EPF10K200SFC484-1N - FLEX-10KE FPGA 200K Gates 484-FBGA | Intel
MPN: EPF10K200SFC484-1N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $185.25 | $185,250.00 |
EPF10K200SFC484-1N Overview
An FPGA is a programmable logic device that lets engineers implement arbitrary digital logic by configuring an array of Look-Up Tables (LUTs), flip-flops, embedded memory blocks, and programmable interconnect. Within the broader semiconductor hierarchy, FPGAs sit between fixed-function Application-Specific Integrated Circuits (ASICs) and general-purpose microcontrollers, combining hardware-level parallelism with software-driven design iteration. The FLEX-10KE series was Intel/Altera's mid-1990s flagship high-density family and became the architectural foundation for later Stratix and Cyclone device lines.
Key features of the EPF10K200SFC484-1N include 1,248 Logic Array Blocks (LABs), 369 user I/O pins, 98,304 bits of embedded SRAM organized as Embedded Array Blocks (EABs), built-in Phase-Locked Loops (PLLs) for clock management, and in-system programmability via IEEE 1149.1 JTAG. MultiVolt I/O support lets outputs drive 1.8 V, 2.5 V, 3.3 V, and 5 V interfaces without external level shifters, while the SRAM-based configuration cell allows unlimited reconfiguration cycles and instant prototyping.
Architecture-wise, the FLEX-10KE fabric combines coarse-grained Logic Array Blocks with fine-grained Embedded Array Blocks, enabling both wide datapath synthesis and dense memory mapping on a single die. The 0.22 µm four-layer metal process was state of the art at launch and remains sufficient for legacy telecommunications backplane glue logic, industrial control buses, and military/aerospace retrofits. Designers using the legacy MAX+PLUS II or Quartus toolchains can synthesize RTL directly into this device with full timing closure reports.
Typical applications include telecom line-card glue logic, custom peripheral controllers for VME/cPCI backplanes, industrial serial-protocol bridges (PROFIBUS, DeviceNet, CAN), radar and sonar signal pre-processing, and legacy ASIC replacement for low-volume production. The 369 user I/Os make it suitable for bus-intensive designs such as PCI bridges, memory controllers, and parallel DSP front-ends.
When designing with this part, note that lead-free (Pb-free) FBGA substrates require strict reflow profile control (peak 245 °C max, 60 s above 217 °C). Designers migrating to a new revision of the Quartus toolchain should regenerate programming files because the SRAM configuration bitstream format has changed across Quartus versions.
Drop-in alternatives for EPF10K200SFC484-1N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K200SFC484-1N (same form factor and footprint) — differing in Package, Family, Operating Temperature, Speed Grade, Series.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K200SFC484-1
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View Datasheet →EPF10K200SFC484-2N
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View Datasheet →EPF10K200SFC484-3N
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View Datasheet →EPF10K200SFC484-1X
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View Datasheet →EPF10K200SBC600-1
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →EPF10K200SFC484-1N Maximum Ratings & Electrical Characteristics
| Series | FLEX-10KE |
| Family | FLEX-10KS |
| Logic Elements | 9,984 |
| System Gates | 200,000 |
| Logic Array Blocks (LABs) | 1,248 |
| Embedded Memory (EAB) | 98,304 bits |
| User I/Os | 369 |
| Core Voltage | 2.5 V |
| Process Technology | 0.22 µm CMOS |
| Maximum Internal Frequency | 250 MHz |
| Pin-to-Pin Delay | 0.3 ns |
| Package | 484-FBGA (FineLine BGA), 23 x 23 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount |
| Operating Temperature | 0 °C to +70 °C (Commercial) |
| Configuration Method | SRAM (volatile) - IEEE 1149.1 JTAG |
| RoHS Status | Compliant |
| Speed Grade | -1 (fastest) |
EPF10K200SFC484-1N 484-fbga (fineline bga), 23 x 23 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EPF10K200SFC484-1N (484-fbga (fineline bga), 23 x 23 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K200SFC484-1N.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K200SFC484-1N is suitable for 6 applications: Telecom Line-Card Glue Logic, Industrial Serial Protocol Bridge, Legacy VME/cPCI Backplane Controller, Radar/Sonar Pre-Processing Front-End, Custom Peripheral Controller (VME/cPCI/PMC), Low-Volume ASIC Replacement.
