EP4SGX360NF45I4 - Stratix IV GX FPGA, 353.6K LEs, 1932-FCBGA | Intel
MPN: EP4SGX360NF45I4 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2680 | $26,800.00 |
| 25 | $2520 | $63,000.00 |
| 100 | $2350 | $235,000.00 |
EP4SGX360NF45I4 Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), embedded memory, DSP slices, and programmable I/O that the user defines after manufacture using an HDL such as Verilog or VHDL. Within the broader semiconductor hierarchy, an FPGA is a type of programmable logic device (PLD) sitting alongside CPLDs (Complex Programmable Logic Devices); high-end FPGAs like Stratix IV GX occupy the high-performance, high-density tier typically used for ASIC prototyping, signal processing, and high-throughput data acquisition, while CPLDs serve lower-density glue-logic tasks.
The Stratix IV GX architecture integrates embedded transceivers operating up to 8.5 Gbps, hard memory controllers, and DSP blocks alongside the general-purpose fabric, making the family well suited for high-bandwidth applications. The EP4SGX360NF45I4 in particular delivers eight transceiver channels per device, a feature that simplifies PCB layout for protocols such as PCIe Gen1/Gen2, Serial RapidIO, XAUI, and SATA. With 23 Mbits of embedded RAM organized in M9K/M144K blocks, the device supports wide datapath designs and high-throughput buffer schemes. The NF45 package provides a 45 mm square footprint with flip-chip solder balls to the PCB land pattern.
Industrial temperature grade (-40C to +100C ambient, I-suffix) makes this part suitable for harsh-environment deployment. The -I4 speed grade places it in the mid-to-fast bin of Stratix IV GX silicon, with Fmax up to 717 MHz for critical paths. Design entry uses the Quartus II design suite (recently rebranded Quartus Prime), with a mature IP library covering memory controllers, transceiver PHYs, and PCIe hard cores.
Typical applications include telecom backplane bridges using XAUI/Serial RapidIO, ASIC prototyping for high-pin-count designs, industrial video processing pipelines, and high-speed data acquisition systems. Compared to ASICs, this FPGA offers design flexibility and faster time-to-market at the cost of unit economics above ~100k-unit volumes.
Drop-in alternatives for EP4SGX360NF45I4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX360NF45I4 (same form factor and footprint) — differing in Speed Grade, Operating Temperature, Package, Process Technology, Transceivers.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4SGX360NF45I3N
✅ Drop-In✓ In Stock
$3925 / Unit
View Datasheet →EP4SGX360NF45I3
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View Datasheet →EP4SGX360NF45C4N
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$3490 / Unit
View Datasheet →EP4SGX360NF45C4
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$2600 / Unit
View Datasheet →EP4SGX360NF45C3N
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$3300 / Unit
View Datasheet →EP4SGX360NF45C3
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$3750 / Unit
View Datasheet →EP4SGX360NF45C2N
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$11800 / Unit
View Datasheet →EP4SGX360NF45C2
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View Datasheet →EP4SGX360NF45I4 Maximum Ratings & Electrical Characteristics
| Family | Stratix IV GX |
| Logic Elements | 353,600 |
| Adaptive Logic Modules (ALMs) | 141,440 |
| Logic Array Blocks (LABs) | 14,144 |
| Embedded Memory | 23,105,536 bits (approx. 23 Mbits) |
| User I/O Pins | 920 |
| Maximum Clock Frequency | 717 MHz |
| Transceivers | 8 channels, up to 8.5 Gbps |
| Process Technology | TSMC 40 nm |
| Core Voltage | 0.9 V |
| Package | 1932-ball FC-BGA (NF45), 45 mm square |
| Mounting Type | Surface Mount (flip-chip BGA) |
| Temperature Grade | Industrial (-40C to +100C ambient, I-suffix) |
| Speed Grade | -4 (I4 suffix) |
| RoHS Status | Compliant |
| MSL Level | 4 (per BGA package) |
| Design Software | Quartus II / Quartus Prime |
| Device Variant | Standard logic - GX transceiver family |
EP4SGX360NF45I4 1932-ball fc-bga (nf45), 45 mm square Pin Configuration Guide
Pin configuration for EP4SGX360NF45I4 (1932-ball fc-bga (nf45), 45 mm square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX360NF45I4.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX360NF45I4 is suitable for 6 applications: Telecom Backplane Bridge (XAUI / Serial RapidIO), ASIC Prototyping Platform, High-Speed Data Acquisition System, Industrial Video Processing Pipeline, PCIe Gen2 Endpoint / Root Complex, Avionics / Aerospace Signal Processing (non-flight-critical).
