EP4CE75F29C8N - Cyclone IV E FPGA, 75K LE, 780-FBGA | Intel
MPN: EP4CE75F29C8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $204.45 | $204.45 |
| 10 | $184 | $1,840.00 |
| 100 | $169.9 | $16,990.00 |
| 500 | $158.5 | $79,250.00 |
| 1,000 | $149.75 | $149,750.00 |
EP4CE75F29C8N Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor device whose digital logic fabric, routing, and I/O behavior are defined by the user's configuration bitstream rather than at the fab. The Cyclone IV E family occupies the low-cost, low-power segment of the FPGA hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. Its 60 nm process and 1.2 V core give it a notable cost/performance advantage for cost-sensitive volume production.
Key features include 426 user I/O, 4 PLL clock managers, 200 18x18 hardware multipliers, and 2,810,880 bits of embedded RAM. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards, with onboard transceivers absent (these are available only on Cyclone IV GX). Configuration is via JTAG, Active Serial, or Passive Serial modes.
The Cyclone IV E architecture pairs a logic array block (LAB) of 16 logic elements with an embedded memory block of 9 Kbits (M9K) and dedicated hardware multiplier blocks. The 60 nm process combined with the 1.2 V core keeps dynamic power low while delivering up to 150 MHz system performance, making the EP4CE75F29C8N well suited for parallel signal-processing tasks.
Typical applications include industrial motor control, video bridging and image processing, automotive infotainment prototyping, test and measurement instrumentation, and embedded protocol bridges (UART/SPI/I2C to high-speed parallel). Designers choose this part when they need a balance of high logic density, abundant DSP blocks, and a low unit cost.
When designing with this FPGA, allocate sufficient PCB layers for the 780-ball FBGA escape routing (typically a minimum 6-layer stack-up with buried vias) and follow Intel's decoupling guidance - one 100 uF bulk, several 10 uF, and 0.1 uF per power pin group.
This page synthesizes distributor pricing, drop-in same-package variants, and practical design notes that go beyond the manufacturer datasheet.
Drop-in alternatives for EP4CE75F29C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE75F29C8N (same form factor and footprint) — differing in Package, Speed Grade, Process Technology, Operating Temperature, Configuration Modes.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CE75F29C8LN
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$175.2 / Unit
View Datasheet →EP4CE75F29C8L
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$109.8 / Unit
View Datasheet →EP4CE75F29C7N
✅ Drop-In✓ In Stock
$152.7 / Unit
View Datasheet →EP4CE75F29I8N
✅ Drop-In📋 Reference alternative (not in catalog)
EP4CE115F29C8N
✅ Drop-In✓ In Stock
$38.9 / Unit
View Datasheet →EP4CE55F29C8N
✅ Drop-In✓ In Stock
$285 / Unit
View Datasheet →EP4CE75F29C8N Maximum Ratings & Electrical Characteristics
| Series | Cyclone IV E |
| Logic Elements (LE) | 75,408 |
| Number of LABs/CLBs | 4713 |
| Total RAM Bits | 2,810,880 |
| Number of I/O | 426 |
| Number of Logic Elements/Cells | 75,408 |
| Voltage - Supply | 1.15 V to 1.25 V |
| Operating Temperature | 0C to +85C |
| Mounting Type | Surface Mount |
| Package | 780-FBGA (29x29 mm, F29) |
| Number of Multipliers (18x18) | 200 |
| Number of PLLs | 4 |
| Configuration Method | JTAG / Active Serial / Passive Serial |
| I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| RoHS Status | Compliant |
| Process Node | 60 nm |
EP4CE75F29C8N Pin Configuration
| Pin A1 | IO — User I/O (bank 1) |
| Pin A20 | IO — User I/O (bank 1) |
| Pin AB1 | IO — User I/O (bank 8) |
| Pin AB20 | IO — User I/O (bank 8) |
| Pin B5 | VCCINT — Core supply 1.15-1.25 V |
| Pin B10 | VCCIO1 — I/O bank 1 supply |
| Pin B15 | VCCIO2 — I/O bank 2 supply |
| Pin E10 | GND — Ground |
| Pin G1 | TMS — JTAG Test Mode Select |
| Pin G20 | TCK — JTAG Test Clock |
| Pin J1 | nCONFIG — Configuration start (active low) |
| Pin J20 | nSTATUS — Configuration status (active low) |
| Pin K10 | CONF_DONE — Configuration done |
| Pin M1 | MSEL0 — Configuration mode select 0 |
| Pin M20 | MSEL1 — Configuration mode select 1 |
| Pin P10 | DCLK — Configuration clock |
| Pin R1 | DATA0 — Configuration data 0 |
| Pin R20 | DATA1 — Configuration data 1 |
| Pin T10 | VCCA_PLL1 — PLL1 analog supply |
| Pin V1 | VCCA_PLL2 — PLL2 analog supply |
Typical Applications
EP4CE75F29C8N is suitable for 6 applications: Industrial Motor Control, Video Bridging and Image Processing, Automotive Infotainment Prototyping, Test and Measurement Instrumentation, Embedded Protocol Bridging, Software-Defined Radio (SDR) Front-End Pre-Processing.
