EP4SGX360KF40C4 - Stratix IV GX FPGA 353K LE FCBGA-1517 | Intel
MPN: EP4SGX360KF40C4 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2680 | $26,800.00 |
| 100 | $2450 | $245,000.00 |
| 500 | $2240 | $1,120,000.00 |
| 1,000 | $2080 | $2,080,000.00 |
EP4SGX360KF40C4 Overview
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon IP such as block RAM, DSP slices, and high-speed transceivers. FPGAs occupy a unique position in the system hierarchy between general-purpose microcontrollers, which run software sequentially, and application-specific integrated circuits (ASICs), which implement fixed logic. The Stratix IV GX sits at the high end of this hierarchy as a 'system-on-chip' FPGA, integrating 8.5 Gbps SERDES, PCIe Gen2 hard IP, and up to ~24 Mbits of on-chip RAM - quantities that would otherwise require multiple discrete ASSPs. Synonymous terminology includes 'programmable logic device', 'PLD', and 'logic array'.
Key features include 8.5 Gbps integrated transceivers (24 channels), up to 24,576 Kbits of embedded memory (M20K blocks), 1,440 18x18 multipliers hardened for DSP, hard PCIe Gen2 x8 endpoints, and dedicated PLL/DCM clock management with 12 PLLs per device. The FC-FBGA-1517 package provides a high pin count (1,517 balls) on a 40x40 mm substrate, suitable for high-I/O ASIC-prototype and line-card designs.
Architecturally, the EP4SGX360KF40C4 combines a 40 nm low-power CMOS logic fabric with hard multi-protocol transceivers. Internal logic is structured around Adaptive Logic Modules (ALMs), each containing an 8-input fracturable LUT, two dedicated adders, and four registers. This LUT-based fabric lets designers implement any digital function up to the available logic and memory budget, while the hard SERDES and PCIe blocks deliver deterministic throughput that LUT-only implementations cannot match.
Typical applications include 10 Gbps wireline backplane bridging, ASIC prototyping and emulation, high-frequency trading platforms, radar and DSP front-ends, broadcast video processing, and PCIe Gen2 accelerator cards. Designers select this part when they need Stratix IV-class logic density and integrated SERDES but cannot justify the cost of a custom ASIC.
When designing with this device, ensure your PCB supports the FC-FBGA-1517 land pattern with microvia stack-up; the 1.0 mm ball pitch requires HDI fabrication. Plan thermal management around the published 0.9 V core current and provide at least eight PCB thermal vias under the central BGA thermal pad to keep junction temperature within the 0C to 85C commercial operating range.
This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design considerations for the EP4SGX360KF40C4 not found in the standalone manufacturer datasheet.
Drop-in alternatives for EP4SGX360KF40C4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX360KF40C4 (same form factor and footprint) — differing in Package, Speed Grade, Process Technology, Transceivers, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4SGX360KF40C3
✅ Drop-In✓ In Stock
$8200 / Unit
View Datasheet →EP4SGX360KF40C3N
✅ Drop-In✓ In Stock
$1320 / Unit
View Datasheet →EP4SGX360KF40C2N
✅ Drop-In✓ In Stock
$1850 / Unit
View Datasheet →EP4SGX360KF40C2
✅ Drop-In✓ In Stock
$10400 / Unit
View Datasheet →EP4SGX360KF40C4 Maximum Ratings & Electrical Characteristics
| Device Type | FPGA (Field Programmable Gate Array) |
| Family | Stratix IV GX |
| Logic Elements | 353,600 |
| Logic Array Blocks | 744 LABs |
| Embedded Memory | 23,105,536 bits (~22.04 Mbit) |
| DSP / 18x18 Multipliers | 1,440 |
| Process Technology | 40 nm CMOS |
| Core Voltage | 0.9 V |
| Transceivers | 24 channels, up to 8.5 Gbps |
| PCIe Hard IP | PCIe Gen2 x1/x4/x8 endpoints |
| PLLs | 12 |
| Package | 1517-ball FC-FBGA, 1.0 mm pitch |
| Package Code | FBGA-1517 |
| Operating Temperature | 0C to +85C (commercial) |
| Mounting Type | Surface Mount |
EP4SGX360KF40C4 fbga-1517 Pin Configuration Guide
Pin configuration for EP4SGX360KF40C4 (fbga-1517 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX360KF40C4.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX360KF40C4 is suitable for 6 applications: 10 Gbps Wireline Backplane Bridging, ASIC Prototyping and Emulation, High-Frequency Trading Platform, Radar and DSP Front-End, Broadcast Video Processing, PCIe Gen2 Accelerator Card.
10 Gbps Wireline Backplane Bridging
The EP4SGX360KF40C4's 24 integrated 8.5 Gbps transceivers and 1,440 DSP blocks are ideal for 10 Gbps backplane bridging between line cards. It implements XAUI, KR, and CPRI with deterministic latency thanks to hard SERDES. Placed on the switch-fabric card with 24 SFP+ cages and an external retimer, it eliminates the latency and BOM cost of a discrete PHY ASIC while leaving ample fabric for protocol conversion logic.
Recommended
ASIC Prototyping and Emulation
With 353,600 logic elements and 22 Mbit of embedded memory, the EP4SGX360KF40C4 maps large ASIC RTL blocks one-to-one, eliminating partitioning. Its 1.0 mm-pitch FC-FBGA-1517 package exposes 1,517 user I/Os, ideal for bringing out ASIC pad signals during bring-up. Quartus II synthesis matches typical ASIC timing within 15-20%, allowing early software development and verification months before silicon tape-out.
