EP4SGX110FF35I4G - Stratix IV GX FPGA, 105K LE, 1152-FCBGA | Altera / Intel
MPN: EP4SGX110FF35I4G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 100 | $1620 | $162,000.00 |
| 500 | $1500 | $750,000.00 |
| 1,000 | $1395 | $1,395,000.00 |
EP4SGX110FF35I4G Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs / ALMs), programmable interconnect, and dedicated hard IP such as transceivers, memory controllers, and DSP blocks. In the system hierarchy it sits between fixed-function ASICs (lowest flexibility, lowest unit cost at volume) and software-programmable DSP/MCU processors (highest flexibility, lowest deterministic performance). Stratix IV GX FPGAs specifically target applications where deterministic sub-nanosecond logic delays, parallel DSP arithmetic, and multi-gigabit serial I/O are required simultaneously.
Key features of the EP4SGX110FF35I4G include 105,600 logic elements distributed across 4,224 Adaptive Logic Modules (ALMs), 42,240 ALMs in the largest configuration of the family, 9.34 Mbit / 9,793,536 bits of embedded block memory, and 480 user I/Os. The "FF35" pinout designation places the device in the 1152-ball FCBGA with high-speed transceivers arranged along dedicated columns, while the "I4" speed-grade and industrial temperature grade (-40C to +100C) suffix indicates an industrial-grade silicon speed bin suitable for harsh-environment deployments. Operating supply voltage is centered at 950 mV core with multiple auxiliary rails for I/O and transceiver banks.
The architecture combines an 8-input ALM (twice the inputs of the previous Stratix III generation) with dedicated 18x18 multipliers and TriMatrix embedded memory blocks, supporting DSP throughput up to ~600 GMACS at the typical configuration. Integrated transceivers support protocols such as PCI Express Gen1/Gen2, Serial RapidIO, XAUI, HiGig, SATA, and backplane interfaces at data rates up to 8.5 Gbps per channel. Hard PCI Express Gen2 IP blocks and hard memory controllers reduce soft-logic overhead, freeing fabric for application code.
Typical applications include high-end ASIC prototyping, telecom line-card protocol bridging, radar and signal-intelligence processing, high-frequency trading platforms, broadcast video infrastructure, and test-and-measurement instrumentation. The wide transceiver bandwidth also makes it suitable for medical imaging reconstruction, software-defined radio base stations, and aerospace communication payloads where both high logic density and serial-link throughput are mandatory.
When designing with this device, pay close attention to power architecture: a fully populated EP4SGX110FF35I4G can dissipate well over 20 W and requires a multi-rail decoupling network, SmartVoltage ID or external regulator sequencing, and a thermal management solution sized for the FCBGA-1152 package. Quartus II software (with the appropriate license) is required for synthesis, place-and-route, and timing closure - the device is mature but still widely supported in Intel Quartus Prime 17.x and earlier tool chains.
This page synthesizes distributor inventory, drop-in Stratix IV GX package-compatibility notes, and practical design considerations that are not available in a single manufacturer datasheet, helping procurement and FPGA design engineers shorten the selection cycle.
Drop-in alternatives for EP4SGX110FF35I4G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX110FF35I4G (same form factor and footprint) — differing in Speed Grade, Package, Embedded Memory, Operating Temperature, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4SGX110FF35I3G
✅ Drop-In✓ In Stock
$1290 / Unit
View Datasheet →EP4SGX110FF35C4G
✅ Drop-In✓ In Stock
$2400 / Unit
View Datasheet →EP4SGX110FF35C3G
✅ Drop-In✓ In Stock
$1960 / Unit
View Datasheet →EP4SGX110FF35C2XG
✅ Drop-In✓ In Stock
$1395 / Unit
View Datasheet →EP4SGX110FF35I4G Maximum Ratings & Electrical Characteristics
| Family | Stratix IV GX |
| Series | Stratix IV |
| Logic Elements | 105600 LE |
| Adaptive Logic Modules (ALMs) | 42240 ALM |
| CLBs | 4224 |
| Embedded Memory | 9793536 bit (9.34 Mbit) |
| Number of I/Os | 480 I/O |
| Operating Supply Voltage | 950 mV (core) |
| Mounting Style | SMD/SMT |
| Package / Case | FBGA-1152 (FCBGA-1152) |
| Packaging | Tray |
| Minimum Operating Temperature | -40 C |
| Maximum Operating Temperature | +100 C |
| Temperature Grade | Industrial |
| Speed Grade | I4 |
| Process Technology | 40 nm |
| RoHS Status | Compliant |
| Manufacturer | Altera / Intel |
EP4SGX110FF35I4G fbga-1152 (fcbga-1152) Pin Configuration Guide
Pin configuration for EP4SGX110FF35I4G (fbga-1152 (fcbga-1152) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX110FF35I4G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX110FF35I4G is suitable for 6 applications: ASIC Prototyping, Telecom Line-Card Protocol Bridging, Radar and Signal-Intelligence Processing, Software-Defined Radio Base Stations, High-Frequency Trading Platforms, Medical Imaging Reconstruction.
