EP4SGX530HH35I3 - Stratix IV GX FPGA, 531K LE, 1152-BGA | Altera
MPN: EP4SGX530HH35I3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $13868.88 | $13,868.88 |
| 10 | $13500 | $135,000.00 |
| 100 | $12800 | $1,280,000.00 |
| 500 | $12200 | $6,100,000.00 |
| 1,000 | $11500 | $11,500,000.00 |
EP4SGX530HH35I3 Overview
What is an FPGA? A Field-Programmable Gate Array is a semiconductor device built around an array of configurable logic blocks (CLBs or ALMs) connected via programmable interconnect and surrounded by programmable I/O cells. Unlike a fixed-function ASIC, an FPGA can be reconfigured after manufacturing, making it ideal for prototyping, low-volume production, and designs requiring post-deployment updates. The Stratix IV GX family sits at the upper end of Altera's high-performance FPGA portfolio, integrating multi-gigabit transceivers and substantial on-chip memory to handle protocol bridging, baseband processing, and high-throughput datapath workloads.
Key features of the EP4SGX530HH35I3 include 21,248 LABs/ALMs, 28 Mb of embedded memory (M9K and M144K blocks), embedded multipliers and DSP blocks, fractional phase-locked loops (fPLLs), and PCI Express hard IP blocks. The 8.5 Gbps transceivers support protocols such as PCIe Gen1/Gen2, Serial RapidIO, XAUI, CEI-6G, Interlaken, and SFI-5, making the part suitable for line-card, backplane, and high-end test equipment designs. The 564 user I/Os are organized across multiple I/O banks supporting LVDS, LVCMOS, HSTL, SSTL, and other single-ended and differential standards.
The device uses a 40 nm TSMC process and a 1.0 V core supply, with separate supply rails for transceivers, PLLs, and I/O banks. Configuration is supported via JTAG, passive serial, fast passive parallel, and Altera-enhanced configuration devices. The 1152-ball flip-chip BGA (HBGA-42.5 x 42.5 mm) package provides the high-pin-count interconnect required for 564 user I/Os and multiple serial transceiver channels.
Typical applications include high-end communication line cards, ASIC and SoC prototyping, high-speed serial interface bridging (PCIe, Serial RapidIO, 10G Ethernet), high-performance DSP and image processing, broadcast video infrastructure, and test and measurement equipment. Designers typically pair the FPGA with external DDR3/QDR memory, clock generators, and high-speed ADCs/DACs.
When designing with this device, allocate sufficient PCB layers (typically 12+ layers with buried vias) and use Altera's Stratix IV GX transceiver toolkit to manage PCB channel simulation. Ensure proper decoupling per the Altera pin connection guidelines, and verify that the selected FPGA power rail sequencing meets the device's power-on-reset requirements. Quartus II design software (or Intel Quartus Prime) is required for synthesis, place-and-route, and configuration bitstream generation.
This page synthesizes distributor pricing, drop-in package-compatible Stratix IV GX variants, and practical design notes not consolidated in the manufacturer datasheet, including lifecycle guidance and lead-time considerations for new designs.
Drop-in alternatives for EP4SGX530HH35I3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX530HH35I3 (same form factor and footprint) — differing in Package, Operating Temperature, Transceivers, RoHS Status, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4SGX530HH35C4N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3490 / Unit
View Datasheet →EP4SGX530HH35C3N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$13200 / Unit
View Datasheet →EP4SGX530HH35C3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$2398 / Unit
View Datasheet →EP4SGX530HH35C2N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3500 / Unit
View Datasheet →EP4SGX530HH35C2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$4500 / Unit
View Datasheet →EP4SGX530HH35I3 Maximum Ratings & Electrical Characteristics
| Family | Stratix IV GX |
| Device Type | FPGA - Field Programmable Gate Array |
| Logic Elements | 531,200 |
| Adaptive Logic Modules / LABs | 21,248 |
| Embedded Memory | 28,033,024 bits (28 Mb) |
| User I/O Pins | 564 |
| Package | 1152-BBGA, FCBGA (42.5 x 42.5 mm, HBGA) |
| Process Node | 40 nm |
| Core Supply Voltage | 1.0 V (typical) |
| Operating Temperature | 0 °C to 85 °C (Industrial) |
| Internal Logic Frequency | 800 MHz (max) |
| Transceivers | Multi-gigabit transceivers up to 8.5 Gbps |
| Configuration | JTAG, Passive Serial, Fast Passive Parallel |
| RoHS Status | RoHS non-compliant (contains lead per legacy BGA package) |
| Mounting Type | Surface Mount (BGA) |
| Memory Type | SRAM-based (volatile, requires configuration) |
EP4SGX530HH35I3 1152-bbga, fcbga (42.5 x 42.5 mm, hbga) Pin Configuration Guide
Pin configuration for EP4SGX530HH35I3 (1152-bbga, fcbga (42.5 x 42.5 mm, hbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX530HH35I3.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX530HH35I3 is suitable for 6 applications: High-Speed Communication Line Card, ASIC and SoC Prototyping, High-Performance DSP and Signal Processing, Test and Measurement Equipment, Broadcast Video Infrastructure, Industrial Control and Aerospace Systems.
