EP4CGX75CF23C7 - Cyclone IV GX FPGA 73.9k LE, 290 I/O, 484-BGA | Intel
MPN: EP4CGX75CF23C7 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $85.5 | $85.50 |
| 10 | $78.2 | $782.00 |
| 100 | $71.4 | $7,140.00 |
| 500 | $65.8 | $32,900.00 |
| 1,000 | $60.5 | $60,500.00 |
EP4CGX75CF23C7 Overview
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a programmable logic device that allows hardware designers to implement custom digital circuits after manufacturing. FPGAs sit in the broader taxonomy of programmable logic devices (PLD), alongside CPLDs, and are categorized as high-density programmable logic. Within Intel's portfolio, Cyclone IV GX belongs to the low-power, low-cost Cyclone series targeted at high-volume, cost-sensitive applications.
Key features of the EP4CGX75CF23C7 include 4,257,792 bits of embedded memory (approximately 4 Mbits), 290 maximum user I/O pins, and integrated 3.125 Gbps transceivers supporting protocols such as PCI Express Gen1, Gigabit Ethernet, and Serial RapidIO. The device operates from a 1.0V/1.2V core with multiple I/O bank voltages, and supports the commercial 0C to +85C temperature grade (denoted by the 'C7' suffix). The 484-BGA package uses Intel's standard 1.0 mm ball pitch for FineLine BGA.
The architecture combines logic elements, embedded memory blocks (M9K), embedded 18x18 multipliers, and high-speed transceivers in a single die. Compared with ASICs, FPGAs deliver faster time-to-prototype and lower NRE costs, while compared with earlier-generation FPGAs, Cyclone IV GX significantly reduces static and dynamic power while integrating transceiver IP blocks that previously required external PHYs.
Typical applications include industrial video bridging and processing, motor control and drive interfaces, broadcast equipment, and embedded PCIe endpoint designs. The integrated transceivers make the EP4CGX75CF23C7 particularly attractive for cost-sensitive serial-protocol designs that previously required more expensive FPGAs or external PHY chips.
When designing with this device, plan I/O bank voltage assignments carefully because mixed-voltage interfaces (1.2V, 1.5V, 1.8V, 2.5V, 3.3V) require dedicated bank supplies. The 484-FBGA package requires a 4+ layer PCB with controlled-impedance routing and matched-length differential pair routing for transceiver channels.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not consolidated on the manufacturer datasheet.
Drop-in alternatives for EP4CGX75CF23C7 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX75CF23C7 (same form factor and footprint) β differing in Package, RoHS Status, Operating Temperature, Embedded Memory, Transceivers.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4CGX75CF23C7N
β Drop-Inβ In Stock
$71.2 / Unit
View Datasheet βEP4CGX75CF23C6N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$99 / Unit
View Datasheet βEP4CGX75CF23C6
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$62.95 / Unit
View Datasheet βEP4CGX75CF23I7N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$165.3 / Unit
View Datasheet βEP4CGX110CF23C7N
β Drop-Inβ In Stock
$89.12 / Unit
View Datasheet βEP4CGX150CF23C7N
β Drop-Inβ In Stock
$138.95 / Unit
View Datasheet βEP4CGX110CF23C7
β Drop-Inβ In Stock
$224.84 / Unit
View Datasheet βEP4CGX75CF23C7 Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV GX |
| Logic Elements (LE) | 73,920 |
| Total Memory Bits | 4,257,792 bits |
| Embedded Memory | M9K blocks |
| Number of I/O | 290 |
| Number of LABs/CLBs | 4620 |
| Package | 484-BGA (FBGA) |
| Package Code | F23 |
| Ball Pitch | 1.0 mm |
| Operating Temperature | 0C to +85C (commercial, C7 suffix) |
| Supply Voltage (Core) | 1.0V / 1.2V |
| Transceivers | 3.125 Gbps integrated |
| RoHS Status | Non-Compliant (Contains Lead per DigChip listing) |
| Lead Free Status | Contains Lead (per DigChip listing) |
| Mounting Type | Surface Mount (BGA) |
EP4CGX75CF23C7 f23 Pin Configuration Guide
Pin configuration for EP4CGX75CF23C7 (f23 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CGX75CF23C7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CGX75CF23C7 is suitable for 6 applications: Industrial Video Bridging and Processing, PCI Express Endpoint Bridge, Motor Control and Drive Interface, Broadcast Equipment and Serial Digital Interface, Industrial Ethernet and Serial Protocol Bridging, Test and Measurement Instrumentation.
