EP4CE75F29I8LN - Cyclone IV E FPGA 75K LE | Intel | 780-BGA
MPN: EP4CE75F29I8LN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $420.75 | $420.75 |
| 10 | $372.5 | $3,725.00 |
| 100 | $316.14 | $31,614.00 |
| 500 | $287.4 | $143,700.00 |
| 1,000 | $258 | $258,000.00 |
EP4CE75F29I8LN Overview
An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device whose logic, interconnect, and I/O behavior are configured by the user after manufacturing, as opposed to an ASIC whose function is fixed at tape-out. Within the broader hierarchy, FPGAs sit alongside microcontrollers, DSPs, and ASICs as programmable logic devices. The Cyclone IV E family targets cost-sensitive, high-volume applications where the power budget and unit cost rule out higher-end Stratix or competing Xilinx Spartan-6 parts, while still requiring the integration and DSP capability of a true FPGA fabric.
Key features of the EP4CE75F29I8LN include up to 426 user I/O pins supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards, embedded signal conditioning on the I/O ring, JTAG boundary-scan configuration via the standard 10-pin or USB-Blaster interface, and 8.7 Mbits of on-chip RAM. The 1.0 mm pitch 780-BGA package supports dense board layouts while keeping signal escape manageable. Configuration is supported by Active Serial (AS), Passive Serial (PS), JTAG, and Fast Passive Parallel (FPP) modes, with optional AES-128 bitstream encryption for IP protection.
Architecturally, the Cyclone IV E device pairs 4-input LUT-based logic elements with per-LE registers, dedicated 18x18 multipliers, M9K memory blocks, and four PLLs providing up to eight clock outputs each. The device supports up to 4 Mbps LVDS performance on the I/O ring and is designed for low static and dynamic power consumption compared with prior Cyclone generations. Designers use the Quartus Prime design suite for synthesis, place-and-route, and timing closure.
Typical applications for the EP4CE75F29I8LN include industrial motor control, video bridging and image processing, telecom line-card glue logic, low-cost ASIC prototyping, USB 3.0 / PCIe Gen1 / GbE interface bridging, and portable medical diagnostic equipment. The combination of DSP blocks, embedded RAM, and cost-optimized packaging makes it especially attractive in industrial automation and consumer video equipment.
When designing with the EP4CE75F29I8LN, pay close attention to power-rail decoupling of the 1.2 V core and 2.5 V/3.3 V analog supplies, JTAG chain integrity for in-system programming, and thermal management of the 780-BGA under peak DSP loading. The lead-free PBGA package requires careful reflow profile control and uses a 29x29 mm PCB footprint with 1.0 mm ball pitch.
This page synthesizes distributor pricing, drop-in speed-grade and package alternatives, and practical design notes not found in the standalone datasheet, giving engineers a faster procurement and evaluation path.
Drop-in alternatives for EP4CE75F29I8LN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE75F29I8LN (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Embedded 18x18 Multipliers, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CE75F29I7N
✅ Drop-In✓ In Stock
$540 / Unit
View Datasheet →EP4CE75F29I8L
✅ Drop-In✓ In Stock
$203.73 / Unit
View Datasheet →EP4CE75F29I7
✅ Drop-In✓ In Stock
$121.3 / Unit
View Datasheet →EP4CE75F29C9LN
✅ Drop-In✓ In Stock
$109.5 / Unit
View Datasheet →EP4CE75F29C8N
✅ Drop-In✓ In Stock
$149.75 / Unit
View Datasheet →EP4CE75F29I8LN Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV E |
| Device Logic Elements | 75,408 |
| Logic Array Blocks (LABs) | 4,713 |
| Embedded Memory Bits | 2,810,880 bits |
| Embedded Multipliers (18x18) | 244 |
| User I/O Count | 426 |
| PLLs | 4 |
| Process Technology | 60 nm |
| Core Supply Voltage | 1.2 V |
| Package | 780-ball FBGA (F29), 29x29 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (Industrial) |
| Lead Free / RoHS | Yes / Compliant |
| Speed Grade | 8 |
| Configuration Mode | AS, PS, JTAG, FPP |
| Bitstream Encryption | AES-128 supported |
EP4CE75F29I8LN 780-ball fbga (f29), 29x29 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP4CE75F29I8LN (780-ball fbga (f29), 29x29 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CE75F29I8LN.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CE75F29I8LN is suitable for 6 applications: Industrial Motor Control, Video Bridging and Image Processing, Telecom Line-Card Glue Logic and Protocol Bridging, Low-Cost ASIC Prototyping, USB 3.0 / PCIe Gen1 / GbE Interface Bridging, Portable Medical Diagnostic Equipment.
