EP4SGX530KH40C2 - Stratix IV GX FPGA, 531K LE | Intel
MPN: EP4SGX530KH40C2 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2620 | $26,200.00 |
| 100 | $2410 | $241,000.00 |
| 500 | $2280 | $1,140,000.00 |
| 1,000 | $2150 | $2,150,000.00 |
EP4SGX530KH40C2 Overview
An FPGA is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. Compared to an ASIC, an FPGA offers post-fabrication reconfigurability, shorter development time, and the ability to fix design bugs or upgrade functionality in the field. Within the broader taxonomy, the EP4SGX530 belongs to programmable logic -> FPGA -> high-end FPGA -> transceiver-equipped FPGA, and Stratix IV GX specifically is positioned for protocol bridging, baseband processing, and high-throughput compute.
Key features of the EP4SGX530KH40C2 include 21,248 LABs/CLBs, 744 maximum user I/Os, multiple internal PLLs and global clock networks supporting internal frequencies up to 800 MHz, dedicated 18x18 multipliers and DSP blocks, and embedded PCle hard IP plus 48 full-duplex transceiver channels. The device supports LVDS, LVTTL, LVCMOS, and SSTL I/O standards and includes on-chip termination, dynamic reconfigurability, and a hard memory controller. These features enable simultaneous high-speed serial I/O and parallel DSP processing on a single die.
Architecturally, the EP4SGX530KH40C2 combines a 40 nm logic fabric with hard PCS/PMA transceivers, embedded PCI Express Gen1/Gen2 hard IP blocks, and a structured ASIC-like memory hierarchy. Designers can implement multi-gigabit serial protocols (PCIe, Serial RapidIO, XAUI, CEI-6G, SFI-5) alongside parallel datapath logic in the same device, achieving deterministic latency and throughput that pure software DSP or discrete ASSP solutions cannot match.
Typical applications include 40G/100G optical transport line cards, wireless baseband processing, software-defined radio (SDR), radar and signal-intelligence platforms, high-performance computing acceleration, ASIC prototyping, broadcast video processing, and test & measurement instrumentation. The combination of 48 transceivers and 531K logic elements makes the EP4SGX530KH40C2 particularly suited to designs that need both protocol I/O and large parallel DSP pipelines.
When designing with this device, pay attention to power-rail sequencing (multiple VCC/VCCPT/VCCA rails), thermal management (the FCBGA requires a high-performance heatsink or cold plate for industrial deployment), and PCB layout of the 1517-ball BGA with high-speed breakout. Use the Altera Quartus II design suite for synthesis, place-and-route, and timing closure. For new designs, the Stratix IV family is in production under Intel's product longevity program but newer Stratix 10 / Agilex families may offer better perf/W.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP4SGX530KH40C2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX530KH40C2 (same form factor and footprint) — differing in Package, Operating Temperature, Mounting Type, Process Technology, Operating Temperature Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4SGX530KH40C2N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3700 / Unit
View Datasheet →EP4SGX530KH40C3
✅ Drop-In✓ In Stock
$8650 / Unit
View Datasheet →EP4SGX530KH40C2ES
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP4SGX530KH40C3N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3420 / Unit
View Datasheet →EP4SGX530KH40I2
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP4SGX530KH40C2 Maximum Ratings & Electrical Characteristics
| Family | Stratix IV GX |
| Device Type | FPGA - Field Programmable Gate Array |
| Logic Elements | 531,200 |
| LABs / CLBs | 21,248 |
| Total RAM Bits | 28,033,024 |
| Number of I/Os | 744 |
| Number of Transceivers | 48 channels |
| Transceiver Data Rate | Up to 8.5 Gbps per channel |
| Internal Frequency | 800 MHz |
| Process Technology | 40 nm CMOS |
| Package Type | 1517-BBGA, FCBGA |
| Package Dimensions | 42.50 x 42.50 mm |
| Operating Temperature | 0 C to +85 C (commercial) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EP4SGX530KH40C2 42.50 x 42.50 mm Pin Configuration Guide
Pin configuration for EP4SGX530KH40C2 (42.50 x 42.50 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX530KH40C2.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX530KH40C2 is suitable for 6 applications: 40G/100G Optical Transport Line Card, Wireless Baseband Processing (LTE / 5G NR), Software Defined Radio (SDR) Platform, Radar and Signal Intelligence (SIGINT) Systems, ASIC Prototyping and Emulation, Broadcast Video Processing and Switchers.
