EPF6016AFC100-3 - FLEX 6000 FPGA, 16K Gates, 81 I/O, 100-FBGA
MPN: EPF6016AFC100-3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $30.38 | $30.38 |
| 10 | $27.34 | $273.40 |
| 100 | $24.3 | $2,430.00 |
| 500 | $21.27 | $10,635.00 |
| 1,000 | $18.23 | $18,230.00 |
EPF6016AFC100-3 Overview
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that integrates configurable logic blocks, programmable interconnect, and I/O cells on a single silicon die. FPGAs sit within the hierarchy: FPGA -> programmable logic device -> digital IC -> semiconductor. The FLEX 6000 family is Intel/Altera's classic SRAM-based, look-up-table (LUT) architecture offering fast design iteration during prototyping and low-cost migration from gate-array ASICs to programmable logic.
Key features include 81 user I/O pins, 4-input LUT-based logic elements, a hierarchical routing fabric with carry and cascade chains for high-speed arithmetic and wide-input functions, in-system programmability via SRAM configuration, and IEEE 1149.1 JTAG boundary-scan support. The FineLine BGA-100 footprint provides compact board mounting and improved signal integrity over QFP packages.
The FLEX 6000 architecture connects Logic Elements (LEs) inside Logic Array Blocks (LABs) with FastTrack Interconnect rows and columns. Each LE contains a 4-input LUT, a programmable register, and a carry/cascade chain path. Carry chains accelerate counters and adders, while cascade chains implement wide fan-in functions with minimal delay, supporting clock speeds beyond 142 MHz for datapath-intensive designs.
Typical applications include glue logic replacement, low-volume ASIC prototyping, industrial control interfaces, communications protocol bridging, and legacy design maintenance. The 3.3 V core voltage simplifies integration with 3.3 V microprocessors and memory.
When designing with this device, ensure the 100-FBGA PCB footprint uses 0.8 mm ball pitch and that JTAG pins TCK/TMS/TDO/TDI are routed cleanly. The FLEX 6000 family is mature and recommended for new designs only when targeting long-lifecycle industrial or legacy-compatible products.
This page synthesizes distributor pricing, drop-in FLEX 6000 alternatives, application guidance, and design notes not aggregated on any single manufacturer or distributor page.
Drop-in alternatives for EPF6016AFC100-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF6016AFC100-3 (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Speed Grade, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF6016AFC100-2
✅ Drop-In✓ In Stock
$5.4 / Unit
View Datasheet →EPF6010ATC100-3
✅ Drop-In✓ In Stock
$18.9 / Unit
View Datasheet →EPF6010ATC100-2
✅ Drop-In✓ In Stock
$14.2 / Unit
View Datasheet →EPF6010ATC100-1
✅ Drop-In✓ In Stock
$5.85 / Unit
View Datasheet →EPF6010ATC100-3N
✅ Drop-In✓ In Stock
$9.95 / Unit
View Datasheet →EPF6016AFC100-3 Maximum Ratings & Electrical Characteristics
| Family | FLEX 6000 |
| Device Type | FPGA (Field Programmable Gate Array) |
| Logic Gates | 16,000 gates |
| Logic Cells | 1,320 cells |
| Maximum Internal Frequency | 142.86 MHz |
| Process Technology | 0.42 um CMOS |
| User I/O | 81 |
| Supply Voltage | 3.3 V |
| Package | 100-pin FineLine BGA (FBGA) |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature | 0 C to 85 C (Commercial) |
| Architecture | SRAM-based, 4-input LUT |
| Configuration Method | SRAM (in-system programmable) |
| JTAG Support | IEEE 1149.1 Boundary Scan |
| RoHS Status | unknown |
EPF6016AFC100-3 100-pin fineline bga (fbga) Pin Configuration Guide
Pin configuration for EPF6016AFC100-3 (100-pin fineline bga (fbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF6016AFC100-3.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF6016AFC100-3 is suitable for 6 applications: ASIC Prototyping and Logic Emulation, Industrial Control and Factory Automation, Communications Protocol Bridging, Legacy Peripheral and Memory Interface, Glue Logic Replacement for Legacy Designs, Test and Measurement Instrumentation.
