EPF10K200SFC484-3N - 200K Gates FLEX 10KE FPGA 484-BGA | Altera
MPN: EPF10K200SFC484-3N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $381.09 | $381.09 |
| 10 | $361.5 | $3,615.00 |
| 100 | $332 | $33,200.00 |
| 500 | $295 | $147,500.00 |
| 1,000 | $261 | $261,000.00 |
EPF10K200SFC484-3N Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable routing, and I/O cells, all controlled by user-defined SRAM configuration bits. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) -> complex PLDs (CPLDs) -> FPGAs -> high-density FPGAs, and within power management and digital design they serve as the central processing and glue-logic element. FPGAs are widely used to implement parallel processing, custom peripherals, and high-speed interfaces that would otherwise require discrete ASICs or large clusters of TTL logic.
Key features of the EPF10K200SFC484-3N include 4 Embedded Array Blocks (EABs) totaling up to 24 Kbits of dedicated RAM, a system clock that can be driven from a dedicated global clock network, IEEE 1149.1 JTAG boundary-scan support, and 3.3 V PCI compliance (speed grade -3) or 5.0 V PCI compliance (speed grade -1). The 484-ball FineLine BGA package supports pin migration across the FLEX 10KE family per Altera's SameFrame pin-compatibility scheme, so design teams can scale logic density without re-laying out the PCB.
The FLEX 10KE architecture uses a continuous SRAM interconnect with fast, predictable routing delays, and the device operates from a 5.0 V core supply with multi-voltage I/O supporting 2.5 V, 3.3 V, and 5.0 V interfaces. Speed grade -3 indicates the fastest commercial speed bin, suitable for high-frequency glue logic and PCI applications. Industrial and commercial temperature grades are both available across the family.
Typical applications include PCI/CompactPCI bridge designs, high-speed glue logic, telecom line-card controllers, industrial automation backplanes, and legacy system upgrades where the FLEX 10KE was the original design-in device. The 484-BGA package also enables dense, high-pin-count designs in compact form factors such as ATCA blades and custom peripheral boards.
When designing with the EPF10K200SFC484-3N, ensure the 5.0 V VCCINT rail has sufficient decoupling (100 µF bulk + 0.1 µF ceramic per power pin), the JTAG chain is properly terminated, and the configuration memory (typically EPC2 or EPC16) is correctly selected for the device's 0.22 µm process. The SameFrame pin-out allows easy migration to EPF10K100 or EPF10K130 in the same 484-BGA footprint, providing design flexibility.
This page synthesizes distributor pricing, SameFrame drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a faster path from search to working hardware than the bare PDF alone.
Drop-in alternatives for EPF10K200SFC484-3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K200SFC484-3N (same form factor and footprint) — differing in Package, Family, Speed Grade, Process Technology, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K200SFC484-1N
✅ Drop-In✓ In Stock
$185.25 / Unit
View Datasheet →EPF10K200SFC484-2N
✅ Drop-In✓ In Stock
$95 / Unit
View Datasheet →EPF10K200SFC484-1
✅ Drop-In✓ In Stock
$162 / Unit
View Datasheet →EPF10K130EFC484-3N
✅ Drop-In✓ In Stock
$109.25 / Unit
View Datasheet →EPF10K100EFC484-3N
✅ Drop-In✓ In Stock
$142 / Unit
View Datasheet →EPF10K200SFC484-3N Maximum Ratings & Electrical Characteristics
| Family | FLEX 10KE |
| Series | FLEX-10KS |
| Typical Gates | 200,000 |
| Logic Elements (LEs) | 9,984 |
| LABs | 1,248 |
| Embedded Array Blocks (EABs) | 4 (up to 24 Kbit RAM) |
| User I/O Pins | 369 |
| Package | 484-ball FineLine BGA |
| Speed Grade | -3 (fastest) |
| Process Technology | 0.22 µm CMOS SRAM |
| Core Voltage (VCCINT) | 5.0 V |
| I/O Voltage Support | 2.5 V / 3.3 V / 5.0 V |
| JTAG Support | IEEE 1149.1 BST |
| PCI Compliance | 3.3 V/33 MHz and 66 MHz (speed grade -3) |
| Operating Temperature | 0°C to +70°C (commercial, N suffix) |
| Mounting Type | Surface Mount |
EPF10K200SFC484-3N 484-ball fineline bga Pin Configuration Guide
Pin configuration for EPF10K200SFC484-3N (484-ball fineline bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K200SFC484-3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K200SFC484-3N is suitable for 7 applications: PCI/CompactPCI Bridge Controller, Telecom Line-Card Controller, Industrial Automation Backplane, Legacy System Upgrade and Re-spin, High-Speed Glue Logic on ATCA Blades, Test and Measurement Instrument Backbone, Medical Imaging Front-End Controller.