Industrial Motor Control
The EP4CE75F29C8N's 200 dedicated 18x18 hardware multipliers and 75,408 logic elements make it well suited for multi-axis industrial motor control. Engineers typically implement field-oriented control (FOC) loops, sigma-delta modulator interfaces, and quadrature encoder decoding inside this FPGA. With 426 user I/O, the device can fan out to multiple gate drivers, current-sense ADCs, and absolute encoder SSI/Hiperface interfaces simultaneously. The 1.2 V core plus selectable I/O standards (LVDS, SSTL) supports both 3.3 V and 1.8 V industrial buses without external level shifters. Per the Cyclone IV E datasheet, deterministic latency across the LAB fabric helps meet the sub-microsecond control-loop deadlines required by servo drives.
Recommended
Video Bridging and Image Processing
With 2,810,880 embedded RAM bits and 75,408 LE, the EP4CE75F29C8N is widely used to bridge HDMI/MIPI/LVDS video streams and run real-time image-processing pipelines (filtering, edge detection, color space conversion). The 426 user I/O handle parallel RGB, BT.656, and CSI-2 deserialized inputs simultaneously. The M9K memory blocks act as line buffers for scaling, de-interlacing, and chroma upsampling. Per the Cyclone IV E datasheet, fabric Fmax around 150 MHz comfortably handles 1080p60 streams at 148.5 MHz pixel clock. Designers targeting 4K should look to a Cyclone 10 GX family instead.
Recommended
Automotive Infotainment Prototyping
Tier-1 and OEM prototyping teams use the EP4CE75F29C8N to develop infotainment head-unit prototypes and ADAS sensor aggregation nodes because the Cyclone IV E family has a long automotive lifecycle and well-known Intel/Quartus support. Its 426 user I/O can interface LVDS displays, MOST or CAN-FD buses, and surround-view camera serializers concurrently. The 60 nm process keeps idle power low for parked-mode scenarios. Per the Cyclone IV E datasheet, commercial grade C8 spans 0-85C; for -40 to +100C under-hood operation the pin-compatible EP4CE75F29I8N is required.
Recommended
Test and Measurement Instrumentation
Test-equipment designers use the EP4CE75F29C8N for protocol-aware logic analyzer probes, pattern generators, and digital stimulus / response capture cards. The 200 hardware multipliers accelerate FFT cores used in spectrum-analyzer front ends, while 426 user I/O accommodate high-channel-count logic probe pods. JTAG, Active Serial, and Passive Serial configuration allow fast bench reprogramming. Per the Cyclone IV E datasheet, the deterministic routing fabric produces repeatable capture timing, which is essential for production ATE where per-channel skew must remain sub-nanosecond.
