EP4SGX110FF35C3G - Stratix IV GX 105KLE FPGA, 1152-FBGA | Intel / Altera
MPN: EP4SGX110FF35C3G ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2233.74 | $2,233.74 |
| 10 | $2165.5 | $21,655.00 |
| 25 | $2110 | $52,750.00 |
| 100 | $2035 | $203,500.00 |
| 500 | $1960 | $980,000.00 |
EP4SGX110FF35C3G Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose digital logic, interconnect, and even analog/serial functions are configured by the user after manufacture via an SRAM configuration bitstream. FPGAs sit alongside microprocessors, ASICs, and ASSPs in the broader programmable logic device (PLD) family, and Stratix IV GX specifically targets high-speed serial connectivity, DSP-heavy designs, and embedded processing systems. The Stratix IV series architecture separates logic (ALMs/LABs), memory (M9K/M144K blocks), DSP (variable-precision multipliers), transceivers, and I/O (LVDS, LVTTL, HSTL, SSTL) into independent, parallel structures connected by a hierarchical routing fabric.
Key features include the transceiver-rich GX variant, 372 user I/O pins, support for DDR3/DDR2/QDRII+ external memory interfaces, hard PCIe Gen1 endpoints, and operation across the -40 C to 100 C commercial junction temperature range. The FF35 speed grade designates the fastest commercial speed bin, the F35 pin/package code denotes the 1152-ball 35 mm x 35 mm FCBGA footprint, and the trailing C3 indicates the 0.85 V VCCINT core voltage with the -3 speed grade designation.
Typical applications include wireline telecom line cards, software-defined radio baseband, test and measurement instrumentation with high-speed serial backplane aggregation, military radar front-end preprocessing, broadcast video processing, and ASIC prototyping for high-bandwidth ASIC emulation. Designers select the EP4SGX110FF35C3G when they need roughly 100K LE of logic with multi-gigabit serial and PCIe Gen1 hardening on a single die.
Consideration for power: at typical activity the Stratix IV GX 110 KLE operates near 5-8 W; full-utilization boards require forced-air flow and copper thermal relief. Quartus II design software (version 13.1 or later with service packs) supports the EP4SGX110FF35C3G and is required to generate JIC/JIC configuration files for JTAG or EPCS configuration. This page consolidates distributor pricing, drop-in speed/pinout-compatible variants, and design notes that supplement the manufacturer datasheet.
Drop-in alternatives for EP4SGX110FF35C3G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX110FF35C3G (same form factor and footprint) — differing in Package, Speed Grade, RoHS Status, Family, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4SGX110FF35C2XG
✅ Drop-In✓ In Stock
$1395 / Unit
View Datasheet →EP4SGX110FF35C4G
✅ Drop-In✓ In Stock
$2400 / Unit
View Datasheet →EP4SGX230FF35I3N
✅ Drop-In📋 Reference alternative (not in catalog)
EP4SGX110DF29I4G
✅ Drop-In✓ In Stock
$1085 / Unit
View Datasheet →EP4SE230F35I4NAD
✅ Drop-In✓ In Stock
$2990 / Unit
View Datasheet →EP4SGX110FF35C3G Maximum Ratings & Electrical Characteristics
| Series | Stratix IV GX |
| Logic Elements (LE) | 105,600 |
| Adaptive Logic Modules (ALM) | 42,240 |
| Embedded Memory | 9.79 Mbit (9,793,536 bit) |
| Embedded 18x18 Multipliers | 562 |
| User I/O Count | 372 |
| Process Technology | 40 nm |
| Package | 1152-BBGA (FCBGA), F35, 35 mm x 35 mm |
| Speed Grade | C3 (commercial, fastest) |
| Multi-Gigabit Transceivers | 8 channels, up to 3.75 Gbps |
| Hard PCIe IP | PCI Express Gen1 endpoint |
| External Memory Support | DDR3 / DDR2 / QDRII+ (controller hard IP) |
| Operating Junction Temperature | 0 C to +100 C (commercial, C suffix) |
| Mounting Type | Surface Mount (BGA) |
| Configuration Method | JTAG / EPCS serial flash via Quartus II |
| RoHS Status | Compliant |
| MSL Level | 3 (per JEDEC J-STD-020) |
| Lead-Free | Yes |
EP4SGX110FF35C3G 1152-bbga (fcbga), f35, 35 mm x 35 mm Pin Configuration Guide
Pin configuration for EP4SGX110FF35C3G (1152-bbga (fcbga), f35, 35 mm x 35 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX110FF35C3G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX110FF35C3G is suitable for 6 applications: Wireline Telecom Line Card, Software-Defined Radio Baseband, Test & Measurement Instrumentation, ASIC Prototyping / Emulation, Broadcast Video Processing, Military Radar Front-End Preprocessing.
