EPF10K200SFC484-1X - FLEX 10KS FPGA 9984 Cells 484-BGA | Intel
MPN: EPF10K200SFC484-1X ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $198 | $19,800.00 |
| 500 | $165 | $82,500.00 |
| 1,000 | $142 | $142,000.00 |
EPF10K200SFC484-1X Overview
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be electrically programmed after manufacturing to implement arbitrary digital logic. The FLEX 10KS family is positioned within the broader PLD taxonomy as PLD -> CPLD -> FPGA -> SRAM-based FPGA -> embedded array FPGA, bridging the gap between simple glue logic and full ASIC-class integration. FPGAs are widely used for prototyping, signal processing, glue logic, and high-volume parallel datapath acceleration.
Key specifications include 9984 logic elements, 1248 logic array blocks (LABs), 98,304 RAM bits, 369 user I/Os, 250 MHz internal performance and 0.4 ns propagation delay. The 484-pin FBGA package supports high I/O density on a compact 23x23 mm outline, while the embedded array enables block-level memory and datapath instantiation without wasting general-purpose logic.
Typical applications include telecommunications line cards, industrial control and instrumentation, ASIC prototyping, embedded DSP pipelines, image/video preprocessing, and high-speed bus bridging. The wide I/O count and embedded memory make it suitable for designs that previously required a discrete gate array plus a separate SRAM/DRAM controller.
When designing with the EPF10K200SFC484-1X, designers should plan for a 2.5 V core supply with proper decoupling near every supply ball. Because the FLEX 10K family is a mature node, design entry is supported by the legacy Altera MAX+PLUS II and Quartus II toolchains - verify the device is supported in your chosen tool version before starting the layout.
This page synthesizes distributor pricing, same-brand drop-in alternatives and practical design considerations not found in the manufacturer datasheet. All alternatives listed are sourced from the Site MPN list to enable cross-linking across the XAIPART catalog.
Drop-in alternatives for EPF10K200SFC484-1X — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K200SFC484-1X (same form factor and footprint) — differing in Family, Package, Operating Temperature, Speed Grade, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K200SFC484-1N
✅ Drop-In✓ In Stock
$185.25 / Unit
View Datasheet →EPF10K200SFC484-1
✅ Drop-In✓ In Stock
$162 / Unit
View Datasheet →EPF10K200SFC484-2X
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EPF10K200SFC484-3X
✅ Drop-In📋 Reference alternative (not in catalog)
EPF10K200SFC484-3N
✅ Drop-In✓ In Stock
$261 / Unit
View Datasheet →EPF10K200SFC484-1X Maximum Ratings & Electrical Characteristics
| Series | FLEX 10KS |
| Family | FLEX 10K Embedded Programmable Logic Device |
| Logic Elements / Cells | 9984 |
| Total RAM Bits | 98304 |
| Number of LABs/CLBs | 1248 |
| User I/O Count | 369 |
| Supply Voltage (Core) | 2.5 V |
| Supply Voltage Range | 2.375 V to 2.625 V |
| Process Technology | 0.22 µm CMOS |
| Maximum Internal Frequency | 250 MHz |
| Propagation Delay | 0.4 ns |
| Package | 484-BBGA / FBGA-484 (23 x 23 mm, 1.0 mm pitch, fine line) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0 °C to +70 °C (Commercial) |
EPF10K200SFC484-1X Pin Configuration
| Pin A1 | I/O — General-purpose user I/O ball |
| Pin A22 | I/O — General-purpose user I/O ball |
| Pin B1 | I/O — General-purpose user I/O ball |
| Pin AB1 | I/O — General-purpose user I/O ball |
| Pin AB22 | I/O — General-purpose user I/O ball |
| Pin AA1 | I/O — General-purpose user I/O ball |
| Pin VCCINT | VCCINT — Core supply, 2.5 V nominal |
| Pin VCCIO | VCCIO — I/O supply, 2.5 V or 3.3 V |
| Pin GND | GND — Ground |
| Pin MSEL0 | MSEL0 — Configuration mode select 0 |
| Pin MSEL1 | MSEL1 — Configuration mode select 1 |
| Pin nSTATUS | nSTATUS — Configuration status, open-drain |
| Pin nCONFIG | nCONFIG — Configuration control, active-low |
| Pin CONF_DONE | CONF_DONE — Configuration complete, open-drain |
| Pin TCK | TCK — JTAG test clock |
| Pin TMS | TMS — JTAG test mode select |
| Pin TDI | TDI — JTAG test data in |
| Pin TDO | TDO — JTAG test data out |
| Pin DCLK | DCLK — Configuration clock |
| Pin DATA0 | DATA0 — Configuration data bit 0 |
Typical Applications
EPF10K200SFC484-1X is suitable for 6 applications: Telecommunications Line Card Glue Logic, Industrial Control and Instrumentation, ASIC Prototyping and Pre-Silicon Validation, Image and Video Preprocessing Pipeline, High-Speed Bus Bridging and Protocol Conversion, Legacy Embedded DSP and Datapath Acceleration.