Recommended
Embedded Protocol Bridging
The EP4CE75F29C8N acts as a protocol-bridging gateway between industrial buses (EtherCAT, Profinet, Modbus) and host CPUs with SPI/UART/I2C interfaces. Its 4 onboard PLLs generate independent clocks for each downstream bus segment, while 426 I/O accommodate parallel RGMII/MII/RMII Ethernet MAC connections alongside UART/SPI/I2C peripherals. The 2,810,880-bit embedded RAM buffers packet payloads during protocol conversion, removing the need for an external SRAM. Per the Cyclone IV E datasheet, fabric Fmax around 150 MHz is sufficient for 100 Mbit/s industrial Ethernet bridging with margin.
Recommended
Software-Defined Radio (SDR) Front-End Pre-Processing
Hobbyist and commercial SDR platforms use the EP4CE75F29C8N to pre-process ADC samples before forwarding them to a host CPU or DSP. With 200 hardware multipliers and 75,408 LE, the FPGA can run DDC (digital down-conversion), FIR filtering, and channelization in real time at sample rates up to ~150 MSPS. The 426 I/O can host LVDS ADC data buses and parallel DAC interfaces simultaneously. Per the Cyclone IV E datasheet, the C8 speed grade delivers Fmax around 150 MHz which is well matched to typical HF/VHF ADC rates. For wideband microwave SDR a Cyclone IV GX or Cyclone 10 LP variant with transceivers is preferred.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE75F29C8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE75F29C8LN | EP4CE75F29C7N | EP4CE75F29I8N | EP4CE55F29C8N | EP4CE115F29C8N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA (F29) 29x29 mm | 780-FBGA (F29) - same | 780-FBGA (F29) - same | 780-FBGA (F29) - same | 780-FBGA (F29) - same | 780-FBGA (F29) - same |
| Logic Elements | 75,408 | 75,408 | 75,408 | 75,408 | 55,856 (-26%) | 114,480 (+52%) |
| Number of I/O | 426 | 426 | 426 | 426 | 374 | 426 |
| Total RAM Bits | 2,810,880 | 2,810,880 | 2,810,880 | 2,810,880 | 2,396,160 (-15%) | 3,981,312 (+42%) |
| Multipliers (18x18) | 200 | 200 | 200 | 200 | 156 | 266 |
| Speed Grade | C8 (-8) | C8 (-8) | C7 (-7, faster ~15%) | I8 (-8, industrial temp) | C8 (-8) | C8 (-8) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | -40C to +100C (industrial) | 0C to +85C | 0C to +85C |
Key Differentiators
- Highest Cyclone IV E density in the commercial temp grade F29 footprint (vs EP4CE55F29C8N)
- Same-package migration path to 114,480 LE (vs EP4CE115F29C8N)
- Direct pin-compatible drop-in to faster speed grade (vs EP4CE75F29C7N)
Design Notes
The 780-ball F29 FBGA has 1.0 mm ball pitch and 29x29 mm body. Estimated: PCB routing requires a minimum 6-layer stack-up with HDI micro-vias to escape the inner rows. Per Cyclone IV E handbook, each VCCINT pin needs its own 0.1 uF + 10 uF decoupling pair placed within 100 mil of the ball. Provide a continuous GND plane directly under the BGA to control return paths.
Estimated: at typical 75% utilization and 150 MHz clock, the EP4CE75F29C8N dissipates approximately 1.5-2.0 W. The F29 BGA has theta_JA around 15-20 C/W on a standard JEDEC 4-layer test board, producing 30-40 C rise above ambient. For sealed enclosures or elevated ambient (>60C), add a thermal pad under the package tied to GND or use airflow to keep junction below 100C.
Do not leave MSEL0/MSEL1 floating - they select JTAG/AS/PS configuration mode and must be tied to VCCIO8 or GND through a 1 kohm resistor. The nCONFIG pin must be pulled to VCCIO8 via 10 kohm. Per Cyclone IV E datasheet, all VCCIO bank supplies must be present even if the bank is unused; floating bank supplies cause configuration failure. Use the Quartus II / Quartus Prime software's pin-planner to validate I/O bank assignments before PCB tape-out.
Compliance Information
RoHS compliant per Altera/Intel product page. Not AEC-Q100 qualified - the EP4CE75F29C8N is commercial grade (0-85C). For AEC-Q100 contexts use the industrial-grade pin-compatible EP4CE75F29I8N.
