EP4CGX75CF23I7 - Cyclone IV GX FPGA 75K LE 484-FBGA | Intel
MPN: EP4CGX75CF23I7 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $220 | $220.00 |
| 10 | $198 | $1,980.00 |
| 100 | $175 | $17,500.00 |
| 500 | $152 | $76,000.00 |
| 1,000 | $135 | $135,000.00 |
EP4CGX75CF23I7 Overview
A Field-Programmable Gate Array (FPGA) is a programmable semiconductor device that lets engineers implement arbitrary digital logic - processors, signal pipelines, control state machines, and high-speed serial interfaces - after PCB fabrication. The Cyclone IV GX family occupies the low-cost, low-power tier of the Cyclone IV portfolio: device-level hierarchy is FPGA -> programmable logic -> semiconductor IC. The "GX" suffix denotes the integrated transceiver variant that brings multi-gigabit serial I/O to a cost-optimized platform, distinguishing it from the non-transceiver Cyclone IV E/GX-less parts.
Key features of the EP4CGX75CF23I7 include 3.125 Gbps transceiver capability, 8 user I/O banks with LVDS, DDR, and LPDDR memory interface support, dedicated 36Kb M9K memory blocks, embedded PLL clock networks, and a 1.2 V core operating voltage. The "I7" speed grade indicates an industrial temperature range (-40C to +100C junction) suitable for ruggedized systems. The 484-FBGA package is a 1.0 mm-pitch FineLine BGA optimized for high I/O density on cost-sensitive boards.
Architecture is built on a 60 nm low-power process, with a logic array composed of Logic Array Blocks (LABs) of 16 Logic Elements (LEs) each. The transceiver blocks support PCIe Gen1/Gen2, Gbit Ethernet, Serial RapidIO, and CPRI-style protocols, while the fabric delivers up to 472.5 MHz internal performance per FindIC data.
Typical applications include industrial machine vision, motor control and factory automation, video processing pipelines, low-cost wireless backhaul, embedded computing in test and measurement, and low-volume prototyping for ASIC replacement. Industrial control, surveillance, and portable instrumentation are particularly common target segments.
Designers should plan power sequencing on the 1.2 V VCCINT rail and use multiple decoupling capacitors around the BGA footprint, since simultaneous switching on the I/O banks can create significant SSO noise. The I7 grade supports industrial ambient conditions but thermal design must still account for BGA-only dissipation paths.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers evaluate sourcing, second-source risk, and PCB thermal trade-offs.
Drop-in alternatives for EP4CGX75CF23I7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX75CF23I7 (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, RoHS Status, Embedded Memory.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CGX75CF23I6N
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View Datasheet →EP4CGX75CF23C8N
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View Datasheet →EP4CGX75CF23C8
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$88.2 / Unit
View Datasheet →EP4CGX75CF23C7N
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$71.2 / Unit
View Datasheet →EP4CGX75CF23C7
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$60.5 / Unit
View Datasheet →EP4CGX75CF23C6N
✅ Drop-In✓ In Stock
$99 / Unit
View Datasheet →EP4CGX75CF23I7 Maximum Ratings & Electrical Characteristics
| Series | Cyclone IV GX |
| Logic Elements | 73,920 |
| Total Memory Bits | 4,257,792 |
| Number of LABs/CLBs | 4,620 |
| Number of Logic Elements/Cells | 73,920 |
| Total RAM Bits | 4,257,792 |
| Number of I/O | 290 |
| Number of Multipliers (18x18) | 290 |
| Voltage Supply | 1.0 V / 1.2 V / 2.5 V / 3.3 V |
| Core Voltage | 1.2 V |
| Operating Temperature | -40C to +100C (Industrial I7 grade) |
| Mounting Type | Surface Mount |
| Package / Case | 484-FBGA (FBGA-484, 23x23 mm, 1.0 mm pitch) |
| Process Technology | 60 nm |
| Transceiver Speed | 3.125 Gbps |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EP4CGX75CF23I7 484-fbga (fbga-484, 23x23 mm, 1.0 mm pitch) Pin Configuration Guide
Pin configuration for EP4CGX75CF23I7 (484-fbga (fbga-484, 23x23 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CGX75CF23I7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CGX75CF23I7 is suitable for 6 applications: Industrial Machine Vision, PCIe Gen2 Endpoint Card, Motor Control and Factory Automation, Video Processing Pipeline, Wireless Backhaul Modem, Test and Measurement Instrumentation.
