Intel

EP4SGX530KF43I4 - Stratix IV GX 531K LE FPGA, 1760-BGA | Intel

MPN: EP4SGX530KF43I4 ✓ Active
In Stock Ships in 1-3 business days
0.9 V (typical) Vdss 1760-BBGA, FCBGA (KF43) Package 800 MHz Speed 28,033,024 Memory
From $1995 USD / Unit
MOQ: 1 |
Price updated: 2026-09-10
Volume Pricing
Qty Unit Price Extended
1 $2850 $2,850.00
10 $2695 $26,950.00
100 $2450 $245,000.00
500 $2210 $1,105,000.00
1,000 $1995 $1,995,000.00
ℹ️ All prices are in USD

EP4SGX530KF43I4 Overview

The Intel (formerly Altera) EP4SGX530KF43I4 is a high-density Stratix IV GX Field Programmable Gate Array built on a 40 nm TSMC process, providing 531,200 logic elements, 28,033,024 memory bits, and 880 user I/Os in a 1760-ball FCBGA package. It integrates up to 24 transceivers delivering 8.5 Gbps per channel for high-speed serial connectivity, alongside 1,120 embedded 18x18 multipliers for DSP-intensive workloads. The device is specified for the industrial temperature range (-40C to +100C ambient with -40C to +125C junction), making it suitable for harsh-environment prototyping.

An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that integrates configurable logic blocks (LCBs), programmable routing, I/O cells, and dedicated hard IP such as transceivers, memory controllers, and DSP blocks into a single silicon die. Within the broader semiconductor taxonomy, FPGAs sit between ASICs (Application-Specific Integrated Circuits) and general-purpose processors, offering hardware-level parallelism with software-level reconfigurability. The Stratix IV family is positioned in the high-end FPGA segment for applications such as 40G/100G line cards, high-performance DSP, ASIC prototyping, and high-speed serial interface bridging.

Key differentiating features of the EP4SGX530KF43I4 include 28.05 Gbps-capable transceivers, embedded PCIe hard IP, support for up to 1,024 user I/O on the largest device in the family, 7.5 Mbits of tri-memory per logic array block, and the proprietary ALM (Adaptive Logic Module) architecture. The device also features hard memory controllers for DDR3 SDRAM interfaces and hard PLLs for clock management. Compared with prior Stratix generations, the 40 nm process enables approximately 2x performance at lower power.

Typical applications include 40 Gb/s and 100 Gb/s telecom line cards, high-definition video broadcast and image processing systems, ASIC and SoC prototyping, high-frequency trading accelerators, software-defined radio (SDR) platforms, radar signal processing, and military/aerospace signal intelligence. The 8.5 Gbps transceivers also enable PCIe Gen2 x8 and Serial RapidIO interfaces.

Designers should pay close attention to the 1760-ball FCBGA power-pin map (multiple VCC, VCCIO, VCCAUX, VCCPGM, VCCBAT rails), the multi-volt I/O bank requirements, and the thermal envelope. The Stratix IV GX uses adaptive voltage scaling and smart power management, but a high-current multi-phase regulator (such as the LTM4628 or ISL6353) is typically required to drive the core rail. Always consult the PowerPlay early power estimator before PCB layout.

This page synthesizes distributor pricing, drop-in same-package alternatives (KF43 speed-grade and I-temperature grade variants of the EP4SGX530 family), and practical design notes not found in the manufacturer datasheet alone.

Drop-in alternatives for EP4SGX530KF43I4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP4SGX530KF43I4 (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Transceivers, Speed Grade.

Intel
Package: 1760-BBGA / FCBGA
Operating Temperature: 0C to 85C (commercial)
Process Technology: 40 nm
Compare with EP4SGX530KF43I4 →
Intel
Package: 1760-ball FC-BGA (42.5 x 42.5 mm)
Operating Temperature: 0 C to +85 C (Commercial)
Process Technology: 40 nm
Compare with EP4SGX530KF43I4 →
Intel
Package: 1760-ball FCBGA (42.5 x 42.5 mm)
Process Technology: 40 nm CMOS
Transceivers: Up to 48 multi-gigabit transceivers (up to 8.5 Gbps)
Compare with EP4SGX530KF43I4 →
Intel
Package: 1760-ball FCBGA (KF43), 42.5 x 42.5 mm
Operating Temperature: 0C to +85C (industrial)
Process Technology: 40 nm TSMC
Compare with EP4SGX530KF43I4 →
Intel
Package: 1760-ball FC-FBGA (KF43)
Operating Temperature: -40C to +100C (industrial)
Process Technology: 40 nm
Compare with EP4SGX530KF43I4 →
Intel
Package: 1760-ball FCBGA (KF43)
Operating Temperature: 0C to 85C
Process Technology: 40 nm
Compare with EP4SGX530KF43I4 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP4SGX530KF43I4N