ASIC Prototyping
The EP4SGX110FF35I4G's 105,600 logic elements and 9.34 Mbit embedded memory make it a strong fit for ASIC prototyping where developers need to validate complex SoC designs before committing to mask-set fabrication. With 480 user I/Os, designers can map most ASIC pad rings directly to the FPGA without external logic, while the industrial temperature grade lets prototype boards operate in lab and field-test environments. Quartus II supports incremental compile so design teams can iterate partition-by-partition. Compared to ASIC tapeout cycles (months), FPGA prototyping reduces verification cycles to days; compared to smaller Cyclone V devices, the EP4SGX110FF35I4G fits larger gate counts and exposes enough transceivers to exercise high-speed ASIC PHYs at full data rate.
Recommended
Telecom Line-Card Protocol Bridging
The EP4SGX110FF35I4G's integrated transceivers operate up to 8.5 Gbps with built-in support for PCI Express Gen2, XAUI, Serial RapidIO, and backplane protocols, making it ideal for line-card bridging between switch fabrics and packet processors. The 9.34 Mbit embedded memory provides deep packet buffering and lookup tables for forwarding-classification logic, while the 480 user I/Os can drive multiple QSFP/SFP+ connectors and external TCAMs. Per the Stratix IV handbook, the hard PCIe Gen2 IP block saves soft-logic area. Compared to a discrete PHY + FPGA architecture, the EP4SGX110FF35I4G reduces BOM and PCB area; compared to ASSP bridge chips, it allows custom protocol stacks and late-spec updates without re-spinning the ASIC.
Recommended
Radar and Signal-Intelligence Processing
The EP4SGX110FF35I4G combines high logic density (105,600 LE) with hundreds of dedicated 18x18 multipliers, supporting multi-channel digital-IF down-conversion, FFT pipelines, and pulse-Doppler processing in radar and SIGINT systems. The industrial -40C to +100C temperature range allows deployment in outdoor or avionics enclosures, while 8.5 Gbps transceivers ingest raw A/D samples from front-end converters. Stratix IV fabric runs at Fmax above 300 MHz on typical DSP paths, enabling real-time processing at GHz sample rates. Compared to GPU-based processing, the EP4SGX110FF35I4G delivers deterministic latency critical for phased-array beamforming; compared to smaller FPGAs, it accommodates more channels per chip.
Recommended
Software-Defined Radio Base Stations
The EP4SGX110FF35I4G's transceiver channels and DSP-rich fabric support multi-standard SDR base stations spanning GSM, LTE, and WiMAX waveforms on a single chip. Its 9.34 Mbit embedded memory accommodates symbol-rate buffering and channelization filter banks, while 480 user I/Os can drive multiple RF DAC/ADC interfaces. The industrial temperature grade enables outdoor remote-radio-head (RRH) deployment. Compared to fixed-function DSP processors, the EP4SGX110FF35I4G handles any modulation scheme via firmware update; compared to smaller FPGAs, it allows more concurrent channels and higher instantaneous bandwidth.
Recommended
High-Frequency Trading Platforms
The EP4SGX110FF35I4G delivers sub-100 ns end-to-end latency for high-frequency trading (HFT) platforms where nanoseconds directly translate to P&L. Stratix IV fabric determinism and dedicated 18x18 multipliers enable parallel order-book matching and risk calculations on the same device, while 8.5 Gbps transceivers sustain market-data feed ingestion without packet drops. The 480 user I/Os interface to multiple Ethernet PHYs and PCIe Gen2 feed interfaces. Compared to CPU-based trading servers, the EP4SGX110FF35I4G eliminates OS jitter; compared to ASIC implementations, it allows strategy updates without re-spinning silicon.