Recommended
High-Frequency Trading Platform
The EP4SGX360KF40C4 delivers sub-100 ns wire-to-wire latency when configured as a TCP-bypass / feed-handling accelerator. Its 1,440 18x18 multipliers process market-data parsing and order-book updates in parallel, while the hard PCIe Gen2 x8 endpoint accepts host commands at 5 Gbps line rate. The 0.9 V core keeps per-channel power around 1.5 W, allowing dense line cards in air-cooled exchanges.
Recommended
Radar and DSP Front-End
The 1,440 18x18 multipliers on the EP4SGX360KF40C4 deliver up to ~300 GMAC/s at 600 MHz, well suited to beamforming, pulse compression, and FFT pre-processing in radar front-ends. Combined with 24 transceivers, the same chip digitizes antenna arrays and outputs baseband data to a host processor over PCIe Gen2. Designers use Altera's DSP Builder to synthesize MATLAB algorithms directly into hardened multipliers.
Recommended
Broadcast Video Processing
The EP4SGX360KF40C4's 22 Mbit of embedded memory holds multiple lines of uncompressed HD/UHD video for color-space conversion, scaling, and overlay operations. Its 1,517-ball package exposes enough I/O for parallel RGB/YCbCr interfaces plus DDR3 external memory controllers. Designers map SMPTE 2022/2059 SDI and emerging ST 2110 IP cores directly into fabric alongside the DSP pipeline.
Recommended
PCIe Gen2 Accelerator Card
The EP4SGX360KF40C4 implements a PCIe Gen2 x8 endpoint with on-die hard IP, freeing all 353,600 LE for acceleration kernels such as AES, compression, or database filters. Its 24 transceivers also expose auxiliary 10 GbE links for host-to-host or host-to-storage data paths. The card typically mounts on a standard PCIe edge finger with external QSFP cages for off-card expansion.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX360KF40C4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX360KF40C3 | EP4SGX360KF40C3N | EP4SGX360KF40C2N | EP4SGX360KF40C2 | EP4SGX360HF35C4 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-ball FC-FBGA (KF40) | 1517-ball FC-FBGA (KF40) - same | 1517-ball FC-FBGA (KF40) - same | 1517-ball FC-FBGA (KF40) - same | 1517-ball FC-FBGA (KF40) - same | 1152-ball FC-FBGA (HF35) - DIFFERENT (not drop-in) |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 |
| Speed Grade | C4 (fastest commercial) | C3 | C3 (RoHS) | C2 (RoHS) | C2 | C4 (HF35 package) |
| Embedded Memory | 23,105,536 bits | 23,105,536 bits | 23,105,536 bits | 23,105,536 bits | 23,105,536 bits | 23,105,536 bits |
| DSP Blocks (18x18 mults) | 1,440 | 1,440 | 1,440 | 1,440 | 1,440 | 1,440 |
| Transceivers (8.5 Gbps) | 24 channels | 24 channels | 24 channels | 24 channels | 24 channels | 24 channels |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C |
| Lifecycle Status | Active (approaching EOL) | Active | Active | Active | Active | Active |
Key Differentiators
- Highest speed grade (C4) in the KF40 footprint (vs EP4SGX360KF40C3)
- Lead-free / RoHS-compliant option in same package (vs EP4SGX360KF40C2)
- Highest-density Stratix IV GX in the KF40 package (vs EP4SGX230KF40I4N)
Design Notes
The 1,517-ball FC-FBGA-1517 package uses a 1.0 mm ball pitch, which mandates HDI PCB fabrication with laser-drilled microvias. Use a 1+N+1 or 2+N+2 stack-up with at most 0.2 mm dielectric between layers, and stitch at least eight 0.3 mm thermal vias under the central BGA thermal pad to the inner ground plane. Reference Intel's Stratix IV GX pin connection guidelines for unused-pin and CONFIG_IO termination rules.
Estimated: at 100% toggle rate on 50% of logic and all 24 transceivers active at 8.5 Gbps, total power reaches ~25 W. Use Altera PowerPlay early in the schematic phase to model rails (0.9 V VCC, 1.1 V VCCA, VCCPD, VCCIO). Provide at least 4 dedicated power planes and a 12 V input rail with a 30 A buck regulator to keep IR drop below 1% on the 0.9 V core.
Do not assume pin-compatibility between the EP4SGX360KF40C4 (KF40 package) and the EP4SGX360HF35I4 (HF35 package); they are different footprints. Also note that Stratix IV GX parts have been progressing through end-of-life since 2020 - confirm the latest Intel Product Discontinuance PDN before committing to a production build. Plan a migration path to Stratix V or Cyclone V GX for long-life-cycle programs.
Transceiver channels are organized in groups of four with shared PLL and clock routing. Place external 100-ohm differential AC-coupling capacitors within 1 cm of the TX/RX ball pairs to meet 8.5 Gbps eye-mask requirements. Isolate transceiver power (VCCA, VCCP) from digital VCC with ferrite beads to prevent 5 GHz reference spurs leaking into the analog supply.
Compliance Information
RoHS/REACH compliance declared per Altera/Intel product page. AEC-Q100 not applicable - this is a commercial-grade FPGA. For automotive applications, Stratix IV GX is generally not recommended; consider Cyclone IV/IV GX automotive variants instead. Confirm latest PDN status with Intel due to approaching EOL.