Industrial Video Bridging and Processing
The EP4CGX75CF23C7 fits industrial video bridging applications because its 290 user I/O pins provide parallel LVCMOS/LVDS buses for BT.1120, RGB, or open-LDI video interfaces, while the 4 Mbits of embedded M9K memory buffer active video lines. Integrated 3.125 Gbps transceivers handle SDI serialization for broadcast-grade outputs or HDMI bridging via external PHY. The 73,920 logic elements support color-space conversion, scaling, and on-screen overlay pipelines. Typical designs place the FPGA between a CMOS sensor and a backplane link, with DDR2/DDR3 external memory for frame buffering.
Recommended
PCI Express Endpoint Bridge
The EP4CGX75CF23C7 serves as a PCIe Gen1 endpoint with hard IP blocks for PCI Express integrated into the Cyclone IV GX architecture, eliminating external PHY cost. The 3.125 Gbps transceivers deliver PCIe Gen1 x1/x2/x4 lanes, supporting endpoint applications such as PCIe frame grabbers, data-acquisition cards, and industrial I/O adapters. The 73.9k logic elements handle protocol bridging (PCIe to local bus, PCIe to memory). The 484-FBGA package provides sufficient I/O for downstream parallel interfaces (FIFO, SRAM, or DDR bridge).
Recommended
Motor Control and Drive Interface
The EP4CGX75CF23C7 suits motor control and drive designs that require multiple PWM channels, encoder interfaces, and high-speed control loops. The 290 user I/O pins accommodate multi-axis PWM outputs, Hall-effect sensor inputs, QEP encoder inputs, and fieldbus (EtherCAT, CAN, RS-485) interfaces. The embedded 18x18 multipliers accelerate field-oriented control (FOC) and Park/Clarke transforms, while the 4 Mbits of memory buffer lookup tables and waveform captures. Industrial-temperature EP4CGX75CF23I7N variants extend operation to -40C to +100C for outdoor cabinets.
Recommended
Broadcast Equipment and Serial Digital Interface
Broadcast equipment designs leverage the EP4CGX75CF23C7 for SDI (Serial Digital Interface) routing, multiplexing, and processing at rates up to 3 Gbps (SMPTE 424M). The integrated transceivers interface directly to SDI PHYs, eliminating external serializer/deserializer chips. The 73.9k logic elements handle ancillary data insertion, audio embedding/de-embedding, and clock recovery. The 290 user I/O pins enable parallel control interfaces and GPIO for routing matrices. RoHS-compliant EP4CGX75CF23C7N variants suit European and North American broadcast OEMs.
Recommended
Industrial Ethernet and Serial Protocol Bridging
The EP4CGX75CF23C7 bridges industrial Ethernet protocols (PROFINET, EtherNet/IP, EtherCAT) to legacy serial buses (RS-232, RS-485, CAN) via its integrated transceivers and soft-IP MACs. The 73.9k logic elements support real-time protocol stacks with deterministic latency, while the 290 user I/O pins accommodate multiple isolated serial ports. The 4 Mbits of embedded memory buffer protocol frames. Designs typically pair the FPGA with an external PHY (such as a Micrel KSZ8041) and use the M9K memory blocks for circular frame buffers.