40G/100G Optical Transport Line Card
The EP4SGX530KH40C2 is well suited to 40G and 100G optical line-card designs because it integrates 48 transceivers operating up to 8.5 Gbps each, allowing a single device to aggregate four or ten lanes for OTU-3/OTU-4 client-side optics without external muxponders. Combined with 531,200 logic elements for framer, FEC, and MAC/PCS logic, the device delivers full line-rate processing for OTN, Ethernet, and SONET/SDH protocols. Its hard PCI Express Gen2 IP also enables direct host connectivity for control plane CPUs, reducing board area compared to ASSP plus FPGA solutions. Designers typically implement 4x10G or 1x40G datapaths in one EP4SGX530KH40C2 and use the remaining logic for performance monitoring and OTN overhead processing.
Recommended
Wireless Baseband Processing (LTE / 5G NR)
The EP4SGX530KH40C2's 531K logic elements and dedicated 18x18 multipliers enable it to host multi-antenna LTE-Advanced or 5G NR baseband processing chains including channel coding (Turbo/LDPC), FFT/iFFT, and MIMO precoding. Its 48 transceiver channels support CPRI front-haul links up to 6.144 Gbps per lane, allowing direct radio-unit aggregation without an additional transceiver ASIC. The device's hard memory controllers and 28 Mbit embedded RAM are sufficient for HARQ buffering and rate-matching tables for 4x4 MIMO configurations. Compared to DSP-only ASSPs, the EP4SGX530KH40C2 offers field reprogrammability for evolving 3GPP releases without silicon re-spin, which is critical for operator-driven feature rollouts.
Recommended
Software Defined Radio (SDR) Platform
The EP4SGX530KH40C2 serves as the central DSP engine in software-defined radio platforms, where its 531K logic elements support wideband DDC/DUC, channelizers, and polyphase filter banks for multi-band RF processing. Its 48 multi-gigabit transceivers allow direct ADC/DAC JESD204B link aggregation at sample rates above 1 GSPS, replacing multiple narrower FPGAs. The combination of hard PCIe Gen2 IP and large on-chip memory simplifies host-side data plumbing in laboratory and field-deployed SDR systems. Engineers use the EP4SGX530KH40C2 to prototype waveforms that later migrate to custom ASICs, while retaining reprogrammability for algorithm updates.
Recommended
Radar and Signal Intelligence (SIGINT) Systems
The EP4SGX530KH40C2 is widely deployed in phased-array radar and SIGINT systems because it integrates enough logic to host digital beamforming, pulse compression, and moving target indication (MTI) processing on a single device. Its 48 transceiver channels aggregate multiple analog front-ends across X-band or Ku-band antenna arrays, while the large 28 Mbit embedded RAM acts as a sample buffer for Doppler FFTs. The device's 40 nm process node gives deterministic latency that simplifies time-sensitive synchronization across phased-array elements. System designers favor the EP4SGX530KH40C2 over newer families for defense programs because the IP is already certified to military qualification standards.
Recommended
ASIC Prototyping and Emulation
The EP4SGX530KH40C2 is commonly used as an ASIC prototyping vehicle because 531K logic elements can map mid-complexity ASIC designs (10-15 M gates equivalent) while the 48 transceivers emulate high-speed SerDes channels of the target ASIC. Design teams partition their ASIC across multiple Stratix IV GX FPGAs in a logic-array board, with the EP4SGX530KH40C2 serving as the central device for clocking, reset, and JTAG distribution. Its mature Quartus II toolchain and pre-validated IP cores shorten bring-up time versus custom prototyping flows. Compared to emulation-specific ASICs, the EP4SGX530KH40C2 offers in-system debug visibility via SignalTap II logic analyzer, accelerating firmware development before tape-out.
