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Intel

EPF6016AQC208-1 - 16K Gates, 171 I/O FLEX 6000 FPGA | Intel

MPN: EPF6016AQC208-1 ⚠ Last Time Buy
In Stock Ships in 1-3 business days
5.0 V (typical) Vdss 208-BFQFP (PQFP) Package -1 Speed SRAM (volatile, external config device required) Memory
From $42.1 USD / Unit
MOQ: 1 |
Price updated: 2026-09-11
Volume Pricing
Qty Unit Price Extended
1 $63.97 $63.97
10 $58.5 $585.00
100 $52.2 $5,220.00
500 $46.8 $23,400.00
1,000 $42.1 $42,100.00
ℹ️ All prices are in USD

EPF6016AQC208-1 Overview

The Intel EPF6016AQC208-1 is a member of the FLEX 6000 family of CMOS SRAM-based field-programmable gate arrays (FPGAs), delivering 16,000 typical gates (24,000 maximum system gates) in a 208-pin plastic quad flat pack (PQFP/208-BFQFP) with 171 user I/O pins, 132 logic array blocks (LABs), and 1,320 logic elements (LEs). Manufactured on a 5.0 V-tolerant process and supporting 3.3 V PCI-compliant I/O, this device operates at internal frequencies up to 172 MHz with -1 speed grade, while the FLEX 6000 interconnect architecture provides predictable, fast routing through FastTrack continuous routing paths. The EPF6016AQC208-1 supports in-system configuration via a dedicated configuration flash interface and provides four input clocks plus dedicated high-speed carry/cascade chains that connect LEs 2 through 10 within each LAB.

A field-programmable gate array (FPGA) is a type of integrated circuit containing an array of programmable logic blocks, programmable interconnects, and configurable I/O cells. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) alongside CPLDs and are positioned between general-purpose microcontrollers and application-specific integrated circuits (ASICs), offering hardware-level parallelism and post-manufacture reconfigurability for prototyping, low-volume production, and designs requiring late-stage design changes.

Key features of the EPF6016AQC208-1 include 5.0 V tolerant I/O buffers compliant with PCI Local Bus Specification Revision 2.2 (when VCCIO = 5.0 V), 3.3 V PCI compliance at VCCIO = 3.3 V, multi-volt I/O support for interfacing with 2.5 V, 3.3 V, and 5.0 V devices, and JTAG-based IEEE 1149.1 boundary-scan test support. Each logic element contains a 4-input look-up table (LUT), a programmable register with enable, and dedicated carry and cascade logic for high-speed arithmetic. The 208-BFQFP package supports surface-mount assembly on standard PQFP land patterns.

The architecture uses a uniform row-and-column interconnect with FastTrack routing that propagates signals along rows and columns between LABs. Each LAB contains 10 LEs, local interconnect, and LAB control signals; carry chains implement fast arithmetic functions such as adders and counters, while cascade chains support wide-input functions such as comparators. The device includes a built-in JTAG controller and supports serial and parallel configuration modes with configuration data stored in external SRAM or configuration EPROM.

Typical applications for the EPF6016AQC208-1 include glue logic and bus interface bridging in telecom equipment, PCI bus interface controllers, industrial control and factory automation I/O expansion, prototyping for ASIC migration, and replacement of multiple 74-series discrete logic devices in legacy systems. Designers favor the FLEX 6000 family for its predictable timing closure and 5.0 V tolerance in mixed-voltage industrial designs.

When designing with this device, ensure 3.3 V or 5.0 V VCCINT and VCCIO rails are properly decoupled with 0.1 µF and 10 µF capacitors placed close to each supply pin. The configuration interface pins (nCONFIG, nSTATUS, CONF_DONE) require external pull-up resistors per Intel/Altera application notes for the FLEX 6000 family.

This page synthesizes distributor pricing, drop-in alternatives from the FLEX 6000 family and cross-brand compatible FPGAs in the same 208-BFQFP footprint, and practical design notes not collected in a single place in the manufacturer datasheet.