Wireline Telecom Line Card
The EP4SGX110FF35C3G suits wireline telecom line cards that aggregate multiple SGMII or Serial RapidIO backhaul links because its 8 hardened multi-gigabit transceivers run up to 3.75 Gbps per channel and support Serial RapidIO 1.3 protocol. The hard PCI Express Gen1 endpoint block simplifies switch-fabric bridging to a host ASIC with no soft-logic overhead. With 105,600 LE of logic and 9.79 Mbit embedded memory, the device can simultaneously process packet headers, run QoS/queueing, and drive an external DDR3 buffer without congestion, while the 40 nm Stratix IV process keeps the typical board power near 5-8 W at full utilization.
Recommended
Software-Defined Radio Baseband
The EP4SGX110FF35C3G is a strong fit for software-defined radio baseband processing because it offers 562 embedded 18x18 multipliers delivering roughly 100 GMACs of DSP throughput and 9.79 Mbit of distributed memory for sample buffering on each channel. According to the Stratix IV DSP block user guide, the variable-precision multiplier architecture supports both fixed-point and floating-point FFT/iFFT paths with native FFT acceleration. The 372 user I/O of the F35 package allow direct parallel LVDS connections to multi-antenna ADC front-ends, while the transceivers serialize the processed baseband upstream to a host DSP.
Recommended
Test & Measurement Instrumentation
For high-end test and measurement instrumentation, the EP4SGX110FF35C3G integrates 8 transceivers at 3.75 Gbps to aggregate multiple high-speed serial ADC/DAC data streams into a coherent capture buffer, eliminating a discrete bridge ASIC. Its 105K LE provide the real-time DSP necessary for FIR filtering, FFT-based spectrum analysis, and trigger decision logic. The hard DDR3 controller (via soft memory controller) interfaces directly to large external sample buffers without glue logic, and the 372 user I/O permit direct LVDS probing of legacy parallel instrumentation buses for backward-compatible test fixtures.
Recommended
ASIC Prototyping / Emulation
The EP4SGX110FF35C3G is widely used as an ASIC prototyping vehicle because it offers 105K LE, which approximates the gate capacity of a 5-10 Mgate ASIC block, and supports multi-FPGA partitioning with the F35 1152-ball package exposing 372 user I/O for chip-to-chip interconnect. The 9.79 Mbit embedded memory is sufficient to model large register files and cache subsystems, while the 8 transceivers provide high-bandwidth serial links between prototype boards at up to 3.75 Gbps per lane. Quartus II design partitioning tools support incremental compile flows essential for multi-FPGA ASIC emulation.
Recommended
Broadcast Video Processing
The EP4SGX110FF35C3G fits broadcast video processing systems where the device must drive multi-rate SDI ingest, real-time scaling/de-interlacing, and HDMI/DisplayPort output concurrently. The 562 embedded 18x18 multipliers provide the throughput needed for chroma upsampling and noise reduction algorithms at 1080p60 rates, while 9.79 Mbit embedded memory acts as line/frame buffers for pipelined video paths. The 8 transceivers handle 3G-SDI/HD-SDI receive, and the F35 package's 372 user I/O support parallel BT.656/BT.1120 buses for legacy interconnects alongside the serial links.
