EPF10K130EBC356-3 - 130K Gate FLEX-10KE FPGA, 356-BGA | Altera
MPN: EPF10K130EBC356-3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $52.78 | $52.78 |
| 10 | $48.5 | $485.00 |
| 100 | $42.9 | $4,290.00 |
| 500 | $38.75 | $19,375.00 |
| 1,000 | $35.2 | $35,200.00 |
EPF10K130EBC356-3 Overview
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), interconnect, and I/O cells that the designer programs after manufacturing. FPGAs sit in the digital logic hierarchy above general-purpose microcontrollers and below Application-Specific Integrated Circuits (ASICs), offering hardware-level parallelism with on-the-fly reconfigurability. The FLEX-10KE family specifically pioneered the "embedded array" concept by integrating dedicated RAM blocks (EABs) alongside the general logic fabric, enabling System-on-a-Programmable-Chip implementations before the modern SoC FPGA era.
Key features include 130,000 typical gates, 8,192 logic elements, 274 maximum user I/O pins, 12 embedded array blocks (EABs) for memory, and PCI-compliant I/O support. The device offers 0.6 ns pin-to-pin propagation delay in the -3 speed grade, multiVolt I/O supporting 2.5 V/3.3 V/5.0 V mixed-voltage interfaces, and in-system programmability via IEEE 1149.1 (JTAG) boundary-scan. The 356-LBGA package provides high-density interconnect for memory-rich and bus-intensive designs.
The FLEX-10KE architecture combines a fine-grained logic fabric optimized for register-intensive datapaths with coarse-grained EABs (Embedded Array Blocks) that can be configured as 2 Kbit RAM, ROM, or FIFO. The lookup-table (LUT) based logic element, FastTrack interconnect, and continuous routing architecture deliver predictable timing closure. The -3 speed grade is the fastest of the FLEX-10KE family, targeting timing-critical applications such as PCI bus interfaces and high-speed glue logic.
Typical applications include telecommunications line cards, industrial control and automation, PCI bridge logic, video processing and display controllers, and legacy ASIC prototyping. The high I/O count and embedded memory make it especially suitable for data-path bridging and protocol conversion in telecom and industrial systems.
When designing with this FPGA, ensure the 2.5 V core rail is decoupled with 0.1 µF + 10 µF bulk capacitors near each supply pin, and route all configuration signals (nCONFIG, nSTATUS, CONF_DONE, DCLK) away from switching I/O to avoid in-system programming glitches. Thermal management is straightforward thanks to the LBGA thermal pad; a minimum 4-layer PCB with a thermal via array under the exposed pad is recommended.
This page synthesizes distributor pricing, same-brand speed-grade and density alternatives, lifecycle status, and practical design notes not found in a single manufacturer datasheet — supporting both new designs and long-lifecycle maintenance of legacy FLEX-10KE systems.
Drop-in alternatives for EPF10K130EBC356-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K130EBC356-3 (same form factor and footprint) — differing in Process Technology, Operating Temperature, Package, Speed Grade, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K130EBC356-2
✅ Drop-In✓ In Stock
$185 / Unit
View Datasheet →EPF10K130EBC356-1
✅ Drop-In✓ In Stock
$95 / Unit
View Datasheet →EPF10K130EBC356-1N
✅ Drop-In✓ In Stock
$18.2 / Unit
View Datasheet →EPF10K130EBC356-1X
✅ Drop-In✓ In Stock
$132 / Unit
View Datasheet →EPF10K100EBC356-3
✅ Drop-In✓ In Stock
$62.5 / Unit
View Datasheet →EPF10K130EBC356-3 Maximum Ratings & Electrical Characteristics
| Family | FLEX-10KE |
| Series | FLEX-10KE |
| Typical Gates | 130,000 |
| Logic Elements | 8,192 |
| Logic Array Blocks (LABs) | 832 |
| Embedded Array Blocks (EABs) | 12 |
| Total RAM Bits | 24,576 bits (12 EABs × 2 Kbit) |
| Maximum User I/Os | 274 |
| Core Supply Voltage | 2.375 V to 2.625 V |
| I/O Supply Voltage | 2.5 V / 3.3 V / 5.0 V (multiVolt I/O) |
| Pin-to-Pin Propagation Delay (-3 grade) | 0.6 ns |
| Operating Temperature | 0 °C to +70 °C (Commercial) |
| Package | 356-LBGA (35x35 mm) |
| Mounting Type | Surface Mount |
| Logic Family | CMOS |
| Process Technology | 0.22 µm SRAM-based CMOS |
| Configuration Method | SRAM-based, JTAG (IEEE 1149.1) in-system programmable |
| Speed Grade | -3 (fastest) |
| RoHS Status | Non-compliant (SnPb ball finish on legacy BGA) |
| Lead-Free | No |
| Lifecycle | Obsolete — last-time-buy / Rochester Electronics stock only |
EPF10K130EBC356-3 356-lbga (35x35 mm) Pin Configuration Guide
Pin configuration for EPF10K130EBC356-3 (356-lbga (35x35 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K130EBC356-3.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K130EBC356-3 is suitable for 6 applications: Telecommunications Line Cards, Industrial Control and Automation, PCI Bridge and Bus Interface Logic, Video Processing and Display Controllers, ASIC Prototyping and Emulation, Legacy System Maintenance and Long-Life Programs.
