EP4CE75F29C7 - Cyclone IV E FPGA, 75K LEs, 780-FBGA | Intel
MPN: EP4CE75F29C7 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $295.08 | $295.08 |
| 10 | $280.32 | $2,803.20 |
| 100 | $251.18 | $25,118.00 |
| 500 | $225.74 | $112,870.00 |
| 1,000 | $199.96 | $199,960.00 |
EP4CE75F29C7 Overview
What is a Cyclone IV E FPGA? Cyclone IV E is the lowest-power, non-transceiver member of the Altera/Intel Cyclone IV family. It belongs to the broader hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. The 'E' variant emphasizes logic density and I/O count without integrated transceivers, distinguishing it from the Cyclone IV GX family. Cyclone IV E devices are widely used in industrial, automotive-informatics, video processing, and consumer designs that need flexible parallel logic, embedded multipliers, and block RAM but do not require multi-gigabit serial links.
Key features include up to 4 PLLs for clock management, 274 embedded 18 x 18 multipliers, 4.5 Mb of embedded SRAM organized as M9K blocks, configuration via JTAG or active/passive serial, and on-chip termination (OCT) calibration. The LVDS-capable I/O pins support DDR2/DDR3 SDRAM interfaces with dedicated DQS phase-shift circuitry, enabling external memory throughput up to 200 MHz without external clock generators.
The device uses a 4-input look-up table (LUT) architecture with embedded memory blocks that can be partitioned into RAM, ROM, or shift-register functions. Configuration flexibility includes compressed bitstreams and AES-128 encryption on Cyclone IV E series variants, supporting secure IP protection for production designs.
Typical applications include industrial motor control and machine vision, video bridging and image processing pipelines, embedded control boards with Nios II soft-core processors, telecom line cards requiring parallel TDM interfaces, and consumer electronics requiring low-cost, low-power programmable logic.
Design consideration: the FBGA-780 package requires a multilayer PCB with microvia or via-in-pad technology. Use the Altera/Intel Quartus Prime design software (free Lite/Standard editions) for synthesis, place-and-route, and timing closure. Pin assignments should leverage the dedicated clock and DQS pins for DDR memory interfaces to minimize skew.
This page synthesizes real-time distributor pricing, same-package Cyclone IV E alternatives, and practical board-level design notes that go beyond the manufacturer datasheet. Engineers comparing Cyclone IV E density points, evaluating migration paths within the Cyclone family, or sourcing FBGA-780 drop-in equivalents should treat this as a decision-grade reference.
Drop-in alternatives for EP4CE75F29C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE75F29C7 (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Configuration Modes, Embedded Multipliers (18x18).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CE75F29C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$152.7 / Unit
View Datasheet →EP4CE75F29C8
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$121.42 / Unit
View Datasheet →EP4CE75F29I7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$121.3 / Unit
View Datasheet →EP4CE115F29C7
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP4CE55F29C7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$132.4 / Unit
View Datasheet →EP4CE115F29I7N
✅ Drop-In📋 Reference alternative (not in catalog)
EP4CE75F29C7 Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV E |
| Device Type | Field Programmable Gate Array (FPGA) |
| Logic Elements (LEs) | 75 408 |
| Embedded Memory Bits | 2 810 880 (4.5 Mbit, M9K blocks) |
| Embedded Multipliers (18 x 18) | 274 |
| Maximum User I/O | 426 |
| PLLs | 4 |
| Process Technology | 60 nm |
| Core Voltage | 1.2 V |
| Operating Temperature Grade | Commercial (0 C to +85 C) |
| Package | 780-ball FBGA (F29, 29 mm) |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 (per JEDEC J-STD-020) |
| RoHS Status | Compliant |
| Configuration Method | JTAG, Active Serial (AS), Passive Serial (PS) |
| Block Memory Type | M9K (9 Kbit blocks) |
| Design Tool | Intel Quartus Prime (Lite / Standard / Pro) |
EP4CE75F29C7 780-ball fbga (f29, 29 mm) Pin Configuration Guide
Pin configuration for EP4CE75F29C7 (780-ball fbga (f29, 29 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CE75F29C7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CE75F29C7 is suitable for 7 applications: Industrial Motor Control and Drives, Video Bridging and Image Processing, Embedded Control with Nios II Soft-Core Processor, Telecom Line Cards and TDM Switching, Test and Measurement Instrumentation Front-End, Automotive Infotainment and ADAS Pre-Processing, Software-Defined Radio Front-End Pre-Processing.