Industrial Machine Vision
The EP4CGX75CF23I7 fits industrial machine vision because its 73,920 LEs and 290 (18x18) multipliers handle real-time Bayer-to-RGB conversion, edge detection, and small CNN inference at GigE Vision frame rates. The 3.125 Gbps transceivers connect directly to GigE Vision cameras over Ethernet, eliminating external PHY chips and reducing BOM. The I7 industrial temperature grade (-40C to +100C junction) is essential for factory-floor enclosures where ambient air can exceed 60C near motor drives. With 290 user I/Os, the part drives multiple Camera Link sensors, LED strobe controllers, and encoder feedback simultaneously without external I/O expanders. Power stays manageable because the Cyclone IV GX 60 nm process is tuned for low static current even with active transceiver lanes.
Recommended
PCIe Gen2 Endpoint Card
The EP4CGX75CF23I7 is a strong fit for PCIe Gen2 endpoint designs because it integrates hard IP blocks supporting PCIe Gen1 (2.5 Gbps) and PCIe Gen2 (5.0 Gbps) without consuming fabric logic. The 484-FBGA exposes the required transceiver pairs for x1/x2/x4 lane configurations, and the 73,920 LEs are sufficient to implement a DMA engine plus device-side register interface. Designers targeting cost-sensitive half-height cards prefer Cyclone IV GX over higher-tier families because unit price is roughly one-third of newer transceivers while still meeting PCIe compliance. Quartus Prime includes the PCIe hard IP wizard, so designers license the IP and integrate it directly. Industrial temperature support means the same design can ship in factory-installed PCIe hosts.
Recommended
Motor Control and Factory Automation
In motor control and factory automation the EP4CGX75CF23I7 provides enough logic to implement field-oriented control (FOC) loops for multi-axis servo drives while the 290 I/Os handle encoder feedback, PWM outputs, and safety inputs concurrently. Its industrial I7 grade ensures reliable operation across -40C to +100C in cabinets adjacent to drives. The 60 nm low-power process keeps static current low even with all 290 I/Os toggling, which is critical for 24V-bus industrial systems where heat dissipation is constrained. The 484-FBGA footprint accommodates both signal traces and power pours on a standard 6-layer FR-4 stack-up. Designers can also instantiate EtherCAT or PROFIBUS protocol stacks in fabric when paired with an external PHY.
Recommended
Video Processing Pipeline
The EP4CGX75CF23I7 is well suited for video processing because the 290 (18x18) multipliers accelerate motion-estimation and de-interlacing kernels, and the 4,257,792 embedded memory bits store multiple line buffers without external SRAM. The transceiver channels support SDI (SMPTE 259M/292M) at 270 Mbps / 1.485 Gbps with a small external cable equalizer, while LVDS I/O banks handle parallel RGB interfaces to LCD panels. The 484-FBGA package gives designers 290 user I/Os to drive HDMI/DVI transmitters, capture sensors, and memory buses concurrently. Industrial temperature makes the part viable for outdoor digital-signage controllers and in-vehicle infotainment head units.
Recommended
Wireless Backhaul Modem
The EP4CGX75CF23I7 fits wireless backhaul modems because the 3.125 Gbps transceivers connect directly to SFP+ cages for CPRI or proprietary RF-to-baseband links, while the 73,920 LEs implement PHY-layer FEC, framer, and adaptive-modulation state machines. The I7 industrial grade handles outdoor cabinet temperatures from -40C to +100C without throttling. With 290 user I/Os the part interfaces to AD9363-class transceivers, GPS synchronizers, and management Ethernet. Lower BOM cost than Cyclone V or Arria devices keeps the design competitive in small-cell and rural-backhaul markets where unit economics dominate.
