Altera

EPF6016ATI100-2N - FLEX 6000 FPGA, 16K Gates, 100-TQFP | Altera/Intel

MPN: EPF6016ATI100-2N ✗ End of Life

In Stock Ships in 1-3 business days

3.3 V Vdss 100-pin TQFP Package 166.67 MHz Speed

From $14.2 USD / Unit

MOQ: 1 |

Price updated: 2026-09-11

Volume Pricing

Qty	Unit Price	Extended
1	$32.5	$32.50
10	$28.9	$289.00
100	$22.4	$2,240.00
500	$17.85	$8,925.00
1,000	$14.2	$14,200.00

ℹ️ All prices are in USD

View Datasheet (PDF) View Alternatives

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EPF6016ATI100-2N Overview

The Intel/Altera EPF6016ATI100-2N is a member of the FLEX 6000 family of SRAM-based Field Programmable Gate Arrays (FPGAs), delivering approximately 16,000 usable gates in a 100-pin TQFP (Thin Quad Flat Pack) package. The device is built on a 0.42 um CMOS SRAM process and contains 1,320 logic elements (LEs) organized into 132 Logic Array Blocks (LABs), with 81 user I/O pins and an internal maximum operating frequency of approximately 166.67 MHz at a 3.3 V core supply. It supports in-system configuration via a JTAG-compatible boundary-scan interface and provides setup times as low as 2 ns with 0 ns hold time for high-speed sequential logic.

An FPGA (Field Programmable Gate Array) is a type of integrated circuit containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be reconfigured by the designer after manufacturing. FPGAs sit between fixed-function ASICs and software-programmable processors in the design hierarchy, offering hardware-level parallelism without the NRE cost of an ASIC. The FLEX 6000 family specifically targets low-cost, high-volume glue logic, control, and bus-interface applications where fast design changes during development are required.

Key features of the EPF6016ATI100-2N include 81 user I/Os, JTAG BST (Boundary-Scan Test) support, slew-rate control on output buffers, tri-state buffer capability per I/O, and dedicated clock networks. The LABs each contain 10 LEs, and the FastTrack interconnect provides predictable timing paths between LABs. I/O pins can drive LE registers directly via the row and column interconnect, simplifying timing closure for high-speed state machines and FIFO controllers.

Architecturally, the device combines a fine-grained LE structure with row/column interconnect routing, allowing automatic place-and-route via the MAX+PLUS II or Quartus design tools. The 0.42 um SRAM process supports 5.0 V tolerant I/Os when the device is powered at 3.3 V, useful for mixed-voltage bus bridging between legacy 5 V peripherals and 3.3 V processors.

Typical applications include bus bridging between microprocessors and peripherals, custom peripheral glue logic in embedded systems, ASIC prototyping, state-machine controllers, and pre-production design validation. The wide I/O count supports 8/16/32-bit data buses with handshake signals.

When designing, ensure the configuration EPROM (such as an EPC2 or EPC8) is correctly sized for the bitstream, and observe 3.3 V supply decoupling with at least 0.1 uF ceramic capacitors near each VCC pin to maintain signal integrity on the JTAG and high-speed I/O lines.

This page combines distributor pricing, verified drop-in alternatives, and practical design notes that supplement the manufacturer datasheet for sourcing and redesign decisions.

Drop-in alternatives for EPF6016ATI100-2N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EPF6016ATI100-2N (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Speed Grade, Logic Array Blocks (LABs).

EPF6010ATI100-2

Altera

Package: 100-pin TQFP (14×14 mm, 0.5 mm pitch)

Operating Temperature: -40 °C to +85 °C (industrial)

Process Technology: 0.42 µm CMOS