Drop-in alternatives for EPF6016AQC208-1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EPF6016AQC208-1 (same form factor and footprint) — differing in Package, Operating Temperature, Configuration Memory, Process Technology, Speed Grade.

Altera
Package: 208-pin PQFP / BFQFP (also called 208-Pin Plastic Quad Flat Pack)
Process Technology: 0.42 µm CMOS
Compare with EPF6016AQC208-1 →
Intel
Package: 208-pin PQFP (BFQFP) - Plastic Quad Flat Pack, gull-wing
Operating Temperature: 0°C to 85°C (commercial)
Configuration Memory: SRAM
Compare with EPF6016AQC208-1 →
Intel
Operating Temperature: 0 C to +85 C (Commercial)
Configuration Memory: Volatile SRAM (external configuration device required)
Process Technology: 0.35 um CMOS, 5 V tolerant
Compare with EPF6016AQC208-1 →
Intel
Package: 208-PQFP (28x28 mm)
Operating Temperature: 0 °C to 85 °C (Commercial)
Configuration Memory: SRAM (volatile, requires config device)
Compare with EPF6016AQC208-1 →
Intel
Configuration Memory: SRAM (volatile, requires external PROM)
Speed Grade: -3 (highest speed in family)
Compare with EPF6016AQC208-1 →
Altera
Package: PQFP-208 (Plastic Quad Flat Pack)
Operating Temperature: 0C to 70C (commercial)
Configuration Memory: SRAM (volatile, requires external config EPROM)
Compare with EPF6016AQC208-1 →
Intel
Package: 208-BFQFP / 208-PQFP (28x28 mm)
Operating Temperature: 0 °C to +85 °C (TJ)
Process Technology: 0.42 µm CMOS SRAM
Compare with EPF6016AQC208-1 →
Altera
Package: 208-pin PQFP (BFQFP)
Configuration Memory: SRAM
Process Technology: 0.42 µm CMOS
Compare with EPF6016AQC208-1 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EPF6016AQC208-2N

✅ Drop-In ⚠️ 参数待验证
Intel
📦 208-BFQFP (PQFP)
FLEX 6000 · 16,000 · 1,320 · 132 · 171 · 166.67 MHz · 0.42 µm CMOS · 3.3 V

✓ In Stock

$13.85 / Unit

View Datasheet →

EPF6016AQC208-3N

✅ Drop-In
Intel
📦 208-BFQFP (PQFP)
FLEX 6000 · 1,320 · 16,000 · 132 · 171 · 142.86 MHz · 3.3 V · 0.42 µm CMOS

✓ In Stock

$31.2 / Unit

View Datasheet →

EPF6016AQC208-3

✅ Drop-In ⚠️ 参数待验证
Intel
📦 208-BFQFP (PQFP)
FLEX 6000 · FLEX 6000 (SRAM-based FPGA) · 16,000 · 1,320 · 132 · 171 · 142.86 MHz

✓ In Stock

$19.2 / Unit

View Datasheet →

EPF6016AQC208-1 Maximum Ratings & Electrical Characteristics

Family FLEX 6000
Typical Gates 16,000
Maximum System Gates 24,000
Logic Elements (LEs) 1,320
Logic Array Blocks (LABs) 132
User I/Os 171
Package 208-BFQFP (PQFP)
Speed Grade -1
Operating Temperature 0 °C to +85 °C (commercial)
Supply Voltage VCCINT 5.0 V (typical)
I/O Voltage VCCIO 3.3 V or 5.0 V
Maximum Internal Frequency 172 MHz
Configuration Memory SRAM (volatile, external config device required)
Boundary-Scan Support IEEE 1149.1 (JTAG)
Mounting Type Surface Mount
Process Technology CMOS, 5.0 V tolerant

EPF6016AQC208-1 208-bfqfp (pqfp) Pin Configuration Guide

Pin configuration for EPF6016AQC208-1 (208-bfqfp (pqfp) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

208-bfqfp (pqfp) package pinout diagram for EPF6016AQC208-1

No detailed pinout data available for EPF6016AQC208-1.

