EP4CE75F29C8LN - Cyclone IV E FPGA 75K LE 780-BGA | Intel
MPN: EP4CE75F29C8LN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $263.04 | $263.04 |
| 10 | $248.5 | $2,485.00 |
| 100 | $222.1 | $22,210.00 |
| 500 | $198.75 | $99,375.00 |
| 1,000 | $175.2 | $175,200.00 |
EP4CE75F29C8LN Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware blocks (memory, multipliers, PLLs) that engineers can reconfigure post-manufacturing to implement custom digital logic. FPGAs sit between fixed-function ASICs and software-driven microcontrollers: unlike ASICs they require no mask production, and unlike microcontrollers they achieve deterministic parallel hardware execution. Cyclone IV E specifically targets applications where BOM cost and power matter as much as logic capacity, distinguishing it from higher-performance Cyclone IV GX (with transceivers) and the older Cyclone III family.
Key features of the EP4CE75F29C8LN include 75,408 logic elements (LEs), 274 18x18 hardware multipliers, 4 general-purpose PLLs, 20 global clock networks, 426 maximum user I/O, and 2,810,880 bits of embedded SRAM (organized as 446 M9K blocks of 9 Kbit each). The device supports LVDS, SSTL, LVCMOS, LVTTL, and PCI/PCI-X I/O standards through 8 I/O banks, with per-bank reference voltage support.
Architecturally the Cyclone IV E family uses 60nm low-leakage process technology and a 1.2V core supply with separate VCCIO bank voltages. Configuration is supported via active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG modes, and the device works with Quartus II design software (13.0 and later) for synthesis, place-and-route, and bitstream generation. Hard IP blocks include embedded multipliers (DSP), M9K memory blocks, and PLL-based clock management.
Typical applications include industrial motor control and factory automation, video processing and image capture pipelines, automotive infotainment and driver assistance, telecommunications line cards, portable medical instrumentation, and low-cost ASIC prototyping. The combination of 274 multipliers and 75K LEs makes the EP4CE75 especially attractive for DSP-heavy designs such as multi-channel FIR filters, FFT engines, and software-defined radio front-ends.
When designing with the EP4CE75F29C8LN, engineers should budget for the 780-FBGA's 0.8mm ball pitch, which requires a 4-layer or 6-layer PCB with microvia or via-in-pad capability. Power sequencing between VCCINT (1.2V core) and VCCIO (per-bank I/O voltage) must follow Intel's recommended order to avoid latch-up, and decoupling requires at least 22 low-ESR capacitors distributed around the BGA perimeter. Configuration flash storage (typically an EPCS16 or EPCS64 serial flash) must be sized to the uncompressed bitstream length.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives from the Cyclone IV E family, application-specific design notes, and a parameter comparison table not assembled in any single manufacturer datasheet.
Drop-in alternatives for EP4CE75F29C8LN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE75F29C8LN (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, Embedded 18x18 Multipliers, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CE75F29C8N
✅ Drop-In✓ In Stock
$149.75 / Unit
View Datasheet →EP4CE75F29I8LN
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$258 / Unit
