EP4CGX50DF23I8N - Cyclone IV GX FPGA, 50K LE, 484-FBGA | Intel
MPN: EP4CGX50DF23I8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $86.5 | $865.00 |
| 100 | $76 | $7,600.00 |
| 500 | $68.5 | $34,250.00 |
| 1,000 | $60 | $60,000.00 |
EP4CGX50DF23I8N Overview
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as transceivers, memory controllers, and multipliers. FPGAs are the bridge between ASICs (Application-Specific Integrated Circuits) and general-purpose processors: unlike ASICs they are reprogrammable, and unlike microcontrollers they perform logic operations in dedicated parallel hardware rather than sequential software. Within the FPGA taxonomy, the Cyclone IV family sits in the low-power / low-cost segment, with the GX variant adding 3.125 Gbps multi-gigabit transceivers.
Key differentiating specifications of the EP4CGX50DF23I8N include up to 364 user I/O pins, eight 3.125 Gbps transceivers (depending on package), 234 Kbits of embedded RAM, 2 PLLs, and PCI Express hard IP blocks. The device supports common memory interfaces such as DDR2, DDR3, and QDRII+. The 60 nm process technology balances cost and dynamic power, with a typical static power around 50 mW for this density.
The architecture integrates 4-input look-up tables (LUTs), embedded memory blocks (M9K), and dedicated 18x18 multipliers for DSP functions. The GX transceiver blocks support protocols such as PCIe Gen1/Gen2 (x1/x2), GbE, Serial RapidIO, and CPRI, enabling the FPGA to interface directly with backplanes and high-speed serial links.
Typical applications include industrial motor control, video processing and surveillance, low-cost PCIe endpoints, software-defined radio, and test and measurement instrumentation. The 484-FBGA package and industrial temperature grade also suit outdoor and ruggedized embedded systems.
When designing with this part, note that LVDS, DDR memory controllers, and PCIe hard IP each require specific bank pin assignments and reference clock pin planning; refer to the pin connection guidelines in the Cyclone IV Device Handbook. Quartus II or Intel Quartus Prime is the required design toolchain for synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor pricing, drop-in Cyclone IV GX and Cyclone V E equivalents, and practical design notes that go beyond the manufacturer datasheet alone.
Drop-in alternatives for EP4CGX50DF23I8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX50DF23I8N (same form factor and footprint) — differing in Package, RoHS Status, Operating Temperature, Transceivers, Speed Grade.
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View Datasheet →EP4CGX50DF23I8N Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV GX |
| Logic Elements | 49,888 |
| Process Technology | 60 nm |
| Core Voltage | 1.2 V |
| Package | 484-ball FineLine BGA (FBGA) |
| Package Code | F23 |
| Operating Temperature | -40C to +85C (Industrial) |
| Temperature Grade | I8N (Industrial, Pb-free) |
| User I/O (max) | 364 |
| Embedded RAM | 234 Kbits (M9K blocks) |
| PLLs | 2 |
| Transceivers | Up to 8 (3.125 Gbps) |
| PCIe Hard IP | Yes (Gen1/Gen2) |
| Multipliers | 18x18 dedicated DSP blocks |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant (Pb-free) |
EP4CGX50DF23I8N f23 Pin Configuration Guide
Pin configuration for EP4CGX50DF23I8N (f23 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CGX50DF23I8N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CGX50DF23I8N is suitable for 6 applications: Industrial Motor Control, Video Surveillance / Image Processing, PCI Express Endpoint Cards, Software-Defined Radio (SDR), Test and Measurement Instrumentation, Industrial Networking / Fieldbus Gateways.
Industrial Motor Control
The EP4CGX50DF23I8N with 49,888 logic elements, 2 PLLs, and 18x18 DSP multipliers is well-suited for multi-axis industrial motor control. It implements field-oriented control (FOC) loops, encoder interfaces (EnDat, BISS, SSI), and protocols like EtherCAT or SERCOS III in parallel hardware. The industrial temperature grade (-40C to +85C, I8N) ensures reliable operation in factory environments with ambient temperature fluctuations and vibration. The 3.125 Gbps transceivers support industrial Ethernet backplane links. Compared to microcontroller solutions, the FPGA's parallel processing delivers sub-microsecond current loop rates needed for high-dynamic servo drives.
