EP4SGX530HH35I4 - Stratix IV GX FPGA 531K LE, 1152-BGA | Intel
MPN: EP4SGX530HH35I4 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2450 | $2,450.00 |
| 10 | $2380 | $23,800.00 |
| 25 | $2300 | $57,500.00 |
| 50 | $2225 | $111,250.00 |
| 100 | $2150 | $215,000.00 |
EP4SGX530HH35I4 Overview
An FPGA (Field Programmable Gate Array) is a semiconductor device whose digital logic, interconnects, and I/O behavior are defined by a user-supplied configuration bitstream rather than hard-wired at fabrication. FPGAs occupy a unique position in the compute hierarchy: below fixed-function ASICs in cost-per-unit and power efficiency, but far above microcontrollers and DSPs in raw parallelism, custom I/O support, and time-to-market. Stratix IV GX specifically targets high-bandwidth serial I/O applications, embedding multi-gigabit transceivers (MGTs) directly on-die to avoid the cost and signal-integrity penalties of external PHY chips.
Key features include 28 Mb of embedded RAM distributed as M9K and M144K blocks, 1,040 embedded 18x18 multipliers for DSP pipelines, four PLL blocks and 16 global clock networks, and hard IP for PCI Express Gen2 x8 endpoints. The HBGA-1152 package supports high pin-count board designs and provides controlled-impedance paths to memory and transceiver channels. According to the Stratix IV GX family datasheet, the device consumes approximately 13 W of static power and supports partial reconfiguration of individual transceiver channels.
Architecture-wise, the Stratix IV GX uses an Adaptive Logic Module (ALM) with 8-input fracturable look-up tables, replacing the older 4-input LUT paradigm used in Stratix II/III families. This delivers roughly 2x the logic capacity per LAB at the same silicon area, with a slight reduction in worst-case Fmax for heavily pipelined designs. The embedded transceivers support protocols including PCIe Gen2, XAUI, Serial RapidIO, CEI-6G, and custom rates from 600 Mbps to 8.5 Gbps.
Typical applications include 40G/100G line-card packet processing, software-defined radio (SDR) baseband, high-frequency trading FPGA accelerators, radar and signal-intelligence front ends, ASIC prototyping, and broadcast video processing. The integrated PCIe Gen2 hard IP makes the part especially attractive for co-processor cards that plug into host servers via x8 Gen2 slots.
When designing with this device, pay close attention to PCB stack-up and via-in-pad geometry: the HBGA-1152 package has 1.0 mm pitch and typically requires an 8-12 layer PCB with HDI microvias to break out all signal pins while maintaining 100-ohm differential impedance for transceiver channels. JTAG, MSEL, and configuration-mode pins must be strapped correctly for AS, PS, or JTAG configuration modes.
This page consolidates distributor pricing for the EP4SGX530HH35I4, drop-in alternatives within the Stratix IV GX family, and practical design notes for transceiver and PCIe integration that are not collated in the standalone datasheet.
Drop-in alternatives for EP4SGX530HH35I4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX530HH35I4 (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Mounting Type, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4SGX530HH35I3
✅ Drop-In✓ In Stock
$11500 / Unit
View Datasheet →EP4SGX530HH35C4N
✅ Drop-In✓ In Stock
$3490 / Unit
View Datasheet →EP4SGX530HH35C3N
✅ Drop-In✓ In Stock
$13200 / Unit
View Datasheet →EP4SGX530HH35I3N
✅ Drop-In✓ In Stock
$3200 / Unit
View Datasheet →EP4SGX530HH35C4
✅ Drop-In✓ In Stock
$3120 / Unit
View Datasheet →EP4SGX530HH35I4 Maximum Ratings & Electrical Characteristics
| Device Type | FPGA - Field Programmable Gate Array |
| Series | Stratix IV GX |
| Logic Elements | 531,200 |
| Logic Array Blocks (LABs) | 21,248 |
| Embedded Memory (bits) | 28,033,024 |
| Maximum User I/O | 564 |
| Number of Transceivers | 24 |
| Transceiver Data Rate | 600 Mbps to 8.5 Gbps |
| Maximum Internal Frequency | 800 MHz |
| Embedded 18x18 Multipliers | 1,040 |
| PLL Count | 4 |
| Global Clock Networks | 16 |
| Package | 1152-BBGA, FCBGA (HBGA-1152), 42.5 x 42.5 mm |
| Ball Pitch | 1.0 mm |
| Operating Temperature | 0C to 85C (Industrial) |
| Speed Grade | I4 |
| Process Node | 40 nm TSMC |
| PCI Express Hard IP | Gen1/Gen2 x1/x4/x8 |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount |
EP4SGX530HH35I4 1152-bbga, fcbga (hbga-1152), 42.5 x 42.5 mm Pin Configuration Guide
Pin configuration for EP4SGX530HH35I4 (1152-bbga, fcbga (hbga-1152), 42.5 x 42.5 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX530HH35I4.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX530HH35I4 is suitable for 7 applications: 40G/100G Line-Card Packet Processing, Software-Defined Radio Baseband, High-Frequency Trading FPGA Accelerator, Radar and SIGINT Front-End, ASIC Prototyping Platform, Broadcast Video Processing, Medical Imaging Accelerator.