PCI/CompactPCI Bridge Controller
The EPF10K200SFC484-3N is well suited for PCI/CompactPCI bridge designs because its -3 speed grade complies with PCI Local Bus Revision 2.2 at 3.3 V/33 MHz and 66 MHz, per the Altera FLEX 10KE datasheet. The 200K gates, 9,984 LEs, and 369 user I/Os allow simultaneous implementation of the PCI target/master controller, FIFO buffers, and the secondary bus interface. With four EABs providing up to 24 Kbit of on-chip memory, the bridge can keep transaction queues on-die, eliminating external FIFOs. Pair with the EPC8/EPC16 configuration EPROM and an Altera MAX II CPLD for hot-swap signaling.
Recommended
Telecom Line-Card Controller
In telecom line cards the EPF10K200SFC484-3N integrates TDM bus multiplexing, HDLC framing, and serial backplane glue in one device, reducing board area versus a discrete ASIC-plus-logic design. The FLEX 10KE architecture gives deterministic routing delays suitable for T1/E1 jitter budgets, while 369 user I/Os back-haul LVTTL or LVCMOS signals to framer ICs and DSPs. Multi-voltage I/O (2.5/3.3/5.0 V) lets one FPGA interface legacy 5 V framers and newer 3.3 V DSPs on the same card. The 4 EABs provide per-channel elastic buffers without external memory.
Recommended
Industrial Automation Backplane
The 200K-gate FLEX 10KE is ideal for industrial backplane controllers that aggregate Fieldbus, RS-485, and Ethernet traffic into a single carrier board. Its 5 V-tolerant multi-voltage I/O bridges legacy 5 V transceivers to modern 3.3 V MCU/DSP, and the 484-ball FineLine BGA (1.0 mm pitch) packs high I/O count into a compact 23 × 23 mm outline. The -3 speed grade clocks SPI, I²C, and parallel backplane buses at full industrial bandwidth without timing-closure pain. JTAG boundary-scan on every I/O simplifies bed-of-nails test on high-density backplane PCBs.
Recommended
Legacy System Upgrade and Re-spin
When re-spinning an end-of-life FLEX 10KE design, the EPF10K200SFC484-3N preserves the original 5.0 V core and multi-voltage I/O, so legacy 5 V analog and 3.3 V digital peripherals do not require level shifters. The 484-BGA FineLine footprint and SameFrame pin migration let designers drop in EPF10K100EFC484-3N or EPF10K130EFC484-3N if 100K-130K gates suffice, avoiding PCB re-layout. The 4 EABs and JTAG chain remain unchanged, preserving the existing Altera Quartus/MAX+PLUS II design flow and the EPC2/EPC8/EPC16 configuration chain.
Recommended
High-Speed Glue Logic on ATCA Blades
ATCA blade designs use the EPF10K200SFC484-3N as a high-density glue-logic engine between switching ASICs, fabric interfaces, and baseboard management controllers. The -3 speed grade supports 66 MHz PCI and high-speed serial protocol logic, while 369 user I/Os eliminate external bus-driver clusters. The 484-ball FineLine BGA 1.0 mm pitch enables dense routing between BGA ICs on the same ATCA board. JTAG chain integration simplifies the mandatory IPMI/management controller test harness on ATCA hardware.
Recommended
Test and Measurement Instrument Backbone
Test equipment chassis leverage the EPF10K200SFC484-3N as the pattern-generation, timing, and instrument-bus controller thanks to 200K gates of flexible logic and 4 EABs for deep pattern buffering. The 5.0 V core plus 2.5/3.3/5.0 V multi-voltage I/O lets one FPGA bridge to GPIB transceivers, LVDS analog front ends, and modern USB controllers without external level translation. The -3 speed grade maintains timing margins on parallel ADC/DAC interfaces. JTAG and SameFrame migration simplify board revisions across instrument families.