Industrial Motor Control
The EP4CE75F29I8LN's 75,408 logic elements, 244 18x18 hardware multipliers, and 426 user I/O make it well suited to multi-axis motor control platforms where field-oriented control loops run at tens of kHz per axis. With the industrial -40C to +100C temperature grade, it tolerates cabinet-side thermal envelopes in factory automation. Designers typically instantiate 4-6 PWM modulator IPs alongside encoder decoder logic and CAN/RS-485 bridges; the four PLLs provide independent clock domains for the control loop, ADC sampling, and host interface. Compared with an MCU approach, the FPGA fabric absorbs high-resolution PWM generation and dead-time insertion without jitter, while the hardware multipliers accelerate Park/Clarke transforms. The 780-FBGA F29 footprint supports dense, multi-axis PCBs.
Recommended
Video Bridging and Image Processing
The EP4CE75F29I8LN delivers 244 18x18 multipliers and 2,810,880 bits of embedded RAM, which is enough to implement real-time image processing pipelines such as deinterlacing, scaling, color-space conversion, and basic edge detection at HD 1080p60 frame rates. The 426 user I/O accommodate parallel TTL/CMOS camera interfaces alongside LVDS or HDMI bridges using external serializers. Designers use M9K blocks for line buffers and frame stores, avoiding external SRAM, while hardware multipliers accelerate convolution kernels. Compared with discrete DSP + ASSP solutions, this Cyclone IV E integrates glue logic, the pixel pipeline, and the host interface in one device, reducing board area and BOM cost for industrial camera and video-wall applications.
Recommended
Telecom Line-Card Glue Logic and Protocol Bridging
With 426 user I/O, four PLLs, and 75,408 logic elements, the EP4CE75F29I8LN can absorb glue logic between line-card ASICs, framer/serializer chips, and backplane SERDES in telecom equipment. Typical uses include TDM-to-Ethernet bridging, custom HDLC/UART aggregation, I2C/SPI management bus multiplexing, and timing distribution across multiple ASIC reference clocks. The Cyclone IV E device's LVDS I/O and dedicated clock networks help maintain signal integrity on backplane traces, while the AES-128 bitstream encryption protects operator-proprietary IPs. Compared with discrete logic gates or CPLDs, the FPGA consolidates multi-function bridging, lowering board complexity and easing field upgrades via JTAG reconfiguration.
Recommended
Low-Cost ASIC Prototyping
The EP4CE75F29I8LN offers a 75,408-LE fabric that maps a moderate-complexity ASIC RTL (typically 30-50K gates equivalent) with headroom for verification IP and debug instrumentation. The Quartus Prime design suite supports synthesis of standard ASIC RTL, and the device's JTAG and SignalTap logic analyzer enable real-time design debugging. Engineers typically prototype control-plane ASICs, peripheral controllers, and custom interface bridges before committing to mask sets. Compared with using a larger Cyclone V or Stratix part, the Cyclone IV E minimizes prototype hardware cost while still delivering real-world I/O behavior. The 780-FBGA F29 footprint mirrors production ASIC BGA pitches, simplifying package migration.
Recommended
USB 3.0 / PCIe Gen1 / GbE Interface Bridging
The 244 hardware multipliers and 426 user I/O make the EP4CE75F29I8LN a flexible bridge between high-speed serial interfaces (USB 3.0, PCIe Gen1, GbE) and parallel processor or sensor buses. Designers instantiate the relevant soft PHY or partner with external PHY devices, then implement protocol layers in fabric. The four PLLs synthesize independent reference clocks for each interface, while M9K blocks hold packet buffers. Compared with an ASSP bridge, the FPGA approach supports custom protocol extensions and field updates. The industrial temperature grade suits industrial-USB and embedded-computing applications, and the 780-FBGA F29 footprint delivers the ground-bounce performance required for 5 Gbps-class signaling.