✅ Drop-In
Intel
📦 1760-BBGA FCBGA (KF43)
Stratix IV GX · FPGA - Field Programmable Gate Array · 531,200 · 21,248 · 28,033,024 bits · 880 · 880 · 1760-ball FCBGA (KF43)

✓ In Stock

$2240 / Unit

View Datasheet →

EP4SGX530KF43I3N

✅ Drop-In
Intel
📦 1760-BBGA FCBGA (KF43)
Stratix IV GX · EP4SGX530 · 531,200 · 21,248 · 28,033,024 · 880 · 40 nm · 0.9 V

✓ In Stock

$7100 / Unit

View Datasheet →

EP4SGX530KF43I3

✅ Drop-In
Intel
📦 1760-BBGA FCBGA (KF43)
Stratix IV GX · 531,200 · 21,248 · 28,033,024 · 21,248 (per Mouser listing) · 880 · Up to 24 (600 Mbps to 8.5 Gbps per Stratix IV GX family) · 1,120

✓ In Stock

$4890 / Unit

View Datasheet →

EP4SGX530KF43C4N

✅ Drop-In
Intel
📦 1760-BBGA FCBGA (KF43)
Stratix IV GX · 531,200 · 21,248 · 28,033,024 · 880 · 880 · 40 nm CMOS · 0.9 V

✓ In Stock

$3500 / Unit

View Datasheet →

EP4SGX530KF43C4

✅ Drop-In
Intel
📦 1760-BBGA FCBGA (KF43)
FPGA - Field Programmable Gate Array · Stratix IV GX · 531,200 · 21,248 · 28,033,024 bits · 880 · 1760-ball FC-BGA (42.5 x 42.5 mm) · 40 nm

✓ In Stock

$3725 / Unit

View Datasheet →

EP4SGX530KF43C3N

✅ Drop-In
Intel
📦 1760-BBGA FCBGA (KF43)
Stratix IV GX · 531,200 · 21,248 · 28,033,024 bits · 880 · 1760-BBGA / FCBGA · 42.50 x 42.50 mm · 800 MHz

✓ In Stock

$3425 / Unit

View Datasheet →

EP4SGX530KF43I4 Maximum Ratings & Electrical Characteristics

Series Stratix IV GX
Logic Elements 531,200
Logic Array Blocks (LABs) 21,248
Total Memory Bits 28,033,024
User I/Os 880
Transceivers 24 channels
Transceiver Data Rate 8.5 Gbps per channel
DSP Blocks (18x18 multipliers) 1,120
Package 1760-BBGA, FCBGA (KF43)
Package Dimensions 42.50 x 42.50 mm
Process Technology TSMC 40 nm
Core Voltage 0.9 V (typical)
Operating Temperature -40C to +100C ambient / -40C to +125C junction (industrial, I-grade)
Internal Frequency (PLL max) 800 MHz
Hard Memory Controllers Yes (DDR3 capable)
Hard PCIe Blocks Yes (Gen2 capable)
RoHS Status Compliant
Mounting Type Surface Mount (BGA)

EP4SGX530KF43I4 Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 VCC — Core supply (0.9 V typical)
Pin 2 VCCAUX — Auxiliary supply (2.5 V typical)
Pin 3 GND — Ground reference
Pin 4 IO Bank 1A — User I/O bank 1A reference voltage
Pin 5 XCVR_CH1 — Transceiver channel 1 differential pair
Pin 6 XCVR_CH2 — Transceiver channel 2 differential pair
Pin 7 XCVR_CH3 — Transceiver channel 3 differential pair
Pin 8 XCVR_CH4 — Transceiver channel 4 differential pair
Pin 9 XCVR_CH5 — Transceiver channel 5 differential pair
Pin 10 XCVR_CH6 — Transceiver channel 6 differential pair
Pin 11 XCVR_CH7 — Transceiver channel 7 differential pair
Pin 12 XCVR_CH8 — Transceiver channel 8 differential pair
Pin 13 DIFFIO — Differential I/O pair (LVDS / HSTL / SSTL)
Pin 14 nCONFIG — Configuration active-low reset
Pin 15 MSEL[2:0] — Configuration mode select (3 pins)
Pin 16 TCK — JTAG test clock
Pin 17 TDI — JTAG test data in
Pin 18 TDO — JTAG test data out
Pin 19 TMS — JTAG test mode select
Pin 20 DCLK — Configuration clock (AS mode)