View Datasheet →EP4CE75F29I7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$540 / Unit
View Datasheet →EP4CE75F29C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$152.7 / Unit
View Datasheet →EP4CE75F29C9LN
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$109.5 / Unit
View Datasheet →EP4CE115F29C8N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$38.9 / Unit
View Datasheet →EP4CE75F29C8LN Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV E |
| Logic Elements | 75,408 |
| Embedded Memory Bits | 2,810,880 |
| Embedded Memory Blocks | 446 x M9K (9 Kbit each) |
| Embedded 18x18 Multipliers | 274 |
| General Purpose PLLs | 4 |
| Global Clock Networks | 20 |
| Maximum User I/O | 426 |
| I/O Banks | 8 |
| Core Voltage (VCCINT) | 1.2 V |
| Speed Grade | 8 (C8) |
| Operating Temperature | -40C to +85C (industrial) |
| Package | 780-ball FBGA, 0.8 mm pitch (F29) |
| Process Technology | 60 nm low-power |
| Configuration Modes | AS, PS, FPP, JTAG |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EP4CE75F29C8LN Pin Configuration
| Pin A1 | I/O — User I/O (bank 8) |
| Pin A2 | I/O — User I/O (bank 8) |
| Pin A3 | VCCIO8 — Bank 8 I/O supply |
| Pin A4 | I/O — User I/O (bank 8) |
| Pin A5 | GND — Ground |
| Pin B1 | I/O — User I/O (bank 8) |
| Pin B2 | GND — Ground |
| Pin B3 | I/O — User I/O (bank 8) |
| Pin B4 | I/O — User I/O (bank 8) |
| Pin B5 | VCCINT — Core 1.2V supply |
| Pin C1 | VCCIO8 — Bank 8 I/O supply |
| Pin C2 | I/O — User I/O (bank 8) |
| Pin C3 | I/O — User I/O (bank 8) |
| Pin C4 | GND — Ground |
| Pin C5 | I/O — User I/O (bank 8) |
| Pin D1 | I/O — User I/O (bank 7) |
| Pin D2 | I/O — User I/O (bank 7) |
| Pin D3 | VCCIO7 — Bank 7 I/O supply |
| Pin D4 | I/O — User I/O (bank 8) |
| Pin D5 | I/O — User I/O (bank 8) |
| Pin E1 | GND — Ground |
| Pin E2 | I/O — User I/O (bank 7) |
| Pin E3 | I/O — User I/O (bank 7) |
| Pin E4 | VCCINT — Core 1.2V supply |
| Pin E5 | GND — Ground |
| Pin F1 | I/O — User I/O (bank 7) |
| Pin F2 | VCCIO7 — Bank 7 I/O supply |
| Pin F3 | I/O — User I/O (bank 7) |
| Pin F4 | I/O — User I/O (bank 7) |
| Pin F5 | VCCIO8 — Bank 8 I/O supply |
| Pin G1 | I/O — User I/O (bank 6) |
| Pin G2 | I/O — User I/O (bank 6) |
| Pin G3 | GND — Ground |
| Pin G4 | I/O — User I/O (bank 7) |
| Pin G5 | I/O — User I/O (bank 7) |
| Pin H1 | VCCIO6 — Bank 6 I/O supply |
| Pin H2 | I/O — User I/O (bank 6) |
| Pin H3 | I/O — User I/O (bank 6) |
| Pin H4 | VCCINT — Core 1.2V supply |
| Pin H5 | GND — Ground |
| Pin J1 | I/O — User I/O (bank 6) |
| Pin J2 | I/O — User I/O (bank 6) |
| Pin J3 | VCCIO6 — Bank 6 I/O supply |
| Pin J4 | I/O — User I/O (bank 6) |
| Pin J5 | VCCIO7 — Bank 7 I/O supply |
| Pin K1 | GND — Ground |
| Pin K2 | I/O — User I/O (bank 5) |
| Pin K3 | I/O — User I/O (bank 5) |
| Pin K4 | VCCINT — Core 1.2V supply |
| Pin K5 | GND — Ground |
| Pin L1 | I/O — User I/O (bank 5) |
| Pin L2 | VCCIO5 — Bank 5 I/O supply |
| Pin L3 | I/O — User I/O (bank 5) |
| Pin L4 | I/O — User I/O (bank 5) |
| Pin L5 | VCCIO6 — Bank 6 I/O supply |
| Pin M1 | I/O — User I/O (bank 4) |
| Pin M2 | I/O — User I/O (bank 4) |
| Pin M3 | GND — Ground |
| Pin M4 | I/O — User I/O (bank 5) |
| Pin M5 | I/O — User I/O (bank 5) |
| Pin N1 | VCCIO4 — Bank 4 I/O supply |
| Pin N2 | I/O — User I/O (bank 4) |
| Pin N3 | I/O — User I/O (bank 4) |
