EP4S40G2F40I2NAA - Stratix IV GT FPGA 40nm 654 I/O 1517-FCBGA | Intel
MPN: EP4S40G2F40I2NAA β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3250 | $3,250.00 |
| 10 | $3105 | $31,050.00 |
| 25 | $2965 | $74,125.00 |
| 100 | $2820 | $282,000.00 |
| 250 | $2710 | $677,500.00 |
EP4S40G2F40I2NAA Overview
A Field-Programmable Gate Array (FPGA) is a class of programmable logic device that combines configurable logic blocks, programmable interconnect, dedicated DSP blocks, embedded memory (BRAM), and high-speed transceiver physical media attachment (PMA) layers. In the broader system hierarchy, FPGAs sit between general-purpose CPUs/GPUs and fixed-function ASICs: they offer near-ASIC performance and parallelism with the flexibility of in-field re-programmability through SRAM-based configuration memory. The Stratix IV family specifically targets applications that demand the highest transceiver data rates and richest logic density in the Altera/Intel FPGA portfolio of that generation.
Key features of the EP4S40G2F40I2NAA include 228,000 logic elements, 17,544,192 embedded memory bits, 654 maximum user I/O pins, integrated 11.3 Gbps transceivers (GT channels), and DSP blocks for high-throughput fixed- and floating-point arithmetic. The 'I2' speed grade balances maximum frequency and timing margin, while the 'N' suffix denotes lead-free / RoHS-compliant packaging. The FCBGA substrate supports high signal integrity for multi-gigabit links and provides the controlled-impedance escape needed for transceiver channels up to 11.3 Gbps.
Architecturally, the device combines a rich fabric of adaptive logic modules (ALMs), MLAB blocks that double as distributed logic or small RAM, M20K dedicated memory blocks, variable-precision DSP blocks, and hard PCI Express and memory controller IP. The hard transceiver blocks (GX/GT) include on-die serial/deserializer (SERDES), clock data recovery (CDR), and physical coding sublayer (PCS) support for protocols such as CPRI, OBSAI, 10G/40G Ethernet, Serial RapidIO, and OTU-2, dramatically reducing the logic fabric overhead required to implement these protocols in soft logic.
Typical applications include 40G/100G optical transport line cards, high-end test and measurement instrumentation such as oscilloscopes and protocol analyzers, high-performance computing fabric bridges, wireless baseband processing, and military/aerospace signal processing. The combination of 11.3 Gbps transceivers and 654 user I/O is well-matched to systems that aggregate multiple 10G lanes into a 40G/100G uplink while exposing wide parallel LVDS or DDR3 memory interfaces for data buffering.
When designing with the EP4S40G2F40I2NAA, pay particular attention to transceiver reference clock jitter and power-rail decoupling for the GT analog supplies. Intel recommends a multi-layer PCB stackup with a continuous ground reference under the transceiver channels and matched-length routing on the transmit-receive pairs. Quartus II / Quartus Prime is the official design toolchain for this family and supports floorplanning, timing closure, and power analysis for high-density designs.
This page synthesizes distributor stock data from DigiKey, pinout and packaging details, drop-in alternatives within the Stratix IV GT family, and practical PCB layout notes not found in the manufacturer datasheet summary. Pricing and lead-time references are stated 'as of 2026-09-10'.
Drop-in alternatives for EP4S40G2F40I2NAA β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4S40G2F40I2NAA (same form factor and footprint) β differing in Package, Mounting Type, Family, RoHS Status, Core Voltage.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4S40G2F40I2NAB
β Drop-Inβ In Stock
$3120 / Unit
View Datasheet βEP4S40G2F40I3G
β Drop-Inπ Reference alternative (not in catalog)
EP4S100G2F40I3G
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$5680 / Unit
View Datasheet βEP4S230F40I2
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP4S40G2F40I1
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP4S40G2F40I2NAA Maximum Ratings & Electrical Characteristics
| Product Family | Stratix IV GT |
| Logic Elements (LE) | 228,000 |
| Embedded Memory Bits | 17,544,192 |
| Maximum User I/O | 654 |
| Process Technology | 40 nm |
| Maximum Transceiver Data Rate | 11.3 Gbps |
| Package | 1517-ball FCBGA |
| Speed Grade | I2 |
| RoHS Status | Compliant (per 'N' suffix) |
| Configuration Memory | SRAM-based, volatile |
| Hard Memory Controllers | DDR3 / DDR2 / QDR II+ controllers embedded |
| Hard PCIe Blocks | PCI Express hard IP embedded |
| Mounting Type | Surface Mount (BGA) |
EP4S40G2F40I2NAA 1517-ball fcbga Pin Configuration Guide
Pin configuration for EP4S40G2F40I2NAA (1517-ball fcbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4S40G2F40I2NAA.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4S40G2F40I2NAA is suitable for 6 applications: 40G/100G Optical Transport Line Card, High-End Test & Measurement Instrumentation, High-Performance Computing Fabric Bridge, Wireless Baseband Processing, Military and Aerospace Signal Processing, Broadcast Video Processing & Format Conversion.
