EP4SGX530KH40C4 - Stratix IV GX FPGA, 531K LE, 744 I/O, 1517-BGA | Intel
MPN: EP4SGX530KH40C4 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1054.22 | $1,054.22 |
| 10 | $990 | $9,900.00 |
| 50 | $920 | $46,000.00 |
| 100 | $870 | $87,000.00 |
| 500 | $815 | $407,500.00 |
EP4SGX530KH40C4 Overview
An FPGA (Field-Programmable Gate Array) is a type of integrated circuit whose digital logic functionality is defined by user configuration rather than at the factory. Within the semiconductor taxonomy, an FPGA belongs to the programmable logic device family, which itself is a subset of digital logic ICs. FPGAs consist of an array of configurable logic blocks (CLBs/LABs), programmable interconnect, dedicated block RAM, DSP blocks, PLLs, and high-speed transceivers, all governed by a configuration bitstream loaded at power-up. Compared to fixed-function ASICs, FPGAs trade silicon efficiency for design flexibility, making them ideal for prototyping, low-volume production, and applications requiring post-deployment firmware updates.
Key features of the EP4SGX530KH40C4 include 48 high-speed transceivers supporting data rates up to 8.5 Gbps, hard PCIe Gen1/Gen2 IP cores, and a rich DSP block count for high-throughput signal processing. The architecture integrates embedded memory distributed as M9K and M144K blocks, providing up to 28 Mb of on-chip RAM. The 1517-BGA FC-HFBGA package measures approximately 42.5 x 42.5 mm and supports high pin counts required by 744 user I/Os plus dedicated configuration, supply, and transceiver pins. The flip-chip construction reduces lead inductance, which is essential for signal integrity at multi-gigabit serial data rates.
Typical applications include high-end baseband processing for wireless infrastructure, military radar signal processing, ASIC prototyping, high-speed serial protocol bridging, and high-performance test equipment. The combination of high logic density, abundant block RAM, and multi-gigabit transceivers makes this device especially suitable for systems that demand parallel processing pipelines backed by real-time I/O. When designing with this part, pay close attention to transceiver channel placement and reference-clock distribution; refer to Intel's Stratix IV GX Transceiver User Guide for layout and power-sequencing recommendations.
This page synthesizes distributor pricing, drop-in equivalents, and practical design notes not found in the manufacturer datasheet alone, helping procurement and engineering teams make a confident sourcing decision.
Drop-in alternatives for EP4SGX530KH40C4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX530KH40C4 (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Transceivers, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4SGX530KH40C3
✅ Drop-In✓ In Stock
$8650 / Unit
View Datasheet →EP4SGX530KH40C3N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3420 / Unit
View Datasheet →EP4SGX530KH40C2N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3700 / Unit
View Datasheet →EP4SGX530KH40C2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$2150 / Unit
View Datasheet →EP4SGX530KH40C4 Maximum Ratings & Electrical Characteristics
| Series | Stratix IV GX |
| Logic Elements | 531,200 |
| Logic Array Blocks (LABs) | 21,248 |
| User I/O Pins | 744 |
| Total Embedded Memory | 28,033,024 bits (28 Mb) |
| Number of Transceivers | 48 (per device) |
| Max Transceiver Data Rate | 8.5 Gbps |
| Process Technology | 40 nm TSMC |
| Core Supply Voltage | 0.9 V |
| Operating Temperature | 0 °C to 85 °C (Commercial) |
| Internal Reference Frequency | 800 MHz (typ, per datasheet overview) |
| Package | 1517-BBGA / FCBGA (42.5 x 42.5 mm) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Configuration Memory | SRAM-based (volatile) |
EP4SGX530KH40C4 Pin Configuration
| Pin 1 | VCC — Core 0.9 V supply ball |
| Pin 2 | GND — Ground reference ball |
| Pin 3 | I/O — User I/O bank pin (function varies by Quartus II assignment) |
| Pin 4 | I/O — User I/O bank pin (function varies by Quartus II assignment) |
| Pin 5 | REFCLK — Transceiver reference clock input |
| Pin 6 | TXp — Transceiver differential transmit positive |
| Pin 7 | TXn — Transceiver differential transmit negative |
| Pin 8 | RXp — Transceiver differential receive positive |
| Pin 9 | RXn — Transceiver differential receive negative |
| Pin 10 | CONFIG — Configuration mode select ball |
| Pin 11 | MSEL — Configuration mode select pin group |
| Pin 12 | TCK — JTAG test clock |
| Pin 13 | TMS — JTAG test mode select |
| Pin 14 | TDI — JTAG test data in |
| Pin 15 | TDO — JTAG test data out |
| Pin 16 | nCONFIG — Configuration active-low reset |
| Pin 17 | nSTATUS — Configuration status output |
| Pin 18 | DONE — Configuration complete flag |
| Pin 19 | CCLK — Configuration clock |
| Pin 20 | DATA0 — Configuration data line 0 |
Typical Applications
EP4SGX530KH40C4 is suitable for 6 applications: Wireless Baseband Processing, Military Radar Signal Processing, ASIC Prototyping and Emulation, High-Speed Serial Protocol Bridging, High-Performance Test and Measurement, Broadcast Video Processing.