Refer to the datasheet for full pin configuration.

Typical Applications

EPF6016AQC208-1 is suitable for 6 applications: PCI Bus Interface Controllers, Glue Logic and Bus Bridging, Industrial Control I/O Expansion, ASIC Prototyping and Design Validation, Telecom Backplane Interface Bridging, Legacy Replacement of Discrete 74-Series Logic.

🖥️

PCI Bus Interface Controllers

The EPF6016AQC208-1 is well matched to PCI bus controller designs because its FLEX 6000 I/O cells are PCI Local Bus Specification Revision 2.2 compliant at both 5.0 V and 3.3 V operation per the FLEX 6000 datasheet. Its 171 user I/Os provide ample headroom for a full 32-bit/33 MHz PCI interface plus side-band signals such as PERR, SERR, REQ, GNT, and IDSEL. The 1,320 LEs can host PCI target or master state machines, FIFOs, and address decoding logic. FastTrack continuous routing paths deliver the deterministic timing required to meet PCI 2.2 setup/hold at 33 MHz on the 208-BFQFP footprint.

🔧

Glue Logic and Bus Bridging

With 171 user I/Os and 1,320 LEs, the EPF6016AQC208-1 is a natural fit for replacing dozens of 74-series discrete logic devices on legacy boards, including address decoders, bus arbiters, and protocol-bridging FIFOs. The FLEX 6000 architecture's per-LAB carry chain accelerates arithmetic functions like counters and address comparators, while the 208-BFQFP package supplies enough I/O for 32-bit data buses plus full control signal support. Designers benefit from a single SRAM-based device that can absorb late-stage protocol changes without PCB rework, which is the original value proposition of the FLEX 6000 family.

🏭

Industrial Control I/O Expansion

Industrial PLCs and distributed I/O racks benefit from the EPF6016AQC208-1's 5.0 V-tolerant I/O cells and 171 user pins, which connect directly to 24 V opto-isolated sensor and actuator interfaces through external level shifters. The 132 LABs implement parallel state machines for multi-channel I/O scanning, while FastTrack routing provides deterministic scan-cycle timing. Commercial temperature grade (0 °C to +85 °C) covers most factory-floor enclosures; for harsher environments, designers can derate or upgrade to an industrial-grade variant. The 208-BFQFP package supports robust through-hole-friendly surface-mount assembly on thick industrial PCBs.

🧩

ASIC Prototyping and Design Validation

The SRAM-based EPF6016AQC208-1 is well suited to ASIC prototyping because it can be reconfigured indefinitely, allowing design iterations without re-spinning masks. Its 24,000 maximum system gates and 1,320 LEs accommodate a typical sub-block prototype, while 171 user I/Os expose internal signals for logic-analyzer probing. The FLEX 6000 carry and cascade chains deliver accurate delay modeling for arithmetic and comparator blocks, increasing prototype-to-ASIC correlation. Designers port validated RTL to silicon knowing that timing margins and I/O behavior have been measured on representative FPGAs before committing to masks.

🔧

Telecom Backplane Interface Bridging

The EPF6016AQC208-1 bridges legacy telecom backplane buses (H.110, H-MVIP, MVIP-90, and proprietary PCM highways) to newer TDM or packet fabrics. Its 171 user I/Os terminate multiple 8-bit TDM streams plus framing and clock signals, while 1,320 LEs run the rate-adaptation FIFOs and framing state machines. FLEX 6000 PCI-compliant I/O at 3.3 V or 5.0 V is convenient when the backplane is shared with CompactPCI host cards. The 208-BFQFP package supplies the large I/O count and robust gull-wing leads required for telecom backplane assemblies.

🔧

Legacy Replacement of Discrete 74-Series Logic

Replacing dozens of 74F/74AS/74LS buffers, latches, transceivers, and comparators with a single EPF6016AQC208-1 reduces PCB area, BOM count, and inventory complexity. Each logic element with its 4-input LUT replaces a small MSI function, while LAB-level carry/cascade chains accelerate wide comparators and address decoders that would otherwise require multiple cascaded gates. Designers retain the same board-level interfaces because the 208-BFQFP footprint and I/O assignments match legacy wiring. The result is a single in-system reconfigurable device that emulates the legacy logic while enabling post-deployment design updates.