Recommended
Military Radar Front-End Preprocessing
The EP4SGX110FF35C3G is suitable for military radar front-end preprocessing because the Stratix IV GX family supports industrial temperature grades and radiation-tolerant packaging options via -I speed bins. The 105K LE deliver the FIR filter and pulse compression compute required for SAR and phased-array radar beamforming, while the 562 multipliers sustain throughput for CFAR detection in real time. According to the Stratix IV military/aerospace brochure, the 8 hardened transceivers drive long-reach fibre-optic links to the back-end processor, eliminating a separate SERDES device.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX110FF35C3G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX110FF35C2XG | EP4SGX110FF35C4G | EP4SGX230FF35I3N | EP4SGX110DF29I4G | EP4SE230F35I4N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-BBGA (FCBGA F35) | 1152-BBGA (FCBGA F35) - same | 1152-BBGA (FCBGA F35) - same | 1152-BBGA (FCBGA F35) - same | 1152-BBGA (FCBGA F35) - same | 1152-BBGA (FCBGA F35) - same |
| Logic Elements | 105,600 | 105,600 - same | 105,600 - same | 230,000 (+118%) | 105,600 - same | 230,000 (+118%) |
| Embedded Memory | 9.79 Mbit | 9.79 Mbit - same | 9.79 Mbit - same | 17.94 Mbit (+83%) | 9.79 Mbit - same | 17.94 Mbit (+83%) |
| Multi-Gigabit Transceivers | 8 channels up to 3.75 Gbps | 8 channels up to 3.75 Gbps - same | 8 channels up to 3.75 Gbps - same | 12 channels up to 3.75 Gbps | 0 (Stratix IV E, no transceivers) | 0 (Stratix IV E, no transceivers) |
| Speed Grade | C3 (commercial, fastest) | C2 (commercial, slower) | C4 (commercial, fastest+) | I3 (industrial) | I4 (industrial) | I4 (industrial) |
| Operating Temperature | 0 C to +100 C (commercial) | 0 C to +100 C - same | 0 C to +100 C - same | -40 C to +100 C (industrial) | -40 C to +100 C (industrial) | -40 C to +100 C (industrial) |
Key Differentiators
- Hardened PCI Express Gen1 endpoint eliminates soft-logic footprint (vs EP4SGX110DF29I4G (Stratix IV E, no transceivers))
- C3 speed grade delivers fastest commercial Fmax (vs EP4SGX110FF35C2XG (C2 grade))
- 230K LE upgrade available in identical F35 footprint (vs EP4SGX230FF35I3N (230K LE))
Design Notes
The Stratix IV GX 110 KLE device under typical activity dissipates 5-8 W, with peak activity pushing junction temperature toward 100 C. The F35 FCBGA package exposes a large thermal pad beneath the die; the PCB must include a 6x6 via array (1.0 mm pitch, 0.3 mm drill) under the thermal ball matrix with copper-filled or epoxied vias to a large inner-plane heat spreader. Forced airflow (200 LFM minimum) is recommended for full-utilization designs. Estimated: with a theta_JB of 1.2 C/W and 4-layer PCB heat spreader, junction-to-ambient thermal resistance is approximately 8 C/W, giving a 50 C temperature rise at 6 W dissipation.
Place decoupling capacitors within 100 mil of each VCCINT and VCCA supply ball using a mix of 0.1 uF X7R 0402 and 4.7 uF X5R 0603 bulk values per the Stratix IV GX pin connection guidelines. The transceiver supply balls (VCCR, VCCT, VCCE, VCCP) each require their own isolated supply planes with ferrite-bead filtering to prevent coupling between high-speed serial and core logic. All free balls on the FCBGA package should be soldered for mechanical reliability, even those marked NC in the datasheet, per the Intel FCBGA soldering recommendation.
The MSL3 moisture sensitivity classification of the F35 FCBGA means the part must be reflowed within 168 hours of opening the sealed dry-pack; bake at 125 C for 48 hours if floor life is exceeded. Configuration bitstream loading via JTAG requires the Quartus II programmer connected to a USB-Blaster, ByteBlaster, or Ethernet Blaster; verify the JTAG chain integrity before attempting AS mode configuration from an EPCS flash. According to the Stratix IV configuration handbook, partial reconfiguration requires dedicated PR regions in the design floorplan - failure to plan this ahead of compile time forces a full design rebuild to enable PR.
Multi-gigabit transceiver channels must be routed on the top PCB layer over a continuous reference plane with 100 ohm differential impedance; the F35 ball-out places 8 transceiver channels in two quads (left and right edge of the die). Pair-to-pair skew must be held below 1 ps per cm of mismatch per Intel's Stratix IV GX transceiver layout guidelines; length-tune each pair to within 5 mil of the lane-pair average. AC-coupling capacitors (0.01 uF X7R 0402) are required on every TX and RX serial lane, placed as close as possible to the FPGA ball.
Compliance Information
RoHS and lead-free status confirmed per Intel Altera product page. Halogen-free status not explicitly stated in the verified data and set to unknown. AEC-Q100 not applicable for FPGAs; commercial (C) and industrial (I) temperature grades are the relevant designations.
