EPF10K30RC20-4 - FLEX 10K 30K Gate FPGA, 5V, PQFP-240 | Altera
MPN: EPF10K30RC20-4 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $85 | $85.00 |
| 10 | $78.5 | $785.00 |
| 100 | $72 | $7,200.00 |
| 500 | $66.5 | $33,250.00 |
| 1,000 | $62 | $62,000.00 |
EPF10K30RC20-4 Overview
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows designers to configure digital logic after manufacturing using a hardware description language or schematic entry. The FLEX 10K architecture combines a logic array with embedded array blocks, which are dual-port RAM blocks optimized for high-speed memory and DSP functions. Within the broader hierarchy, FPGAs sit above CPLDs in density and below mask-programmed ASICs in non-recurring engineering cost; FLEX 10K devices pioneered embedded memory and are positioned between pure logic FPGAs and modern SoC FPGAs that integrate hard processor cores.
Key features include a typical gate count of approximately 30,000 (up to 50,000 maximum), 12,000 usable gates, 5.0 V core supply with 5.0 V TTL-compatible I/O, in-system programmability via the IEEE 1149.1 JTAG interface, multi-volt I/O support, and four FastTrack interconnect routing channels. The -4 speed grade corresponds to a -4 speed bin providing pin-to-pin logic delays around 5 ns in the family, and the device supports configuration via serial configuration EPROMs, JTAG, or passive serial/parallel modes.
Architecturally, each logic element contains a 4-input look-up table, a programmable flip-flop, and dedicated carry and cascade logic for fast arithmetic and wide fan-in functions. The six EABs each provide 4 Kbits of RAM that can be cascaded for wider or deeper memory, effectively implementing on-chip dual-port RAM, ROM, FIFO, and multiplier functions without consuming logic resources. The FastTrack continuous routing network with horizontal and vertical channels provides fast, predictable interconnect across the entire device.
Typical applications of the EPF10K30RC20-4 include telecommunications glue logic, bus-bridging interfaces, peripheral controllers, high-speed datapath glue logic in test equipment, prototype ASIC emulation, and embedded control in industrial automation. The 240-pin PQFP package with 0.5 mm pitch was the workhorse high-density FPGA footprint of the 1990s, well-suited for moderate-speed (typically 60-80 MHz internal) glue logic.
When designing with this device, note that it is a 5.0 V part and predates the multi-volt tolerant I/O standards of later FPGAs; level translation to 3.3 V peripherals is required for modern mixed-voltage designs. Configuration EPROM (EPC1/EPC2/EPC1441) selection must match the chosen configuration mode, and the JTAG chain must be terminated correctly for in-system programming. This part is no longer recommended for new designs - the FLEX 10K family has been superseded by MAX 7000/AE, MAX II, Cyclone, and later device families with lower power and higher density.
This page synthesizes distributor pricing, drop-in alternatives from the Site MPN list, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EPF10K30RC20-4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K30RC20-4 (same form factor and footprint) — differing in Package, Process Technology, Family, Operating Temperature, Total RAM Bits.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K30EQC208-1
✅ Drop-In✓ In Stock
$17.95 / Unit
View Datasheet →EPF10K30EQC208-1N
✅ Drop-In✓ In Stock
$28.4 / Unit
View Datasheet →EPF10K30EQC208-2
✅ Drop-In✓ In Stock
$17.85 / Unit
View Datasheet →EPF10K30EQC208-3
✅ Drop-In✓ In Stock
$26.1 / Unit
View Datasheet →EPF10K30AQC208-3N
✅ Drop-In✓ In Stock
$19.1 / Unit
View Datasheet →EPF10K30AQC208-3
✅ Drop-In✓ In Stock
$15.4 / Unit
View Datasheet →EPF10K30AQC208-1N
✅ Drop-In✓ In Stock
$21.4 / Unit
View Datasheet →EPF10K30RC20-4 Maximum Ratings & Electrical Characteristics
| Family | FLEX 10K Embedded Programmable Logic Device |
| Typical Gates | 30,000 |
| Maximum Gates | 50,000 |
| Usable Gates | 12,000 |
| Logic Elements (LEs) | 1,728 |
| Embedded Array Blocks (EABs) | 6 |
| Maximum RAM Bits | 24,576 |
| Speed Grade | -4 |
| Core Supply Voltage | 5.0 V (3.0 V min, 3.6 V max per datasheet classification) |
| Operating Voltage | 3.3 V / 5.0 V (per EPF10K30 datasheet note: 3V-3.6V supply class) |
| I/O Standard | 5.0 V TTL-compatible |
| Package | PQFP-240 (RC) - 240-pin Power Quad Flat Pack |
| Mounting Type | Surface Mount |
| Configuration | Serial/Parallel EPROM, JTAG (IEEE 1149.1) |
| Process | SRAM-based CMOS |
| Lifecycle Status | Obsolete - FLEX 10K family discontinued |
EPF10K30RC20-4 pqfp-240 (rc) - 240-pin power quad flat pack Pin Configuration Guide
Pin configuration for EPF10K30RC20-4 (pqfp-240 (rc) - 240-pin power quad flat pack package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K30RC20-4.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K30RC20-4 is suitable for 7 applications: Legacy Telecommunications Glue Logic, Industrial Bus-Bridging Interface, ASIC Prototype Emulation Platform, Test & Measurement Datapath, Embedded Control in Avionics Sub-Systems, Digital Signal Processing Pre-Processing, Legacy Industrial Peripheral Controller.
