS boot and driver validation before tape-out. Despite NRND, the device remains a mainstay in active emulation farms.
Recommended
Radar and Software Defined Radio Baseband
Radar baseband processing leverages the EP3SE110F1152I4L's parallel DSP throughput: 528 multipliers at 600 MHz yield approximately 316 GMACs, sufficient for phased-array beamforming, pulse compression, and Doppler FFT at radar PRF rates. Embedded block RAM implements windowing coefficient tables and complex FFT twiddle factors. The industrial temperature range allows deployment in air-cooled radar cabinets. The FPGA typically captures digitized I/Q streams from multi-channel ADCs at 200-500 MSPS and produces processed detections over Ethernet or Aurora SERDES. SDR systems use it for digital downconversion, channelization, and protocol demodulation. The FCBGA package's signal integrity preserves wideband spectral purity up to 500 MHz IF.
Recommended
High-End Test and Measurement Equipment
Test and measurement instruments benefit from the EP3SE110F1152I4L's deterministic timing and high DSP throughput. Protocol analyzers use its 8.9 Mbit block RAM to capture multi-gigabit waveforms with sub-nanosecond resolution, while arbitrary waveform generators exploit the DSP multipliers for real-time interpolation and predistortion math. The 744 I/Os accept parallel ADC/DAC buses and trigger synchronization signals from external instruments. Industrial temperature operation supports benchtop and portable analyzer enclosures. The Quartus II SignalTap logic analyzer integration accelerates firmware bring-up. Manufacturers of oscilloscopes, BERTs, and protocol testers have standardized on this part despite NRND status, leveraging long-term inventory commitments.
Recommended
DSP-Intensive Data Acquisition Systems
The EP3SE110F1152I4L anchors high-channel-count data acquisition systems in industrial, scientific, and aerospace applications. Its 528 DSP blocks execute per-channel digital filtering, decimation, and spectral analysis at throughput rates exceeding 100 MSPS per channel when pipelined. The 8.9 Mbit embedded memory absorbs burst ADC data while PCIe or Serial RapidIO hard IP transfers processed results to a host processor. Industrial temperature operation supports factory floor and outdoor deployments. The FPGA commonly interfaces with multi-channel 16/18-bit ADCs (LTC2188, AD9268 families) and provides deterministic latency for closed-loop control. Engineers prefer this device for legacy systems where firmware qualification has already been completed under DO-254 or IEC 61508.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE110F1152I4L — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE110F1152I4 | EP3SE110F1152I3N | EP3SE110F1152I2N | EP3SE110F1152C4LN |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA |
| Logic Elements | 107,500 | 107,500 | 107,500 | 107,500 | 107,500 |
| Embedded Memory (bits) | 8,936,448 | 8,936,448 | 8,936,448 | 8,936,448 | 8,936,448 |
| DSP Multipliers (9-bit) | 528 | 528 | 528 | 528 | 528 |
| User I/Os | 744 | 744 | 744 | 744 | 744 |
| Speed Grade | I4 (fastest industrial) | I4 (same) | I3 (~10-15% slower) | I2 (~20-30% slower) | C4 (commercial temp, I4 speed) |
| Temperature Range | -40C to +100C (Industrial) | -40C to +100C (same) | -40C to +100C | -40C to +100C | 0C to +85C (Commercial) |
Key Differentiators
- Highest speed grade (I4) in the Stratix III E family for the same density and package (vs EP3SE110F1152I3N)
- Industrial temperature range operation (vs EP3SE110F1152C4LN)
- Maximized DSP and logic density at the cost of static power (vs EP3SL110F1152I3LN (Stratix III L))
Design Notes
The Stratix III E family requires multiple voltage rails: core (typically 0.9V), I/O banks (1.2V-3.3V depending on standard), PLL analog supply, and auxiliary supply. The 1152-FCBGA package's high ball count distributes these rails across the die periphery. Design a 4-layer PCB minimum with dedicated ground and power planes; use at least 20 decoupling capacitors (100 nF X7R + 10 uF bulk) per VCC pin group. Estimated: typical dynamic power is 3-5W at 60-80% utilization; idle power is approximately 0.5W with PowerPlay enabled.
The 1152-ball FCBGA at 1.0 mm pitch requires microvia (laser-drilled stacked vias) PCB technology for escape routing. Standard 4-mil/4-mil line/space rules are insufficient; use HDI (High Density Interconnect) processes with 3-3-3 or 4-4-4 stackup. Assign at least 6 PCB layers for signal routing alone, plus dedicated ground and power. The exposed-die flip-chip construction means heat is conducted primarily through the PCB ball grid, not the package top; use thermal vias in the BGA land pattern to spread heat into inner copper planes.
Common pitfalls when designing with the EP3SE110F1152I4L: (1) Configuring I/O banks to incompatible voltage standards - verify VCCIO matches VREF for differential standards. (2) Forgetting the configuration source - the device requires a JTAG, AS, PS, or FPP configuration scheme selected via MSEL pins. (3) Neglecting to enable CRC error checking in Quartus II for production programming. (4) Using 3.3V LVCMOS inputs without proper clamping - the FPGA's hot-socketing spec allows live insertion but downstream logic may not. (5) Assuming NRND status means obsolete - inventory remains available, but plan a migration path to Stratix V or Arria 10 for new programs.
Compliance Information
Lead-free finish (L suffix) per Intel ordering code nomenclature. RoHS and REACH status not explicitly stated in verified web data; REACH SVHC declaration should be requested from Intel. AEC-Q100 is not applicable for FPGA logic devices. Conflict minerals compliance status not provided in web data.