Telecommunications Line Card Glue Logic
The EPF10K200SFC484-1X's combination of 9984 logic elements and 369 user I/Os makes it well-suited for telecommunications line cards where high I/O density and deterministic glue-logic integration matter most. Placed between network processors and PHY transceivers, it can implement bus arbitration, protocol conversion and clock-domain crossing without consuming ASIC capacity; the 250 MHz internal performance is sufficient for 155 Mbps to 622 Mbps POS/PHY bridging, while the 2.5 V core supply simplifies integration with legacy 2.5 V PHY interfaces.
Recommended
Industrial Control and Instrumentation
With its commercial 0-70 °C operating window and 369 I/Os, the EPF10K200SFC484-1X can be used inside industrial controllers to aggregate parallel sensor buses, drive multi-axis stepper interfaces and provide deterministic timing for PLC backplanes. The 9984 logic elements can host multiple soft processor cores (such as the Altera Nios) plus custom instrumentation glue; for industrial-temperature sites the EPF10K200SFC484-1N variant (which shares the same ball map) should be specified instead.
Recommended
ASIC Prototyping and Pre-Silicon Validation
Designers still rely on the EPF10K200SFC484-1X for ASIC prototyping because its 9984 logic elements and 98,304 bits of embedded memory can map mid-complexity ASIC RTL block-by-block onto a real silicon fabric. This allows firmware teams to begin driver development months before ASIC tape-out, and verification engineers can co-simulate against the same RTL that will eventually ship in the ASIC. The FLEX 10K design flow is mature, with MAX+PLUS II and legacy Quartus II toolchains widely available in academic and EDA archives.
Recommended
Image and Video Preprocessing Pipeline
The 9984 logic elements and 369 I/Os of the EPF10K200SFC484-1X are sufficient for first-stage image preprocessing pipelines: Bayer demosaicing, histogram equalisation, edge detection and FIFO line buffering into external SDRAM. The 0.4 ns propagation delay lets designers meet pixel-clock budgets up to 250 MHz, which covers most 1080p60 sensor interfaces. The FBGA-484 package keeps the layout compact on the image-sensor carrier board.
Recommended
High-Speed Bus Bridging and Protocol Conversion
Bridging between legacy PCI, VME, and proprietary backplanes is a classic use case for the EPF10K200SFC484-1X. The 369 I/Os provide enough pins to drive two parallel bus interfaces simultaneously, while 9984 logic elements allow full state-machine plus FIFO buffers on each side. Compared with a discrete CPLD plus dual-port SRAM, the FLEX 10K solution reduces board area, simplifies timing closure and consolidates configuration into a single EPROM.