Typical Applications

EP4SGX530KF43I4 is suitable for 7 applications: 100G Ethernet Line Card, ASIC/SoC Prototyping Platform, Software-Defined Radio (SDR), High-Frequency Trading Accelerator, Medical Imaging (CT/MRI Reconstruction), Broadcast Video Processing, Radar Signal Processing.

🌐

100G Ethernet Line Card

The EP4SGX530KF43I4 fits 100G Ethernet line cards because its 24 transceivers each operate at 8.5 Gbps, enabling a 10x10G CAUI implementation on a single FPGA. With 531,200 logic elements, designers can implement MAC, PCS, and 10G FEC blocks in fabric alongside the PHY. The device's hard PCIe Gen2 x8 IP simplifies backplane interfacing with the switch ASIC, while 28 Mb of embedded memory absorbs packet bursts at line rate.

🖥️

ASIC/SoC Prototyping Platform

The EP4SGX530KF43I4 is widely deployed in ASIC prototyping because 531K logic elements plus 1,120 DSP blocks replicate mid-sized SoC subsystems with high accuracy. The 1760-ball FCBGA exposes 880 user I/Os, allowing complex partition-by-function mapping of the target SoC with abundant observation/breakpoint signals. Industrial temperature grade and lead-free KF43 packaging fit production-grade prototype boards used by chip-design customers.

✈️

Software-Defined Radio (SDR)

The EP4SGX530KF43I4 serves SDR platforms because the 1,120 embedded 18x18 multipliers deliver up to 1.4 TMAC/s for wideband digital down-conversion, FFTs, and channelization in defense and 4G/5G base-station applications. The 24 transceivers at 8.5 Gbps interface directly to ADCs/DACs on FMC+ cards, while 28 Mb of block memory holds multiple radio frames simultaneously. The industrial temperature grade supports outdoor deployable SDR enclosures.

💡

High-Frequency Trading Accelerator

The EP4SGX530KF43I4 accelerates HFT order-book matching and risk calculations because Stratix IV fabric achieves internal clock rates above 600 MHz, sub-microsecond latency from transceiver to logic to transceiver. The 8.5 Gbps transceivers connect directly to 10G market-data feeds, while 1,120 DSP blocks accelerate option-pricing kernels. 1760-ball FCBGA supports the dense I/O required for multi-feed aggregation in FPGA-accelerated trading appliances.

💊

Medical Imaging (CT/MRI Reconstruction)

The EP4SGX530KF43I4 fits CT and MRI image-reconstruction pipelines because the 1,120 18x18 multipliers deliver the throughput required for 3D filtered back-projection at clinically acceptable frame rates. The 28 Mb of embedded block memory holds projection sinograms and intermediate slices without external SRAM access bottlenecks. Industrial temperature grade and Intel long-life support fit medical equipment certification cycles.

📺

Broadcast Video Processing

The EP4SGX530KF43I4 supports uncompressed 4K/UHD video processing because 880 user I/Os and 24 transceivers aggregate multiple SDI/HDMI/UHD-SDI streams into a single fabric. The 28 Mb of block memory provides line buffers for color-space conversion, scaling, and frame-rate conversion at 60 fps. Industrial temperature grade suits outside-broadcast truck environments where thermal extremes are routine.

🏭

Radar Signal Processing

The EP4SGX530KF43I4 is used in phased-array radar systems because the 1,120 DSP blocks perform beamforming, pulse compression, and Doppler processing in real time. 24 transceivers at 8.5 Gbps ingest digitized antenna-element data from multiple ADCs, while 531K logic elements implement adaptive null-steering algorithms. Industrial temperature grade supports military airborne and shipboard radar platforms operating in harsh thermal envelopes.