Recommended
Video Surveillance / Image Processing
The EP4CGX50DF23I8N supports real-time video processing pipelines including Bayer demosaicing, noise reduction, and H.264 encoding pre-processing. The 49,888 logic elements and 234 Kbits of M9K RAM handle line buffers and intermediate frame data for HD (720p/1080p) streams. Embedded 18x18 multipliers accelerate 2D convolution kernels for edge detection and motion estimation. The LVDS I/O supports direct connection to CMOS image sensors and MIPI bridges. Compared to ASICs, the FPGA enables rapid prototyping of new algorithms and quick adaptation to evolving video standards.
Recommended
PCI Express Endpoint Cards
The EP4CGX50DF23I8N integrates PCI Express Gen1/Gen2 hard IP blocks, enabling direct PCIe x1 or x2 endpoint implementation without an external PHY. This makes the device ideal for low-cost data acquisition cards, industrial I/O cards, and protocol analyzer cards. The F23 484-FBGA package provides sufficient I/O for PCIe edge connector plus auxiliary GPIO and JTAG. The PCIe hard IP block handles link training, transaction layer, and data link layer autonomously, freeing FPGA logic for application-specific functions like DMA engines and register interfaces.
Recommended
Software-Defined Radio (SDR)
The EP4CGX50DF23I8N's multi-gigabit transceivers (up to 3.125 Gbps) and DSP multipliers make it a viable FPGA for narrow-band SDR platforms implementing digital downconversion, channelization, and modulation/demodulation in FPGA fabric. The 49,888 logic elements can implement FFT cores, FIR filters, and digital IF processing for sub-100 MHz bandwidth applications. Compared to dedicated DSP processors, the FPGA's parallel architecture handles higher sample rates with deterministic latency. The industrial temperature grade suits portable and field-deployed SDR equipment.
Recommended
Test and Measurement Instrumentation
The EP4CGX50DF23I8N supports test and measurement applications including protocol-aware logic analyzers, protocol exercisers, and bench-top BERT testers. The 364 user I/Os accommodate many probe channels, while transceivers handle serial protocol stimulus/response at rates up to 3.125 Gbps. The 2 PLLs generate multiple independent clock domains for protocol-aware sampling. Industrial temperature grade supports lab and field use. Compared to fixed-function ASICs, the FPGA allows test engineers to implement new protocols via firmware updates without silicon redesign.
Recommended
Industrial Networking / Fieldbus Gateways
The EP4CGX50DF23I8N bridges multiple industrial protocols including Profibus, Modbus TCP, EtherCAT, and CAN in a single device. With 49,888 logic elements, it can implement two or three independent protocol stacks simultaneously alongside a gateway management CPU implemented in soft-core (Nios II). The 8 transceivers support multiple industrial Ethernet ports. The industrial temperature grade ensures operation in control cabinets with elevated temperatures. Compared to multi-chip solutions, single-chip integration reduces BOM cost and PCB footprint for DIN-rail gateways.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX50DF23I8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX50DF23I7N | EP4CGX50DF23C8N | EP4CGX50CF23I8N | EP4CGX110DF23I7N |
|---|---|---|---|---|---|
| Package | 484-FBGA (F23) | 484-FBGA (F23) | 484-FBGA (F23) | 484-FBGA (F23) | 484-FBGA (F23) |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Logic Elements | 49,888 | 49,888 | 49,888 | 49,888 | 109,424 |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +100C (Industrial Extended) | 0C to +85C (Commercial) | -40C to +85C (Industrial) | -40C to +100C (Industrial Extended) |