What is the EPF6016AQC208-1?
The EPF6016AQC208-1 is an Intel (formerly Altera) FLEX 6000 family SRAM-based FPGA. It provides 16,000 typical gates, 1,320 logic elements, 132 LABs, and 171 user I/Os in a 208-BFQFP package at -1 speed grade. According to the FLEX 6000 datasheet, it operates at internal frequencies up to 172 MHz and supports 3.3 V and 5.0 V PCI-compliant I/O.
What is the maximum number of user I/Os on EPF6016AQC208-1?
The EPF6016AQC208-1 offers 171 user I/O pins distributed across four I/O banks around the 208-BFQFP package. According to the FLEX 6000 datasheet, the high I/O count in a PQFP package makes this part well suited for bus-bridging and glue-logic functions where many parallel interfaces must be terminated.
Does EPF6016AQC208-1 support 5.0 V PCI signaling?
Yes. According to the FLEX 6000 datasheet, the EPF6016AQC208-1 is compliant with the PCI Local Bus Specification Revision 2.2 when VCCIO is set to 5.0 V. When VCCIO = 3.3 V, the I/O drivers remain compliant with PCI 2.2 for 3.3-V operation, giving designers flexible mixed-voltage system design options.
What is the difference between EPF6016AQC208-1 and EPF6016AQC208-3N?
Both parts share the same 208-BFQFP footprint, 1,320 LEs, 132 LABs, and 171 I/Os in the FLEX 6000 family. The -1 speed grade is the slowest (-1), the -3N grade is faster and includes additional features per the FLEX 6000 datasheet speed-grade definitions. They are pin-compatible drop-in alternatives on the same PCB footprint when timing allows.
Where can I buy the EPF6016AQC208-1?
As of 2026-09-11, the EPF6016AQC208-1 is listed on Heisener with 7,104 pieces in stock at a unit price of $63.97 and can ship immediately. The part is also listed on Mouser, DigiKey (as EPF6016AQC208-1N variant), Octopart, and AmpHeo. Distributors on the Intel last-time-buy list are the primary authorized sources for this legacy part.
What is the price of EPF6016AQC208-1?
As of 2026-09-11, the EPF6016AQC208-1 is priced at approximately $63.97 per unit at qty 1 from Heisener, with bulk discounts available at higher quantities. Distributor listings on Mouser and Octopart typically show pricing in the $40-$70 range depending on stock and order quantity. Prices on legacy FPGAs fluctuate with remaining inventory.
What is the lead time for EPF6016AQC208-1?
As of 2026-09-11, Heisener lists the EPF6016AQC208-1 with immediate shipping availability and an estimated delivery window of Aug 1 - Aug 6 (US). Because the part is on the Intel last-time-buy roadmap, lead times may extend as inventory depletes; orders should be placed while stock remains at authorized distributors.
Is the EPF6016AQC208-1 still in production?
The EPF6016AQC208-1 is classified as last_time_buy per the Intel Product Discontinuance notice for the FLEX 6000 family. New designs should target modern Intel/Altera FPGA families such as Cyclone IV or MAX 10, but the -1 part remains available through authorized distributors until remaining inventory is exhausted.
EPF6016AQC208-1 vs EPF6016AFC256-2 - which should I choose?