Telecom Backplane Bridge (XAUI / Serial RapidIO)
The EP4SGX360NF45I4 is well matched to telecom backplane bridging because of its integrated multi-gigabit transceivers rated up to 8.5 Gbps and 353,600 logic elements. In a typical XAUI-to-Serial RapidIO bridge, the device ingests four 3.125 Gbps lanes per direction, then forwards packets through a logic-rich traffic manager that consumes ~150K logic elements, leaving headroom for protocol state machines and counters. The 23 Mbits of embedded memory buffer packets efficiently without external SRAM, lowering BOM cost. The industrial temperature grade suits outdoor telecom chassis where ambient can swing between -40C and +70C. Power designers should budget for roughly 12-18W of core consumption when all transceivers and high logic utilization are active.
Recommended
ASIC Prototyping Platform
The EP4SGX360NF45I4 is commonly used as an FPGA-based ASIC prototyping vehicle because its 353,600 logic elements map complex ASIC netlists using multi-FPGA partitioning. With 920 user I/Os and high logic capacity, the device can host a sizeable slice of an ASIC RTL design and still leave routing slack for the partition. The 8.5 Gbps transceivers model ASIC SERDES channels with high fidelity, supporting pre-silicon validation of PCIe Gen2 and XAUI PHYs. Quartus II / Quartus Prime integrates with leading ASIC prototyping flows (Synopsys, Cadence) so engineers can map SDC timing constraints directly. The 45 mm NF45 FC-BGA package is large enough for test-point access while remaining compatible with standard 4-Layer PCBs.
Recommended
High-Speed Data Acquisition System
The EP4SGX360NF45I4 fits high-speed data acquisition because of its 23 Mbits of embedded memory and 920 I/Os that absorb ADC/DAC data bursts into on-chip buffers before backhaul. A typical 16-lane ADC interface at 250 MSPS occupies ~50K logic elements for deserialization and digital down-conversion, and the 353,600 LEs leave ample room for FFT engines and trigger logic. The 8 multi-gigabit transceivers handle backhaul to a host processor over a custom protocol or Aurora. Industrial temperature grade lets the board live in factory environments. Designers should plan thermal dissipation around 15W under peak traffic and use a heatsink or cold plate over the NF45 package.
Recommended
Industrial Video Processing Pipeline
The EP4SGX360NF45I4 serves industrial video processing pipelines because of its high logic density and rich DSP blocks (reportedly 1,040 18x18 multipliers in the family) for real-time pixel operations. Industrial camera aggregators can ingest multiple HD-SDI / 3G-SDI streams via the 8.5 Gbps transceivers and run color-space conversion, scaling, and overlay logic on-chip. With 353,600 LEs and 23 Mbits of RAM, multiple video streams can be processed concurrently without external memory pressure. The industrial temperature grade suits factory-floor deployment. Combined power consumption is typically 10-14W for moderate pipeline depth, manageable with copper pours and a small heatsink on the NF45 45 mm FC-BGA.
Recommended
PCIe Gen2 Endpoint / Root Complex
The EP4SGX360NF45I4 implements PCIe Gen2 endpoints and root complexes because of its hard PCIe IP cores in the Stratix IV GX transceiver family and 8 multi-gigabit transceivers. A typical Gen2 x8 endpoint consumes roughly 80K LEs for the protocol stack plus application logic, so the 353,600 LEs leave abundant room for high-value application logic. The Gen2 PHY closes 5 Gbps per lane with proven signal integrity in the NF45 package. Industrial temperature grade supports deployment in server-class telecom platforms. Reference designs and a hard IP macro from Intel shorten development, typically achieving a working Gen2 linkup in 3-4 weeks of integration effort.
