EPF10K200SFC484-2 - FLEX 10KS FPGA 200K Gates | Altera / Intel
MPN: EPF10K200SFC484-2 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132.5 | $1,325.00 |
| 100 | $115 | $11,500.00 |
| 500 | $99.75 | $49,875.00 |
| 1,000 | $88.4 | $88,400.00 |
EPF10K200SFC484-2 Overview
An FPGA (Field Programmable Gate Array) is a type of programmable logic device that combines the architectural flexibility of gate arrays with the design-turnaround advantage of in-system programmability. FPGAs sit hierarchically as: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. The FLEX 10KS family specifically introduced embedded array blocks (EABs) for on-chip memory and DSP-like functions, bridging the gap between classic PLDs and modern SRAM-based FPGAs.
Key features include 369 LABs (Logic Array Blocks), 4 EABs of 2,048 bits each for embedded memory, 4 embedded PLLs for clock management, multiVolt I/O supporting 2.5V/3.3V/5V interfacing, and JTAG-based IEEE 1149.1 boundary-scan testing. Core supply is 2.5V with separate VCCIO banks for I/O voltage flexibility.
Architecturally, the FLEX 10K uses a CMOS SRAM cell with continuous, routable interconnect. Look-up tables (LUTs) drive combinational logic while EABs implement RAM, ROM, or multiplier functions. This hybrid architecture enabled designers to integrate logic and memory on a single die, foreshadowing modern system-on-chip FPGA concepts.
Typical applications include telecommunications infrastructure (line cards, bridges), industrial control systems, high-performance computing accelerators, and ASIC prototyping. The 484-pin FineLine BGA also supports migration across the FLEX 10K family using SameFrame pin-out compatibility.
When designing with this part, ensure proper decoupling (100 nF + 10 uF per supply pin group), JTAG chain integrity, and configuration source selection (EPC configuration device or microcontroller). Operating temperature is commercial 0C to 70C. Lead-free BGA soldering requires peak reflow profiles per JEDEC J-STD-020.
This page synthesizes distributor pricing, drop-in FPGA alternatives within the FLEX 10KS family, and practical design notes not found in the original datasheet.
Drop-in alternatives for EPF10K200SFC484-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K200SFC484-2 (same form factor and footprint) — differing in Family, Package, Speed Grade, Operating Temperature, Propagation Delay.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K200SFC484-2X
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EPF10K200SFC484-1
✅ Drop-In✓ In Stock
$162 / Unit
View Datasheet →EPF10K200SFC484-1N
✅ Drop-In✓ In Stock
$185.25 / Unit
View Datasheet →EPF10K200SFC484-1X
✅ Drop-In✓ In Stock
$142 / Unit
View Datasheet →EPF10K130EFC484-3
✅ Drop-In✓ In Stock
$178.92 / Unit
View Datasheet →EPF10K130EFC484-3N
✅ Drop-In✓ In Stock
$109.25 / Unit
View Datasheet →EPF10K130EFC484-2
✅ Drop-In✓ In Stock
$105 / Unit
View Datasheet →EPF10K130EFC484-2N
✅ Drop-In✓ In Stock
$799 / Unit
View Datasheet →EPF10K200SFC484-2 Maximum Ratings & Electrical Characteristics
| Series | FLEX 10KS |
| Family | FLEX 10K (FLEX-10KS subfamily) |
| Logic Elements / Cells | 9,984 |
| System Gates | 200,000 |
| Embedded Memory (RAM bits) | 98,304 |
| Embedded Array Blocks (EAB) | 4 EABs x 2,048 bits |
| Logic Array Blocks (LAB) | 369 |
| User I/Os | 369 |
| Propagation Delay | 0.4 ns (max) |
| Number of Pins | 484 |
| Package Type | FineLine BGA-484 (23 x 23 mm, 1.0 mm pitch) |
| Technology | 0.22 um CMOS, SRAM-based |
| Core Supply Voltage | 2.5 V (2.375 V to 2.625 V) |
| I/O Supply Voltage | 2.5 V / 3.3 V / 5 V (multiVolt I/O) |
| Operating Temperature | 0 C to +70 C (commercial) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant (lead-free) |
| Configuration Method | EPC configuration device, JTAG, or microcontroller |
| Speed Grade | -2 (faster than -3) |
| PLL Count | 4 |
EPF10K200SFC484-2 fineline bga-484 (23 x 23 mm, 1.0 mm pitch) Pin Configuration Guide
Pin configuration for EPF10K200SFC484-2 (fineline bga-484 (23 x 23 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K200SFC484-2.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K200SFC484-2 is suitable for 7 applications: Telecommunications Line Card Interface, Industrial Control and Factory Automation, ASIC Prototyping and Emulation, High-Performance Computing Accelerator, Legacy Medical Imaging Signal Chain, Military/Aerospace Test Equipment (COTS-based), Educational FPGA Training Platforms.