Recommended
Medical Imaging Reconstruction
The EP4SGX110FF35I4G's parallel processing fabric is well suited to CT, MRI, and ultrasound reconstruction pipelines that demand streaming FFT and back-projection across gigabytes of raw sensor data. The 9.34 Mbit embedded memory holds intermediate sinogram and k-space data, while the 8.5 Gbps transceivers ingest raw data from sensor front-ends without bottlenecks. Industrial temperature grade supports imaging-cart and operating-room deployments. Compared to CPU/GPU workstations, the EP4SGX110FF35I4G completes reconstructions deterministically and at lower power; compared to smaller FPGAs, it processes larger volumetric datasets in a single chip.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX110FF35I4G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX110FF35I3G | EP4SGX110FF35C4G | EP4SGX110FF35C3G | EP4SGX110FF35C2XG |
|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Package | FCBGA-1152 (FF35) | FCBGA-1152 (FF35) - same | FCBGA-1152 (FF35) - same | FCBGA-1152 (FF35) - same | FCBGA-1152 (FF35) - same |
| Logic Elements | 105600 LE | 105600 LE | 105600 LE | 105600 LE | 105600 LE |
| Embedded Memory | 9.34 Mbit | 9.34 Mbit | 9.34 Mbit | 9.34 Mbit | 9.34 Mbit |
| User I/Os | 480 | 480 | 480 | 480 | 480 |
| Speed Grade | I4 | I3 (slower) | C4 (faster) | C3 (slower) | C2 (slowest) |
| Temperature Grade | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C |
| Approx. Unit Price (USD, as of 2026-09-10) | $1850 @ qty 1 | $1750 @ qty 1 (est.) | $1850 @ qty 1 (est.) | $1700 @ qty 1 (est.) | $1650 @ qty 1 (est.) |
Key Differentiators
- Balanced logic density and transceiver bandwidth in a single device (vs EP4CGX110DF31I7N (Cyclone IV GX family))
- Industrial temperature grade at I4 speed bin (vs EP4SGX110FF35C4G (commercial temp grade))
- Mature, long-term supported silicon with abundant Quartus II IP cores (vs Newer Stratix 10 / Agilex 7 devices)
- Hard PCIe Gen2 IP block saves fabric area (vs EP4CE75F29I7N (Cyclone IV E with no hard PCIe))
Design Notes
Estimated: at typical 60-70% utilization and 50% toggle rate, the EP4SGX110FF35I4G draws approximately 18-22 W from the 950 mV core rail plus auxiliary VCCPT/VCCGXL/VCCAUX rails. Per the Stratix IV handbook, the device requires SmartVoltage ID or external regulator sequencing. Design the power-supply network with at least 4 bulk ceramic capacitors (220 uF) near the FCBGA, plus 0.1 uF / 0.01 uF high-frequency bypass on every power pin pair. Do NOT rely solely on the FPGA's internal decoupling for multi-MHz switching loads.
Estimated: the FCBGA-1152 package theta_JA is approximately 0.6 C/W with a 1 m/s airflow and a standard JEDEC test board, but at 22 W dissipation the junction temperature rises ~13 C above ambient without airflow - so active cooling is mandatory. Use a heat spreader or heat sink attached via thermal interface material (TIM) to the package top, plus thermal vias in the PCB land pattern to spread heat to inner copper planes. Re-validate after layout because via density and copper weight materially change effective theta_JA.
Use microvia or stacked-via technology on the FCBGA-1152 1.0 mm pitch land pattern; standard 8 mil through-vias will not allow escape routing. Separate high-speed transceiver (GXB) routes from general-purpose I/O and clock signals, keep differential-pair lengths matched within 5 mil, and use 100-ohm differential impedance with a grounded coplanar waveguide. Reference the Stratix IV GX transceiver user guide for the recommended stackup and via pattern around the GXB balls.
Do not assume the EP4SGX110FF35I4G is supported in the latest Quartus Prime Pro 22.x or later toolchains - Stratix IV devices are supported only through Quartus II / Quartus Prime 17.x or earlier. Forgetting this results in compile failure and lost time; lock the Quartus version early. Also note that JTAG chain ordering on multi-device boards must follow the TMS/TCK daisy-chain rules in AN 471 to avoid configuration failures.
The integrated transceivers operate up to 8.5 Gbps, which is at the limit of FR-4 PCB loss budgets above 6 inches trace length. Use low-loss Megtron-6 or equivalent PCB material for backplanes, and place AC-coupling capacitors within 200 mil of the FPGA GXB pins. Reference the Stratix IV GX Transceiver User Guide for pre-emphasis and equalization settings; default settings are conservative and may leave margin on the table for short-reach interconnects.
Compliance Information
RoHS-compliant per Altera/Intel product page. AEC-Q100 not applicable - this is an industrial-grade FPGA, not an automotive-qualified IC. Reach SVHC compliance status confirmed via Altera/Intel material declaration.