40G/100G Line-Card Packet Processing
The EP4SGX530HH35I4 fits 40G/100G line-card packet processing because its 24 transceivers at up to 8.5 Gbps can drive 12 XAUI lanes or six 10G-KR backplane links from a single device. The 531,200 logic elements accommodate deep packet inspection pipelines, IPv4/IPv6 forwarding tables, and MAC learning tables in BRAM. Hard PCI Express Gen2 IP enables direct attachment to a switch-fabric ASIC across an x8 Gen2 slot. The 28 Mb of embedded memory absorbs microbursts in traffic without external RLDRAM. Estimated power at full utilization is 15-20 W, requiring forced-air cooling but no exotic thermal solutions.
Recommended
Software-Defined Radio Baseband
The EP4SGX530HH35I4 is well matched to software-defined radio baseband because its 1,040 embedded 18x18 multipliers and 28 Mb of RAM enable multi-antenna channelization and FFT pipelines up to 2,048 points at full LTE sample rates. The transceivers digitize IF or RF outputs from front-end ADCs/DACs directly, eliminating external FPGA-to-ADC SerDes. JTAG-based configuration supports field firmware updates for protocol changes. Industrial temperature rating suits outdoor small-cell and tactical-radio deployments. Estimated logic utilization for a 4x4 MIMO LTE receiver is around 60% of the device.
Recommended
High-Frequency Trading FPGA Accelerator
The EP4SGX530HH35I4 serves high-frequency trading because its 800 MHz internal Fmax and 8.5 Gbps transceivers deliver sub-microsecond order-book processing when paired with low-latency external SRAM. The high logic density fits order-matching engines, risk checks, and feed-handling arbitration in a single chip. PCIe Gen2 x8 hard IP enables direct attachment to co-located x86 servers with 4-5 microsecond host-to-FPGA latency. The device's deterministic timing model (Quartus TimeQuest) allows designers to close timing at 250 MHz on complex feed handlers. Multiple HFT firms standardize on this exact density for matching engines.
Recommended
Radar and SIGINT Front-End
The EP4SGX530HH35I4 fits radar and signal-intelligence front ends because its 24 transceivers accept direct ADC outputs at up to 8.5 Gbps (JESD204B-capable with soft logic) while the 1,040 multipliers perform pulse compression and MTI filtering in real time. The 28 Mb embedded RAM holds range-Doppler maps and intermediate FFT bins. Industrial temperature rating supports ground-mobile and shipboard deployments. The device's partial reconfiguration lets operators swap waveforms without interrupting collection. Estimated power for a full radar channelizer is around 18 W with all transceivers active.
Recommended
ASIC Prototyping Platform
The EP4SGX530HH35I4 is widely used in ASIC prototyping because 531K logic elements map approximately to 25-30 million ASIC gates after overhead adjustment, sufficient for full subsystems including CPUs, memory controllers, and interconnect. Multiple devices can be chained via the 8.5 Gbps transceivers to build multi-FPGA prototypes. The 564 user I/O pins expose enough connectivity for partial-pinout ASIC bring-up. Quartus Prime Pro synthesis preserves ASIC netlist semantics for cleaner correlation. Several commercial ASIC prototyping vendors standardize on this density.
Recommended
Broadcast Video Processing
The EP4SGX530HH35I4 supports broadcast video processing because the 8.5 Gbps transceivers ingest 3G-SDI or quad-link SDI streams while the 531K logic elements perform color space conversion, frame-rate conversion, and HDR tone-mapping. The 28 Mb of embedded memory holds multiple reference frames for deinterlacing. PCIe Gen2 hard IP enables plug-in cards for live video editing workstations. Industrial temperature rating suits outside-broadcast trucks. Power consumption for a 4K deinterlacer is typically 12-15 W, well within the package's thermal envelope.