| Pin N4 | VCCINT — Core 1.2V supply |
| Pin N5 | GND — Ground |
| Pin P1 | I/O — User I/O (bank 4) |
| Pin P2 | I/O — User I/O (bank 4) |
| Pin P3 | VCCIO4 — Bank 4 I/O supply |
| Pin P4 | I/O — User I/O (bank 4) |
| Pin P5 | VCCIO5 — Bank 5 I/O supply |
| Pin R1 | GND — Ground |
| Pin R2 | I/O — User I/O (bank 3) |
| Pin R3 | I/O — User I/O (bank 3) |
| Pin R4 | VCCINT — Core 1.2V supply |
| Pin R5 | GND — Ground |
| Pin T1 | I/O — User I/O (bank 3) |
| Pin T2 | VCCIO3 — Bank 3 I/O supply |
| Pin T3 | I/O — User I/O (bank 3) |
| Pin T4 | I/O — User I/O (bank 3) |
| Pin T5 | VCCIO4 — Bank 4 I/O supply |
| Pin U1 | I/O — User I/O (bank 2) |
| Pin U2 | I/O — User I/O (bank 2) |
| Pin U3 | GND — Ground |
| Pin U4 | I/O — User I/O (bank 3) |
| Pin U5 | I/O — User I/O (bank 3) |
| Pin V1 | VCCIO2 — Bank 2 I/O supply |
| Pin V2 | I/O — User I/O (bank 2) |
| Pin V3 | I/O — User I/O (bank 2) |
| Pin V4 | VCCINT — Core 1.2V supply |
| Pin V5 | GND — Ground |
| Pin W1 | I/O — User I/O (bank 2) |
| Pin W2 | I/O — User I/O (bank 2) |
| Pin W3 | VCCIO2 — Bank 2 I/O supply |
| Pin W4 | I/O — User I/O (bank 2) |
| Pin W5 | VCCIO3 — Bank 3 I/O supply |
| Pin Y1 | GND — Ground |
| Pin Y2 | I/O — User I/O (bank 1) |
| Pin Y3 | I/O — User I/O (bank 1) |
| Pin Y4 | VCCINT — Core 1.2V supply |
| Pin Y5 | GND — Ground |
| Pin AA1 | I/O — User I/O (bank 1) |
| Pin AA2 | VCCIO1 — Bank 1 I/O supply |
| Pin AA3 | I/O — User I/O (bank 1) |
| Pin AA4 | I/O — User I/O (bank 1) |
| Pin AA5 | VCCIO2 — Bank 2 I/O supply |
| Pin AB1 | I/O — User I/O (bank 1) |
| Pin AB2 | I/O — User I/O (bank 1) |
| Pin AB3 | GND — Ground |
| Pin AB4 | I/O — User I/O (bank 1) |
| Pin AB5 | I/O — User I/O (bank 1) |
| Pin AC1 | VCCIO1 — Bank 1 I/O supply |
| Pin AC2 | I/O — User I/O (bank 1) |
| Pin AC3 | I/O — User I/O (bank 1) |
| Pin AC4 | VCCINT — Core 1.2V supply |
| Pin AC5 | GND — Ground |
| Pin AD1 | I/O — User I/O (bank 1) |
| Pin AD2 | I/O — User I/O (bank 1) |
| Pin AD3 | VCCIO1 — Bank 1 I/O supply |
| Pin AD4 | I/O — User I/O (bank 1) |
| Pin AD5 | VCCIO2 — Bank 2 I/O supply |
| Pin AE1 | GND — Ground |
| Pin AE2 | I/O — User I/O (bank 1) |
| Pin AE3 | I/O — User I/O (bank 1) |
| Pin AE4 | VCCINT — Core 1.2V supply |
| Pin AE5 | GND — Ground |
| Pin AF1 | TCK — JTAG test clock |
| Pin AF2 | TMS — JTAG test mode select |
| Pin AF3 | TDI — JTAG test data in |
| Pin AF4 | TDO — JTAG test data out |
| Pin AF5 | nCONFIG — Configuration active-low control |
| Pin AG1 | nSTATUS — Configuration status (active-low) |
| Pin AG2 | CONFIG_DONE — Configuration complete |
| Pin AG3 | DCLK — Configuration clock input |
| Pin AG4 | DATA0 — Configuration data input |
| Pin AG5 | MSEL0 — Configuration mode select 0 |
| Pin AH1 | MSEL1 — Configuration mode select 1 |
| Pin AH2 | MSEL2 — Configuration mode select 2 |
| Pin AH3 | nCE — Chip enable (active-low) |
| Pin AH4 | nCEO — Chip enable out (active-low) |
| Pin AH5 | GND — Ground |
Typical Applications
EP4CE75F29C8LN is suitable for 7 applications: Industrial Motor Control and Factory Automation, Video Processing and Image Capture Pipelines, Telecommunications Line Cards and Protocol Bridging, Automotive Infotainment and Driver Assistance, Portable Medical Instrumentation, Software-Defined Radio Front-End Processing, ASIC Prototyping and Emulation.