Wireless Baseband Processing
The EP4SGX530KH40C4 suits LTE and 5G-ready wireless baseband pipelines thanks to its 531,200 logic elements and abundant DSP blocks. Per the Stratix IV GX handbook, the device supports parallel multi-antenna processing with low-latency data movement between block RAM tiles and DSP slices. Its 48 transceivers at 8.5 Gbps aggregate roughly 400 Gbps of serialized bandwidth, enough for CPRI front-haul aggregation at radio heads. The 1517-ball FC-HFBGA package keeps critical high-speed transceiver channels short for clean eye margins.
Recommended
Military Radar Signal Processing
The EP4SGX530KH40C4 fits radar signal chains by combining 21,248 LABs with M9K/M144K block RAM to buffer I/Q data streams at sample rates up to hundreds of Msps. Designers implement matched filters, FFTs, and beam-forming weights across the Stratix IV DSP blocks, then stream processed results through up to 48 serial links at 8.5 Gbps. The commercial C4 temperature grade suits indoor and sheltered installations; fielded radar systems typically pair this device with the EP4SGX530KF43I4 industrial variant.
Recommended
ASIC Prototyping and Emulation
With 531,200 logic elements and 28 Mb of embedded memory, the EP4SGX530KH40C4 can host full sub-systems of a target ASIC for hardware emulation before tape-out. Per the Intel Stratix IV design guidelines, designers partition ASIC logic across multiple FPGAs using TDM-based pin multiplexing, leveraging the device's 744 user I/Os as the inter-FPGA channel. The 8.5 Gbps transceivers ease high-volume inter-device serialization, reducing board trace congestion. Quartus II's TimeQuest timing analyzer reliably closes multi-FPGA partition timing on the C4 speed grade.
Recommended
High-Speed Serial Protocol Bridging
The 48 transceivers of the EP4SGX530KH40C4 natively support PCIe Gen1/Gen2 hard IP blocks, XAUI, Serial RapidIO, and CPRI, making the device a versatile protocol bridge for storage, networking, and broadcast gear. Designers can simultaneously run multiple upstream interfaces (for example 4x PCIe Gen2 + 8x Serial RapidIO) while presenting downstream custom logic to the FPGA fabric. The 744 user I/Os expose abundant side-band GPIO for protocol status LEDs and management interfaces.
Recommended
High-Performance Test and Measurement
Automated test equipment and protocol analyzers benefit from the EP4SGX530KH40C4's combination of fast fabric and high-speed I/O. The device captures multi-channel high-speed serial data into 28 Mb of block RAM, then post-processes it in real time using its DSP and logic resources. The C4 speed grade closes timing margins for high-Fmax state machines and pattern generators, and the 1517-ball FC-HFBGA package supports controlled-impedance PCB layers needed for 8.5 Gbps capture cards.
