EP4CE75F29C9LN - Cyclone IV E FPGA, 75K LEs, 780-FBGA | Intel / Altera
MPN: EP4CE75F29C9LN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $165 | $165.00 |
| 10 | $152.5 | $1,525.00 |
| 100 | $138 | $13,800.00 |
| 500 | $122.75 | $61,375.00 |
| 1,000 | $109.5 | $109,500.00 |
EP4CE75F29C9LN Overview
Cyclone IV E FPGAs are SRAM-based programmable logic devices that occupy a defined position in the broader programmable logic taxonomy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. Compared with CPLDs, FPGAs offer much higher logic density, embedded memory blocks, and DSP/multiplier blocks. Compared with the higher-end Cyclone IV GX family, the E variant omits transceivers to reduce cost and power, making it the cost-optimized choice for parallel I/O-centric designs.
Key features of the EP4CE75F29C9LN include up to 200 MHz internal operation, support for external memory interfaces such as DDR/DDR2 SDRAM, QDRII SRAM, and asynchronous SRAM/Flash, eight PLLs for clock management, and 4 phase-locked loops supporting fractional-N synthesis. The device supports configuration via JTAG, Active Serial, Active Parallel, and Passive Serial modes, and includes built-in CRC for configuration error detection. An on-chip soft-core (Nios II) can be instantiated for embedded processor functionality.
The 780-FBGA package offers excellent signal and power integrity for high-pin-count designs, with a dedicated ground/power ball grid that simplifies PCB power-plane design. The F29 package variant operates with four octants, supports up to 426 user I/O, and uses 1.0 mm ball pitch.
Typical applications include industrial motor control and factory automation, video processing and display controllers, communications infrastructure line cards, medical imaging front-end pre-processing, and automotive driver-assistance pre-processing prototypes. The combination of high logic density, embedded memory, hardware multipliers, and the cost-optimized Cyclone IV E architecture makes the EP4CE75F29C9LN well-suited to volume production.
Designers should follow Altera's power estimation methodology (PowerPlay Early Power Estimator) to size decoupling networks, layer-stackup, and thermal management. The 780-FBGA requires PCB land patterns and via-in-pad or dog-bone fan-out designs with at least 6 PCB layers recommended to maintain signal integrity across the parallel I/O fabric.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design considerations not found in the manufacturer datasheet, giving engineers a single reference for sourcing and integrating the EP4CE75F29C9LN.
Drop-in alternatives for EP4CE75F29C9LN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE75F29C9LN (same form factor and footprint) — differing in Package, Speed Grade, Embedded 18x18 Multipliers, Operating Temperature, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CE75F29C8LN
✅ Drop-In✓ In Stock
$175.2 / Unit
View Datasheet →EP4CE75F29C8N
✅ Drop-In✓ In Stock
$149.75 / Unit
View Datasheet →EP4CE75F29C7N
✅ Drop-In✓ In Stock
$152.7 / Unit
View Datasheet →EP4CE75F29I8LN
✅ Drop-In✓ In Stock
$258 / Unit
View Datasheet →EP4CE115F29I7N
✅ Drop-In📋 Reference alternative (not in catalog)
EP4CE115F29C8N
✅ Drop-In✓ In Stock
$38.9 / Unit
View Datasheet →EP4CE75F29C9LN Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV E |
| Logic Elements (LE) | 75,408 |
| Total RAM Bits | 2,810,880 bits |
| Embedded 18x18 Multipliers | 200 |
| User I/O Pins | 426 |
| PLLs | 4 |
| Package | 780-FBGA (F29) |
| Ball Pitch | 1.0 mm |
| Speed Grade | C9 |
| Temperature Grade | Commercial (0C to +85C) |
| Process Node | 60 nm (TSMC) |
| Supply Voltage | 1.2 V (per DigiChip summary) |
| Configuration Modes | JTAG, Active Serial, Active Parallel, Passive Serial |
| RoHS Status | Compliant (Pb-free finish, "L" suffix) |
| Mounting Type | Surface Mount |
EP4CE75F29C9LN 780-fbga (f29) Pin Configuration Guide
Pin configuration for EP4CE75F29C9LN (780-fbga (f29) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CE75F29C9LN.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CE75F29C9LN is suitable for 6 applications: Industrial Motor Control and Factory Automation, Video Processing and Display Controllers, Communications Infrastructure Line Cards, Medical Imaging Front-End Pre-Processing, Automotive ADAS Prototyping, Test and Measurement Instrumentation.