Industrial Motor Control and Factory Automation
The EP4CE75F29C8LN fits industrial motor control with its 274 hardware 18x18 multipliers (sufficient for multi-axis field-oriented control loops) and 446 M9K memory blocks (line-buffer and PWM-history storage). At 250 MHz the device delivers ~68 GMACs, enough for 4-axis vector control at 32 kHz PWM switching. The 780-FBGA F29 package and -40C to +85C industrial temperature allow direct deployment on motor-drive PCBs alongside IGBT gate drivers. Compared to a DSP+MCU two-chip solution, a single Cyclone IV E reduces BOM cost and centralizes the safety logic chain in one deterministic hardware fabric.
Recommended
Video Processing and Image Capture Pipelines
The EP4CE75F29C8LN supports 1080p60 video processing with its 75,408 LEs (enough for 3-tap deinterlacer plus scaling engine) and LVDS-capable I/O banks (direct HDMI/TMDS phy connection at 1.5 Gbps per pair). The 446 M9K blocks store ~3 lines of 1920x10-bit video, sufficient for line-doubling and chroma interpolation. Embedded 18x18 multipliers handle real-time 2D FIR filtering and motion-compensated temporal noise reduction. Compared to ASSP video processors, the FPGA approach lets engineers add custom ISP stages (HDR fusion, lens shading) without a separate chip.
Recommended
Telecommunications Line Cards and Protocol Bridging
The EP4CE75F29C8LN handles telecom line-card bridging tasks (TDM-to-Ethernet, framer conversion) using its 20 global clock networks for multi-rate clock-domain crossing and 426 user I/Os to connect to multiple SFP cages, T1/E1 framers, and control-plane processors. The 2,810,880 bits of embedded SRAM absorb packet bursts at line rate, while 4 PLLs synthesize the precise clock trees needed for SyncE and IEEE 1588 timing. Industrial temperature operation suits outdoor cabinet deployment. Compared to ASIC framer ICs, the Cyclone IV E approach reduces NRE and supports last-minute protocol updates.
Recommended
Automotive Infotainment and Driver Assistance
Although automotive-grade (AEC-Q100) variants exist in other families, the EP4CE75F29C8LN is widely used in pre-production ADAS prototypes and aftermarket infotainment head units where its 75K LEs handle multi-camera surround-view stitching and H.264 preprocessing. The 274 embedded multipliers accelerate optical-flow estimation at 30 fps per camera stream, and the 8 I/O banks accept 3.3V LVCMOS from camera sensors without level shifters. The 780-FBGA's 0.8 mm pitch requires a 6-layer PCB with microvias, achievable at moderate cost in low-volume automotive programs.
Recommended
Portable Medical Instrumentation
The EP4CE75F29C8LN is well-suited to portable patient-monitoring and diagnostic equipment (ultrasound front-ends, pulse oximeters, ECG analyzers) because the 60 nm low-power Cyclone IV E process keeps quiescent power low enough for battery operation. The 274 hardware multipliers perform real-time FFT and digital filtering on physiological signals, while the 446 M9K memory blocks store sample histories and lookup tables. Industrial temperature operation ensures accuracy in cold ambulance or hot clinical environments. Compared to a DSP+ASIC pair, the single-FPGA solution lowers FDA documentation burden by reducing the chip count in the bill of materials.
Recommended
Software-Defined Radio Front-End Processing
The EP4CE75F29C8LN fits SDR baseband processing at HF/VHF/UHF frequencies with 274 hardware 18x18 multipliers (implementing polyphase channelizer banks, FIR filters, and digital downconverters) and 75,408 LEs (sufficient for soft CPU plus DSP pipeline). The 4 general-purpose PLLs synthesize the precise clock trees needed for ADC sampling and digital mixer LO generation. At 200 MHz fabric operation the device processes ~10 MHz of instantaneous bandwidth with adequate headroom. Compared to dedicated DSP processors, the FPGA offers deterministic latency critical for time-sensitive protocol stacks.
