EP4SGX290NF45I4 - 290K LE Stratix IV GX FPGA | Intel | 1932-FCBGA
MPN: EP4SGX290NF45I4 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $11258.42 | $11,258.42 |
| 5 | $11050 | $55,250.00 |
| 10 | $10775 | $107,750.00 |
| 25 | $10425 | $260,625.00 |
| 100 | $9875 | $987,500.00 |
EP4SGX290NF45I4 Overview
An FPGA (Field Programmable Gate Array) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP such as transceivers, DSP blocks, and block RAM. FPGAs belong to the broader programmable logic family within the logic IC category, sitting alongside CPLDs and structured ASICs, and they enable hardware-level parallelism that microcontrollers and DSPs cannot match. The Stratix IV series from Intel (formerly Altera) is engineered for high-performance signal processing, telecom line cards, and high-end ASIC prototyping.
Key features of the EP4SGX290NF45I4 include 11,648 LABs (Logic Array Blocks), 832 embedded 18x18 multipliers capable of running at up to 600 MHz, true dual-port and FIFO memory blocks, and an industrial temperature grade. The integrated PCI Express hard IP and multi-gigabit transceivers make the part a strong fit for protocol bridging, backplane aggregation, and high-throughput data acquisition.
Architecturally, the device pairs a rich programmable fabric with hardened memory and DSP, enabling designers to implement wide datapaths and pipeline-intensive DSP without consuming logic resources for those functions. The 8-transceiver GXB blocks at up to 8.5 Gbps pair with 36 PLL/DCM clock managers and support protocols such as PCIe Gen1/Gen2, XAUI, CEI-6G, and Serial RapidIO.
Typical applications include high-end ASIC prototyping, telecom line cards and baseband processing, high-definition video broadcast equipment, military radar and signal intelligence, and test and measurement instrumentation. The wide transceiver bandwidth also supports 40G/100G data path prototyping when multiple FPGAs are used.
Designers should plan power-rail sequencing for the 0.9 V core, the transceiver supply, and the auxiliary supplies, and ensure the FC-BGA land pattern meets Intel's recommended PCB stackup. Thermal management at full transceiver utilization requires a heatsink or cold-plate solution because the 1932-ball package concentrates significant thermal density.
This page synthesizes distributor pricing, real cross-reference candidates, and PCB-aware design notes not aggregated in the manufacturer datasheet, giving the engineer a one-stop engineering brief for the EP4SGX290NF45I4.
Drop-in alternatives for EP4SGX290NF45I4 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX290NF45I4 (same form factor and footprint) β differing in Package, Transceivers, Mounting Type, Operating Temperature, Core Voltage.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4SGX290NF45I3N
β Drop-Inβ In Stock
$9200 / Unit
View Datasheet βEP4SGX290NF45C4
β Drop-Inπ Reference alternative (not in catalog)
EP4SGX290NF45C3
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP4SGX290NF45I4N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$2095 / Unit
View Datasheet βEP4SGX290NF45I4 Maximum Ratings & Electrical Characteristics
| Family | Stratix IV GX |
| Logic Elements | 291,200 |
| Adaptive Logic Modules (ALMs) | 113,600 |
| Logic Array Blocks (LABs) | 11,648 |
| Embedded Memory | 17,661,952 bits |
| Embedded 18x18 Multipliers | 832 |
| User I/Os | 920 |
| Transceivers | 36 channels up to 8.5 Gbps |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| Package | 1932-ball FC-BGA (NF45) |
| Operating Temperature | -40C to +100C (industrial) |
| PCIe Hard IP | Yes (Gen1/Gen2) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
EP4SGX290NF45I4 1932-ball fc-bga (nf45) Pin Configuration Guide
Pin configuration for EP4SGX290NF45I4 (1932-ball fc-bga (nf45) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX290NF45I4.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX290NF45I4 is suitable for 6 applications: ASIC Prototyping and Emulation, Telecom Line Card and Baseband Processing, High-Definition Video Broadcast Equipment, Military Radar and Signal Intelligence, Test and Measurement Instrumentation, High-Performance Computing and Network Acceleration.
ASIC Prototyping and Emulation
The EP4SGX290NF45I4's 291,200 logic elements, 17.6 Mbit embedded memory, and 920 user I/Os make it the canonical FPGA for ASIC prototyping. According to the Stratix IV GX datasheet, the part is widely deployed in commercial ASIC emulator platforms because of its high logic density and predictable timing closure. The 832 embedded 18x18 multipliers accelerate prototype verification of datapath-heavy designs. Designers partition the ASIC RTL across multiple Stratix IV GX devices using dedicated multi-FPGA partitioning tools.
Recommended
Telecom Line Card and Baseband Processing
Telecom line cards require dense packet processing and high-speed serial links to backplanes, both of which the EP4SGX290NF45I4 delivers. According to the manufacturer datasheet, the 36 embedded transceivers at up to 8.5 Gbps support SPI-4.2, SFI-5, XAUI, and Serial RapidIO, matching legacy 4G/5G fronthaul interface requirements. The 832 multipliers enable high-throughput baseband DSP for channelization and pre-coding. The 920 user I/Os allow direct connection to external packet processors and timing ICs.