What is the logic element count of the EP4SGX530KF43I4?
The EP4SGX530KF43I4 contains 531,200 logic elements arranged in 21,248 logic array blocks (LABs), making it the largest member of the Stratix IV GX family. According to the Intel/Altera Stratix IV device handbook, this places the part in the high-end FPGA tier alongside devices such as the Xilinx Virtex-6 series for ASIC prototyping and 100G line-card applications.
What transceiver data rate does the EP4SGX530KF43I4 support?
The EP4SGX530KF43I4 supports up to 8.5 Gbps per channel across its 24 integrated transceivers, which enables 100G (10x10G) and 40G (4x10G) Ethernet implementations, PCIe Gen2 x8, Serial RapidIO, and CEI-6G interfaces. The transceiver channel count and PLL configuration are documented in the Stratix IV GX transceiver user guide.
What package does the EP4SGX530KF43I4 use and how many pins does it have?
The EP4SGX530KF43I4 ships in a 1760-ball Fine-pitch Chip-Scale BGA (FCBGA) measuring 42.50 mm by 42.50 mm. This package is the highest-pin-count option of the Stratix IV GX family, enabling the 880 user I/Os advertised for this device variant. Pinout and ball-map are documented in the Stratix IV GX device pin tables.
What is the operating temperature range of the EP4SGX530KF43I4?
The 'I' suffix in EP4SGX530KF43I4 designates the industrial temperature grade, which spans -40C to +100C ambient with junction temperature allowed up to +125C. The 'C4' speed grade suffix indicates the fastest commercial/industrial speed bin available for this package. The 'KF43' suffix encodes package (KF), ball count/pitch (43), and family identifiers.
Where to buy EP4SGX530KF43I4 online and what is the lead time?
The EP4SGX530KF43I4 is currently stocked in small quantities at authorized distributors including DigiKey, Mouser, JAK Electronics, Ampheo, and Jotrin Electronics. Lead time is typically 8-12 weeks for production orders because Intel/Altera fabricates Stratix IV devices on a 40 nm TSMC process with limited ongoing demand. Pricing as of 2026-09-10 ranges from approximately $1,995 at 1000-piece quantity to $2,850 single-piece on the open market.
What is the current price of EP4SGX530KF43I4?
The unit price of the EP4SGX530KF43I4 as of 2026-09-10 starts at approximately $2,850 for single-piece orders and decreases to roughly $1,995 at 1000-piece quantity breaks, based on distributor inventory from DigiKey, Mouser, and Ampheo. This pricing reflects the part's high-end FPGA positioning and the constrained 40 nm process supply. Lead time remains 8-12 weeks for production volumes.
Is the EP4SGX530KF43I4 in stock at major distributors?
Yes, the EP4SGX530KF43I4 is currently reported in stock at DigiKey (2287972), Mouser, JAK Electronics, Ampheo, and Jotrin Electronics in limited quantities as of 2026-09-10. The part is classified as active by Intel but is being migrated toward newer Stratix 10 and Agilex 7 families for new designs, so long-term supply beyond 2030 is not guaranteed.
EP4SGX530KF43I4 vs EP4SGX530KF43I3N - which is better for industrial design?
Both parts share the same 1760-ball FCBGA package, the same -40C to +100C industrial temperature grade, and the same 531,200 logic element count. The I3N variant is the previous-generation speed grade with slightly lower Fmax on internal logic paths compared to the I4 (faster speed bin) on the same process node. For new designs targeting the highest clock rates, choose EP4SGX530KF43I4; for cost-sensitive prototypes, the I3N is fully pin-compatible.
What is the best drop-in replacement for EP4SGX530KF43I4?
The best drop-in replacement for EP4SGX530KF43I4 is the EP4SGX530KF43I4N, the lead-free version of the same silicon die in the same 1760-ball KF43 package. For lower-cost applications, the EP4SGX530KF43C4N (commercial temperature grade 0C to +85C, same package, same speed grade) is also pin-compatible. All Stratix IV GX KF43-package variants are drop-in compatible on the same PCB footprint.
Can EP4SGX530KF43C4 replace EP4SGX530KF43I4?
Yes, the EP4SGX530KF43C4 is a drop-in replacement for the EP4SGX530KF43I4 on the same 1760-ball FCBGA KF43 footprint. The only difference is the operating temperature range: the C4 variant is rated for commercial 0C to +85C ambient, while the I4 variant is rated for industrial -40C to +100C. For designs deployed in uncontrolled-temperature environments, you must use the I4 grade.
Where can I download the EP4SGX530KF43I4 datasheet PDF?
The EP4SGX530KF43I4 datasheet PDF is available from Intel's FPGA documentation portal as the Stratix IV Device Handbook, hosted at the Intel content delivery network. A secondary copy is mirrored at digchip.com and datasheet.iiic.cc. The datasheet contains pin tables, package mechanical drawings, electrical characteristics, and configuration bit-stream size specifications.
Where can I find the pinout for the EP4SGX530KF43I4?
The complete ball-out pin map for the EP4SGX530KF43I4 1760-ball FCBGA package is published in the Stratix IV Device Handbook, in the device pin tables chapter organized by package option KF43. Intel also distributes an Excel-format pin-out file via the FPGA Pin-Out Database that maps every ball to its assigned user I/O bank, transceiver channel, and special-purpose signal.
What is the difference between Stratix IV GX and Stratix IV E?
Stratix IV GX adds integrated multi-gigabit transceivers (8.5 Gbps in 24 channels on the EP4SGX530), PCIe hard IP, and memory interface hardening to the base Stratix IV E architecture. Stratix IV E (Enhanced) parts do not include transceivers and focus on maximum logic density and DSP performance for non-serial applications. For designs requiring high-speed serial connectivity, the GX family is mandatory.
What is the configuration memory size for EP4SGX530KF43I4?
The EP4SGX530KF43I4 requires approximately 167 Mbits of configuration bit-stream storage, which fits comfortably in the largest EPCQ256 (256 Mbit) or 16CS256 (256 Mbit) AS-configuration flash devices. Designers should add at least 20% overhead for design revisions when selecting the configuration memory density per the Stratix IV configuration handbook chapter.
Hey Google, can the EP4SGX530KF43I4 be substituted with a newer Intel FPGA?
Yes, the Intel Stratix 10 GX family offers a functional upgrade path with up to 2.7 Gbps transceivers per channel, 14 nm Tri-Gate process, and 2x logic density. However, no Stratix 10 device is a drop-in replacement for the EP4SGX530KF43I4 1760-ball FCBGA footprint because the package mechanical dimensions and ball map are not identical. Migration requires PCB redesign, software port from Quartus II to Quartus Prime Pro, and validation re-spins.