Industrial Motor Control and Drives
The EP4CE75F29C7 fits industrial motor control with its 426 user I/O and 274 embedded 18x18 multipliers, which are sized for field-oriented control (FOC) of three-phase PMSM and induction motors. The 4.5 Mbit of M9K RAM buffers encoder feedback and ADC samples per PWM cycle, while the four PLLs generate the deterministic switching frequencies needed for IGBT gate drivers. Industrial designers favor the commercial temperature grade for cabinet-mounted drives, and the FBGA-780 footprint allows integration with external op-amps and current-sense ADCs on the same board. Compared with DSP-only solutions, the FPGA adds reconfigurable safety logic (STO, SBC) without changing hardware.
Recommended
Video Bridging and Image Processing
The EP4CE75F29C7 is well-suited for video bridging ASICs and image preprocessing pipelines because of its 75 408 LEs, parallel multiplier count, and DDR memory bandwidth. Designs that take a DVI/HDMI/parallel RGB input and convert to LVDS or MIPI bridge through the FPGA using the LVDS-capable I/O banks. The 4.5 Mbit of block RAM holds a complete 1280x720 frame buffer at 8 bits per pixel, supporting full-frame temporal noise reduction. Dedicated DQS pins and the four PLLs handle the 148.5 MHz pixel clock needed for 1080p60 video. Quartus Prime reference designs shorten development of deinterlacer and color-space conversion blocks.
Recommended
Embedded Control with Nios II Soft-Core Processor
The EP4CE75F29C7 commonly hosts an Altera/Intel Nios II/e or Nios II/f soft-core processor for embedded control without an external MCU. With 75 408 LEs, the device can run a Nios II/f at 100 MHz while leaving substantial logic for custom peripherals such as Ethernet MACs, I2C/SPI controllers, and PWM generators. The 4.5 Mbit of block RAM serves as instruction and data cache, and the 426 I/O connect to external sensors, actuators, and an SDRAM data memory. Industrial automation, building controllers, and small-form-factor IoT gateways adopt this pattern to merge logic and software on a single device, eliminating BOM and reducing board area.
Recommended
Telecom Line Cards and TDM Switching
Telecom line cards historically use FPGAs like the EP4CE75F29C7 to implement TDM (T1/E1) cross-connects, HDLC controllers, and proprietary framing logic. The 426 user I/O accommodate dozens of T1/E1 framer interfaces in parallel, while the 4.5 Mbit of block RAM implements per-channel elastic stores. The four PLLs derive all 1.544 MHz and 2.048 MHz TDM clocks from a single backplane reference, eliminating external clock generators. Cyclone IV E is preferred over Cyclone IV GX on these cards because TDM is parallel and does not need high-speed serial transceivers, keeping BOM cost low.
Recommended
Test and Measurement Instrumentation Front-End
Test and measurement equipment uses the EP4CE75F29C7 as a flexible front-end that adapts to multiple DUT signaling standards. Its 426 user I/O accommodate dozens of bidirectional digital channels, and the four PLLs synthesize arbitrary sample clocks for ADC and DAC synchronization. The 274 embedded 18x18 multipliers enable real-time DSP such as FIR filtering and FFT blocks before data transfer to a host CPU. The industrial-temperature variant (EP4CE75F29I7) extends deployment to lab and factory-floor environments, while the same FBGA-780 footprint lets designers upgrade to the EP4CE115F29C7 with no PCB rework when more logic is needed.
Recommended
Automotive Infotainment and ADAS Pre-Processing
In automotive infotainment and entry-level ADAS pre-processing, the EP4CE75F29C7 handles LVDS camera aggregation, surround-view stitching glue logic, and HUD driving before data reaches an application processor. The FPGA's parallel DSP resources perform edge detection and histogram equalization in real time, and the DDR2/DDR3 controller built from the DQS circuitry streams processed frames to the SoC. For cabin-mounted designs the commercial temperature range is adequate; for engine-bay or exterior mounted ECUs, designers substitute the industrial-grade EP4CE75F29I7 in the same FBGA-780 footprint without PCB changes, satisfying AEC-Q100-aligned thermal derating goals on the system level.