High-Speed Communication Line Card
The EP4SGX530HH35I3 is well suited for high-end communication line cards requiring 8.5 Gbps transceiver channels and substantial parallel processing. With 531K logic elements and 564 user I/Os, it can simultaneously aggregate multiple 10G Ethernet, Serial RapidIO, or Interlaken interfaces while running forwarding-plane logic. The 28 Mb of embedded memory supports large packet buffer lookup tables and traffic shaping, eliminating the need for external TCAMs in mid-density designs. Compared to a discrete PHY + ASIC approach, this FPGA consolidates multi-protocol adaptation, channel bonding, and OAM processing in a single device, reducing BOM cost and PCB area.
Recommended
ASIC and SoC Prototyping
With 531K logic elements and abundant I/O, the EP4SGX530HH35I3 serves as a robust ASIC/SoC prototyping platform. Designers map ASIC RTL to the Stratix IV GX architecture using Quartus II and validate full-system functionality before tape-out. The 8.5 Gbps transceivers emulate high-speed serial interfaces typically found in ASICs (PCIe, USB 3.0, SATA), while the 28 Mb embedded memory approximates on-chip SRAM behavior. Multiple EP4SGX530HH35I3 devices can be combined on a prototyping board to validate multi-million-gate ASICs, with the same package across the family enabling board reuse for various design sizes.
Recommended
High-Performance DSP and Signal Processing
The EP4SGX530HH35I3's embedded DSP blocks and multipliers deliver hundreds of GMACs of DSP throughput for radar, beamforming, and software-defined radio (SDR) baseband processing. Combined with 28 Mb embedded memory, it can sustain complex FFT and matrix operations without external memory bottlenecks. The 564 user I/Os interface directly to high-speed ADCs and DACs used in radar and wireless test equipment. Compared to a DSP processor cluster, this FPGA offers 10-100x speedup on parallel kernels while consuming comparable power, making it a preferred platform for real-time signal processing.
Recommended
Test and Measurement Equipment
Test and measurement instruments such as oscilloscopes, logic analyzers, and protocol analyzers rely on high-density FPGAs for data acquisition, triggering, and real-time signal processing. The EP4SGX530HH35I3's 8.5 Gbps transceivers capture and generate high-speed serial data streams, while 531K logic elements implement deep state machines, packet parsers, and protocol decoders. The 28 Mb embedded memory buffers acquisition windows at GHz sampling rates, and the 564 user I/Os provide ample parallel channels for parallel logic-analyzer probes. Industrial temperature grade (0 °C to 85 °C) supports bench and lab deployments.
Recommended
Broadcast Video Infrastructure
Broadcast video routers, multiviewers, and format converters demand the bandwidth and processing density of the EP4SGX530HH35I3. The 8.5 Gbps transceivers accept SDI signals up to 3G-SDI and emerging UHD formats, while the 564 user I/Os support HDMI, DisplayPort, and parallel digital video interfaces. Designers implement color-space conversion, scaling, and frame-rate conversion in the FPGA fabric using Altera's video and image processing IP cores. The 28 Mb embedded memory handles multiple frame buffers for compositing and Picture-in-Picture functions.