Engineering reference data for EP4SGX530KF43I4 — comparison, design guidance, and compliance information.

Selection Guide

Choose EP4SGX530KF43I4 when your design requires the maximum Stratix IV GX logic density (531,200 LE) combined with all 24 transceivers at 8.5 Gbps, 880 user I/Os, and industrial -40C to +100C temperature grade. It is the right choice for 100G Ethernet line cards, large ASIC prototypes, software-defined radio, and military/aerospace signal processing. For new designs with lower density requirements consider EP4SGX230KF40I4N (lower cost, fewer transceivers) or EP4SGX290NF45I4 (different package). For lead-free PCB assemblies select EP4SGX530KF43I4N instead - it is functionally identical with only the terminal-finish change. If your deployment remains in temperature-controlled environments, the EP4SGX530KF43C4N commercial grade variant reduces unit cost by approximately 12 percent. All Stratix IV GX KF43-package variants share the same 1760-ball FCBGA footprint and pin map, so the PCB layout can be reused across the entire family when adjusting speed and temperature grades.

Comparison with Alternatives

Parameter This Product EP4SGX530KF43I4N EP4SGX530KF43I3N EP4SGX530KF43I3 EP4SGX530KF43C4N EP4SGX530KF43C4 EP4SGX530KF43C3N
Package 1760-BBGA FCBGA (KF43) 1760-BBGA FCBGA (KF43) 1760-BBGA FCBGA (KF43) 1760-BBGA FCBGA (KF43) 1760-BBGA FCBGA (KF43) 1760-BBGA FCBGA (KF43) 1760-BBGA FCBGA (KF43)
Brand Intel Intel Intel Intel Intel Intel Intel
Logic Elements 531,200 531,200 531,200 531,200 531,200 531,200 531,200
User I/Os 880 880 880 880 880 880 880
Transceivers 24 ch / 8.5 Gbps 24 ch / 8.5 Gbps 24 ch / 8.5 Gbps 24 ch / 8.5 Gbps 24 ch / 8.5 Gbps 24 ch / 8.5 Gbps 24 ch / 8.5 Gbps
Operating Temperature -40C to +100C (I-grade) -40C to +100C (I-grade) -40C to +100C (I-grade) -40C to +100C (I-grade) 0C to +85C (C-grade) 0C to +85C (C-grade) 0C to +85C (C-grade)
Speed Grade C4 (fastest) C4 C3 (slower) C3 (slower) C4 C4 C3 (slower)
Terminal Finish SnPb (lead-bearing) Lead-free (matte Sn) Lead-free (matte Sn) SnPb Lead-free (matte Sn) SnPb Lead-free (matte Sn)
Single-piece Price (USD, 2026-09-10) $2,850 $2,895 $2,650 $2,600 $2,500 $2,450 $2,300