Recommended
Software-Defined Radio Front-End Pre-Processing
The EP4CE75F29C7 is used as a wideband front-end pre-processor in low-cost software-defined radio receivers. The 274 embedded 18x18 multipliers and 4.5 Mbit block RAM implement polyphase channelizer filters, digital downconverters, and AGC loops for sample rates up to ~100 MHz. The four PLLs generate the ADC sample clock and the tuning LO offsets, and the LVDS-capable I/O banks accept high-speed ADC data directly. Although Cyclone IV E lacks integrated transceivers, designers pair the FPGA with an external ADC and rely on parallel LVDS to deliver gigabit-class sample streams into an upstream processor for software demodulation.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE75F29C7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE75F29C7N | EP4CE75F29C8 | EP4CE75F29I7 | EP4CE115F29C7 | EP4CE55F29C7 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | FBGA-780 (F29, 29 mm) | FBGA-780 (F29, 29 mm) - same | FBGA-780 (F29, 29 mm) - same | FBGA-780 (F29, 29 mm) - same | FBGA-780 (F29, 29 mm) - same | FBGA-780 (F29, 29 mm) - same |
| Logic Elements | 75 408 | 75 408 - same | 75 408 - same | 75 408 - same | 114 480 | 55 488 |
| Embedded Memory Bits | 2 810 880 (4.5 Mbit) | 2 810 880 - same | 2 810 880 - same | 2 810 880 - same | 3 888 Kbit | 2 340 Kbit |
| Embedded 18x18 Multipliers | 274 | 274 - same | 274 - same | 274 - same | 532 | 156 |
| Maximum User I/O | 426 | 426 - same | 426 - same | 426 - same | 528 | 374 |
| PLLs | 4 | 4 - same | 4 - same | 4 - same | 4 | 4 |
| Speed Grade | 7 (fastest) | 7 - same | 8 (slower) | 7 - same | 7 | 7 |
| Temperature Grade | Commercial (0 C to +85 C) | Commercial - same | Commercial - same | Industrial (-40 C to +100 C) | Commercial - same | Commercial - same |
Key Differentiators
- Pb-free / RoHS-compliant drop-in variant with identical silicon (vs EP4CE75F29C7N)
- Industrial temperature rating for harsh-environment drop-in (vs EP4CE75F29I7)
- Higher-density 114 480 LE upgrade on the same PCB (vs EP4CE115F29C7)
- Lower-density 55 488 LE option to right-size cost (vs EP4CE55F29C7)
Design Notes
The FBGA-780 package with 1.0 mm ball pitch requires microvia or via-in-pad PCB technology to escape all signals. Use a minimum 6-layer stackup with 1 oz copper for power and ground, and 0.5 oz signal layers. Place at least 4 to 6 ground balls per quadrant directly stitched to the inner ground plane with low-inductance microvia arrays. Maintain a continuous reference plane under the BGA for all signal layers to control impedance. The Altera AN-653 application note provides recommended land pad and solder-mask openings for FBGA-780.
Estimated: at typical 25% toggle rate, the EP4CE75F29C7 core current is around 1.0 to 1.5 A from the 1.2 V VCCINT rail. Decouple with 10 uF bulk tantalum plus 0.1 uF and 1 nF ceramic caps within 5 mm of every VCCINT ball. The 2.5 V VCCAUX rail (used for JTAG and configuration) draws under 100 mA but still needs a 4.7 uF bulk cap. Power sequencing per Altera AN-588: VCCINT must reach 90% of nominal before VCCAUX, and VCCIO banks may be powered in any order. Add a TI TPS3823 or similar voltage supervisor for deterministic configuration startup.
Do not confuse the F29 FBGA-780 package with the F23 FBGA-256 - the ball counts and pin assignments are completely different. Verify the device code on the top marking (EP4CE75F29C7) before soldering. For DDR2/DDR3 interfaces, the DQS pins are pin-mapped to specific I/O banks; consult the Cyclone IV External Memory Interface Handbook before final pin assignment or the memory controller will not close timing. Configuration mode (AS, PS, JTAG) is selected by MSEL pins - tie them correctly on power-up to avoid configuration failures.
Cyclone IV E supports DDR2 up to 200 MHz and DDR3 up to 200 MHz when the read-capture DQS phase-shift circuitry is used. Match trace lengths for DQ, DQS, and DM within 20 mil (0.5 mm) on the PCB to meet tDS and tDH. Use the OCT (on-chip termination) feature for DDR3 to eliminate external termination resistors. For LVDS pairs, maintain 100 ohm differential impedance with matched lengths within 5 mil. The Cyclone IV Handbook volume 3 contains recommended IBIS models for SI simulation; download them from the Intel FPGA website.
Compliance Information
RoHS compliance per distributor listings. The C7 suffix variant is lead-bearing (Pb) for legacy compatibility; the C7N / I7N / C8N suffixes are Pb-free. The device is not AEC-Q100 qualified; system-level automotive qualification is the integrator's responsibility.
