EP4CGX75CF23I6N - 73,920-Cell FPGA, 1.2V | Intel
MPN: EP4CGX75CF23I6N ✓ Active| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP4CGX75CF23I6N Overview
A field-programmable gate array is an integrated circuit containing configurable logic blocks, programmable interconnects, and I/O resources that engineers can configure after manufacturing. Within the semiconductor hierarchy, an FPGA belongs to programmable logic devices, which are a category of digital integrated circuits. Unlike a fixed-function application-specific integrated circuit, an FPGA can implement changing logic requirements, parallel processing structures, interface protocols, and hardware accelerators while retaining design-revision flexibility.
The principal verified characteristics are 73,920 FPGA cells, 1.2V technology supply, 60nm process technology, and a 484-pin FBGA package. The Cyclone IV GX designation also indicates a family intended for programmable logic designs requiring integrated system-level functionality. Because the supplied data does not expose the exact logic-element count, memory capacity, transceiver count, maximum I/O count, speed grade, or operating-temperature limit, those values are deliberately not inferred.
The package combines a 484-ball FBGA land pattern with programmable logic density suitable for control, communications, industrial, and embedded-processing systems. Engineers should use the manufacturer ordering-code documentation to interpret the I6N suffix and select matching power, configuration, memory, and PCB implementation guidance. A BGA assembly also requires controlled-impedance routing, appropriate via structures, thermal analysis, and manufacturer-qualified assembly processes.
Typical verified application areas include embedded control systems, industrial automation, communications equipment, test and measurement, video or image processing, and configurable digital-signal-processing platforms. The device is particularly relevant where a custom hardware datapath is needed without committing the product to a fixed-function ASIC design.
The main design trade-off is that an FPGA provides flexibility and parallel processing but requires configuration memory, power sequencing, device-specific implementation tools, and thorough timing closure. Exact speed, power, I/O, and environmental values must be confirmed from the official manufacturer documentation before schematic or PCB release.
This data set combines the verified manufacturer product-family description, package and process values, visible pricing-availability references, and explicit uncertainty markers. It also avoids presenting unverified pin-to-pin alternatives as drop-in replacements, which is essential for a 484-ball programmable-logic device.
Drop-in alternatives for EP4CGX75CF23I6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX75CF23I6N (same form factor and footprint) — differing in Package, RoHS Status, Operating Temperature, Mounting Type, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
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View Datasheet →EP4CGX75CF23I6N Maximum Ratings & Electrical Characteristics
| Product Type | Field-Programmable Gate Array (FPGA) |
| FPGA Family | Cyclone IV GX |
| Logic Cell Count | 73,920 cells |
| Process Technology | 60 nm |
| Core Supply Voltage | 1.2 V |
| Package | 484-pin FBGA |
| Mounting Type | Surface Mount |
| RoHS Status | unknown |
| REACH Status | unknown |
| AEC-Q100 Qualification | unknown |
| Lead-Free Status | unknown |
| Halogen-Free Status | unknown |
EP4CGX75CF23I6N 484-pin fbga Pin Configuration Guide
Pin configuration for EP4CGX75CF23I6N (484-pin fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CGX75CF23I6N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CGX75CF23I6N is suitable for 6 applications: Industrial Automation Controllers, Communications Interface Equipment, Embedded Digital Signal Processing, Test and Measurement Instruments, Video and Image Processing, Configurable Protocol Bridge.
Industrial Automation Controllers
EP4CGX75CF23I6N is a strong candidate for industrial automation controllers that require configurable digital logic, parallel processing, and multiple interface functions in one device. Its verified Cyclone IV GX identity, 73,920 logic cells, 1.2V technology, and 484-pin FBGA package provide a platform for motor-control sequencing, sensor aggregation, protocol conversion, and deterministic control datapaths. Engineers can implement custom state machines, timing blocks, and interface bridges while retaining the ability to revise logic after PCB assembly. The large area-array package supports many device connections but requires a carefully designed BGA escape, power distribution network, and thermal solution. Industrial qualification, temperature range, I/O limits, and timing margins are not present in the verified data and must be checked against the official Intel ordering documentation before release.
Recommended
Communications Interface Equipment
EP4CGX75CF23I6N can support communications equipment that needs configurable packet handling, framing, channel aggregation, or protocol adaptation. The 73,920-cell Cyclone IV GX architecture allows multiple parallel logic blocks and custom interface functions to coexist without committing to a fixed-function ASIC. The 484-pin FBGA package provides a high-density connection solution for I/O banks, memory interfaces, clocks, and control signals. In a communications design, the FPGA can perform buffering, header processing, error checking, and data-path adaptation while engineers adjust the logic as standards or system requirements change. The verified data does not specify transceiver count, supported protocols, I/O voltage, or maximum clock frequency, so those capabilities must be confirmed from the manufacturer datasheet rather than inferred from the family name.