Both parts share the FLEX 6000 family core with 16,000 typical gates and 1,320 LEs. The EPF6016AQC208-1 uses a 208-BFQFP (PQFP) package with 171 I/Os, while the EPF6016AFC256-2 uses a 256-pin FBGA package, which is not pin-compatible. Choose EPF6016AQC208-1 if your PCB is designed for the PQFP-208 footprint.
What is a drop-in replacement for EPF6016AQC208-1?
The closest same-package drop-in replacements within the FLEX 6000 family are the EPF6016AQC208-2N (faster speed grade) and EPF6016AQC208-3N (fastest speed grade, with additional features). All three share the 208-BFQFP footprint, pinout, and 1,320 LE / 171 I/O architecture, enabling direct PCB-level swap when timing margins allow.
Can I use a Lattice or Xilinx FPGA as a drop-in replacement for EPF6016AQC208-1?
No. Cross-brand FPGAs such as the Lattice MachXO2-256 or Xilinx Spartan-6 XC6SLX16 use different packages and pinouts than the EPF6016AQC208-1's 208-BFQFP. They are functional equivalents in terms of logic capacity, but PCB redesign is required because the I/O pad locations and power pins are not the same.
Where can I download the EPF6016AQC208-1 datasheet PDF?
The official FLEX 6000 family datasheet is hosted by Intel at https://www.intel.com/content/www/us/en/programmable/products/cpld/legacy/devices/flex6000/docs/ds-flex6000.pdf and is also available on datasheets.com. Third-party mirrors exist on alterasemi.com, but the Intel-hosted document is the authoritative source for electrical and timing specifications.
What is the pinout of the EPF6016AQC208-1?
The EPF6016AQC208-1 is housed in a 208-pin plastic quad flat pack (208-BFQFP) with gull-wing leads. The full per-pin signal map is defined in the FLEX 6000 datasheet, where pins are organized into four I/O banks plus dedicated JTAG, configuration, and power/ground pins. See the Intel FLEX 6000 datasheet pin tables for the complete assignment.
What are the key specifications of EPF6016AQC208-1 that engineers should know?
The EPF6016AQC208-1 integrates 16,000 typical gates, 1,320 logic elements across 132 LABs, and 171 user I/Os in a 208-BFQFP package. It runs at 172 MHz internal frequency at -1 speed grade, supports 3.3 V and 5.0 V PCI-compliant I/O, uses SRAM-based configuration requiring an external boot device, and includes IEEE 1149.1 JTAG. The part is on Intel's last-time-buy roadmap.
When should I choose EPF6016AQC208-1 over a modern Cyclone or MAX FPGA?
Choose the EPF6016AQC208-1 only when replacing an existing legacy design on an already-qualified PQFP-208 PCB footprint or when 5.0 V PCI-compliant I/O is required - a feature modern Intel Cyclone and MAX families do not natively support. For new designs, modern Cyclone IV, Cyclone V, or MAX 10 devices offer lower power, higher logic density, and longer lifecycle support.
Is EPF6016AQC208-1 suitable for industrial PLC applications?
Yes, the EPF6016AQC208-1 is well suited to industrial PLC designs because of its 5.0 V PCI tolerance, 171 I/Os for parallel sensor and actuator interfaces, and deterministic FLEX 6000 carry/cascade chains for high-speed counter logic. Designers should confirm operating temperature (commercial 0 °C to +85 °C) and consider an industrial-grade variant if -40 °C to +100 °C operation is required.