Telecommunications Line Card Interface
The EPF10K200SFC484-2's 200K system gates and 369 user I/Os map directly to T1/E1 framer interfaces, Utopia backplanes, and HDLC controllers in legacy telecom line cards. Its 4 embedded PLLs handle multi-rate clock synthesis for 1.544 MHz and 2.048 MHz traffic streams without external clock buffers. The FineLine BGA-484 footprint integrates cleanly onto 6-layer telecom backplane PCBs while the 2.5V core keeps board power below 5W typical. Engineers value this part for TDM switching fabrics and ATM segmentation-and-reassembly blocks where embedded EAB RAM eliminates the need for external FIFOs.
Recommended
Industrial Control and Factory Automation
With 200K gates and 369 I/Os, the EPF10K200SFC484-2 supports multi-axis motor controllers, PLC scan engines, and fieldbus protocol bridges (Profibus, DeviceNet, Modbus) in a single chip. The commercial 0C to 70C operating range suits factory-floor enclosures with forced-air cooling. EAB blocks enable deterministic message buffering for real-time industrial Ethernet protocols, while multiVolt I/O banks drive both 5V and 3.3V sensors from the same device. Designers choose this FPGA for legacy plant upgrades where firmware-defined logic reduces component count versus discrete microcontrollers plus ASICs.
Recommended
ASIC Prototyping and Emulation
ASIC design teams historically used the EPF10K200SFC484-2 as a cost-effective ASIC prototype substrate because its 200K gates could absorb entire sub-blocks of multi-million-gate SoCs. The SRAM-based configuration supports in-system reprogramming via JTAG, enabling rapid design iteration. MultiVolt I/O allows direct connection to ASIC pad libraries at 2.5V/3.3V/5V. Internal EABs emulate ASIC RAM macros for timing-accurate system validation. Note: for new ASIC prototyping today, modern Cyclone V or Stratix 10 FPGAs offer far higher density, but the FLEX 10KS remains in service for legacy ASIC regression racks.
Recommended
High-Performance Computing Accelerator
The EPF10K200SFC484-2 served as a coprocessor in 1990s HPC clusters for bit-level parallelism in DSP, encryption, and signal processing workloads. Its 4 PLLs deliver multiple clock domains needed for pipeline stages, while 98 Kbits of internal RAM supports local coefficient storage for FIR filters. Latency-critical applications such as forward-error-correction (FEC) decoders exploited the 0.4 ns propagation delay of speed grade -2. Today, equivalent functions are served by Stratix V or Arria 10 FPGAs, but the FLEX 10KS remains in legacy Cray-style HPC mainframes for backward compatibility.
Recommended
Legacy Medical Imaging Signal Chain
Ultrasound beamformers and CT scanner front-end boards used the EPF10K200SFC484-2 to implement beam-steering FIR filters and channel-multiplex logic in the early 2000s. The 200K gate capacity handles 16-channel beamforming per FPGA, and the 369 user I/Os connect directly to A/D converters without external bus drivers. Embedded EABs store steering coefficients for dynamic focal-point adjustment during real-time scan. Today, medical OEMs retain this FPGA for certified legacy equipment that requires FDA 510(k) trace continuity - substitution to a newer FPGA would force re-certification, so the obsolete part remains in service via franchised distributor stock.
Recommended
Military/Aerospace Test Equipment (COTS-based)
Defense prime contractors historically built COTS-based (commercial off-the-shelf) avionics test racks around the EPF10K200SFC484-2 because its 200K gates could emulate MIL-STD-1553 buses, ARINC 429 interfaces, and FibreChannel arbitrated loops. The 484-ball FineLine BGA survives MIL-STD-810 shock and vibration tests when board-stacked with appropriate underfill. Multiple JTAG chains allowed parallel testing of redundant channels. Because the part is obsolete, defense sustainment programs now source through franchised distributors with C-of-C documentation. For new designs, modern radiation-tolerant FPGAs from Microchip RTG4 or Xilinx XQR Kintex are preferred.