Recommended
High-Definition Video Broadcast Equipment
Broadcast video routers and contribution codecs require multi-gigabit serial I/O for uncompressed HD-SDI and emerging 12G-SDI streams. The EP4SGX290NF45I4's 8.5 Gbps transceivers and 920 user I/Os make it suitable for 4K video routers and video-over-IP gateways. According to the Stratix IV GX datasheet, the integrated SDI support IP and PCIe hard IP streamline broadcast system design. The large block RAM (17.6 Mbit) buffers multi-stream video without external SDRAM bottlenecks.
Recommended
Military Radar and Signal Intelligence
Radar and signal intelligence systems demand dense DSP, large embedded memory, and ruggedized packaging. The EP4SGX290NF45I4's industrial temperature grade, 832 hardware multipliers, and 17.6 Mbit block RAM enable real-time pulse compression and FFT processing. According to the manufacturer datasheet, the device is commonly used in phased-array radar front-ends where multiple transceiver channels feed high-speed ADCs. The FC-BGA package also supports the thermal envelope of ruggedized enclosures.
Recommended
Test and Measurement Instrumentation
High-end oscilloscopes, logic analyzers, and protocol analyzers leverage the EP4SGX290NF45I4 for real-time waveform processing and pattern generation. The 36 transceivers at up to 8.5 Gbps capture or generate multi-lane protocols (PCIe Gen2, USB 3.0, SATA, 10GbE), while the 832 multipliers accelerate FFT and modulation analysis. According to Stratix IV GX documentation, the wide LVDS parallel I/O also drives high-speed ADC/DAC front-ends in instrumentation.
Recommended
High-Performance Computing and Network Acceleration
Datacenter appliances and HPC accelerators use the EP4SGX290NF45I4 to offload compute-intensive workloads such as encryption, compression, and packet classification. According to the Stratix IV GX datasheet, the part's PCI Express Gen2 hard IP and multi-gigabit transceivers enable direct host attachment and high-bandwidth network interfaces. The 291,200 logic elements and 832 multipliers provide the throughput required to accelerate network functions at line rate.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX290NF45I4 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX290NF45I3N | EP4SGX290NF45C4 | EP4SGX290NF45C3 | EP4SGX290NF45I4N |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1932-ball FC-BGA (NF45) | 1932-ball FC-BGA (NF45) - same | 1932-ball FC-BGA (NF45) - same | 1932-ball FC-BGA (NF45) - same | 1932-ball FC-BGA (NF45) - same |
| Logic Elements | 291,200 | 291,200 | 291,200 | 291,200 | 291,200 |
| Embedded Memory | 17,661,952 bits | 17,661,952 bits | 17,661,952 bits | 17,661,952 bits | 17,661,952 bits |
| User I/Os | 920 | 920 | 920 | 920 | 920 |
| Transceivers / Data Rate | 36 ch / 8.5 Gbps | 36 ch / 8.5 Gbps | 36 ch / 8.5 Gbps | 36 ch / 8.5 Gbps | 36 ch / 8.5 Gbps |
| Speed Grade | I4 (industrial, fast) | I3 (industrial, -1 bin) | C4 (commercial, fast) | C3 (commercial, -1 bin) | I4 (industrial, fast, lead-free) |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C |
Key Differentiators
- Highest-density Stratix IV GX with 36 transceivers at 8.5 Gbps (vs EP4SGX230FF35C3G)
- Industrial temperature grade with full 8.5 Gbps SerDes (vs EP4SGX290NF45C4)
- Same-package, same-die speed-grade upgrade path (vs EP4SGX290NF45I3N)
Design Notes
The EP4SGX290NF45I4 requires multiple power rails - 0.9 V core, 1.1 V PLL analog, 1.5 V/2.5 V I/O banks, and transceiver supplies. Power-on sequencing must follow the manufacturer's recommended order to avoid latch-up: VCC core before VCCIO and VCCE (transceiver). Estimated: at full transceiver utilization with 8.5 Gbps line rate, total power can exceed 25 W, so a multi-phase digital controller is recommended.
The 1932-ball FC-BGA concentrates significant thermal density, especially when all 36 transceivers run at full rate. A heatsink with thermal interface material or a cold-plate is recommended for closed enclosures; without forced airflow the junction temperature can exceed 100 C under industrial temperature conditions. The PCB must use the manufacturer-recommended thermal via array under the package to spread heat into inner copper planes.
The NF45 FC-BGA package demands a high-layer-count PCB stackup (typically 12+ layers) with microvia or via-in-pad construction to escape the dense 1.0 mm pitch ball grid. Transceiver channel routing must follow Intel's length-matching and impedance-control guidelines (typically 100 ohm differential). Maintain continuous reference planes beneath high-speed traces to control crosstalk and jitter on multi-Gbps links.
Place decoupling capacitors as close as possible to each power pin, using a mix of 0.1 uF, 1 uF, and 10 uF values to cover the FPGA's wide current-step bandwidth. Separate analog PLL supplies from digital noise by using ferrite beads and dedicated ground islands. Transceiver reference clock routing must be length-matched across all lanes and shielded from noisy digital signals.
Do not mix I/O standards on the same bank without re-validating VCCIO. Configuration mode (AS, PS, JTAG) must match the boot memory interface and pull-up/pull-down resistors on configuration pins. JTAG chain integrity should be verified early - Stratix IV FPGAs are sensitive to TCK noise. Always generate the Quartus pin-out assignment file before PCB fabrication to catch missing pins early.
Compliance Information
RoHS and REACH compliance per Intel (Altera) product declaration. AEC-Q100 is not applicable - this is an FPGA, not an automotive-grade IC. Industrial temperature grade qualified.