ASIC Prototyping and Logic Emulation
The EPF6016AFC100-3 fits ASIC prototyping because its 16,000-gate density and 1,320 logic cells map directly to gate-array netlists of similar capacity, while 81 user I/Os accommodate wide data and address buses typical of emulated SoC designs. Engineers port RTL from ASIC flows, validate timing at up to 142.86 MHz internal toggle rate, and iterate without NRE charges, then migrate to a hard ASIC once the prototype is stable. The 100-FBGA package with 0.8 mm pitch enables high-density breadboard designs. Carry chains accelerate datapath elements like counters and adders, while cascade chains implement wide-input glue logic with low delay. For cost-sensitive prototyping runs, the -2 speed grade EPF6016AFC100-2 is pin-compatible.
Recommended
Industrial Control and Factory Automation
The EPF6016AFC100-3 suits industrial control because its 81 user I/Os directly interface 24 V-tolerant opto-isolated signals (with external level shifters), 3.3 V core integrates cleanly with legacy microcontrollers, and the 0-85 C commercial temperature range covers most factory-floor enclosures. The 100-FBGA package is mechanically robust for vibration-prone environments when properly underfilled, and the SRAM-based configuration supports remote firmware updates via JTAG over Ethernet bridges. Typical designs include motor-control state machines, PLC co-processors, and protocol bridges converting between Profibus, Modbus, and CANopen. The FLEX 6000 family has decades of field-proven reliability in industrial settings, and Rochester Electronics maintains long-term inventory for legacy support.
Recommended
Communications Protocol Bridging
The EPF6016AFC100-3 is well-suited for protocol bridging because its 1,320 logic cells implement UART, SPI, I2C, and parallel-bus state machines concurrently, while 81 I/Os accommodate multiple physical interfaces simultaneously. The 142.86 MHz internal frequency supports HDLC bit-stuffing, CRC computation, and clock-domain crossing for legacy-to-modern protocol migration (RS-232 to USB, parallel to SPI). The 100-FBGA package keeps trace lengths short for the multi-megahertz serial interfaces. Designers commonly use this FPGA as a co-processor alongside a microcontroller, offloading real-time protocol framing. The -3 speed grade ensures timing closure at maximum bus rates; downgrade to EPF6016AFC100-2 for slower serial interfaces.
Recommended
Legacy Peripheral and Memory Interface
The EPF6016AFC100-3 fits legacy interface designs because its 16K-gate density implements ISA-bus controllers, IDE/PATA interfaces, and SRAM/DRAM glue logic with abundant I/O headroom (81 pins). The 3.3 V supply aligns with PC-era chipset rails, and the 0.42 um CMOS process delivers the timing margins required for half-bus architectures where legacy peripherals expect 8-33 MHz operation. The 100-FBGA footprint reduces board area versus equivalent QFP designs, important when stacking multiple FPGAs for bus multiplexing. Designers use it to extend the lifecycle of industrial PCs, test equipment, and medical instrumentation built around obsolete microprocessors without redesigning the entire motherboard.
Recommended
Glue Logic Replacement for Legacy Designs
The EPF6016AFC100-3 is ideal for glue logic consolidation because a single device replaces dozens of 74-series TTL or CMOS logic chips (gates, muxes, latches, decoders) using 16K gates of LUT-based logic. The 81 user I/Os aggregate all discrete signals, and the 100-FBGA package's compact 16x16 mm footprint replaces large discrete-logic PCB sections, reducing board area and improving signal integrity. Designers use this FPGA when maintaining legacy products whose original logic is obsolete or hard-to-source. The 142.86 MHz internal frequency easily meets legacy timing budgets. The -2 speed grade EPF6016AFC100-2 provides a lower-cost variant for designs not requiring full -3 performance.