Recommended
Educational FPGA Training Platforms
University electronics laboratories use the EPF10K200SFC484-2 on legacy Altera development kits (such as the Nios development board classic edition) to teach VHDL/Verilog hardware description, JTAG-based configuration flows, and FLEX 10K architecture fundamentals. The 200K gate capacity supports meaningful student projects such as CPU cores, peripheral controllers, and image-processing pipelines. Courseware still references FLEX 10K because Altera's QUARTUS MAX+PLUS II legacy design flow remains pedagogically simple. For new university procurement, modern Cyclone IV or Cyclone 10 LP kits are recommended, but FLEX 10K boards persist in second-hand laboratory inventories.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K200SFC484-2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K200SFC484-2X | EPF10K200SFC484-1 | EPF10K130EFC484-3 | EPF10K130EFC484-2 |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 484-FBGA FineLine BGA (23x23 mm) | 484-FBGA FineLine BGA (same) | 484-FBGA FineLine BGA (same) | 484-FBGA FineLine BGA (same) | 484-FBGA FineLine BGA (same) |
| Family | FLEX 10KS | FLEX 10KS | FLEX 10KS | FLEX 10KE (enhanced) | FLEX 10KE (enhanced) |
| System Gates | 200,000 | 200,000 | 200,000 | 130,000 | 130,000 |
| Speed Grade | -2 | -2 | -1 (slower) | -3 (slower) | -2 |
| Lead-Free / RoHS | Yes (RoHS compliant) | Yes (RoHS compliant) | Non-RoHS | Non-RoHS | Non-RoHS |
| Logic Density vs Target | 100% | 100% | 100% | 65% | 65% |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- 200K gates (vs 130K) at the same 484-ball FineLine BGA footprint (vs EPF10K130EFC484-3)
- RoHS/lead-free compliance for EU export markets (vs EPF10K200SFC484-1)
- Speed grade -2 propagation delay of 0.4 ns enables 200 MHz internal Fmax (vs EPF10K200SFC484-1)
Design Notes
The EPF10K200SFC484-2 requires a 2.5V core supply (VCCINT) with tight regulation (2.375V to 2.625V); use an LDO or DC-DC converter with at least 2A capacity for the core alone. Each VCCIO bank is independently powered at 2.5V/3.3V or 5V; budget 500 mA per active bank under heavy I/O switching. Decoupling follows Altera's reference: 100 nF X7R ceramic on every VCCINT and VCCIO pin plus 10 uF bulk tantalum per supply plane. Inrush during configuration peaks at approximately 1.5A; ensure the regulator maintains monotonic ramp-up.
The 484-ball FineLine BGA uses a 1.0 mm pitch on a 23 x 23 mm footprint, requiring HDI PCB stack-up with microvias for signal escape. Recommended: 6-layer board with 4 routing layers, 4 mil trace/space, and laser-drilled microvias on inner pads. Matched-length routing for clock pairs is mandatory - skew should be <50 ps for any single clock domain. Provide a continuous ground pour beneath the BGA for thermal dissipation and return-current continuity. JTAG chain signal integrity requires series-damping resistors on TMS/TDI/TCK within 25 mm of the FPGA.
Although the FLEX 10KS is not high-power, sustained toggling of all 369 I/Os at 50 MHz can dissipate 1.5-2.0 W. With theta_JA around 18 C/W on a JEDEC 4-layer test board, this yields a junction temperature rise of 27-36 C above ambient. Mount within a chassis that maintains ambient below 50 C so the junction remains under the 85 C commercial limit. Thermal vias under the center balls (within the depopulated grid region) improve heat transfer; at least 9 thermal vias on a 1.2 mm pitch are recommended per Altera thermal management guidelines.
Configure the EPF10K200SFC484-2 via the EPC2 or EPC8 configuration device, JTAG (IEEE 1149.1), or microcontroller-driven PS (Passive Serial) mode. For production boards, place the EPC configuration flash within 50 mm of the FPGA to keep the DCLK trace length manageable. JTAG chain: TMS, TDI, TDO, TCK all require 10 kohm pull-ups to VCCIO_3V3 for reliable operation; TDO is high-impedance during configuration and must be buffered if observed by a tester. Use the nCONFIG pin to delay configuration during power-rail sequencing.
Common pitfalls: (1) Using FLEX 10KE (E-suffix) libraries instead of FLEX 10KS (S-suffix) - the E family removes some EABs and changes interconnect; verify timing closure. (2) Mixing 5V and 3.3V on the same I/O bank - each VCCIO pin supports only one voltage per bank. (3) Driving JTAG signals from 5V logic without level shifters - VCCIO of the JTAG bank must match the driver voltage. (4) Confusing FLEX 10K FPGAs with FLEX 10KA/10KE die variants - SameFrame pin migration is only guaranteed between certain density steps (verify against the Altera SameFrame Pin Migration Table).
Compliance Information
EPF10K200SFC484-2 is RoHS compliant and lead-free per Altera (Intel) product marking. Not AEC-Q100 qualified (commercial grade only, 0C to 70C). REACH compliance inferred from manufacturer declaration; verify with Intel PSG for current SVHC list status. Halogen-free status not published in datasheet excerpts provided.
