EPF10K130EFC484-2N - 130K-Gate FPGA, 484-BBGA | Altera
MPN: EPF10K130EFC484-2N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1250 | $1,250.00 |
| 10 | $1125 | $11,250.00 |
| 100 | $999 | $99,900.00 |
| 500 | $899 | $449,500.00 |
| 1,000 | $799 | $799,000.00 |
EPF10K130EFC484-2N Overview
An FPGA is a field-programmable gate array: a semiconductor device containing programmable logic elements, routing resources, and configurable I/O that engineers can program after manufacturing. FPGAs occupy the programmable-logic tier between fixed-function application-specific integrated circuits and software-controlled processors. They implement digital datapaths, control logic, interfaces, and state machines in configurable hardware, while the FLEX-10KE family combines embedded programmable logic with embedded memory for system-on-a-programmable-chip designs.
The defining capability is 130,000 gates supported by 6,656 cells, which gives the device meaningful capacity for multi-interface glue logic and moderate digital systems. Its 65,536 RAM bits support buffers, state storage, lookup tables, and small FIFOs. A 369-I/O budget accommodates many external buses and peripheral interfaces, while 0.22 µm CMOS technology and a listed 333.33 MHz frequency reflect the device family and fabrication generation represented in the verified source data.
The architecture is based on logic-array blocks and programmable interconnects rather than fixed execution instructions. Configuration data determines logic functions and signal routing, so changes can be implemented through FPGA design software without replacing the IC. The embedded memory is distributed within this programmable fabric, allowing compact implementations that might otherwise require external memory devices for small storage or queue functions.
Typical uses include industrial control and automation, communications-interface bridging, test and measurement equipment, and legacy digital systems requiring a dense programmable BGA device. The 369 available I/Os are especially useful when aggregating parallel buses, memory interfaces, counters, and protocol adapters. The 23 mm by 23 mm FBGA package is intended for space-conscious boards but requires appropriate BGA assembly, inspection, routing, and thermal design capabilities.
Designers should verify all configuration, clock, power, signal-integrity, and ball-assignment details against the manufacturer datasheet before release. They should also validate timing at the selected speed grade and supply condition rather than assuming the listed family frequency applies to every implemented circuit. BGA escape routing, contiguous ground references, decoupling placement, and manufacturing-process controls are central to reliable operation.
This page consolidates verified distributor specifications, package information, sourcing evidence, application guidance, and drop-in comparison limits. The cross-reference data identifies closely related family and speed-grade candidates, but only candidates with defensible same-package, pin-to-pin evidence are treated as drop-in alternatives.
Drop-in alternatives for EPF10K130EFC484-2N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K130EFC484-2N (same form factor and footprint) — differing in Speed Grade, Operating Temperature, Process Technology, Package, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K130EFC484-2
✅ Drop-In✓ In Stock
$105 / Unit
View Datasheet →EPF10K130EFC484-1
✅ Drop-In✓ In Stock
$92 / Unit
View Datasheet →EPF10K100EFC484-2
✅ Drop-In✓ In Stock
$185.4 / Unit
View Datasheet →EPF10K100EFC484-1
✅ Drop-In✓ In Stock
$142 / Unit
View Datasheet →EPF10K100AFC484-2N
✅ Drop-In✓ In Stock
$152 / Unit
View Datasheet →EPF10K130EFC484-2N Maximum Ratings & Electrical Characteristics
| Product Type | Field Programmable Gate Array (FPGA) |
| Series | FLEX-10KE |
| Gate Count | 130,000 gates |
| Logic Cells | 6,656 cells |
| Logic Family | CMOS |
| Process Technology | 0.22 µm |
| Listed Maximum Frequency | 333.33 MHz |
| Propagation Delay | 0.6000 ns |
| User I/Os | 369 I/Os |
| Alternative I/O Count Listing | 274 I/Os |
| Embedded Memory | 65,536 bits |
| Logic Array Blocks | 832 LABs |
| Supply Voltage | 2.5 V nominal |
| Verified Supply-Voltage Range | 2.375 V to 2.625 V |
| Alternate Supply Listing | 3.3 V |
| Operating Temperature | 0 °C to 70 °C |
| Package | 484-ball FBGA, 23 mm × 23 mm |
| Package Pin Count | 356 pins |
| Ball Pitch | 1 mm |
| RoHS Compliance | unknown |
| REACH Compliance | unknown |
| AEC-Q100 Qualification | unknown |
| Lead-Free Status | unknown |
| Halogen-Free Status | unknown |
EPF10K130EFC484-2N 356 pins Pin Configuration Guide
Pin configuration for EPF10K130EFC484-2N (356 pins package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K130EFC484-2N.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K130EFC484-2N is suitable for 6 applications: Industrial Control and Automation, Communications Interface Bridging, Test and Measurement Equipment, Legacy Digital System Maintenance, High-I/O Data Acquisition, Embedded Systems Prototyping.