Telecommunications Line Cards
The EPF10K130EBC356-3's 274 user I/Os and PCI-compliant drivers make it well-suited for telecom line-card glue logic, where the device bridges TDM buses, framer ICs, and network processors. Its 12 Embedded Array Blocks provide 24 Kbits of dual-port RAM for cell buffering and lookup-table storage, while the 0.6 ns Tpd at the -3 speed grade meets timing closure for 33 MHz PCI bus interfaces. The multiVolt I/O at 2.5/3.3/5 V interfaces directly to legacy telecom ASICs without level shifters, simplifying board layout and reducing BOM cost in legacy line-card designs.
Recommended
Industrial Control and Automation
The EPF10K130EBC356-3 handles deterministic control loops and high-speed I/O processing in industrial automation systems, where its 130K-gate capacity accommodates custom protocol stacks, motor-control state machines, and encoder interfaces. The 832 LABs provide abundant register-rich datapath resources for parallel I/O scanning, while EAB-based RAM implements message buffers and PID lookup tables. The commercial 0-70 °C temperature range suits factory-floor enclosures with controlled climate; for harsher environments, the EPF10K130EBC356-3N industrial variant extends coverage to -40 to +85 °C.
Recommended
PCI Bridge and Bus Interface Logic
The EPF10K130EBC356-3's PCI-compliant I/O drivers and 0.6 ns Tpd at the -3 speed grade support 33 MHz PCI bus bridge implementations with deterministic timing closure. Designers typically instantiate a custom PCI target or master core in the 130K-gate fabric, using the EAB-based RAM for configuration-space registers and FIFOs. The 274 user I/Os accommodate multiple bus interfaces (PCI + local + memory) on a single device, eliminating external bridge chips and reducing board complexity in legacy add-in cards and embedded systems.
Recommended
Video Processing and Display Controllers
The EPF10K130EBC356-3 supports video pipeline functions such as frame-rate conversion, overlay generation, and color-space conversion where its 832 LABs implement parallel pixel-processing datapaths and its 12 EABs buffer scan-line data. The 274 user I/Os accommodate wide video buses (24-bit RGB plus control) alongside memory interfaces to external SDRAM or SRAM frame buffers. Designers use the multiVolt I/O to interface directly to 3.3 V video DACs and 5.0 V sync logic, while the 0.6 ns Tpd keeps timing margins comfortable at pixel clocks up to 100 MHz.
Recommended
ASIC Prototyping and Emulation
The EPF10K130EBC356-3 serves as an ASIC prototyping vehicle where designers map pre-silicon RTL to the FLEX-10KE fabric to validate functionality, software drivers, and system integration before tape-out. The 130K-gate capacity accommodates medium-complexity ASIC blocks, while the embedded RAM models on-chip SRAMs. Engineers often partition a multi-FPGA ASIC prototype across several EPF10K130EBC356-3 devices, leveraging the 356-LBGA's high I/O count to interconnect emulation partitions with minimal external wiring and the -3 speed grade to maintain real-time emulation throughput.