Recommended
Broadcast Video Processing and Switchers
The EP4SGX530KH40C2 supports broadcast video processing applications including 4K/UHD multi-stream switching, format conversion, and color-space transform because its 531K logic elements can host multiple parallel video pipelines. Its 48 transceivers handle SDI (SMPTE ST 424, ST 2082) and HDMI 2.0 fan-out at 6 Gbps and 12 Gbps per lane, replacing multiple single-protocol ASSPs in a broadcast switcher chassis. The device's high internal clock rate (up to 800 MHz) supports real-time video scaling and frame-rate conversion without external memory bottlenecks. Broadcast OEMs value the EP4SGX530KH40C2 for its reprogrammability to support evolving codec standards.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX530KH40C2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX530KH40C2N | EP4SGX530KH40C3 | EP4SGX530KH40C3N | EP4SGX530KH40I2 |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1517-BBGA, FCBGA (H40, 42.5x42.5 mm) | 1517-BBGA, FCBGA (H40) - same | 1517-BBGA, FCBGA (H40) - same | 1517-BBGA, FCBGA (H40) - same | 1517-BBGA, FCBGA (H40) - same |
| Logic Elements | 531,200 | 531,200 | 531,200 | 531,200 | 531,200 |
| Speed Grade | C2 | C2 (lead-free) | C3 (faster) | C3 (faster, lead-free) | I2 (industrial temp) |
| Transceiver Channels | 48 | 48 | 48 | 48 | 48 |
| Operating Temperature | 0 C to +85 C (commercial) | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | -40 C to +100 C (industrial) |
| Embedded Memory | 28,033,024 bits | 28,033,024 bits | 28,033,024 bits | 28,033,024 bits | 28,033,024 bits |
| Lead-Free / Solder Balls | Standard C2 finish | Lead-free (N suffix) | Standard C3 finish | Lead-free (N suffix) | Standard I2 finish |
Key Differentiators
- Mature, production-proven Stratix IV GX silicon with 48 transceivers at 8.5 Gbps (vs EP4SGX230KF40C2 (lower-density same family))
- Same die/package allows flexible speed-grade selection (vs EP4SGX530KH40C3 (faster speed grade, same package))
- Same FCBGA-1517 footprint enables industrial-temp migration (vs EP4SGX530KH40I2 (industrial temperature variant))
Design Notes
Estimated: The EP4SGX530KH40C2 in a 42.5 x 42.5 mm 1517-ball FCBGA dissipates up to ~15-25 W depending on transceiver utilization and toggle rate. With the package's theta_JA of approximately 8-10 C/W on a standard 8-layer PCB, junction temperature rise above ambient is roughly 120-250 C at full load. A high-performance heatsink, cold plate, or significant PCB copper area is required to keep Tj below the 85 C commercial limit. Use thermal vias under the package BGA thermal balls and consider forced-air cooling for sustained transceiver-heavy workloads.
Route the 48 transceiver channels with differential microstrip or stripline on a low-loss PCB stack-up (typical 8-12 layer, FR-4 or high-Tg material). Maintain 100 ohm differential impedance and keep trace lengths matched within 0.13 mm (5 mil) per inch to preserve signal integrity at 8.5 Gbps. Decouple each transceiver channel power pin with a 0.1 uF + 10 uF capacitor pair placed within 2 mm of the BGA ball. Use the Altera Stratix IV GX Transceiver Signal Integrity Guidelines to validate your breakout topology before tape-out.
The EP4SGX530KH40C2 requires multiple voltage rails including VCCINT (core), VCCPD (I/O pre-driver), VCCA (PLL analog), VCCPT (transceiver analog), and per-bank VCCIO. Use a sequenced power supply IC to enforce the Stratix IV GX power-up sequencing (VCCINT before VCCPD, VCCA before VCCIO). Inrush current can exceed 10 A during configuration; size your regulator's bulk capacitance to keep VCCINT within +/- 30 mV during load transients. The Altera PowerPlay Early Power Estimator (EPE) worksheet provides accurate rail-current estimates before PCB layout.
Do not confuse the H40 1517-ball package (this part) with the F43 1760-ball package (EP4SGX530KF43 series). They share the same die but have different ball counts and pinouts - the KF43 cannot drop into the KH40 PCB. Also note that Stratix IV GX requires dedicated configuration memory such as EPCQ64 or EPCQ128; using the wrong EPCS configuration device will fail to configure. Verify all bank I/O standards (LVDS, LVCMOS, SSTL) match VCCIO before designing the pinout.
Place the Altera MAX II CPLD or similar clock-distribution device within 25 mm of the FPGA clock pins to minimize skew. Route the global clock networks (CLK[0..15] pins) using length-matched stripline with controlled impedance. For 8.5 Gbps transceivers, keep AC-coupling capacitors within 25 mm of the FPGA transmitter pin and minimize the via stub on the receiver side by using back-drilling for via lengths above 0.4 mm.
Compliance Information
RoHS compliant per Altera/Intel product page. Not AEC-Q100 qualified (automotive grade not offered for Stratix IV GX). Halogen-free status not specified in retrieved data. The C2 suffix indicates commercial speed grade with standard ball finish; the C2N variant is the lead-free ball-finish equivalent.