Industrial Control and Automation
EPF10K130EFC484-2N fits industrial control systems that need configurable digital logic without a software processor handling every real-time operation. Its 130,000-gate class, 6,656 logic cells, and 65,536 RAM bits can implement counters, state machines, sequencing logic, motion-control interfaces, and compact data buffers. The 369 listed user I/Os provide substantial connectivity for parallel sensors, actuator controllers, communications adapters, and legacy backplanes. A designer can use the embedded FPGA fabric to consolidate discrete glue logic while retaining in-system programmability. The commercial 0 °C to 70 °C operating range supports controlled factory environments, but it does not establish suitability for uncontrolled outdoor installations. Decoupling, ground integrity, clock distribution, and 484-ball BGA escape routing must be reviewed before production release.
Recommended
Communications Interface Bridging
EPF10K130EFC484-2N can bridge processors, memories, and multiple communications peripherals in equipment requiring parallel protocol conversion. The FLEX-10KE architecture provides 6,656 cells for serializers, packet buffers, timing recovery controls, address decoding, and interface state machines, while 65,536 RAM bits support FIFOs and elastic storage. The 369 listed user I/Os allow a single device to aggregate wide buses and several lower-speed control interfaces, reducing the amount of discrete logic on the board. Its 0.6000 ns propagation-delay listing and 333.33 MHz family-frequency listing provide useful family-level context but do not replace post-route timing analysis. Designers should constrain I/O standards, clock domains, and crossing logic explicitly, then verify timing using the selected configuration and PCB implementation.
Recommended
Test and Measurement Equipment
EPF10K130EFC484-2N is appropriate for programmable acquisition, timing, stimulus, and instrument-control subsystems. The 130,000-gate class and 6,656 cells can hold test sequencers, trigger logic, pattern generators, digital filters, and protocol decoders, while the 65,536 RAM bits provide local buffering. The device’s 369 listed user I/Os help aggregate sensor buses, calibration interfaces, displays, and control ports. FPGA programmability allows instrument modes and signal-processing revisions to be updated without replacing the component. In precision equipment, power integrity and signal integrity are critical: use controlled-impedance routes, maintain continuous reference planes, separate noisy I/O from sensitive clocks, and model decoupling at the 484-ball FBGA interface. Timing must be closed using the actual design, configuration, speed grade, voltage, and temperature conditions.
Recommended
Legacy Digital System Maintenance
EPF10K130EFC484-2N is well matched to maintenance and redesign work around FLEX-10KE systems, provided the original logical intent and pin assignment are preserved. Its 130,000 gates, 6,656 cells, 65,536 RAM bits, and 369 listed user I/Os provide substantial capacity for reproducing discontinued glue logic, bus controllers, or interface functions in programmable hardware. The same-family EPF10K130EFC484-2 is a plausible sourcing candidate, but the different -2N suffix still requires confirmation of package code, temperature grade, and orderability. Engineers should archive the original configuration, compare generated pin assignments, and verify power sequencing before transplanting a design. The 484-ball, 23 mm by 23 mm FBGA package is not a no-penalty substitute for a larger legacy package because PCB escape and assembly may need redesign.
Recommended
High-I/O Data Acquisition
EPF10K130EFC484-2N can serve as the configurable hub in a high-I/O data-acquisition subsystem. The 369 user I/Os listed by DigiKey can connect multiplexed sensor channels, parallel converters, status signals, and local control buses, while 6,656 cells implement channel selection, calibration sequencing, trigger distribution, and data packing. Its 65,536 RAM bits support short capture buffers and FIFO control, reducing the need for external memory in modest buffering applications. Clock-domain management is essential when asynchronous converter and system clocks coexist, and the 0.6000 ns propagation-delay value should not be treated as a complete system timing guarantee. Use registered I/O where appropriate, constrain setup and hold paths, and verify the 2.375 V to 2.625 V supply range with accurate board-level measurements.