| Speed Grade | I8N (Industrial, fastest) | I7N | C8N | I8N (C-speed bin) | I7N |
| Embedded RAM | 234 Kbits | 234 Kbits | 234 Kbits | 234 Kbits | 549 Kbits |
| Transceivers | Up to 8 (3.125 Gbps) | Up to 8 (3.125 Gbps) | Up to 8 (3.125 Gbps) | Up to 8 (3.125 Gbps) | Up to 8 (3.125 Gbps) |
| PCIe Hard IP | Yes (Gen1/Gen2) | Yes (Gen1/Gen2) | Yes (Gen1/Gen2) | Yes (Gen1/Gen2) | Yes (Gen1/Gen2) |
Key Differentiators
- I8N industrial temperature grade with fastest speed bin (vs EP4CGX50CF23I8N)
- Drop-in compatibility with higher-density F23 family members (vs EP4CGX110DF23I7N)
- Integrated PCI Express hard IP reduces BOM cost (vs EP4CE55F23I8N (Cyclone IV E non-GX))
Design Notes
Cyclone IV GX FPGAs require multiple supply rails: 1.2 V core (VCCINT), 2.5 V/3.3 V I/O banks (VCCIO), 2.5 V analog PLL supply (VCCA_PLL), and 1.2 V/2.5 V transceiver supplies (VCCHIP, VCCA_TX, VCCA_RX). Estimated: at 49,888 LE utilization around 60-70%%, total board power consumption is approximately 1.5-2.5 W. Decoupling requires 0.1 uF MLCCs placed adjacent to every VCC pin plus bulk 100 uF electrolytic/MLCC on each rail. Power sequencing should follow the Cyclone IV handbook guidelines to avoid latch-up. Reference design: Altera Cyclone IV GX FPGA Development Kit schematic.
The F23 484-FBGA package has a junction-to-ambient thermal resistance (theta_JA) of approximately 12-15 C/W with a properly designed 4-layer PCB and adequate copper area for the thermal balls. Estimated: at 2 W total power, junction temperature rise is 24-30C above ambient. For industrial applications at +85C ambient, recommend keeping total power below 1.5 W or using thermal vias under the thermal pad ball array. Use the Cyclone IV FPGA Thermal Modeling Guide for board-level thermal simulation.
The 484-FBGA package requires a 1.0 mm pitch BGA fanout. Recommended PCB design: 6-layer stackup with ground planes directly under the BGA pads to control impedance. Use 0.4 mm via-in-pad micro-vias with 0.2 mm capture pads for inner-row escape routing. Maintain 100 ohm differential impedance for transceiver pairs and 50 ohm single-ended for LVDS/CMOS signals. Reference design: Cyclone IV GX FPGA Development Kit gerber files available from Intel/Altera.
The EP4CGX50DF23I8N supports multiple configuration schemes: JTAG (for development), Active Serial (AS) using EPCS serial flash, and Passive Serial (PS) using an external host. For production designs, Active Serial mode with EPCS64 (64 Mbit) is recommended to provide sufficient storage for the 50K LE device's compressed bitstream plus Nios II firmware. Use the SFL (Serial Flash Loader) IP core for in-field firmware updates via JTAG-to-AS bridge. Reference design: AN370 Configuring Cyclone IV Devices application note.
Common design pitfalls: (1) Do not leave unused transceiver channels floating - they must be powered down or terminated properly; (2) PCIe hard IP requires reference clock inputs with strict jitter specs - use dedicated PCIe clock buffer; (3) LVDS I/O requires external 100 ohm differential termination near receiver pins; (4) PLL VCCA_PLL must be filtered with ferrite bead and decoupling cap, not connected directly to digital 2.5 V. Reference: Cyclone IV Device Handbook pin connection guidelines.
Compliance Information
RoHS compliant (Pb-free BGA) per Intel/Altera Cyclone IV product page. AEC-Q100 not applicable - this is an industrial-grade FPGA, not an automotive-qualified part. For AEC-Q100 FPGAs, consider Cyclone IV GX automotive-grade variants or Microsemi/IGLOO2.