Recommended
Test and Measurement Instrumentation
Test and measurement equipment benefits from the EP4CGX75CF23C7's combination of high-speed transceivers (for serial data acquisition), abundant user I/O (for parallel stimulus/response buses), and ample logic for custom DSP and pattern generation. Logic analyzers, protocol exercisers, and bit-error-rate testers use the FPGA to generate stimulus patterns at rates up to 3.125 Gbps while sampling and analyzing return signals. The 484-FBGA package's thermal envelope supports continuous high-utilization operation when mounted on a PCB with adequate copper pour.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX75CF23C7 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX75CF23C7N | EP4CGX75CF23C6N | EP4CGX75CF23C6 | EP4CGX75CF23I7N | EP4CGX110CF23C7N | EP4CGX150CF23C7N | EP4CGX110CF23C7 |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-BGA (FBGA F23) | 484-BGA (FBGA F23) - same | 484-BGA (FBGA F23) - same | 484-BGA (FBGA F23) - same | 484-BGA (FBGA F23) - same | 484-BGA (FBGA F23) - same | 484-BGA (FBGA F23) - same | 484-BGA (FBGA F23) - same |
| Logic Elements | 73,920 | 73,920 | 73,920 | 73,920 | 73,920 | 109,424 (+47%) | 149,760 (+103%) | 109,424 (+47%) |
| Total Memory Bits | 4,257,792 bits | 4,257,792 bits | 4,257,792 bits | 4,257,792 bits | 4,257,792 bits | 5,499,264 bits (+29%) | 6,475,200 bits (+52%) | 5,499,264 bits (+29%) |
| User I/O Pins | 290 | 290 | 290 | 290 | 290 | 290 (same) | 290 (same) | 290 |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| RoHS Status | Non-Compliant (Contains Lead) | Compliant (Lead-free) | Compliant (Lead-free) | Non-Compliant | Compliant (Lead-free) | Compliant (Lead-free) | Compliant (Lead-free) | Non-Compliant |
| Transceivers | 3.125 Gbps integrated | 3.125 Gbps integrated | 3.125 Gbps integrated | 3.125 Gbps integrated | 3.125 Gbps integrated | 3.125 Gbps integrated | 3.125 Gbps integrated | 3.125 Gbps integrated |
Key Differentiators
- Same package, RoHS-compliant drop-in replacement available (vs EP4CGX75CF23C7N)
- Industrial-temperature variant available in same package (vs EP4CGX75CF23I7N)
- Higher-density upgrade paths in same F23 footprint (vs EP4CGX110CF23C7N)
- Maximum-density drop-in in same F23 footprint (vs EP4CGX150CF23C7N)
Design Notes
The 484-FBGA package's thermal performance depends heavily on PCB copper pour area and via count under the package. For designs utilizing >75% of logic resources at high toggle rates, provide at least 1 square inch of top-layer copper directly under the BGA, plus a 4-layer stack-up with dedicated ground/power planes. Cyclone IV GX power estimation via PowerPlay Early Power Estimator should be run before final layout to size thermal relief.
The 484-BGA with 1.0 mm ball pitch requires a 4+ layer PCB with laser-drilled or 0.3 mm mechanical-drilled microvias for fanout from inner balls. Match-length differential pair routing is mandatory for transceiver channels - use the Quartus II pin planner to export the .qsf pin assignments and import them into your PCB CAD tool. Maintain 100-ohm differential impedance for transceiver lanes and 50-ohm single-ended for general-purpose I/O.
Estimated: A typical Cyclone IV GX design using 70% of logic, 50% of memory, and 4 active transceiver channels at 3.125 Gbps draws approximately 2.5-3.5W. Designers should size VCCINT regulator to 4W headroom and use a switching regulator at 1.0-1.2V with output ripple below 30 mVpp. Decoupling: 100 nF X7R capacitors placed within 5 mm of each VCCINT pin, plus bulk 47-100 uF polymer or ceramic on the supply rail. VCCA (2.5V PLL analog) must be filtered separately from digital supplies.
Common pitfalls when using EP4CGX75CF23C7: (1) Mixing I/O voltage standards across banks without checking VCCIO per bank - VCCIO pins are bank-specific. (2) Forgetting MSEL[0.2] configuration mode pin pull-up/pull-down for AS/PS/JTAG configuration selection. (3) Not connecting nCONFIG, nSTATUS, and CONF_DONE to the configuration controller - leaving them floating can cause configuration failure. (4) Insufficient transceiver reference clock quality - use a jitter-cleaner or low-jitter crystal oscillator meeting the device's data sheet requirements.
For 3.125 Gbps transceiver channels, layer stack-up must be designed for 85-100 ohm differential impedance with matched trace lengths within 150 mil of the longer trace. Use AC-coupled capacitors (typically 100 nF X7R) on each transceiver serial lane. Maintain solid ground reference under transceiver traces; avoid crossing splits in reference planes. Cyclone IV GX transceivers require board-level signal integrity verification via 3D EM simulation or measurement with TDR/TDT equipment.
Compliance Information
Per DigChip listing and Micro-Semiconductor distributor data: RoHS Non-Compliant, Lead Free Status: Contains Lead (SnPb BGA balls). For RoHS-compliant drop-in, use EP4CGX75CF23C7N. Reach, halogen-free, and conflict-mineral status not specified in Verified Web Data.