Recommended
Embedded Systems Prototyping
EPF10K130EFC484-2N supports embedded-system prototypes that need customizable peripheral logic, bus control, and hardware accelerators. The 130,000-gate class and 6,656 cells can implement memory controllers, custom accelerators, protocol adapters, and board-management state machines, while the 65,536-bit memory supports small tables and FIFOs. Its 369 listed user I/Os are valuable when a processor must connect to many memories, converters, displays, and legacy peripherals. The FLEX-10KE device allows design revisions through configuration changes rather than board respins, shortening prototype iteration. However, engineers must preserve the supported tool flow, confirm configuration storage and reset sequencing, and review the 484-ball FBGA implementation for prototype fabrication. A lower-capacity 100,000-gate family member may be considered only when measured utilization remains comfortably within its limits.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K130EFC484-2N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K130EFC484-2 | EPF10K130EFC484-1 | EPF10K100EFC484-2 | EPF10K100EFC484-1 | EPF10K100AFC484-2N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 484-pin FBGA | 484-pin FBGA | 484-pin FBGA | 484-pin FBGA | 484-pin FBGA | 484-pin FBGA |
| Gate Class | 130,000 gates | 130,000 gates | 130,000 gates | 100,000 gates | 100,000 gates | 100,000 gates |
Key Differentiators
- Higher gate-class capacity (vs EPF10K100EFC484-2)
- Larger verified logic-cell resource (vs EPF10K130EFC484-1)
- Same-package sourcing candidate with matching family identity (vs EPF10K130EFC484-2)
Design Notes
Design the power network around the verified 2.375 V to 2.625 V supply range and place local decoupling at every appropriate power entry of the 484-ball FBGA. Use a low-impedance ground plane, bulk capacitance for transient support, and ceramic capacitors near power balls. Confirm the configuration-interface voltage, permitted ramp behavior, and sequencing requirements from the manufacturer documentation. The alternate 3.3 V source listing conflicts with the 2.5 V product-detail range, so do not add or switch supply rails until the authoritative ordering documentation resolves it.
Treat the 23 mm by 23 mm FBGA as a high-density BGA rather than a fine-pitch peripheral IC. Follow the exact ball map and escape strategy from the selected PCB stack-up, fan out each signal through assigned via layers, and avoid sharing return paths between clocks, high-speed outputs, and quiet inputs. Maintain continuous reference planes, length-match clock and bus groups as required by timing constraints, and provide test points for configuration, clock, reset, and selected power rails. Prototype inspection must account for hidden-joint defects.
The 0.6000 ns propagation-delay listing and 333.33 MHz family-frequency listing are not substitutes for system timing closure. Register high-speed interfaces where possible, define each clock domain, constrain setup, hold, pulse width, recovery, and removal checks, and add synchronization logic for asynchronous crossings. The 369 listed I/Os create a dense edge environment, so control edge rates, maintain short return paths, and analyze crosstalk after the actual placement and routing are complete. Evaluate alternative I/O voltage requirements before connecting mixed-voltage peripherals.
Plan thermal verification using the actual FPGA utilization, toggle rate, output loading, voltage, enclosure, and PCB copper area; a reliable junction estimate cannot be derived from gate count alone. Keep thermal vias beneath or around the package when allowed by the land pattern, connect internal ground layers without blocking escape routing, and use spreader copper where assembly rules permit. Validate temperatures at maximum ambient and commercial 70 °C boundary conditions. Do not infer FPGA junction temperature from case temperature because the package, airflow, and board contribution are not provided.
Do not assume the 369-I/O listing, 274-I/O listing, 356-pin description, and 484-ball package description describe different orders without checking the applicable datasheet revision and product-category definition. Preserve configuration files, version the bitstream, and review reset and initialization timing before using an EPF10K130EFC484-2 candidate. For a 100,000-gate substitute, estimate logic, memory, routing, and I/O utilization with margin; the approximately 23% lower gate-class positioning can still exclude a design through routing or memory pressure even when cell count appears sufficient.
Compliance Information
The verified web data does not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. These fields are therefore unknown rather than compliant or qualified.