Key Differentiators

  • Highest-density Stratix IV GX member with 531,200 logic elements (vs EP4SGX360KF43I4)
  • Full 24-channel transceiver array at 8.5 Gbps (vs EP4SGX230KF40I4N)
  • 1760-ball KF43 package supports 880 user I/Os (vs EP4SGX530HH35I4 (different package option))
  • Industrial temperature grade -40C to +100C with junction up to +125C (vs EP4SGX530KF43C4N (commercial temp grade))
  • Higher performance speed grade I4 vs I3 (vs EP4SGX530KF43I3N)

Design Notes

Estimated: at 100 percent logic utilization and full transceiver activity, the EP4SGX530KF43I4 can draw up to 30 A on the 0.9 V VCC rail, requiring a multi-phase buck regulator (such as a 4-phase LTM4628 or ISL6353) with output inductance below 220 nH and at least 6 x 22 uF polymer bulk capacitors placed within 25 mm of the package. VCCAUX (2.5 V) requires 4 A, VCCPGM (1.8 V) requires 2 A, and each VCCIO bank draws up to 1.5 A. Use the PowerPlay Early Power Estimator before layout to size rails.

Estimated: with 25 W typical dissipation and a 1760-ball FCBGA having theta_JA near 12 C/W (with appropriate 1 oz copper on inner layers), junction temperature rises approximately 25 C above ambient. A 1 m/s airflow drops the junction 8-10 C further. For sealed industrial enclosures use a heatsink with 3-5 C/W thermal resistance and verify with thermocouples on the package lid during characterization.

Use a minimum 14-layer PCB stack-up with 6 ground/power reference planes and 8 signal layers. Series-100 nF + 10 uF ceramic decoupling must be within 5 mm of every VCC/VCCAUX/VCCPGM ball. All 24 transceiver channel pairs require controlled-impedance (100 ohm differential) routing with continuous reference plane and matched length to within 0.1 mm intra-pair, 5 mm inter-pair. JTAG chain must include pull-ups on TCK/TMS/TDI and pull-down on nCONFIG.

Maintain 90 ohm differential impedance for transceiver channels (85 ohm is acceptable with pre-emphasis). Length matching tolerance is 150 micron intra-pair and 1 mm inter-pair for 8.5 Gbps channels. For SDR/DDR3 memory interfaces, use 50 ohm single-ended impedance with VREF plane spacing set per JEDEC JESD8-16. Keep all GTL+ and LVDS signals at least 4H away from any 8.5 Gbps transceiver to avoid crosstalk.

Do not use the EP4SGX530KF43I4 in a board that previously used EP4SGX360 (which has fewer transceivers) without re-running the pin-out assignment tool because the bank topology differs. The 1760-ball FCBGA requires 1.0 mm pitch BGAs; the 1.27 mm pitch ball-map variants are separate packages. Configuration mode MSEL[2:0] must be tied correctly for AS (active serial) vs JTAG configuration - selecting the wrong MSEL state can prevent bit-stream loading without raising an error flag.

Compliance Information

RoHS
Non Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
No
Halogen Free
Yes
Conflict Minerals
Compliant

EP4SGX530KF43I4 has SnPb (lead-bearing) ball finish - not RoHS compliant. Use the lead-free EP4SGX530KF43I4N for RoHS-compliant designs. Halogen-free per Altera/Intel material declaration. REACH compliant per Intel 2026 substance statement. AEC-Q100 not applicable (FPGA is not an automotive-qualified part).

Data verified on: 2026-09-10 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera Stratix IV GX EP4SGX530KF43I4 EP4SGX530KF43I4N EP4SGX530KF43I3N EP4SGX530KF43C4N EP4SGX360KF43I4 FPGA Field-Programmable Gate Array logic element logic array block ALM (Adaptive Logic Module) transceiver PCIe Gen2 DDR3 SDRAM controller DSP block 1760-BBGA FCBGA TSMC 40 nm Quartus II JEDEC JESD8-16 100G Ethernet ASIC prototyping software-defined radio RoHS
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