40G/100G Optical Transport Line Card
The EP4S40G2F40I2NAA is well-suited to 40G and 100G optical transport line cards because of its 11.3 Gbps hard transceivers and 654 user I/O. A typical 40G OTU-3 or 100G OTU-4 line card aggregates four 10G client-side lanes into a single 40G trunk or ten 10G lanes into a 100G trunk, and the device's hard PCS logic (CAUI, XLAUI) eliminates the need to implement the 64B/66B encoder in soft logic. With 17,544,192 bits of embedded memory and hard DDR3 controllers, the FPGA can buffer client traffic during GFP/LCAS mapping and OTN framing without external TCAMs. Designers typically instantiate four or eight GT channels per FPGA and pair the device with a 40G CFP or 100G CFP2/CFP4 optical module via OIF-compliant CAUI-4 interface.
Recommended
High-End Test & Measurement Instrumentation
Test and measurement instruments such as 12-bit+ oscilloscopes, protocol analyzers, and arbitrary waveform generators require wide LVDS sample paths, deep acquisition memory, and deterministic low-latency DSP. The EP4S40G2F40I2NAA's 654 user I/O support parallel LVDS or DDR3 sample-acquisition buses up to 1 Gsample/s, while its 17.5 Mbit of BRAM provides enough on-chip capture buffer for typical segmented-storage scopes. The 11.3 Gbps transceivers serve as a fast back-haul to the host processor or as a coherent trigger bus across multiple synchronized instruments. The 'I2' speed grade gives the timing margin required to close DSP-heavy FIR/FFT signal-processing pipelines at sustained trigger rates.
Recommended
High-Performance Computing Fabric Bridge
In HPC fabrics, the EP4S40G2F40I2NAA bridges between Infiniband, 10/40G Ethernet, and proprietary backplanes, providing low-latency cut-through switching and protocol translation. Its 11.3 Gbps transceivers are sufficient for QDR Infiniband and 40G Ethernet lanes, and 228,000 LE supports full packet header processing with checksum offload. The device's 654 user I/O expose enough parallel bandwidth to drive high-density DDR3 or RLDRAM-II packet buffers, while the embedded SERDES hard IP avoids the latency of soft PCS implementations. Typical use cases include co-processor PCIe Gen2 attachments, multi-FPGA coherent shared-memory islands, and FPGA-based smart-NIC implementations.
Recommended
Wireless Baseband Processing
The EP4S40G2F40I2NAA serves as a CPRI/OBSAI baseband processor in 4G LTE and small-cell base stations, where it converts digitized RF data from remote radio heads into baseband I/Q streams. Its 11.3 Gbps transceivers aggregate multiple 4.915 Gbps CPRI links from several RRH antennas, and the 228k LE plus dedicated DSP blocks deliver the multiply-accumulate throughput needed for LTE FFT/iFFT and channel estimation. Industrial temperature grade and lead-free FCBGA packaging suit outdoor small-cell enclosures. The device also integrates enough I/O to interface with a companion application-specific DSP for PHY-layer upper functions.
Recommended
Military and Aerospace Signal Processing
The EP4S40G2F40I2NAA in industrial temperature grade is widely used in military and aerospace signal-processing systems for radar, electronic warfare, and SIGINT applications. Its 228,000 LE enables wide-bandwidth digital-channelizer and beam-forming pipelines, and the 11.3 Gbps transceivers digitize multi-channel RF at 10-bit+ resolution. The FCBGA package provides the mechanical robustness required for avionics, and the device's hard SERDES supports high-speed sensor networks such as SFPDP. Designers benefit from the rich IP ecosystem for FFT, FIR filtering, and polyphase channelizers that ship with Quartus II.