Recommended
Medical Imaging Front-End Controller
In ultrasound and patient-monitoring front ends, the EPF10K200SFC484-3N coordinates beam-forming, ADC data aggregation, and DSP hand-off in a single device. The 4 EABs hold channel-data buffers while 9,984 LEs implement beam-forming FIR filters and timing generators, eliminating external SRAM. The 369 user I/Os connect to multi-channel ADCs and DSPs simultaneously, and the 5.0 V core with 3.3 V I/O supports legacy medical front ends. The same FLEX 10KE 484-BGA footprint (SameFrame) enables design reuse across imaging product families.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K200SFC484-3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K200SFC484-1N | EPF10K200SFC484-2N | EPF10K200SFC484-1 | EPF10K130EFC484-3N | EPF10K100EFC484-3N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 484-ball FineLine BGA | 484-ball FineLine BGA - same | 484-ball FineLine BGA - same | 484-ball FineLine BGA - same | 484-ball FineLine BGA - same (SameFrame) | 484-ball FineLine BGA - same (SameFrame) |
| Typical Gates | 200,000 | 200,000 (same die) | 200,000 (same die) | 200,000 (same die) | 130,000 (-35%) | 100,000 (-50%) |
| Speed Grade | -3 (fastest) | -1 (slower) | -2 (mid) | -1 (slower) | -3 (same) | -3 (same) |
| Operating Temperature | 0°C to +70°C (commercial) | 0°C to +70°C (commercial) | 0°C to +70°C (commercial) | -40°C to +85°C (industrial) | 0°C to +70°C (commercial) | 0°C to +70°C (commercial) |
| Logic Elements | 9,984 | 9,984 (same die) | 9,984 (same die) | 9,984 (same die) | ~6,600 (-34%) | ~4,992 (-50%) |
| User I/Os | 369 | 369 (same) | 369 (same) | 369 (same) | 369 (same) | 369 (same) |
| EAB Memory | 4 EABs / 24 Kbit | 4 EABs / 24 Kbit (same die) | 4 EABs / 24 Kbit (same die) | 4 EABs / 24 Kbit (same die) | fewer EABs (~3) | fewer EABs (~2) |
| PCI Compliance | 3.3 V / 33-66 MHz | 5.0 V / 33 MHz | 3.3 V / 33 MHz | 5.0 V / 33 MHz | 3.3 V / 33-66 MHz | 3.3 V / 33-66 MHz |
Key Differentiators
- Highest-density FLEX 10KE in 484-BGA (vs EPF10K130EFC484-3N)
- Fastest commercial speed grade (vs EPF10K200SFC484-2N)
- Commercial temperature at -3 speed (vs EPF10K200SFC484-1)
- SameFrame migration compatibility (vs Cyclone series FPGAs)
Design Notes
The EPF10K200SFC484-3N requires a clean 5.0 V VCCINT rail. Per the Altera FLEX 10KE datasheet, decoupling requires a 100 µF bulk tantalum or ceramic capacitor near the package plus one 0.1 µF ceramic per VCCINT pin. Multi-voltage I/O banks (VCCIO) must each be independently decoupled with 0.1 µF ceramic capacitors. Estimated: worst-case core current at 200K-gate utilization is approximately 250-350 mA, so the 5 V regulator must deliver at least 2 W to the FPGA core alone.
The 484-ball FineLine BGA uses a 1.0 mm ball pitch, which requires laser-drilled microvias or 0.4 mm via-in-pad technology at the BGA fan-out. PCB stack-up should be 6-8 layers minimum with dedicated ground and power planes under the BGA. JTAG TCK must be length-matched and isolated from switching I/O lines to avoid programming failures. Use 50 Ω controlled impedance for top-speed I/O (PCI 66 MHz) traces.
Do not confuse FineLine BGA (1.0 mm pitch) with the older 1.27 mm pitch BGA-484 used in the original FLEX 10K family - they are NOT interchangeable on the PCB. The SameFrame migration scheme is valid only within the 1.0 mm FineLine BGA devices (EPF10K100EFC484, EPF10K130EFC484, EPF10K200SFC484, EPF10K200EFC484). Configuration EPROM must be sized for the device ID plus the largest design file - EPC8/EPC16 is recommended over EPC2 for production.
Place the configuration EPROM as close as possible to the EPF10K200SFC484-3N DATA and DCLK pins to avoid signal-integrity issues during configuration. JTAG chain ordering should place the FLEX 10KE first and any MAX/EPM CPLDs downstream. Leave an unpopulated 0 Ω resistor or test point on the JTAG TDO pin for board-level debug access.
Estimated: at maximum junction temperature +85°C and typical power dissipation of 1.5 W, the 484-ball FineLine BGA requires at least 25 cm² of copper pour on inner/outer layers for cooling. For sealed industrial enclosures, derate ambient by 10°C or add 100 LFM forced airflow. Use the FLEX 10KE family thermal model from Altera (AN 74) for accurate junction calculations.
Compliance Information
EPF10K200SFC484-3N is a pre-RoHS-era Altera FLEX 10KE part; original Altera production was SnPb finish. RoHS/REACH compliance status varies by distributor and date code - request a C-of-C from the supplier before placing volume orders. AEC-Q100 not applicable (industrial/commercial FPGAs are not automotive-qualified).