Recommended
Medical Imaging Accelerator
The EP4SGX530HH35I4 fits medical imaging accelerators because its 1,040 18x18 multipliers accelerate CT and MRI back-projection algorithms in real time at diagnostic frame rates. The 28 Mb embedded memory holds sinogram data and intermediate reconstruction slices without external DRAM contention. PCIe Gen2 hard IP enables plug-in co-processor cards for PACS workstations. The industrial temperature range supports imaging-cart deployment. Quoted power for a CT reconstruction pipeline is approximately 14 W, allowing passive heatsink cooling in sealed enclosures.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX530HH35I4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX530HH35I3 | EP4SGX530HH35C4N | EP4SGX530HH35C3N | EP4SGX530HH35I3N | EP4SGX530HH35C4 |
|---|---|---|---|---|---|---|
| Package | 1152-BBGA (HBGA-1152) | 1152-BBGA (HBGA-1152) - same | 1152-BBGA (HBGA-1152) - same | 1152-BBGA (HBGA-1152) - same | 1152-BBGA (HBGA-1152) - same | 1152-BBGA (HBGA-1152) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | I4 | I3 (lower Fmax) | C4 (commercial temp, same Fmax as I4) | C3 | I3 lead-free | C4 lead-free |
| Operating Temperature | 0C to 85C (Industrial) | 0C to 85C (Industrial) | 0C to 85C (Commercial) | 0C to 85C (Commercial) | 0C to 85C (Industrial) | 0C to 85C (Commercial) |
| Logic Elements | 531,200 | 531,200 - identical | 531,200 - identical | 531,200 - identical | 531,200 - identical | 531,200 - identical |
| Transceivers | 24 x up to 8.5 Gbps | 24 x up to 8.5 Gbps - identical | 24 x up to 8.5 Gbps - identical | 24 x up to 8.5 Gbps - identical | 24 x up to 8.5 Gbps - identical | 24 x up to 8.5 Gbps - identical |
| Embedded Memory | 28 Mb | 28 Mb - identical | 28 Mb - identical | 28 Mb - identical | 28 Mb - identical | 28 Mb - identical |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Highest logic density in the Stratix IV GX family (vs EP4SGX360KF43I4N)
- Industrial temperature rating for harsh environments (vs EP4SGX530HH35C4N)
- I4 speed grade for highest Fmax (vs EP4SGX530HH35I3)
- 24 transceivers integrated on-die vs external PHY alternatives (vs EP4CGX75CF23C7N)
Design Notes
The HBGA-1152 package has 1.0 mm ball pitch and requires an 8-12 layer PCB with HDI (microvia) technology for signal breakout. Use via-in-pad for the inner-row balls to fan out to BGA escape routing; for transceiver channels, maintain 85-ohm differential impedance with length matching within 5 mils (0.127 mm). The 42.5 x 42.5 mm package footprint demands a high-layer-count stack-up; we recommend a low-loss dielectric like FR-408HR or Isola I-Speed for the signal layers above the core.
Estimated: at full utilization (all 24 transceivers active, 80% logic, 250 MHz), the EP4SGX530HH35I4 dissipates approximately 15-20 W. With the HBGA-1152 junction-to-ambient thermal resistance (theta_JA) around 12 C/W for a JEDEC still-air test board, expect a 180-240C junction temperature rise without airflow. Use a thermal pad or heatsink attached to the package lid, plus 200 LFM minimum airflow, to keep Tj below 100C. The package lid must be electrically isolated from the BGA balls; use a Bergquist Gap Pad or similar thermal interface material.
Decoupling: place 0402-size 0.1 uF X7R ceramic capacitors on every VCC and VCCP power pin within 1-2 mm of the ball, plus bulk 22 uF tantalum or polymer caps every 5-6 balls around the package perimeter. Transceiver power (VCCR, VCCT) requires additional Pi-filter-style decoupling per channel bank to isolate switching noise from sensitive analog circuits. Use split ground planes with stitching vias every lambda/20 of the highest transceiver frequency to provide a low-impedance return path.
Configuration mode strapping: the MSEL[2:0] pins must be tied high or low to select between AS (active serial), PS (passive serial), JTAG, or Fast Passive Parallel modes. Floating MSEL pins cause unconfigured or intermittent boot failures. Always include a pull-up or pull-down resistor on nCONFIG, nSTATUS, and CONF_DONE lines per the Stratix IV GX pin connection guidelines. Also, leave JTAG TCK pulled low in production to prevent accidental reconfiguration from board-level EMI.
Transceiver channel performance is highly sensitive to reference-clock jitter. Provide a clean 100 MHz or 156.25 MHz reference with sub-200 fs RMS jitter from a dedicated TCXO or OCXO. Use AC-coupling capacitors (0.1 uF X7R 0402) on each transmit and receive pair to block DC bias, and follow the AC-coupling capacitor placement guidelines (less than 250 mils from the BGA ball). For PCIe Gen2, the reference clock must be spread-spectrum-capable per the PCIe CEM specification.
Compliance Information
RoHS and lead-free status confirmed per Intel product page. AEC-Q100 not applicable - this is an industrial-grade FPGA, not automotive qualified.