Recommended
Broadcast Video Processing & Format Conversion
The EP4S40G2F40I2NAA is well-matched to broadcast video routers, format converters (SDI/HDMI/DisplayPort), and 4K up/down/cross-converters. Its 654 user I/O accept many parallel SDI streams and the embedded memory buffers 4K frames at broadcast color depths. The 11.3 Gbps transceivers carry 6G-SDI or 12G-SDI single-link signals for UHD workflows, and the 228k LE supports multi-channel scaling engines and HDR tone-mapping in a single device. Combined with hard DDR3 controllers, the FPGA can implement frame-rate conversion with multiple field-buffer frames without external memory controllers.
Recommended
Recommended Products Summary
Engineering reference data for EP4S40G2F40I2NAA β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4S40G2F40I2NAB | EP4S40G2F40I3G | EP4S100G2F40I3G | EP4S230F40I2 | EP4S40G2F40I1 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-ball FCBGA | 1517-ball FCBGA - same | 1517-ball FCBGA - same | 1517-ball FCBGA - same | 1517-ball FCBGA - same | 1517-ball FCBGA - same |
| Logic Elements | 228,000 | 228,000 | 228,000 | ~531,000 | ~230,000 | 228,000 |
| Embedded Memory (bits) | 17,544,192 | 17,544,192 | 17,544,192 | ~27,600,000 | ~17,200,000 | 17,544,192 |
| Maximum User I/O | 654 | 654 | 654 | ~696 | ~654 | 654 |
| Speed Grade | I2 | I2 | I3 (faster) | I3 | I2 | I1 (slower) |
| Maximum Transceiver Rate | 11.3 Gbps | 11.3 Gbps | 11.3 Gbps | 11.3 Gbps | 11.3 Gbps | 11.3 Gbps |
| Process Technology | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm |
| Lifecycle Status | NRND | NRND | NRND | Active (limited) | NRND | NRND |
Key Differentiators
- Highest-density Stratix IV GT member in the 40 nm family (vs EP4S230F40I2)
- Functional second-source within the same Stratix IV GT family (vs EP4S40G2F40I2NAB)
- Migratable to higher-density I3 speed grade on the same footprint (vs EP4S100G2F40I3G)
Design Notes
The 1517-ball FCBGA requires a high-density PCB stackup: Intel recommends a 12-layer or 14-layer board with a continuous reference ground plane beneath the transceiver balls. Use 0.4 mm pitch escape routing with micro-via-in-pad (VIP) and back-drilling on transceiver TX/RX differential pairs to control reflections at 11.3 Gbps. Matched-length routing with skew under 1 ps across each lane is required for CAUI-4 compliance.
Stratix IV GT transceivers require clean, low-noise analog supplies (VCCA, VCCHIP) with a maximum 10 mVpp ripple. Decouple each analog pin with a 0.1 uF ceramic plus a 10 uF tantalum or polymer bulk capacitor placed within 100 mil of the ball. Sequence the analog and digital power rails per Intel's power-up/down requirements to avoid latch-up. Total FPGA power at 100% utilization can exceed 25 W and demands a thermal-management plan (heatsink or cold plate) sized for 30 C/W or better.
For 11.3 Gbps channels, route TX and RX differential pairs with 100 ohm differential impedance and 50 ohm single-ended impedance, with intra-pair skew under 0.15 mm and inter-pair skew budgeted against the PCS FIFO depth. Use AC-coupled interconnects (8 nF to 100 nF series caps) on the TX side per CPRI/OIF guidelines. Place reference clock jitter cleaners such as the Si5324 close to the FPGA reference-clock inputs; phase noise below 1 ps RMS is the typical mask for 10G Ethernet compliance.
Do not enable configuration via JTAG and passive serial simultaneously - the EP4S40G2F40I2NAA's MSEL pins must be set exactly once per Quartus-generated programming file. Avoid backdriving MSEL during power ramp. When migrating firmware from EP4S40G2F40I2NAB, verify bitstream compatibility by re-running Quartus assembly; silicon revisions can shift pinout tables even when the ball map is identical. Always verify transceiver pre-emphasis and equalization settings in Quartus II SignalTap before locking firmware for production.
Compliance Information
RoHS compliance inferred from N suffix per Altera/Intel ordering code convention. REACH compliance not explicitly stated in distributor data; set to 'unknown' unless confirmed by manufacturer declaration. AEC-Q100 is not applicable for this FPGA.