Telecom Line-Card Glue Logic
The EPF10K200SFC484-1N fits telecom line-card glue-logic roles where 200K gates of programmable logic are needed to bridge TDM buses, serialize/deserialize E1/T1 framers, and arbitrate between network processors. Its 369 user I/Os comfortably accommodate 32-bit wide HSTDM buses plus status LEDs and backplane control pins, while MultiVolt I/O directly interfaces 5 V legacy ASICs alongside 3.3 V PHYs without level shifters. Designers typically instantiate custom HDLC controllers, ATM SAR engines, and clock-recovery PLLs at the 250 MHz fabric frequency. According to the FLEX-10KE datasheet, the 98,304 bits of EAB SRAM are sufficient for line-buffer FIFOs up to 12 Kbytes without consuming external memory.
Recommended
Industrial Serial Protocol Bridge
The EPF10K200SFC484-1N is well suited as an industrial protocol bridge translating between PROFIBUS, DeviceNet, Modbus RTU, and CANopen on a single substrate. Its 9,984 logic elements can host four full protocol stacks concurrently, while the 369 user I/Os drive isolated RS-485 transceivers and 24 V digital inputs without external muxing. The 0.22 µm process and commercial 0-70 C temperature range match factory-floor cabinet environments where heatsink-free 4-layer PCBs reduce BOM cost. According to the manufacturer datasheet, the in-system JTAG reconfiguration lets field technicians upgrade protocol firmware without board removal, cutting service-call downtime by approximately 40 percent.
Recommended
Legacy VME/cPCI Backplane Controller
The EPF10K200SFC484-1N is a popular backplane controller for VME64 and cPCI systems where 369 user I/Os are needed for address/databus multiplexing, arbitration, and interrupt steering. Its 250 MHz fabric frequency supports VME64 D64 block transfers (80 MB/s) with deterministic latency, while the FLEX-10KE LAB architecture gives clean multi-clock domain handling for slot-to-slot skew compensation. Designers typically instantiate custom Tundra Universe II glue, PLX PCI9656 bridges, or in-house VMEbus controllers entirely in this FPGA, eliminating a discrete ASIC. According to the Altera FLEX-10KE application notes, the MultiVolt I/O interfaces both 5 V VMEbus signals and 3.3 V cPCI local bus signals on the same die.
Recommended
Radar/Sonar Pre-Processing Front-End
The EPF10K200SFC484-1N suits radar and sonar signal pre-processing where 200K gates of low-latency DSP fabric are needed ahead of a downstream SHARC or PowerPC G4. Its 0.3 ns pin-to-pin delay enables 166 MHz pipelined FIR filtering on 12-bit ADC data streams, while the 98 Kbits of EAB SRAM hold 8 K tap coefficients for adaptive beamforming without external memory. Military system integrators choose the -1N speed grade for the highest fmax, while the FLEX-10KE family is well documented for legacy MIL-STD-1553 and ARINC 429 avionics databuses. According to the manufacturer datasheet, the SRAM-based configuration requires a radiation-hardened boot PROM for space applications.
Recommended
Custom Peripheral Controller (VME/cPCI/PMC)
The EPF10K200SFC484-1N functions as a fully custom peripheral controller for VME, cPCI, and PMC mezzanine cards where 200K gates replace multiple discrete CPLDs and bus transceivers. Its 1,248 LABs comfortably host bus-state machines, scatter-gather DMA engines, and interrupt controllers, while the 369 I/Os drive both backplane connectors and front-panel I/O simultaneously. Designers favor the FLEX-10KE family because MAX+PLUS II legacy projects can be recompiled without a complete RTL rewrite, preserving decades of verified IP. According to Altera migration notes, the SRAM bitstream is reloadable in 80 ms via JTAG, enabling in-field firmware patches for long-lifecycle military and aerospace programs.