Industrial Motor Control and Factory Automation
The EP4CE75F29C9LN is well-suited to industrial motor control and factory automation because its 75,408 logic elements and 200 18x18 hardware multipliers provide the parallel arithmetic throughput required for field-oriented control (FOC) loops running at sub-microsecond update rates. The 426 user I/O pins accommodate multiple encoder interfaces, PWM channels, and isolated GPIO banks for PLC-style I/O. The 2.8 Mbit embedded RAM allows implementation of multi-axis state-space controllers and observer algorithms without external memory. The 780-FBGA package with 1.0 mm pitch and dedicated power/ground balls enables robust 4-layer PCB designs suitable for industrial EMC environments, and the C9 speed grade supports the >100 MHz PWM switching frequencies needed for high-RPM servo drives.
Recommended
Video Processing and Display Controllers
The EP4CE75F29C9LN's high logic density and 2.8 Mbit embedded RAM make it a strong fit for video processing pipelines such as deinterlacers, scalers, color-space converters, and multi-layer display compositors. The 200 18x18 multipliers enable real-time motion-adaptive deinterlacing at HD resolutions, while the DDR/DDR2 external memory interface controllers support frame-buffer bandwidths of several Gbps. The 426 user I/O pins can host parallel RGB/TTL display buses, HDMI bridge interfaces, and camera sensor inputs. Compared to fixed-function ASSPs, the Cyclone IV E architecture allows custom algorithms and per-model differentiation, while the 780-FBGA package supports the high signal count required for parallel video buses without requiring high-layer-count PCB stackups.
Recommended
Communications Infrastructure Line Cards
The EP4CE75F29C9LN fits communications line-card applications such as TDM-over-packet bridges, low-density framer/mapper designs, and protocol conversion cards in access networks. The 4 PLLs and rich clocking fabric support the multiple independent clock domains typical in telecom line interfaces, and the 426 user I/O pins accommodate parallel LVDS data paths plus SERDES-via-soft-IP implementations. The 200 hardware 18x18 multipliers accelerate Reed-Solomon and FEC codecs common in error-correction subsystems. The Cyclone IV E family's reputation for long-life support and Intel's continued commitment to the family make it appropriate for carrier-grade infrastructure with multi-decade deployment horizons.
Recommended
Medical Imaging Front-End Pre-Processing
The EP4CE75F29C9LN is appropriate for medical imaging front-end preprocessing such as ultrasound beamforming front-ends, endoscopy video pre-processing, and patient-monitoring DSP. Its 200 18x18 multipliers implement beamforming FIR filters and image-domain convolutions in real time at ultrasound sampling rates, while 426 user I/O pins accommodate multi-channel ADC data ingest at LVDS signaling rates. The 2.8 Mbit embedded RAM allows partial frame buffering for speckle reduction and noise-suppression algorithms, reducing external memory cost. Medical designs benefit from the Cyclone IV E family's low-power 60 nm process which simplifies IEC 60601-1 thermal and patient-safety compliance. Designers must still apply functional-safety verification and risk-management per IEC 62304.
Recommended
Automotive ADAS Prototyping
For pre-production ADAS prototyping (front-camera perception, surround-view fusion, and radar signal pre-processing), the EP4CE75F29C9LN offers the logic density to instantiate multi-camera ISP pipelines and sensor-fusion DSP prototypes ahead of ASIC tape-out. The 200 18x18 multipliers accelerate corner-detection and optical-flow kernels, and 426 user I/O pins accommodate multiple MIPI-CSI bridge interfaces and automotive Ethernet MAC soft cores. Designers should note that for production automotive deployment, AEC-Q100 qualified parts such as the Cyclone V or Cyclone IV GX automotive variants are required, but the EP4CE75F29C9LN's commercial temperature grade is acceptable for engineering development and pre-compliance validation.