Recommended
Portable Medical Diagnostic Equipment
The EP4CE75F29I8LN's combination of low static power, embedded DSP blocks, and industrial temperature rating suits portable medical devices such as ultrasound front-end preprocessing, patient-monitoring front-ends, and point-of-care analyzers. The 75,408 logic elements implement front-end signal conditioning (FIR filtering, decimation, envelope detection) while the 2,810,880 bits of embedded RAM hold sample buffers. Designers integrate display drivers, USB device controllers, and custom touch-panel interfaces in fabric, reducing external component count. Compared with discrete DSP+MCU designs, the FPGA approach meets medical latency budgets while remaining field-upgradable. The -40C to +100C industrial grade supports clinical and field environments where temperatures vary.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE75F29I8LN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE75F29I7N | EP4CE75F29I8L | EP4CE75F29I7 | EP4CE75F29C9LN | EP4CE75F29C8N |
|---|---|---|---|---|---|---|
| Package | 780-ball FBGA (F29) | 780-ball FBGA (F29) - same | 780-ball FBGA (F29) - same | 780-ball FBGA (F29) - same | 780-ball FBGA (F29) - same | 780-ball FBGA (F29) - same |
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Logic Elements | 75,408 | 75,408 | 75,408 | 75,408 | 75,408 | 75,408 |
| User I/O | 426 | 426 | 426 | 426 | 426 | 426 |
| Speed Grade | I8 (Industrial, mid-fast) | I7 (slower) | I8 (same) | I7 (slower) | C9 (faster, commercial) | C8 (faster, commercial) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Embedded Memory Bits | 2,810,880 | 2,810,880 | 2,810,880 | 2,810,880 | 2,810,880 | 2,810,880 |
| 18x18 Multipliers | 244 | 244 | 244 | 244 | 244 | 244 |
Key Differentiators
- Industrial temperature rating with same-package speed-grade upgrade path (vs EP4CE75F29I7N)
- Maintains industrial temperature grade vs commercial-grade C9 alternative (vs EP4CE75F29C9LN)
- 75K LE plus 244 multipliers at industrial temperature, all in F29 FBGA (vs EP4CE55F29I8LN)
Design Notes
Estimated: at VIN core 1.2 V and a typical dynamic current around 1.5 A under sustained DSP load on the EP4CE75F29I8LN, core power dissipation is approximately 1.8 W. Provide at least four 0.1 uF + four 10 uF ceramic decoupling caps adjacent to the FBGA, plus a ferrite-bead-isolated PLL analog 2.5 V rail. Place bulk 100 uF polymer caps near the package corners. Power-rail sequencing requires VCCINT (1.2 V) before VCCAUX (2.5 V) before VCCIO, per the Cyclone IV Device Handbook.
The 780-ball FBGA F29 package has a junction-to-ambient thermal resistance of approximately 13-15 C/W with a standard 4-layer JEDEC test board. Estimated: at 1.8 W core dissipation and 25 C ambient, junction temperature rises only 23-27 C, comfortably below the 100 C industrial limit. For sustained 3+ W loads, add a heat spreader or internal PCB copper coin under the BGA to drop theta-JA further.
Route all eight global clock networks as 50 ohm microstrip or stripline with reference planes unbroken by signal layers. The four PLL analog supplies require star routing from a ferrite bead to each PLL pin; avoid sharing PLL ground with the digital ground return. JTAG TCK should be series-terminated with 33-47 ohm at the driver to prevent ringing on the 780-BGA escape routes.
Do not confuse the F29 780-FBGA package with the F23 484-FBGA package - they have different ball maps and are not pin-compatible. Also note that the I8 speed grade is slower than C9; do not assume C-grade timing models will close in I-grade silicon. Finally, verify the configuration mode (AS/PS/JTAG/FPP) and pull-up on nCONFIG before board bring-up, as the Cyclone IV E device does not default to a known state without it.
Compliance Information
RoHS / REACH compliant per Cyclone IV Device Handbook ordering info; lead-free finish confirmed by 'N' suffix and per DigiKey/Mouser listing. AEC-Q100 not applicable for FPGAs in this context.
