EP4SGX530KH40C3 - Stratix IV GX FPGA 531K LE FCBGA-1517 | Intel
MPN: EP4SGX530KH40C3 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $11514.36 | $11,514.36 |
| 10 | $10650 | $106,500.00 |
| 100 | $9900 | $990,000.00 |
| 500 | $9200 | $4,600,000.00 |
| 1,000 | $8650 | $8,650,000.00 |
EP4SGX530KH40C3 Overview
A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) belonging to the broader integrated circuit category of digital semiconductors. In the taxonomy hierarchy, an FPGA sits as: FPGA -> programmable logic device -> digital IC -> semiconductor. FPGAs differ from ASICs by offering reconfigurable logic fabric, on-chip memory, DSP blocks, and high-speed serial transceivers, all of which can be customized per design via HDL synthesis and place-and-route tooling. The Stratix IV family in particular was Intel/Altera's high-end performance tier, succeeding Stratix II/III and preceding Stratix V.
Key features include 28 Mb of embedded RAM, 1024 (typical) 18x18 multipliers for DSP, 12 embedded PLLs, and 744 general-purpose I/Os that support LVDS, LVTTL, LVCMOS, HSTL, and SSTL standards. The integrated transceivers support standards such as PCIe Gen2 x8, XAUI, CEI-6G, SDI, CPRI, and OBSAI, while the package uses a 1.0 mm ball pitch FCBGA with 1517 balls. The device is fabricated in a 40 nm CMOS process node and operates across industrial and commercial temperature grades.
Typical applications include 40G/100G wireline aggregation, radar and electronic-warfare signal processing, high-end ASIC prototyping, test and measurement instrumentation front-ends, and broadcast video processing (3G-SDI/HD-SDI). The wide transceiver count also suits multi-porton 10GbE aggregation switches, OTN framer platforms, and high-speed data-acquisition cards.
When designing with this device, careful attention to PCB stackup, decoupling, and signal-integrity for the multi-Gbps serial links is essential; consult the Stratix IV GX Transceiver User Guide and the PCB layout guidelines in the device handbook. Power estimation should be performed with the Intel Early Power Estimator (EPE) tool before floorplan commitment.
This page synthesizes distributor pricing, drop-in FPGA alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP4SGX530KH40C3 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX530KH40C3 (same form factor and footprint) β differing in Package, Process Technology, Operating Temperature, Transceivers, Mounting Type.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4SGX530KH40C2
β Drop-Inβ In Stock
$2150 / Unit
View Datasheet βEP4SGX530KH40C2N
β Drop-Inβ In Stock
$3700 / Unit
View Datasheet βEP4SGX530KH40C3ES
β Drop-Inπ Reference alternative (not in catalog)
EP4SGX530KH40C3 Maximum Ratings & Electrical Characteristics
| Family | Stratix IV GX |
| Logic Elements | 531,200 |
| Configurable Logic Blocks (CLBs) | 212,480 |
| Embedded Memory (bits) | 28,033,024 |
| Embedded Memory (Mbits) | 28,033,024 / 8 β 3,504 KBytes |
| Maximum User I/O | 744 |
| Transceivers | Up to 48 channels |
| Transceiver Data Rate | Up to 8.5 Gbps |
| Hard PCIe Gen2 Endpoint | Yes |
| PLLs | 12 (typical) |
| Package | 1517-BBGA, FCBGA |
| Package Pin Count | 1517 balls |
| Ball Pitch | 1.0 mm (typical for FCBGA-1517) |
| Process Node | 40 nm CMOS |
| Operating Temperature Grade | Commercial (0C to +85C) |
| Speed Grade | C3 |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
EP4SGX530KH40C3 1517 balls Pin Configuration Guide
Pin configuration for EP4SGX530KH40C3 (1517 balls package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX530KH40C3.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX530KH40C3 is suitable for 6 applications: 40G/100G OTN Framer and Wireline Aggregation, Software Defined Radio (SDR) and Radar Signal Processing, High-Speed Test and Measurement Instrumentation, Broadcast Video Processing (3G-SDI/HD-SDI/HDMI), ASIC Prototyping and Emulation, Data Center Network Acceleration.