Recommended
Test and Measurement Instrumentation
The EP4CE75F29C9LN suits test and measurement equipment such as protocol analyzers, logic analyzer front-ends, mixed-signal test platforms, and arbitrary waveform generators. The 426 user I/O pins with LVDS support allow multi-channel acquisition at hundreds of Mbps per channel, while the 75K logic elements implement custom trigger engines, pattern generators, and protocol decoders. The 4 PLLs provide the multiple low-jitter clock domains required for coherent sampling in oscilloscope and BERT designs. Cyclone IV E's long-term availability and Intel's continued software support through Quartus Prime Lite Edition make it a practical choice for instrumentation products with long production lifetimes.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE75F29C9LN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE75F29C8LN | EP4CE75F29I8LN | EP4CE115F29I7N | EP4CE115F29C8N |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-FBGA (F29) | 780-FBGA (F29) - same | 780-FBGA (F29) - same | 780-FBGA (F29) - same | 780-FBGA (F29) - same |
| Logic Elements | 75,408 | 75,408 | 75,408 | 114,480 | 114,480 |
| Total RAM Bits | 2,810,880 | 2,810,880 | 2,810,880 | 3,981,312 | 3,981,312 |
| 18x18 Multipliers | 200 | 200 | 200 | 266 | 266 |
| User I/O Pins | 426 | 426 | 426 | 426 | 426 |
| Speed Grade | C9 | C8 | I8 | I7 | C8 |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Industrial (-40C to +100C) | Industrial | Commercial |
Key Differentiators
- Higher density than EP4CE40F29C8N within the same F29 780-FBGA footprint (vs EP4CE40F29C8N)
- Commercial temperature grade with C9 highest speed bin (vs EP4CE75F29I8LN)
- Same die across the EP4CE75F29x family enables speed-grade upgrades (vs EP4CE75F29C7N)
Design Notes
Use the PowerPlay Early Power Estimator (EPE) spreadsheet provided by Intel / Altera to size power-supply decoupling and thermal dissipation before committing to PCB layout. For the EP4CE75F29C9LN at full utilization, VCCINT current can reach 1.5-2 A and I/O bank current varies with switching activity. Decoupling recommendations: 100 uF bulk + 4.7 uF per supply rail + 0.1 uF and 0.01 uF high-frequency bypass at each VCC pin, placed within 100 mils of the BGA ball. Separate VCCIO banks must each have their own decoupling network per the Cyclone IV E Device Handbook.
The 780-FBGA F29 package uses 1.0 mm ball pitch and requires dog-bone fan-out or via-in-pad technology for breakout. A 6-layer PCB stackup is recommended (signal / GND / power / power / GND / signal) to maintain signal integrity on parallel I/O buses. Reference the Cyclone IV E Hardware Design Guidelines for trace-width, impedance-control, and length-matching recommendations. Differential pairs (LVDS) must be length-matched to within 150 mils and routed over a continuous reference plane to avoid impedance discontinuities.
Place clock inputs on dedicated clock pins with shortest possible routing from the clock source. Use the device's 4 PLLs strategically: one for the system reference clock, one for memory-interface DQS delay compensation, one for I/O fabric clocking, and reserve one for user-defined high-speed interfaces. Power pins must be tied to the appropriate supply (VCCINT, VCCIO, VCCA, VCCD_PLL) per the pin tables; the device will not function reliably with floating PLL supply pins. Configuration pins (MSEL, nCE, nCONFIG, nSTATUS, CONF_DONE) must be pulled to the correct state for the chosen configuration mode.
Common pitfalls when designing with the EP4CE75F29C9LN include: (1) ignoring I/O bank VCCIO compatibility when mixing LVTTL, LVCMOS, and LVDS on the same bank - all I/O standards sharing a bank must use compatible VCCIO voltages; (2) overlooking the need for a CONFIG_DONE pull-up to VCCIO when using Active Serial configuration; (3) failing to instantiate the ALTGXB megafunction correctly when implementing LVDS channels; (4) selecting the wrong AS configuration device (EPCS series) capacity for the FPGA bitstream size. Always validate the design by running through the full Quartus Prime compilation flow including TimeQuest timing analysis before committing to layout.
Compliance Information
RoHS compliant per the L (lead-free) suffix in the MPN. Pb-free finish confirmed by DigiKey product listing. AEC-Q100 not applicable - the EP4CE75F29C9LN is commercial grade; for AEC-Q100 qualified automotive FPGAs, evaluate the Cyclone IV GX automotive variants.