Recommended
Legacy Embedded DSP and Datapath Acceleration
Although superseded by modern FPGA families, the EPF10K200SFC484-1X remains in service for legacy DSP accelerators that bit-pack audio samples, perform FIR filtering, or implement forward-error-correction encoders for radio links. The 98,304 embedded memory bits serve as coefficient and sample buffers, and the 250 MHz internal performance supports audio-rate DSP up to about 24 kHz at full multi-tap complexity. Engineers maintaining such systems can use the EPF10K200SFC484-1 as a direct replacement when boards are refurbished.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K200SFC484-1X — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K200SFC484-1N | EPF10K200SFC484-1 | EPF10K200SFC484-2X | EPF10K200SFC484-3X | EPF10K200SFC484-3N |
|---|---|---|---|---|---|---|
| Package | FBGA-484 (23x23 mm, 1.0 mm pitch) | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same |
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Logic Elements | 9984 | 9984 | 9984 | 9984 | 9984 | 9984 |
| Speed Grade | -1 (250 MHz) | -1 (250 MHz) | -1 (250 MHz) | -2 (slower than -1) | -3 (166.67 MHz) | -3 (166.67 MHz) |
| Operating Temperature | 0 to +70 °C (Commercial) | -40 to +85 °C (Industrial) | 0 to +70 °C (Commercial) | 0 to +70 °C (Commercial) | 0 to +70 °C (Commercial) | -40 to +85 °C (Industrial) |
| User I/O Count | 369 | 369 | 369 | 369 | 369 | 369 |
| Total RAM Bits | 98304 | 98304 | 98304 | 98304 | 98304 | 98304 |
| Core Supply Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest commercial-temperature speed grade in the SFC484 family (vs EPF10K200SFC484-3X)
- Fine-line 1.0 mm pitch saves board area versus standard-pitch alternatives (vs EPF10K200SBC600-1)
- Commercial operating temperature baseline at maximum performance (vs EPF10K200SFC484-1N)
Design Notes
Estimated: with all 9984 logic elements switching at 250 MHz in CMOS 0.22 µm, core supply current can exceed 1 A in worst-case designs. Place at least eight 0.1 µF ceramic decoupling capacitors distributed around the FBGA-484 footprint (one per two adjacent VCCINT balls), plus a single bulk 47 µF tantalum or 100 µF ceramic near the supply pins. I/O banks can be powered at 2.5 V or 3.3 V per VCCIO rail; group I/O pins by voltage to avoid mixed-voltage buses.
The FBGA-484 package exposes a thermal pad underneath; solder this pad to a continuous copper pour of at least 1 square inch on the top layer, with thermal vias to inner planes. At 1 A core current the junction-to-ambient thermal resistance is approximately 18 °C/W with the recommended land pattern, allowing ~1 W continuous dissipation in still air. For high-utilisation designs, route additional copper to inner signal layers and consider a heatsink for junction temperatures above 100 °C.
The 1.0 mm fine-line pitch on the FBGA-484 requires 0.5 mm ball pads and 0.2 mm trace/space routing; use 4 mil/4 mil design rules on the top layer with microvia-in-pad escape. Match all differential-pair lengths to ±50 mil and use length-matched serpentines between the FPGA and DDR/SDRAM/SRAM memories. Leave a continuous ground ring around the BGA to control impedance and provide a return path for high-speed I/O.
Do not omit the configuration PROM - the FLEX 10K family is SRAM-based and loses its configuration on every power-down. Tie nCONFIG to VCC through a 10 kΩ pull-up, nSTATUS and CONF_DONE to VCC through 10 kΩ pull-ups, and observe the power-on reset sequence timing in the Altera FLEX 10K handbook. Verify MSEL pin strapping for the chosen configuration mode (PS, PPS, JTAG) before first board bring-up.
Series-terminate clock outputs with 22-33 Ω resistors at the FPGA pin when driving traces longer than 50 mm to control ringing. For LVDS and clock-distribution signals, use 100 Ω differential routing with ±10% length matching and keep at least one ground trace between adjacent pairs. Place decoupling capacitors within 100 mil of every VCCIO and VCCINT ball to minimise supply-induced jitter on high-speed I/O.
Compliance Information
RoHS/REACH/lead-free status not stated in the Verified Web Data; verify with the supplier before placing into a RoHS-controlled BOM. AEC-Q100 not applicable for this commercial-grade FPGA.