Legacy Telecommunications Glue Logic
The EPF10K30RC20-4's combination of 30,000 typical gates, 6 EABs providing 24 Kbits of on-chip RAM, and TTL-compatible I/O made it a workhorse glue-logic device in 1990s telecommunications infrastructure, including T1/E1 multiplexers, SONET framer backplanes, and digital cross-connect systems. The PQFP-240 package exposes 180+ user I/O pins, enough to interface directly with parallel telecom buses without external buffers. The 5.0 V core matched the dominant telecom supply rail of the era, eliminating level shifters. The device's JTAG interface allowed board-level boundary-scan test, critical for telecom manufacturing test.
Recommended
Industrial Bus-Bridging Interface
The EPF10K30RC20-4 excels as a high-density bus bridge between legacy industrial buses (VME, ISA, PCI) and custom peripheral interfaces in factory automation controllers. The 6 embedded array blocks provide dual-port RAM for bus-transaction buffering, and the 1,728 logic elements handle address decoding, wait-state generation, and interrupt steering. The -4 speed grade enables ~80 MHz internal Fmax in pipelined designs, sufficient for 33 MHz PCI bus bridging. The PQFP-240 surface-mount package is well-suited to wave-soldering on large industrial PCBs.
Recommended
ASIC Prototype Emulation Platform
Designers used the EPF10K30RC20-4 as a building block for ASIC prototype emulation racks in the late 1990s, partitioning large ASIC designs across multiple FLEX 10K devices with on-chip EABs serving as cache and FIFO buffers between siblings. The SRAM-based fabric allowed unlimited design-iteration cycles without NRE cost. With 30K typical gates per device, a 300K-gate ASIC mapped cleanly onto ten EPF10K30 devices. This use case motivated the FLEX 10K family's EAB architecture, where the 4-Kbit blocks can be cascaded to form wide/deep FIFOs.
Recommended
Test & Measurement Datapath
The EPF10K30RC20-4 found extensive use in bench-top test and measurement equipment, including logic analyzers, protocol analyzers, and digital oscilloscope trigger subsystems. The EABs can store pre-defined trigger patterns, while the LEs implement state-machine control for real-time pattern matching across 32+ channels. The JTAG interface allowed remote firmware upgrades via IEEE 1149.1 boundary scan, a significant advantage for installed test equipment. The PQFP-240 package is easy to probe for bench debugging, in contrast to fine-pitch BGAs.
Recommended
Embedded Control in Avionics Sub-Systems
Mid-1990s avionics sub-systems used the EPF10K30RC20-4 for non-flight-critical embedded control in cockpit displays, navigation aids, and radar signal pre-processing. The 5.0 V core matched the avionics 28 V-to-5 V supply chain, and the PQFP-240 package's 0.5 mm pitch met then-current avionics assembly standards. The device's deterministic timing supported MIL-STD-1553B bus monitoring and ARINC 429 receive functions. Modern equivalents must clear DO-254 design assurance; new avionics uses radiation-tolerant FPGAs from Microsemi/Microchip or Xilinx Virtex-4QV.
Recommended
Digital Signal Processing Pre-Processing
In the 1990s, the EPF10K30RC20-4's EABs enabled fixed-coefficient FIR and IIR filter implementations by loading tap values into RAM blocks and using LEs for adders and pipelining. While modern FPGAs have dedicated DSP blocks (Xilinx DSP48, Altera DSP), the FLEX 10K's RAM-based approach allowed up to 8-tap FIR filters at audio sample rates. The -4 speed grade sustained ~60 MHz pipeline rates. Today, this application has moved to Cyclone/Stratix with DSP blocks, but legacy signal-conditioning boards still use the EPF10K30 in maintenance scenarios.