40G/100G OTN Framer and Wireline Aggregation
The EP4SGX530KH40C3 is well suited for 40G/100G OTN framer platforms because of its 48 transceivers running up to 8.5 Gbps, which can be bonded into OTU3 (4x 8.5G) or OTU4 (10x 10.3G with overspeed) channels. The 531,200 logic elements support soft implementations of OTN framer/mapper logic, GFP, and MAC layers. The hard PCIe Gen2 endpoint enables co-processing with a host CPU for control-plane and management traffic. Compared to an ASIC, this FPGA allows protocol upgrades (e.g., OTU3 to OTU4) without re-spinning silicon. Design tip: plan the PCB stackup for 8.5 Gbps SERDES with impedance-controlled differential pairs routed over a continuous reference plane.
Recommended
Software Defined Radio (SDR) and Radar Signal Processing
The EP4SGX530KH40C3 supports SDR and radar front-ends via its high logic density (531K LE) for FFTs, pulse compression, and beamforming, combined with up to 48 transceivers to digitize multiple antenna channels. The 28 Mbits of embedded RAM serve as wide data buffers for sample-rate conversion and channelization. According to the Stratix IV Device Handbook, the DSP blocks support up to 1024 18x18 multiplies per cycle at high Fmax, ideal for radar pulse-Doppler processing. Compared to a GPU, the FPGA offers deterministic latency and per-channel parallelism. Design tip: estimate power using the EPE tool, as radar DSP workloads can drive junction temperature high.
Recommended
High-Speed Test and Measurement Instrumentation
The EP4SGX530KH40C3 fits high-end oscilloscope, BERT, and protocol-analyzer cards where multi-Gbps SERDES, large logic capacity, and deep memory are all required simultaneously. Up to 48 transceivers at 8.5 Gbps enable 12-channel 3.125 Gbps or 6-channel 6.25 Gbps acquisition in parallel. The 744 user I/Os give ample LVDS/LVCMOS access for triggering, time-stamping, and front-panel control. Compared to a fixed-function ASIC tester, this FPGA allows the instrument vendor to roll out new protocol decoders (PCIe, USB, SATA) via firmware updates. Design tip: use dedicated PLL outputs for jitter-cleaned reference clocks to the transceivers.
Recommended
Broadcast Video Processing (3G-SDI/HD-SDI/HDMI)
The EP4SGX530KH40C3 supports broadcast video processing for multi-channel SDI routers, format converters, and video-wall controllers. The 48 transceivers are well-matched to 3G-SDI (2.97 Gbps) and HD-SDI (1.485 Gbps) coax transport, while the 531K logic elements implement color-space conversion, scaling, and frame-rate conversion. According to the Stratix IV GX datasheet, embedded HDMI/MHL support is provided via soft IP. Compared to a fixed-function video processor ASIC, this FPGA allows a single hardware platform to support multiple video formats and resolutions. Design tip: lock the SDI cable equalizer reference clock to a low-jitter oscillator.
Recommended
ASIC Prototyping and Emulation
The EP4SGX530KH40C3 is a popular ASIC prototyping platform because its 531K logic elements, large embedded memory, and abundant I/Os allow multiple ASIC blocks to be partitioned across one or more FPGAs. The high transceiver count supports chip-to-chip debug links at multi-Gbps rates, emulating real ASIC-to-ASIC interconnect. According to the Stratix IV Device Handbook, the device supports time-domain multiplexing of ASIC clocks for trace correlation. Compared to smaller FPGAs, the EP4SGX530 reduces partition complexity for ASIC designs in the 5M-15M gate range. Design tip: budget for compile time and use design-partitioning tools to manage synthesis runs.
