Intel

EP4CGX75CF23C7N - Cyclone IV GX FPGA, 75K LE, 484-BGA | Intel

Name: EP4CGX75CF23C7N - Cyclone IV GX FPGA, 75K LE, 484-BGA | Intel
Brand: Intel
SKU: EP4CGX75CF23C7N
Price: 71.2 USD
Availability: InStock

MPN: EP4CGX75CF23C7N ✓ Active

In Stock Ships in 1-3 business days

1.16 V to 1.24 V (nominal 1.2 V) Vdss 484-ball BGA (F23, 23 x 23 mm) Package 4,257,792 Memory

From $71.2 USD / Unit

MOQ: 1 |

Price updated: 2026-09-10

Volume Pricing

Qty	Unit Price	Extended
1	$122	$122.00
10	$110.5	$1,105.00
100	$95	$9,500.00
500	$82.4	$41,200.00
1,000	$71.2	$71,200.00

ℹ️ All prices are in USD

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EP4CGX75CF23C7N Overview

The Intel (formerly Altera) EP4CGX75CF23C7N is a Cyclone IV GX field-programmable gate array (FPGA) with 73,920 logic elements, 4,257,792 bits of embedded memory, and 290 maximum user I/O pins, housed in a 484-ball fine-pitch BGA package (F23, 23 mm). It integrates up to eight 3.125 Gbps transceivers for high-speed serial I/O and is fabricated on a low-power 60 nm process that targets cost- and power-sensitive applications. The Cyclone IV GX family is positioned between the lower-density Cyclone IV E and the higher-end Cyclone V families, balancing logic density, transceiver bandwidth, and static power consumption.

An FPGA (Field-Programmable Gate Array) is a semiconductor device built from an array of configurable logic blocks (CLBs), programmable interconnect, embedded memory (block RAM), and dedicated hard IP such as transceivers, PLLs, and DSP blocks. FPGAs sit in the broader taxonomy: programmable logic -> logic IC -> integrated circuit -> semiconductor. Unlike an ASIC, an FPGA's function is defined at power-up by a configuration bitstream loaded from external flash, enabling rapid prototyping, in-field upgrades, and hardware revision without respin. Within Intel's portfolio, Cyclone IV GX is the low-power mid-range tier that adds high-speed serial transceivers for protocols like PCI Express Gen1, Gigabit Ethernet, and Serial RapidIO.

Key features of the EP4CGX75CF23C7N include 73,920 logic elements, approximately 4.4 Mbits of embedded RAM (M9K blocks), 290 user I/O pins, up to 8 transceiver channels at data rates up to 3.125 Gbps, 4 PLLs, and 2 hard memory controllers. The device operates from a core supply of 1.16 V to 1.24 V (nominal 1.2 V) with I/O banks supporting multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL). It supports commercial temperature grade (0 °C to 85 °C) per the C7N suffix and offers JTAG-based configuration via Active Serial (AS), Passive Serial (PS), or Fast Passive Parallel (FPP) modes.

The Cyclone IV GX architecture pairs a sea-of-LAB fabric with column-based M9K memory blocks and row-based embedded transceivers. Hard IP includes transceiver channels with embedded PCS (physical coding sublayer) for PCIe and GbE, dedicated PLL blocks for clock synthesis, and DSP blocks (18x18 multipliers) for arithmetic. Compared with Cyclone III, the Cyclone IV GX achieves lower static power through a 60 nm process and adds hardened transceivers, while sharing the same Quartus II design flow that engineers already know.

Typical applications for the EP4CGX75CF23C7N include industrial video surveillance with on-board image processing, low-cost PCI Express Gen1 endpoint cards, gigabit Ethernet bridge/mux designs, motor control and factory automation, broadcast video processing, software-defined radio front-ends (digital baseband), and portable medical imaging. The integrated 3.125 Gbps transceivers enable designers to add a small-form-factor PCIe or GbE interface without external PHY chips, reducing BOM cost and PCB area.

When designing with this device, plan power sequencing for core (1.2 V), PLL analog (2.5 V), and transceiver supplies (1.2 V / 2.5 V / 3.3 V) per the pin connection guidelines, and provide a proper decoupling network. The 484-BGA F23 package requires careful PCB stack-up and microvia technology for reliable assembly, especially on the transceiver balls that carry multi-GHz signals.

This page synthesizes the official Intel Cyclone IV GX device handbook, current distributor pricing, drop-in device-tree alternatives, and PCB design notes not aggregated elsewhere, giving procurement and design engineers a single-source reference for EP4CGX75CF23C7N selection.

Drop-in alternatives for EP4CGX75CF23C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP4CGX75CF23C7N (same form factor and footprint) — differing in Package, Operating Temperature, RoHS Status, Speed Grade, Process Technology.

EP4CGX150CF23C7N

Intel

Package: FBGA-484 (23 x 23 mm, 1.0 mm pitch)

Operating Temperature: Commercial (0C to +85C)

RoHS Status: Compliant (lead-free)