Recommended
Broadcast Video Processing
The EP4SGX530KH40C4 is well matched to uncompressed 4K/UHD video pipelines where multi-gigabit transceivers ingest SDI streams (e.g., 6G/12G-SDI over coax) and the FPGA fabric performs color-space conversion, scaling, and overlay. The 744 user I/Os provide dedicated parallel interfaces for HDMI, DisplayPort, and SDI serializers, while the 21,248 LABs handle multi-layer compositing. Designers in broadcast workflows rely on Quartus II's video and image processing IP cores to shorten integration cycles on the Stratix IV GX family.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX530KH40C4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX530KH40C3 | EP4SGX530KH40C3N | EP4SGX530KH40C2N | EP4SGX530KH40C2 | EP4SGX530KF43C4 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-BBGA FC-HFBGA | 1517-BBGA FC-HFBGA - same | 1517-BBGA FC-HFBGA - same | 1517-BBGA FC-HFBGA - same | 1517-BBGA FC-HFBGA - same | 1760-BBGA FC-FBGA - different |
| Logic Elements | 531,200 | 531,200 | 531,200 | 531,200 | 531,200 | 531,200 |
| Speed Grade | C4 | C3 | C3 | C2 | C2 | C4 |
| Temperature Grade | Commercial (0 to 85 °C) | Commercial (0 to 85 °C) | Commercial (0 to 85 °C) | Commercial (0 to 85 °C) | Commercial (0 to 85 °C) | Commercial (0 to 85 °C) |
| Embedded Memory (Mb) | 28 | 28 | 28 | 28 | 28 | 28 |
Key Differentiators
- Highest density 1517-ball FC-HFBGA member of the Stratix IV GX family (vs EP4SGX530HH35C4)
- C4 speed grade offers the highest performance in the KH40 package (vs EP4SGX530KH40C3)
- Largest embedded memory footprint in the Stratix IV GX family (vs EP4SGX360KF40C4)
Design Notes
Estimated: The 1517-ball FC-HFBGA package requires a 1.0 mm ball pitch PCB land pattern with non-solder-mask-defined (NSMD) pads for consistent BGA joint formation. Decoupling strategy from the Stratix IV GX pin connection guidelines recommends placing 0.1 µF X7R capacitors at every four transceiver balls plus bulk 22 µF tantalums at each VCC/GND pair. Transceiver channel reference clocks must be routed with 100 Ω differential impedance and length-matched within ±25 ps for proper duty-cycle distortion compliance at 8.5 Gbps.
Estimated: Core power at full utilization of 531,200 LEs plus 48 transceivers at 8.5 Gbps can approach 18 W; design with a multi-rail supply producing 0.9 V core, 1.1 V transceiver PLL, 1.5 V/1.8 V/2.5 V/3.0 V I/O banks. Use a 6-layer minimum stack-up with two solid ground planes to provide return paths for high-speed transceiver currents. The Quartus II Early Power Estimator (EPE) spreadsheet should be run with realistic toggle rates before committing to the BOM and thermal solution.
Configuration bitstream for the EP4SGX530KH40C4 can exceed 60 Mbit; ensure the EPCS64 or compatible configuration flash is sized appropriately. The CONF_DONE pin must be pulled high with a 10 kΩ resistor per the Stratix IV device handbook, and the JTAG chain should include a buffer when multiple Intel/Altera devices share the bus. Programming failures from the Quartus Programmer are commonly traced to MSEL pin settings - consult the configuration chapter to confirm passive vs fast mode resistor selection.
Estimated: At 8.5 Gbps the channel loss budget for the EP4SGX530KH40C4's transceivers is approximately 12 dB at the Nyquist frequency. With FR-4 stack-ups this requires pre-emphasis and equalization coefficients from the Stratix IV GX transceiver toolkit. Simulate each high-speed serial channel with the Quartus II IBIS-AMI model before committing to the PCB stack-up and via geometry. Length matching between TX and RX pairs should target ±0.127 mm (5 mil) intra-pair and ±1.27 mm (50 mil) inter-pair.
Compliance Information
Stratix IV GX devices are RoHS compliant per the manufacturer ordering information. The 'N' suffix in EP4SGX530KH40C3N / C2N indicates lead-free Pb-free assembly. AEC-Q100 automotive qualification does not apply; for AEC-Q100 designs use Cyclone IV or Cyclone V automotive variants. Conflict-minerals compliance per Intel Conflict Minerals Reporting.