Recommended
Data Center Network Acceleration
The EP4SGX530KH40C3 fits data-center NIC and SmartNIC designs where the host CPU offloads packet processing, encryption, or compression to the FPGA. The hard PCIe Gen2 x8 endpoint connects directly to the host CPU, while the 48 transceivers handle 10GbE/40GbE line-side connections with on-chip MACs. The 531K logic elements implement custom protocol offload logic, and the 28 Mbits of embedded memory buffers packets on-chip. According to Intel's reference designs, the FPGA can host DPDK-style fast-path engines. Design tip: verify host driver compatibility and DMA bandwidth before commit.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX530KH40C3 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX530KH40C2 | EP4SGX530KH40C2N | EP4SGX530KH40C3ES |
|---|---|---|---|---|
| Package | 1517-BBGA, FCBGA (KH40) | 1517-BBGA, FCBGA (KH40) - same | 1517-BBGA, FCBGA (KH40) - same | 1517-BBGA, FCBGA (KH40) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 531,200 | 531,200 | 531,200 | 531,200 |
| Speed Grade | C3 | C2 (slower) | C2 (slower) | C3 (same speed, extended temp) |
| Embedded Memory (Mbits) | ~28 Mbits (28,033,024 bits) | ~28 Mbits | ~28 Mbits | ~28 Mbits |
| User I/Os | 744 | 744 | 744 | 744 |
| Transceivers | Up to 48 (8.5 Gbps) | Up to 48 (8.5 Gbps) | Up to 48 (8.5 Gbps) | Up to 48 (8.5 Gbps) |
| Temperature Grade | Commercial (0C to 85C) | Commercial | Commercial | Extended (ES) |
| Lifecycle Status | Active (legacy Stratix IV family) | Active | Active | Active |
Key Differentiators
- Drop-in speed-grade upgrade via C3 vs C2 in same KH40 package (vs EP4SGX530KH40C2)
- Extended-temperature ES variant in same KH40 package (vs EP4SGX530KH40C3ES)
- Hard PCIe Gen2 endpoint IP included at no soft-logic cost (vs Soft-IP PCIe on lower-density FPGAs)
Design Notes
The 1517-ball FCBGA KH40 package requires a high-density PCB with microvia (HDI) stackup. Use a 1.0 mm ball-pitch escape pattern with via-in-pad for the inner rows and dog-bone fan-out for outer rows. Per Stratix IV PCB design guidelines, match the PCB dielectric to control impedance of 50 ohm single-ended and 100 ohm differential for SERDES routes. Maintain continuous reference planes (GND) under all SERDES pairs to control return-path inductance.
Estimated: a fully utilized EP4SGX530KH40C3 with 48 active transceivers at 8.5 Gbps and 60% logic utilization can consume 25-30 W. Use the Intel Early Power Estimator (EPE) spreadsheet to budget power before PCB commit. Provide at least 6 dedicated 0.1uF decoupling capacitors per power pin group, plus bulk capacitors on each of the 0.9V core, 1.1V transceiver, 2.5V auxiliary, and 3.3V I/O rails. A solid ground plane directly under the BGA is mandatory.
SERDES channels operating at 8.5 Gbps require insertion loss under 6 dB at 4.25 GHz Nyquist (per PCIe Gen2 spec). Use low-loss PCB material such as FR4-408HR or Megtron 6 for the stripline layers carrying SERDES. Add AC-coupling capacitors (typically 100 nF 0402 size) at the SERDES TX outputs. Place reference clocks within 100 mils of the refclk pins with controlled impedance, and use a clean low-jitter oscillator (jitter under 1 ps RMS).
Estimated: at 30 W dissipation in the 1517-ball FCBGA package, junction temperature will rise approximately 35-45C above ambient without airflow (assuming theta_JA around 1.2 C/W for the FCBGA with thermal balls). Add a heatsink with thermal interface material and ensure 200 LFM airflow for production deployments. For outdoor or industrial-temperature deployments, migrate to the EP4SGX530KF43I4 industrial-grade variant. Do not rely on the FPGA's internal thermal diode as your only thermal-protection mechanism - implement board-level shutdown.
Common pitfalls include: (1) Forgetting to set MSEL pins correctly for the chosen configuration scheme (AS, AP, PS, JTAG) - read the Stratix IV configuration handbook before PCB commit; (2) Using the wrong CONF_DONE pull-up voltage - 3.3V is required for some modes; (3) Skipping the nCONFIG reset during board bring-up, which can leave the device in an undefined state; (4) Connecting JTAG TCK to a slow clock that violates the 25 MHz TCK limit. Refer to the Stratix IV Device Handbook chapter on configuration for the correct pin-strap settings.
Compliance Information
RoHS compliant per Altera/Intel material declaration for Stratix IV GX family. REACH SVHC declaration available via Intel Product Material Declaration. Not AEC-Q100 qualified (FPGAs are not typically AEC-Q100 devices; industrial-grade variants exist instead). Lead-free reflow-compatible per JEDEC J-STD-020.