Recommended
Low-Volume ASIC Replacement
The EPF10K200SFC484-1N is widely used as a low-volume ASIC replacement where mask costs exceed $500K and time-to-market dominates unit price. Its 200K-gate capacity covers 90 percent of legacy ASIC designs in telecom, industrial, and test-equipment applications, while the SRAM-based configuration enables late-stage bug fixes without a metal-mask spin. The 484-FBGA package supports multi-layer PCB substrates matching typical ASIC package footprints, so existing ASIC land patterns can be reused with minimal rework. According to industry analysis, FLEX-10KE-based ASIC replacements typically cut NRE cost by 80 percent and time-to-market by 6-9 months versus a custom 0.22 µm ASIC flow.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K200SFC484-1N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K200SFC484-1 | EPF10K200SFC484-2N | EPF10K200SFC484-3N | EPF10K200SFC484-1X |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-FBGA (23x23 mm, 1.0 mm pitch) | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Speed Grade | -1 (fastest) | -1 | -2 | -3 | -1 |
| System Gates | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 |
| Logic Elements | 9,984 | 9,984 | 9,984 | 9,984 | 9,984 |
| Max Internal Frequency | 250 MHz | 250 MHz | ~200 MHz | ~167 MHz | 250 MHz |
| User I/Os | 369 | 369 | 369 | 369 | 369 |
| Solder Ball Finish | Lead-free (Pb-free, N suffix) | SnPb (leaded) | Lead-free | Lead-free | Lead-free |
| Operating Temperature | 0 to +70 C (Commercial) | 0 to +70 C | 0 to +70 C | 0 to +70 C | -40 to +85 C (Industrial) |
Key Differentiators
- Highest speed grade in the FLEX-10KE 200K-gate family (vs EPF10K200SFC484-3N)
- Lead-free solder balls meet RoHS compliance (vs EPF10K200SFC484-1)
- Highest-density FLEX-10KE variant in 484-FBGA footprint (vs EPF10K130EFC484-3)
- Commercial 0-70 C operating temperature (vs EPF10K200SFC484-1X)
Design Notes
The 484-FBGA package uses 1.0 mm ball pitch on a 23 x 23 mm substrate, requiring a 4-layer or 6-layer PCB with 0.5 oz copper and microvia-in-pad if signal escape is required under the BGA. According to IPC-7351 land-pattern guidelines, the NSMD (non-solder-mask-defined) pad is preferred with a 0.45 mm pad diameter and 0.65 mm solder-mask opening. Reflow profile must peak at 245 C maximum for lead-free (N suffix) variants; SnPb variants may peak at 220 C. Always include 0.1 uF decoupling capacitors within 5 mm of each VCCIO/VCCINT ball pair to suppress simultaneous-switching noise on the 369 I/Os.
The FLEX-10KE configuration SRAM is volatile and must be loaded from an external boot PROM (EPC2, EPC8, or EPC16) on every power-up. Designers commonly forget the CONFIG_DONE pull-up resistor and the nSTATUS pull-up, leading to configuration failure on cold-boot. According to the FLEX-10KE datasheet, the MSEL pins must be tied to 00 for passive serial configuration or to 01 for passive parallel asynchronous. JTAG chain integrity must be verified with the Quartus II JTAG chain checker before debugging; chain errors look like configuration failures but originate in the BSDL file selection. Toolchain version must be Quartus II 13.0sp1 or earlier; Quartus Prime versions do not support FLEX-10KE.
At typical switching activity (15-25 percent of 9,984 LEs toggling at 100 MHz), the EPF10K200SFC484-1N dissipates approximately 1.5-2.5 W of dynamic power in the FBGA-484 package, plus approximately 0.3 W static power. According to the Altera FLEX-10KE datasheet, the thermal resistance theta_JA for the 484-FBGA package is approximately 18 C/W on a standard 4-layer JEDEC test board. Designers should size the copper pour under the BGA thermal balls (a dedicated 25 x 25 mm ground plane is recommended) to keep junction temperature below 100 C at 70 C ambient. Estimating with PD = 2 W and theta_JA = 18 C/W gives a junction temperature rise of 36 C, well within the commercial 0-70 C range.
Compliance Information
RoHS compliant via 'N' suffix lead-free solder balls. Not AEC-Q100 qualified (FPGA, not automotive IC). REACH compliant per distributor disclosure. Halogen-free status not explicitly disclosed by manufacturer.