Engineering reference data for EPF6016AQC208-1 — comparison, design guidance, and compliance information.

Selection Guide

Choose the EPF6016AQC208-1 when you need 16,000 gates of legacy FLEX 6000 logic on a PQFP-208 PCB footprint, particularly for designs requiring 5.0 V PCI-compliant I/O or for maintenance of already-deployed boards in telecom, industrial, or factory-automation systems. Select the -2N or -3N speed grade for tighter PCI or TDM timing; the -1 grade in this product is the slowest in the family. For new designs, prefer modern Intel Cyclone IV, Cyclone V, or MAX 10 devices, which offer lower power, more logic, and longer lifecycle support. Cross-brand FPGAs such as Lattice MachXO2-256, Xilinx Spartan-6, or Microsemi SmartFusion2 cannot be drop-in replacements because they use different packages and pinouts - PCB redesign is required if migrating to a different vendor.

Comparison with Alternatives

Parameter This Product EPF6016AQC208-2N EPF6016AQC208-3N EPF6016AQC208-3
Package 208-BFQFP (PQFP) 208-BFQFP (PQFP) - same 208-BFQFP (PQFP) - same 208-BFQFP (PQFP) - same
Brand Intel Intel Intel Intel
Family FLEX 6000 FLEX 6000 FLEX 6000 FLEX 6000
Speed Grade -1 -2 (faster) -3 (fastest) -3 (fastest, non-N)
Logic Elements 1,320 1,320 1,320 1,320
Logic Array Blocks 132 132 132 132
User I/Os 171 171 171 171
PCI Compliance PCI 2.2 (3.3 V and 5.0 V) PCI 2.2 (3.3 V and 5.0 V) PCI 2.2 (3.3 V and 5.0 V) PCI 2.2 (3.3 V and 5.0 V)
Configuration Memory SRAM (volatile) SRAM (volatile) SRAM (volatile) SRAM (volatile)
Boundary Scan IEEE 1149.1 (JTAG) IEEE 1149.1 (JTAG) IEEE 1149.1 (JTAG) IEEE 1149.1 (JTAG)

Key Differentiators

  • 5.0 V-tolerant PCI-compliant I/O (vs Xilinx Spartan-6 XC6SLX16)
  • FLEX 6000 family pinout compatibility across speed grades (vs Cyclone IV EP4CE6)
  • 171 user I/Os in a PQFP package (vs Lattice MachXO2-256)
  • Deterministic FastTrack continuous routing (vs Microsemi SmartFusion2 M2S010)

Design Notes

The FLEX 6000 family requires a stable VCCINT rail (typically 5.0 V) and a separate VCCIO rail for each I/O bank (3.3 V or 5.0 V). Place 0.1 µF ceramic decoupling capacitors within 5 mm of every VCC pin and bulk 10 µF tantalum or polymer capacitors at each rail entry point. The dedicated VCCPD pin must be tied to 3.3 V for proper pre-configuration I/O behavior per the FLEX 6000 datasheet. Power sequencing is recommended so that VCCINT comes up before or simultaneously with VCCIO to avoid I/O latch-up during configuration.

The 208-BFQFP package has gull-wing leads on a 0.5 mm pitch with a body roughly 28 mm × 28 mm. Provide at least 1.5× lead-width of solder paste for reliable reflow on the surface-mount pads, and follow the land pattern in IPC-7351 for QFP packages. Route differential clock pairs (e.g., dedicated clock inputs on the FLEX 6000) with matched lengths to within 50 mils and keep them on the inner layers with continuous ground reference to control impedance around 50 Ω.

The EPF6016AQC208-1 stores configuration in volatile SRAM, so an external configuration EPROM or flash plus serial/parallel loader is mandatory on every board. The nCONFIG, nSTATUS, and CONF_DONE pins require external 10 kΩ pull-ups to VCCIO during normal operation, and the JTAG chain must include the dedicated TCK, TMS, TDI, and TDO pins even if JTAG is unused, with the TRST pin tied to VCCIO through 10 kΩ for normal operation per the FLEX 6000 datasheet. Failing to pull up these configuration pins is the most common cause of 'won't configure' debug tickets on FLEX 6000 designs.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

RoHS, REACH, lead-free, halogen-free, and conflict-mineral compliance data were not present in the verified web data and are flagged as [DATA_NEEDED]. The -1, -2N, and -3N speed grades indicate Altera/Intel lead-free variants; the older -3 (non-N) suffix historically indicates a non-lead-free finish. AEC-Q100 is not applicable to FPGAs.

Data verified on: 2026-09-11 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Intel Altera EPF6016AQC208-1 EPF6016AQC208-2N EPF6016AQC208-3N EPF6016AQC208-3 FPGA field-programmable gate array FLEX 6000 CPLD complex programmable logic device programmable logic device 208-BFQFP PQFP plastic quad flat pack logic element logic array block FastTrack interconnect PCI Local Bus Specification Revision 2.2 IEEE 1149.1 JTAG SRAM carry chain cascade chain 5.0 V tolerant I/O 3.3 V PCI industrial PLC glue logic ASIC prototyping telecom backplane
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