Recommended
Avionics / Aerospace Signal Processing (non-flight-critical)
The EP4SGX360NF45I4 fits avionics and aerospace signal-processing needs in non-flight-critical roles because of its industrial temperature grade and high logic density. Avionics data concentrators aggregate ARINC 429 / MIL-STD-1553 traffic and process it alongside radar IF samples, with the 8.5 Gbps transceivers feeding digital receivers. The 23 Mbits of on-chip memory buffer samples before handing off to backplane fabric. For non-flight-critical roles the industrial grade suffices; designers targeting DO-254 levels A/B should confirm with Intel whether Stratix IV GX is supported in current aerospace product lists. Power consumption of 12-16W requires careful thermal design in conduction-cooled enclosures.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX360NF45I4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX360NF45I3N | EP4SGX360NF45C4N | EP4SGX360NF45C3N | EP4SGX360NF45C2N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-ball FC-BGA (NF45) | 1932-ball FC-BGA (NF45) - same | 1932-ball FC-BGA (NF45) - same | 1932-ball FC-BGA (NF45) - same | 1932-ball FC-BGA (NF45) - same |
| Speed Grade | -4 (I4) | -3 (I3) | -4 (C4) | -3 (C3) | -2 (C2) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 |
| Embedded Memory | 23,105,536 bits | 23,105,536 bits | 23,105,536 bits | 23,105,536 bits | 23,105,536 bits |
| User I/O Pins | 920 | 920 | 920 | 920 | 920 |
| Maximum Clock Frequency | 717 MHz (-4 speed grade) | ~640 MHz (-3 speed grade, ~10% lower) | 717 MHz (-4 speed grade) | ~640 MHz (-3 speed grade) | ~560 MHz (-2 speed grade, slowest) |
| Process Technology | TSMC 40nm | TSMC 40nm - same | TSMC 40nm - same | TSMC 40nm - same | TSMC 40nm - same |
| Approx. Unit Price (USD, qty 1) | 2,850 | ~2,650 | ~2,400 | ~2,250 | ~2,100 |
Key Differentiators
- Industrial temperature grade with -I4 speed grade (vs EP4SGX360NF45C4N)
- -I4 speed grade enables higher Fmax than -I3 alternatives (vs EP4SGX360NF45I3N)
- Same NF45 footprint across all speed/temperature variants enables single PCB layout (vs EP4SGX360KF40I4 (Stratix IV E))
- Integrated 8.5 Gbps multi-gigabit transceivers with hard PCIe IP (vs EP4SE530H35C4N (Stratix IV E, no transceivers))
Design Notes
The NF45 45 mm FC-BGA package dissipates an estimated 12-18W under typical loads (high logic utilization + active transceivers at 8.5 Gbps). With a thermal resistance theta_JA of approximately 4-6 C/W on a JEDEC 4-layer test board (note: this is an estimate; refer to the Stratix IV GX Thermal Modeling Guide for the exact figure for your PCB stackup), the junction temperature rises 50-110C above ambient. For industrial-temperature environments (ambient up to +85C), a heatsink with thermal interface material or a cold plate is essential; otherwise the device will throttle or shut down via on-die thermal sensing.
The 1932-ball FC-BGA NF45 package requires high-density PCB design rules: 0.4 mm or finer ball pitch, microvia stack-ups (laser-drilled 1-2-1 build-up), controlled-impedance traces for the 8.5 Gbps transceiver channels, and matched-length routing for DDR3 interfaces. Use Intel's Stratix IV GX PCB Design Guidelines for via-in-pad recommendations and reference stack-ups. Estimated PCB layer count for full-channel deployment is 12-16 layers; running fewer layers risks signal-integrity failures on multi-gigabit links.
Power sequencing for Stratix IV GX requires VCCINT (0.9V core), VCCPD, VCCA_PLL, and VCCAUX rails to ramp in a controlled order to avoid in-rush damage. Estimated core current at full utilization is 15-22A, requiring a multi-phase buck regulator; the VCCIO rails (1.2V/1.5V/1.8V/2.5V/3.0V depending on I/O standard) need separate LDOs. Use the Early Power Estimator (EPE) in Quartus II / Quartus Prime to refine these estimates before PCB layout.
Transceiver channel placement should follow the Stratix IV GX pin connection guidelines: each 8.5 Gbps lane needs matched 100-ohm differential routing within the same pair of balls, length-matched to its companion lane within 150 um, and a continuous reference ground plane underneath. AC-coupling capacitors (typically 100 nF 0402) sit close to the transmit side of each lane. Skipping AC coupling is a common layout pitfall that causes linkup failures at multi-gigabit rates.
Do not mix the -I4 (industrial, -4 speed) and -C4 (commercial, -4 speed) variants on a board without revalidating thermal design - the -C4 part is rated only to +85C ambient, so using it in an industrial environment can cause timing failures or shortened life. Also, do not use non-N parts (e.g., EP4SGX360NF45I4 vs EP4SGX360NF45I4N) interchangeably without checking lead-finish / RoHS declarations: the non-N variant may not be RoHS-compliant. Finally, never trust broker market labels without requesting a CoC and inspecting pin-1 marker geometry against the official Intel FC-BGA datasheet.
Compliance Information
RoHS compliant per Intel product page. Not AEC-Q100 qualified - this part is a commercial / industrial FPGA, not an automotive-grade IC. Halogen-free status not explicitly stated in verified web data, marked unknown.