Recommended
Test and Measurement Instrumentation
The EPF6016AFC100-3 suits test equipment because its programmable architecture supports reconfigurable test pattern generators, protocol analyzers, and timing generators with 142.86 MHz resolution. The 81 user I/Os handle parallel test vector buses, while the SRAM-based configuration enables per-test loadable patterns via JTAG. The 100-FBGA package with 0.8 mm pitch fits in compact PXI/PCI cards and benchtop instruments. Designers implement counter/timer chains using the carry chain paths for sub-nanosecond resolution. The FLEX 6000 family's long-term availability through Rochester Electronics makes it viable for production test equipment with 10-20 year lifecycle expectations in ATE and laboratory instrumentation markets.
Recommended
Recommended Products Summary
Engineering reference data for EPF6016AFC100-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF6016AFC100-2 | EPF6010ATC100-3 | EPF6010ATC100-2 | EPF6010ATC100-1 | EPF6010ATC100-3N |
|---|---|---|---|---|---|---|
| Package | 100-FBGA | 100-FBGA - same | 100-FBGA - same | 100-FBGA - same | 100-FBGA - same | 100-FBGA - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Family | FLEX 6016 | FLEX 6016 | FLEX 6010 | FLEX 6010 | FLEX 6010 | FLEX 6010 |
| Logic Gates | 16,000 | 16,000 | 10,000 | 10,000 | 10,000 | 10,000 |
| Logic Cells | 1,320 | 1,320 | 880 | 880 | 880 | 880 |
| Max Internal Frequency | 142.86 MHz (-3 grade) | ~120 MHz (-2 grade) | 142.86 MHz (-3 grade) | ~120 MHz (-2 grade) | ~100 MHz (-1 grade) | 142.86 MHz (-3 grade) |
| User I/O | 81 | 81 | 81 | 81 | 81 | 81 |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C |
| Lifecycle | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest density FLEX 6000 device in the 100-FBGA package (vs EPF6010ATC100-3)
- Fastest speed grade in the FLEX 6016 family (vs EPF6016AFC100-2)
- Mature, long-supported legacy FPGA family (vs EPF6010ATC100-3N)
Design Notes
The 100-FBGA package uses 0.8 mm ball pitch, which requires PCB fabrication with laser-drilled microvias or 4 mil line/space rules. Recommended PCB stack-up: 4-6 layers with continuous ground plane beneath the BGA to control return paths for the 81 high-speed I/Os. Use non-solder-mask-defined (NSMD) pads smaller than the 0.5 mm ball to improve self-alignment during reflow. For prototypes, consider break-away adapter boards that route the BGA to 0.1 inch headers for breadboard access; for production, allocate at least 16x16 mm board area plus keepout for routing fan-out.
The FLEX 6000 family uses SRAM-based configuration, which means the FPGA loses its design on power-down and must be reconfigured at every boot from a configuration PROM (EPC2LC20, EPC4, EPC8) or via JTAG. A common mistake is omitting the configuration memory in production boards, resulting in non-functional prototypes. Also, MSELn pins must be tied to select the configuration mode (AS, AP, PS, JTAG) - leaving them floating causes configuration failures. The nCONFIG, nSTATUS, and CONF_DONE pins must each have a 10 kohm pull-up to VCC for reliable power-on reset behavior.
Estimated: At maximum utilization with all 1,320 logic cells toggling at 142.86 MHz, the EPF6016AFC100-3 dissipates approximately 0.5-1.0 W. The 100-FBGA package has a theta_JA of approximately 25-30 C/W with standard JEDEC test board conditions, giving a junction temperature rise of 12-30 C above ambient. For industrial applications where ambient reaches 70 C, ensure the design utilizes less than 60% of logic cells to keep junction temperature below 100 C. The exposed center balls in the FBGA can be tied to GND on the PCB for additional thermal dissipation if needed.
Compliance Information
RoHS/lead-free compliance status not confirmed in the verified distributor data. FLEX 6000 family parts predate RoHS mandates in many cases; the EPF6010ATC100-3N variant carries an 'N' suffix suggesting lead-free/RoHS-compliant reflow compatibility. AEC-Q100 not applicable as this is a commercial-grade FPGA.