Recommended
Embedded Digital Signal Processing
EP4CGX75CF23I6N is suitable for embedded digital-signal-processing systems that benefit from parallel datapaths and hardware-level determinism. With 73,920 logic cells in the Cyclone IV GX family, the device can host filters, encoders, decoders, control loops, and custom arithmetic structures while leaving room for configuration and interface logic. The 1.2V technology description and 60nm process are useful starting points for power and thermal planning, but the supplied data does not state multiplier count, memory capacity, DSP performance, or maximum frequency. Designers should therefore use the exact device family documentation to determine throughput and resource utilization. The 484-pin FBGA package helps integrate a high-density programmable device, while BGA escape, controlled impedance, decoupling, and clock integrity remain essential board-level considerations.
Recommended
Test and Measurement Instruments
EP4CGX75CF23I6N can serve as a configurable processing and control platform in test and measurement instruments. Its 73,920 logic cells and Cyclone IV GX architecture allow engineers to implement acquisition sequencing, trigger logic, waveform processing, timing generation, and instrument interfaces in programmable hardware. Parallel FPGA logic can process multiple data streams with predictable structure, while post-assembly logic updates help accommodate changing test requirements or calibration algorithms. The 484-pin FBGA package supports a dense integration strategy, but it also makes signal integrity, power integrity, and thermal performance central to the design. The verified source data does not specify the number of I/O pins, memory bits, DSP blocks, operating temperature, or speed grade. Those parameters must be verified in the official Intel documentation before selecting the part for a precision instrument.
Recommended
Video and Image Processing
EP4CGX75CF23I6N may be used in video or image-processing systems requiring configurable pipelines, frame handling, filtering, and real-time control. The 73,920-cell Cyclone IV GX FPGA can implement parallel processing stages and adapt data widths, frame formats, or timing behavior as system requirements evolve. The 484-pin FBGA package provides high connection density for image sensors, memory interfaces, clock domains, and output bridges. A practical design can partition acquisition, processing, buffering, and transmission into dedicated hardware blocks, reducing reliance on sequential software execution. However, the verified data does not provide the exact memory capacity, DSP resources, supported I/O standards, or maximum clock frequency, so image throughput and frame rate cannot be calculated from the supplied values. Confirm device resources and timing before committing to a specific architecture.
Recommended
Configurable Protocol Bridge
EP4CGX75CF23I6N is a logical choice for a configurable protocol bridge that must translate between sensors, processors, memory devices, or communication interfaces. Its 73,920 logic cells and Cyclone IV GX architecture allow parallel state machines, FIFOs, serializers, and format-conversion blocks to be implemented together. The device can support hardware changes without redesigning the entire PCB, which is useful for evolving embedded products. The 484-pin FBGA package offers high-density integration, but the design must account for BGA routing, signal integrity, power integrity, and thermal performance. The verified source data does not list exact I/O count, supported voltage levels, transceiver resources, or timing limits, so a bridge design must be based on the official device documentation. Confirm configuration-memory, clocking, I/O-bank, and power-sequencing requirements before layout.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX75CF23I6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX75CF23C6N | EP4CGX75CF23C7N | EP4CGX75CF23C8N | EP4CGX75CF23C6 | EP4CGX75CF23C7 |
|---|---|---|---|---|---|---|
| Package | 484-pin FBGA | 484-pin FBGA | 484-pin FBGA | 484-pin FBGA | 484-pin FBGA | 484-pin FBGA |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| FPGA Family | Cyclone IV GX | Cyclone IV GX | Cyclone IV GX | Cyclone IV GX | Cyclone IV GX | Cyclone IV GX |
Key Differentiators
- Requested EP4CGX75CF23I6N ordering identity (vs EP4CGX75CF23C6N)
- Large verified logic-cell capacity (vs EP4CGX50CF23C6N)
- Cyclone IV GX family positioning (vs EP4CGX30CF23C6N)
Design Notes
Start the 484-pin FBGA layout from the official Intel package drawing and ball map, not from a generic BGA template. Confirm ball numbering, orientation, power and ground assignments, differential pairs, and configuration pins. Plan the escape routing, via transition, layer stack-up, impedance, and return-path continuity before placing unrelated components. A package name alone does not establish pinout compatibility, so the complete pin assignment must be checked against the selected device ordering code and PCB land pattern.
Use the official Cyclone IV GX power-management guidance for the selected device and speed grade. The verified data states 1.2V technology and 60nm process, but it does not provide core-current curves, I/O-bank voltage limits, auxiliary rails, power-up sequencing, or thermal design values. Size the regulator and decoupling network from manufacturer current limits and transient requirements, and verify startup sequencing and brownout behavior in the final schematic.
The 484-pin FBGA package concentrates logic and I/O connections in a small area, so thermal analysis should begin with the official package thermal data and the selected PCB stack-up. The supplied data does not provide junction-to-ambient resistance, maximum junction temperature, or power dissipation. Use the complete Intel documentation to estimate worst-case dissipation, copper spreading, airflow, and local heating. Do not treat 60nm process technology as a substitute for a validated thermal design.
For high-speed clocks, memory interfaces, and differential signals, define controlled-impedance routing and continuous reference planes before layout. The verified snippets do not state the supported I/O standards, transceiver resources, or maximum clock frequency, so these values must be taken from the exact device documentation. Keep clock and configuration routing away from noisy power regions, provide local decoupling at the relevant supply pins, and validate the finished design with signal-integrity simulation and measurement.
Compliance Information
The verified web data does not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. Compliance values are therefore unknown rather than inferred.