Recommended
Legacy System Maintenance and Long-Life Programs
The EPF10K130EBC356-3 supports long-lifecycle maintenance of fielded systems in military, aerospace, and industrial-automation programs where the original FLEX-10KE-based design must continue operating for 15-25 years. Rochester Electronics is the primary authorized aftermarket source, holding bonded inventory of EPF10K130EBC356-3 units for call-off contracts. The -3 speed grade, 356-LBGA footprint, and standard 2.5 V core supply maintain bitstream compatibility with original designs, so field-replacement units require no firmware changes or timing reclosure.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K130EBC356-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K130EBC356-2 | EPF10K130EBC356-1 | EPF10K130EBC356-1N | EPF10K130EBC356-1X | EPF10K100EBC356-3 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 356-LBGA (35x35 mm) | 356-LBGA (35x35 mm) - same | 356-LBGA (35x35 mm) - same | 356-LBGA (35x35 mm) - same | 356-LBGA (35x35 mm) - same | 356-LBGA (35x35 mm) - same |
| Typical Gates | 130,000 | 130,000 | 130,000 | 130,000 | 130,000 | 100,000 (-23%) |
| Logic Elements | 8,192 | 8,192 | 8,192 | 8,192 | 8,192 | 6,272 (-23%) |
| Speed Grade (Tpd) | -3 (~0.6 ns) | -2 (~0.7 ns, +17%) | -1 (~0.9 ns, +50%) | -1 (~0.9 ns, +50%) | -1 (~0.9 ns, +50%) | -3 (~0.6 ns, identical) |
| Maximum User I/Os | 274 | 274 | 274 | 274 | 274 | 274 |
| Operating Temperature | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) | -40 °C to +85 °C (Industrial) | 0 °C to +70 °C (Commercial, Pb-free) | 0 °C to +70 °C (Commercial) |
| Core Voltage | 2.5 V (2.375-2.625 V) | 2.5 V (2.375-2.625 V) | 2.5 V (2.375-2.625 V) | 2.5 V (2.375-2.625 V) | 2.5 V (2.375-2.625 V) | 2.5 V (2.375-2.625 V) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| RoHS Compliance | Non-compliant | Non-compliant | Non-compliant | Non-compliant | Compliant (Pb-free) | Non-compliant |
Key Differentiators
- Fastest speed grade in the FLEX-10KE 130K-gate family (vs EPF10K130EBC356-2)
- Higher logic density than the next-lower-density FLEX-10KE variant (vs EPF10K100EBC356-3)
- Wider availability through Rochester Electronics' bonded inventory program (vs EPF10K130EBC356-1N)
Design Notes
The EPF10K130EBC356-3 requires a tightly regulated 2.5 V core supply (2.375-2.625 V) with peak transient current up to ~500 mA during configuration and high-utilization operation. Estimated: at 100% logic utilization with 274 switching I/Os at 33 MHz, ICC_core is approximately 300-450 mA. Place a 10 µF tantalum + 4.7 µF ceramic + 0.1 µF ceramic decoupling network within 5 mm of each VCC pin cluster. The 3.3 V/5.0 V VCCIO banks must be powered before or simultaneously with VCCINT to prevent I/O latchup; a Schottky diode or power-sequencer is recommended for hot-plug safety.
The 356-LBGA package has a theta_JA of approximately 12-15 °C/W with a properly designed thermal via array (estimated, depends on PCB stackup). Estimated: at 1.5 W total dissipation and 25 °C ambient, junction temperature rises 18-22 °C, well within the 125 °C maximum. For high-utilization designs exceeding 2 W, populate a full thermal-via array under the exposed pad and stitch thermal reliefs to internal copper planes on a 4-layer PCB. The commercial temperature grade limits operation to 0-70 °C ambient, derated by junction-to-ambient thermal resistance.
Use a minimum 4-layer PCB with continuous VCC and GND planes for the EPF10K130EBC356-3. The 356-LBGA uses 1.27 mm pitch — escape routing requires 0.2 mm (8 mil) traces with 0.2 mm spaces on the top layer, then via-down to inner BGA breakouts. Maintain 50 Ω controlled impedance on clock and high-speed I/O traces (nCONFIG, DCLK, CONF_DONE). Route all configuration signals (nCONFIG, nSTATUS, CONF_DONE, DCLK) away from switching I/O to prevent in-system programming glitches. Provide a JTAG header (TCK, TMS, TDI, TDO) per IEEE 1149.1 for boundary-scan and programming access.
Three common pitfalls when migrating the EPF10K130EBC356-3 between speed grades: (1) the -3 (0.6 ns Tpd) and -1 (0.9 ns Tpd) share the same bitstream format, but timing closure fails if a design synthesized for -3 is loaded onto -1 — re-run timing analysis with Quartus II for the target speed grade; (2) mixing commercial (0-70 °C) and industrial (-40-85 °C) variants without checking the part marking causes field failures; (3) confusing the EPF10K100EBC356-3 (100K gates) with EPF10K130EBC356-3 (130K gates) on a BOM swap causes logic overflow — verify gate count via Quartus compilation report before substitution.
For 33 MHz PCI bus interfaces, maintain 65 Ω ±10% trace impedance (PCI specification) and keep PCI bus traces under 50 mm length with matched lengths within ±5 mm. Use series 33 Ω damping resistors on PCI clock nets within 15 mm of the EPF10K130EBC356-3. Enable PCI-compliant I/O drivers in the Quartus II pin planner (PCI-I/O standard). For LVTTL or LVCMOS interfaces above 50 MHz, apply series 22 Ω damping resistors on clock and strobe nets. IBIS models for the FLEX-10KE family are available from Intel's Altera literature archive for board-level signal-integrity simulation.
Compliance Information
EPF10K130EBC356-3 uses SnPb (tin-lead) BGA balls per legacy Altera packaging standards, hence RoHS non-compliant. The -1X variant (EPF10K130EBC356-1X) is the Pb-free RoHS-compliant option. Reach, halogen-free, and conflict-mineral status not explicitly published in the available data. AEC-Q100 is not applicable to commercial-grade FPGAs; for automotive-grade, no FLEX-10KE variant is qualified — automotive designers must migrate to Cyclone IV/V.