Recommended
Legacy Industrial Peripheral Controller
Factory-floor peripheral controllers, including stepper-motor drivers, PLC expansion modules, and HMI subsystems, used the EPF10K30RC20-4 as a flexible glue-logic hub interfacing sensors and actuators to a central CPU. The 30K-gate capacity handles quadrature decoders, PWM generation, and SPI/I2C master controllers simultaneously. The 5.0 V I/O tolerance interfaces directly to industrial sensor outputs (24 V isolated via external optos). The JTAG boundary-scan enables in-circuit test for high-volume manufacturing.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K30RC20-4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K30EQC208-1 | EPF10K30EQC208-2 | EPF10K30AQC208-3 | EPF10K30AQC208-1N |
|---|---|---|---|---|---|
| Package | PQFP-240 (RC) | PQFP-208 | PQFP-208 | PQFP-208 | PQFP-208 |
| Brand | Altera | Altera | Altera | Altera | Altera |
| Family | FLEX 10K (5.0 V) | FLEX 10K (5.0 V) | FLEX 10K (5.0 V) | FLEX 10KA (3.3 V) | FLEX 10KA (3.3 V) |
| Typical Gates | 30,000 | 30,000 | 30,000 | 30,000 | 30,000 |
| Core Supply Voltage | 5.0 V | 5.0 V | 5.0 V | 3.3 V | 3.3 V |
| Speed Grade | -4 | -1 (fastest) | -2 | -3 | -1 (fastest) |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 |
| Embedded Array Blocks | 6 | 6 | 6 | 6 | 6 |
| On-Chip RAM | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits |
| Pin Count | 240 | 208 | 208 | 208 | 208 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest-pin-count 30K-gate FLEX 10K option in PQFP (vs EPF10K30EQC208-1)
- 5.0 V native supply - matches legacy system rails (vs EPF10K30AQC208-3)
- Mid-tier speed grade -4 for balanced cost-performance (vs EPF10K30EQC208-1)
Design Notes
The EPF10K30RC20-4 requires a clean 5.0 V core supply (VCCINT) and a separate VCCIO bank supply for I/O. Per the FLEX 10K datasheet, VCCINT tolerance is +/-5%; noise above 50 mVpp can cause configuration-memory soft errors in the SRAM fabric. Use a low-ESR 100 uF bulk capacitor plus 0.1 uF ceramic decoupling on each VCCINT pin pair, with traces kept short to minimize inductance. During configuration, supply current can spike to ~500 mA; design the regulator with adequate headroom.
Configuration EPROM (EPC1/EPC2/EPC1441) selection must match the FLEX 10K configuration mode and bitstream size. The EPF10K30's 30K-gate bitstream (~200 Kbit uncompressed) exceeds the EPC1 capacity; use EPC2 (1.6 Mbit) or larger. Pull nCONFIG high with 10 kohm, and add a 1 kohm pull-up on nSTATUS and CONF_DONE. For JTAG programming, ensure the JTAG chain order (TDI -> EPF10K30 -> TDO) matches the BSDL file or boundary-scan will fail.
The PQFP-240 package has a typical theta_JA of approximately 25 C/W (with airflow) per Altera package thermal data, but the FLEX 10K family dissipates up to 1.5 W at maximum toggle rates. Estimated: at 25 C ambient and 1.5 W dissipation, junction temperature rises ~38 C to 63 C - within the 85 C commercial limit. Industrial (-40 to +100 C) and military-grade variants exist but require special order codes. Always provide forced-air cooling above 70 C ambient.
The PQFP-240 package's 0.5 mm pitch demands 4-layer PCB construction with 0.15 mm-wide signal traces and 0.20 mm spaces per the FLEX 10K datasheet recommendations. Use a 0.4 mm via pad with 0.2 mm drill for signal fan-out. Decoupling caps must be placed on the opposite PCB side directly under the PQFP-240 footprint with via-in-pad or short stub traces. Keep clock and JTAG signals length-matched within 50 mil if using multiple clocks.
FLEX 10K I/O outputs have limited slew-rate control; 33 MHz PCI designs require external 22-33 ohm series damping resistors on clock and strobe lines per Altera AN-119 application note. The TTL-compatible inputs have a 1.5 V threshold; noise below 0.8 V is safely rejected, but ground-bounce above 0.8 V on heavily-switching outputs can cause false triggering on adjacent inputs. Maintain a 3 H ground-rule separation between switching and clock-receiver pins.
Compliance Information
FLEX 10K family pre-dates widespread RoHS adoption; RoHS/REACH status should be verified with obsolete-stock distributors as of 2026-09-11. Not AEC-Q100 qualified - FLEX 10K is commercial/industrial only.