Recommended
Test and Measurement Instrumentation
The EP4CGX75CF23I7 is well matched for test and measurement equipment because the transceivers support 1-3 Gbps serial data acquisition, the 290 multipliers deliver real-time FFT/DSP at full sample rate, and 4.2 Mbits of embedded memory hold windowed sample buffers. The I7 industrial temperature range is helpful for portable instruments that may operate in field enclosures. Designers use the part to implement protocol-aware logic analyzers, BER testers, and arbitrary waveform generators in a single chip. The 484-FBGA exposes enough LVDS pairs to drive high-resolution LCD readouts and accept parallel ADC outputs concurrently.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX75CF23I7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX75CF23I6N | EP4CGX75CF23C8N | EP4CGX75CF23C8 | EP4CGX75CF23C7N | EP4CGX75CF23C7 | EP4CGX75CF23C6N |
|---|---|---|---|---|---|---|---|
| Package | 484-FBGA (FBGA-484, 23x23 mm, 1.0 mm pitch) | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 73,920 | 73,920 (identical) | 73,920 (identical) | 73,920 (identical) | 73,920 (identical) | 73,920 (identical) | 73,920 (identical) |
| Total Memory Bits | 4,257,792 | 4,257,792 (identical) | 4,257,792 (identical) | 4,257,792 (identical) | 4,257,792 (identical) | 4,257,792 (identical) | 4,257,792 (identical) |
| User I/O Count | 290 | 290 (identical) | 290 (identical) | 290 (identical) | 290 (identical) | 290 (identical) | 290 (identical) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | 7 (I7) | 6 (I6) - slightly slower Fmax | 8 (C8) - faster Fmax | 8 (C8) - faster Fmax | 7 (C7) - similar Fmax, commercial temp | 7 (C7) - similar Fmax, commercial temp | 6 (C6) - slowest Fmax |
| Transceiver Speed | 3.125 Gbps | 3.125 Gbps (identical) | 3.125 Gbps (identical) | 3.125 Gbps (identical) | 3.125 Gbps (identical) | 3.125 Gbps (identical) | 3.125 Gbps (identical) |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- Industrial temperature grade with full speed retention (vs EP4CGX75CF23C7N)
- Higher Fmax at industrial temperature (vs EP4CGX75CF23I6N)
- Mature transceiver IP for PCIe Gen2 and CPRI (vs EP4CE75F23I7N)
Design Notes
The EP4CGX75CF23I7 requires four independent supply rails: VCCINT (1.2 V core), VCCA (2.5 V PLL analog), VCCIO (1.0-3.3 V per bank, bank-referenced), and VCCD_PLL (1.2 V PLL digital). Designers should power up VCCINT first or simultaneously with VCCIO to avoid I/O driving into an unpowered core. Place 100 nF decoupling capacitors on every VCCINT pin and bulk 10-47 uF tantalum/ceramic capacitors on the PCB power plane immediately adjacent to the BGA. Estimate static current roughly at 1-1.5 A and dynamic current up to 3-4 A when all 290 I/Os and transceivers are active.
Estimated: with all 290 I/O banks active at 100 MHz and four transceiver channels at 3.125 Gbps, total device dissipation may reach 3-5 W. The 484-FBGA exposes a thermal pad and ball grid that conduct heat primarily into the PCB; design a 4-layer or 6-layer stack-up with stitched thermal vias under the die and flooded copper pours on inner and outer layers. Without active cooling in a 60C ambient, expect junction temperature rise of 35-50C above ambient. The I7 grade permits +100C junction, but derate at least 10C below the maximum for long-term reliability.
The 484-FBGA at 1.0 mm pitch requires PCB fabrication with 1.0 mm-pitch BGA escape rules: typically 4-6 mil trace/space with laser-drilled microvias or via-in-pad. Plan escape routing for the transceiver differential pairs first, because they have the most stringent impedance (90-ohm differential) and length-matching (within 150 mil) requirements. Keep all eight transceiver channels on the same PCB side to simplify the reference-plane continuity for high-speed return currents.
Do not mix I/O standards across banks without consulting the Cyclone IV GX Device Handbook; LVDS requires specific bank VCCIO (2.5 V) and dedicated clock inputs. Do not drive the JTAG TMS pin with a pulled-down signal at power-up, or the device will fail configuration; place a 10 kohm pull-up on TMS and a 10 kohm pull-down on TCK per Altera guidelines. Also avoid long parallel traces adjacent to transceiver channels - SSO noise can couple into the 3.125 Gbps serial data and cause CRC errors.
Compliance Information
RoHS and REACH compliance per Intel product page. AEC-Q100 is not applicable for FPGAs. Lead-free and halogen-free per the Cyclone IV GX family datasheet.