Recommended
Industrial Control and Aerospace Systems
Industrial-grade temperature range (0 °C to 85 °C) makes the EP4SGX530HH35I3 suitable for harsh-environment applications such as industrial motor controllers, aerospace flight systems, and defense signal intelligence. The 40 nm process provides good radiation tolerance compared to newer process nodes, and the mature Quartus II toolchain is trusted in safety-critical flows with extensive verification IP. Designers implement deterministic real-time control loops, MIL-STD-1553 and ARINC 429 interfaces, and FPGA-based triple modular redundancy for fault tolerance in aerospace systems.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX530HH35I3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX530HH35C4N | EP4SGX530HH35C3N | EP4SGX530HH35C3 | EP4SGX530HH35C2N | EP4SGX530HH35C2 |
|---|---|---|---|---|---|---|
| Package | 1152-BBGA, FCBGA (42.5 x 42.5 mm, HBGA) | 1152-BBGA, FCBGA (42.5 x 42.5 mm) - same | 1152-BBGA, FCBGA (42.5 x 42.5 mm) - same | 1152-BBGA, FCBGA (42.5 x 42.5 mm) - same | 1152-BBGA, FCBGA (42.5 x 42.5 mm) - same | 1152-BBGA, FCBGA (42.5 x 42.5 mm) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 531,200 | 531,200 | 531,200 | 531,200 | 531,200 | 531,200 |
| Speed/Temperature Grade | I3 (Industrial, speed grade 3) | C4 (Commercial, speed grade 4) | C3 (Commercial, speed grade 3) | C3 (Commercial, speed grade 3) | C2 (Commercial, speed grade 2 - slower) | C2 (Commercial, speed grade 2 - slower) |
| Operating Temperature | 0 °C to 85 °C (Industrial) | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C (Commercial) |
| Embedded Memory | 28,033,024 bits (28 Mb) | 28,033,024 bits (28 Mb) | 28,033,024 bits (28 Mb) | 28,033,024 bits (28 Mb) | 28,033,024 bits (28 Mb) | 28,033,024 bits (28 Mb) |
| User I/O Pins | 564 | 564 | 564 | 564 | 564 | 564 |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Highest logic density in the Stratix IV GX family (vs EP4SGX360HF35I3N)
- Industrial temperature grade option (I3) (vs EP4SGX530HH35C4N (commercial C4))
- Mature Quartus II toolchain with extensive Stratix IV IP library (vs Xilinx Virtex-6 (legacy competitor))
Design Notes
The 1152-ball flip-chip BGA at 42.5 x 42.5 mm requires a high-density PCB with microvia or via-in-pad technology for fan-out. Plan for at least 12 layers with 4-6-4 stackup and 0.4 mm pitch escape routing. Use Altera's Stratix IV GX package-specific breakout routing guidelines and verify impedance-controlled traces for 8.5 Gbps serial channels (typically 85-ohm differential for transceivers, 100-ohm differential for LVDS).
Stratix IV GX devices require multiple supply rails (VCC, VCCPT, VCCA_PLL, VCCAUX, VCCH_GXB, VCCE_GXB, VCCL_GXB) with strict power-on sequencing. Use a dedicated FPGA power controller such as the LTC3567 or follow Altera's recommended power tree in the device handbook. Estimated core current at 531K logic elements and full transceiver utilization can exceed 15-20A on VCC; design the PDN with bulk decoupling and at least 100 uF of high-frequency ceramic capacitance near each transceiver bank.
At maximum logic utilization and full transceiver activity, the EP4SGX530HH35I3 dissipates 15-25 W (design-dependent; estimate with PowerPlay EPE). The HBGA package requires a thermal interface material (TIM) and heatsink with sufficient airflow (200 LFM minimum for typical designs). Junction temperature must stay below 100 °C for industrial-grade operation; monitor via the on-chip temperature-sensing diode with external ADC for safety-critical deployments.
Do not confuse the EP4SGX530HH35I3 with lower-density Stratix IV GX variants (EP4SGX360, EP4SGX290) that share the same HBGA package outline but differ in logic density and pin assignments. Always verify pinout against the specific device variant file in Quartus II. Also note that the part lacks the 'N' suffix designation typically associated with lead-free RoHS compliance per Components-Store data; verify RoHS status with the actual part marking before assembly.
For 8.5 Gbps transceiver channels, channel loss budget is typically limited to 8-10 dB at 4.25 GHz Nyquist. Use Megtron 6 or equivalent low-loss PCB materials (Dk 3.5, Df 0.005) and follow Altera's Stratix IV GX transceiver user guide for pre-emphasis and equalization settings. Always run IBIS-AMI or IBIS model simulations in tools like Ansys HFSS or Cadence PowerSI to validate your specific stackup before committing to PCB fabrication.
Compliance Information
Per Components-Store product data, EP4SGX530HH35I3 contains lead and is RoHS non-compliant. For RoHS-compliant designs in this family, choose variants with N suffix (e.g., EP4SGX530HH35C4N). AEC-Q100 not applicable (industrial FPGA, not automotive-qualified). REACH, halogen-free, and conflict-minerals status not provided in source data.