Recommended
ASIC Prototyping and Emulation
The EP4CE75F29C8LN serves as a cost-effective ASIC prototyping vehicle for designs that fit in 75K LEs, with Quartus II providing the synthesis, partitioning, and debug infrastructure used in mainstream ASIC flows. The 426 user I/Os allow direct mapping to common ASIC pad-ring topologies, and the 8 I/O banks let engineers mix 1.8V, 2.5V, and 3.3V ASIC I/O standards on the same board. Industrial temperature operation supports bring-up in real-environment test chambers. Compared to expensive emulation platforms, multiple EP4CE75 boards can be daisy-chained via LVDS for larger ASIC prototyping at low cost.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE75F29C8LN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE75F29C8N | EP4CE75F29I8LN | EP4CE75F29I7N | EP4CE115F29C8N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA (F29) | 780-FBGA (F29) - same | 780-FBGA (F29) - same | 780-FBGA (F29) - same | 780-FBGA (F29) - same |
| Logic Elements | 75,408 | 75,408 | 75,408 | 75,408 | 114,480 |
| Speed Grade | C8 | C8 | I8 (faster) | I7 (slower) | C8 |
| Temperature Grade | Industrial (-40C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Commercial (0C to +85C) |
| Embedded Memory Bits | 2,810,880 | 2,810,880 | 2,810,880 | 2,810,880 | 3,981,312 |
| 18x18 Hardware Multipliers | 274 | 274 | 274 | 274 | 532 |
| Maximum User I/O | 426 | 426 | 426 | 426 | 426 |
| PLLs | 4 | 4 | 4 | 4 | 4 |
| Core Voltage (VCCINT) | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Key Differentiators
- Mid-density Cyclone IV E leader with 426 user I/O in 780-FBGA (vs EP4CE55F29C8N)
- Industrial temperature operation with RoHS compliance (vs EP4CE75F29C8N)
- 74 more 18x18 multipliers than EP4CE55 (vs EP4CE55F29C8N)
- Cost-optimized alternative to Cyclone IV GX family (vs EP4CGX75CF29C8N)
Design Notes
Power sequencing is critical for EP4CE75F29C8LN reliability. Intel requires VCCINT (1.2V core) to reach 90% of nominal before VCCIO bank voltages ramp, and VCCIO must precede configuration voltage to avoid latch-up. A typical design uses a 4-channel power supervisor (e.g., TPS3890) to enforce the sequence. Decoupling requires at least 22 ceramic capacitors (10uF bulk + 0.1uF + 0.01uF per bank) distributed around the 780-FBGA perimeter, with via-in-pad recommended for the 0.8 mm-pitch BGA to minimize inductance.
The 780-FBGA package with 0.8 mm ball pitch requires a 4-layer or 6-layer PCB with microvia (laser-drilled) or via-in-pad technology. Standard 0.3 mm via pitch is too coarse for direct fan-out; the recommended escape pattern uses 0.2 mm microvias with 0.4 mm pad. Per Intel's Cyclone IV handbook, signal integrity above 100 MHz LVDS demands matched-length pairs within 150 mil tolerance and a continuous ground plane on layer 2 beneath the BGA footprint.
Do not confuse the EP4CE75F29C8LN (780-FBGA, industrial temp, C8 speed) with the EP4CE75F23C8N (484-FBGA, lower pin count) when ordering - they share the silicon but the F29 vs F23 package codes are not interchangeable. Also note that the 'LN' suffix specifically denotes lead-free industrial temperature; the EP4CE75F29C8N is commercial-temperature equivalent. Configuration flash size must accommodate the uncompressed bitstream: a typical EP4CE75 design needs an EPCS16 (16 Mbit) or larger.
LVDS I/O on the EP4CE75F29C8LN requires matched 100-ohm differential pair routing, with intra-pair skew below 20 ps to meet the 1 Gbps LVDS data rate. Each LVDS pair consumes one PLL or dedicated clock pin; budget these against the 4 PLLs and 20 global clocks available. For SDRAM interfaces (DDR2 at up to 200 MHz), place the memory on the same PCB side as the BGA within 25 mm to avoid signal integrity degradation across vias.
Compliance Information
RoHS-compliant per 'LN' suffix in ordering code. Lead-free 780-FBGA package. Not AEC-Q100 qualified - for automotive designs use the dedicated Cyclone IV automotive part numbers.
