Altera

EPF6016AFC100-2 - FLEX 6000 FPGA, 1320 LE, 81 I/O, 100-LBGA | Intel/Altera

MPN: EPF6016AFC100-2 ✗ End of Life

In Stock Ships in 1-3 business days

3.0 V to 3.6 V Vdss 100-LBGA (FineLine BGA, 11x11 mm) Package 172 MHz Speed SRAM (volatile) Memory

From $5.4 USD / Unit

MOQ: 1 |

Price updated: 2026-09-11

Volume Pricing

Qty	Unit Price	Extended
1	$8.49	$8.49
10	$7.95	$79.50
100	$6.8	$680.00
500	$5.95	$2,975.00
1,000	$5.4	$5,400.00

ℹ️ All prices are in USD

View Datasheet (PDF) View Alternatives

Quantity

EPF6016AFC100-2 Overview

The Intel (Altera) EPF6016AFC100-2 is a member of the FLEX 6000 family of CMOS SRAM-based Field-Programmable Gate Arrays, providing 1,320 logic elements across 132 LABs (Logic Array Blocks) with 81 user I/O pins housed in a 100-ball FineLine BGA (100-LBGA, 11x11 mm) package. It is a logic-density optimized FPGA built on a 0.42 µm SRAM process that operates from a 3.3 V core supply (3.0 V to 3.6 V) and supports both commercial and industrial temperature grades. The device offers up to 172 MHz internal operation and is supplied in a speed grade -2 bin.

A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows designers to configure digital logic circuits through software-defined look-up tables (LUTs), embedded RAM blocks, and programmable interconnect. Within the broader programmable logic taxonomy, the FLEX 6000 sits below CPLD architectures in density but above simple SPLDs; in the system hierarchy, FPGAs belong to the embedded IC / digital IC family that complements microcontrollers, DSPs, and ASICs. The FLEX 6000 family uses a LUT-based fabric that delivers higher logic density than the older MAX 7000 CPLDs while remaining low-cost and low-power.

Key features include 1,320 logic elements (LEs), 132 LABs, 81 user I/Os, JTAG (IEEE 1149.1) boundary-scan support, and a 4-input LUT structure that simplifies synthesis tool mapping. The 100-LBGA FineLine BGA package provides high-density board routing with a 1.0 mm ball pitch and a footprint of 11x11 mm, ideal for space-constrained designs. The device supports in-system programmability via the dedicated configuration interface and standard SRAM configuration bitstream storage.

Architecturally, the FLEX 6000 uses an SRAM cell to hold configuration data, allowing unlimited reconfiguration. Each LAB contains 8 LEs, and each LE combines a 4-input LUT, a programmable register, and dedicated carry-chain logic for arithmetic. The interconnect is a continuous FastTrack row/column structure that delivers predictable timing and simplifies static timing closure compared with earlier segmented FPGA architectures.

Typical applications include glue logic replacement, bus bridging, peripheral control, low-complexity state machines, and prototype ASIC verification in industrial, communications, and consumer products. Engineers select the FLEX 6000 family when they need more logic than a CPLD but want to avoid the cost and complexity of high-density FPGAs such as Cyclone or Stratix.

When designing with the EPF6016AFC100-2, ensure that your power-decoupling network matches Altera's FLEX 6000 reference design and that JTAG chain ordering is consistent with board-level boundary-scan planning. The 100-LBGA package requires careful PCB layout for the ball-pad fan-out - use of 0.5 mm via-in-pad or dog-bone fan-out is recommended to avoid solder joint reliability issues.

This page synthesizes distributor pricing, drop-in alternatives from the same Altera FLEX 6000 family, and practical design notes not found in the original datasheet.

Drop-in alternatives for EPF6016AFC100-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EPF6016AFC100-2 (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Speed Grade, Logic Array Blocks (LABs).

EPF6010ATC100-1

Altera

Package: 100-pin TQFP

Operating Temperature: -40°C to +85°C (industrial)

Process Technology: 0.42 µm CMOS