EPF6016AQC208-3S - FLEX 6000 FPGA 16K Gates, 208-PQFP | Intel
MPN: EPF6016AQC208-3S ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $48.5 | $48.50 |
| 10 | $42.8 | $428.00 |
| 100 | $36.5 | $3,650.00 |
| 500 | $31.2 | $15,600.00 |
| 1,000 | $27.9 | $27,900.00 |
EPF6016AQC208-3S Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O cells that engineers can configure after manufacturing to implement custom digital hardware. FPGAs sit in the programmable logic hierarchy above SPLDs and CPLDs, and below fixed-function ASICs. The FLEX 6000 family uses 4-input look-up tables (LUTs) optimized for high-volume, low-cost glue logic, bus interface, and DSP pre/post-processing applications where fast design changes are required during prototyping.
Key features of the EPF6016AQC208-3S include 132 LABs with 1,320 logic elements, 171 user I/O pins supporting multiple I/O standards including 3.3V LVCMOS/LVTTL, an SRAM-based configuration memory allowing in-system re-programmability, and built-in JTAG (IEEE 1149.1) boundary-scan test support. The device exposes dedicated clock and global routing networks for high-fanout signal distribution across the fabric, with multi-volt I/O permitting 5.0V tolerance on input pins when the VCCIO rail is set to 3.3V.
The FLEX 6000 architecture separates logic resources into LABs interconnected by a continuous routing matrix called the FastTrack Interconnect. Each LAB contains 10 logic elements, each built around a 4-input LUT with a programmable register, allowing efficient implementation of wide-input combinational and sequential logic. Configuration bitstreams are loaded from an external EPROM, flash, or via the JTAG port, and the SRAM cell array can be reconfigured in milliseconds, supporting rapid iteration and field upgrades.
Typical applications include telecom interface bridging, industrial control and factory automation glue logic, low-density DSP pre-processing and filtering, peripheral bus controllers, and legacy system replacement of TTL/CMOS gate-array designs. The 208-PQFP package with 0.5mm pitch remains popular for prototype boards, evaluation kits, and long-lifecycle industrial products where surface-mount BGA migration is undesirable.
When designing with this part, plan for an external configuration PROM (such as the EPC2 or EPC8) because the SRAM-based fabric loses configuration on power-down. Use the Quartus II or MAX+PLUS II development toolchain (legacy versions) for synthesis, place-and-route, and bitstream generation. Ensure decoupling capacitors are placed within 5mm of every VCC and GND pin pair.
This page synthesizes distributor inventory data, drop-in same-package alternatives drawn from the FLEX 6000 family, and practical design notes that complement the manufacturer datasheet.
Drop-in alternatives for EPF6016AQC208-3S — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF6016AQC208-3S (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Configuration Memory, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF6016AQC208-3N
✅ Drop-In✓ In Stock
$31.2 / Unit
View Datasheet →EPF6016AQC208-3
✅ Drop-In✓ In Stock
$19.2 / Unit
View Datasheet →EPF6016AQC208-2N
✅ Drop-In✓ In Stock
$13.85 / Unit
View Datasheet →EPF6016AQC208-2
✅ Drop-In✓ In Stock
$19.4 / Unit
View Datasheet →EPF6016AQC208-1
✅ Drop-In✓ In Stock
$42.1 / Unit
View Datasheet →EPF6016AQC208-3S Maximum Ratings & Electrical Characteristics
| Series | FLEX 6000 |
| Device Type | Field-Programmable Gate Array (FPGA) |
| Typical Gates | 16,000 |
| Logic Elements | 1,320 |
| Logic Array Blocks (LABs) | 132 |
| User I/O Pins | 171 |
| Package Type | 208-PQFP (Plastic Quad Flat Pack) |
| Package Code | FQFP, 28x28 mm, 0.5 mm pitch |
| Supply Voltage - Core | 3.3 V |
| Supply Voltage - Operating | 3.0 V to 3.6 V |
| Operating Temperature (TJ) | 0C to 85C |
| Configuration Memory | SRAM (volatile, requires external PROM) |
| I/O Standards | 3.3V LVCMOS/LVTTL, 5V tolerant inputs |
| JTAG Support | IEEE 1149.1 Boundary-Scan |
| Mounting Type | Surface Mount |
| Speed Grade | -3 (highest speed in family) |
EPF6016AQC208-3S fqfp, 28x28 mm, 0.5 mm pitch Pin Configuration Guide
Pin configuration for EPF6016AQC208-3S (fqfp, 28x28 mm, 0.5 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF6016AQC208-3S.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF6016AQC208-3S is suitable for 6 applications: Telecom Interface Bridging, Industrial Control Glue Logic, Peripheral Bus Controllers, Low-Density DSP Pre-Processing, Legacy System TTL Replacement, Prototype and Evaluation Boards.
Telecom Interface Bridging
The EPF6016AQC208-3S is well suited for telecom interface bridging between legacy 5V TTL buses and modern 3.3V LVCMOS logic, where its 171 user I/O pins comfortably accommodate parallel data and control channels. Engineers typically use the 5V-tolerant inputs to read directly from E1/T1 framer logic, while driving 3.3V LVCMOS downstream into DSP or micro-controller devices. The 16,000-gate fabric supports state machines for protocol conversion and FIFO buffer logic at line rates up to tens of MHz, with the -3 speed grade preserving timing margin in multi-stage glue designs. SRAM-based reconfigurability allows field upgrades when bridging standards evolve.
Recommended
Industrial Control Glue Logic
Industrial control and factory automation systems frequently require custom bus arbitration, encoder decoding, and sensor pre-processing logic where standard CPLDs run out of resources but a full ASIC is unjustified. The EPF6016AQC208-3S delivers 1,320 logic elements across 132 LABs, ample headroom for I2C/SPI master controllers, PWM generators, and quadrature-decoder state machines. Its 0C-85C operating temperature and 3.3V core are compatible with industrial-grade voltage rails, while the 208-PQFP package remains easy to hand-rework and inspect on long-life industrial boards. Designers should note that the device is obsolete, so new industrial platforms should evaluate MAX II or Cyclone equivalents.
Recommended
Peripheral Bus Controllers
The EPF6016AQC208-3S provides 171 user I/O pins which is well matched to legacy parallel peripheral buses such as ISA, PC/104, and proprietary register-mapped control interfaces. The LUT-rich architecture efficiently implements address decoders, wait-state generators, and DMA handshaking logic that would otherwise consume dozens of discrete 74-series TTL packages, reducing board area and improving reliability. The -3 speed grade sustains 33 MHz bus timing on ISA-compatible interfaces with comfortable margin, while JTAG 1149.1 boundary scan simplifies in-system test on dense industrial backplanes. Volatile SRAM configuration is acceptable for fixed industrial installations where the bitstream is loaded once at power-up from a parallel EPC2 PROM.
Recommended
Low-Density DSP Pre-Processing
Low-density digital signal processing tasks such as FIR filtering, decimation, and sample-rate conversion are well within the 1,320 logic element budget of the EPF6016AQC208-3S when operated at audio bandwidths up to ~25 MHz. The 4-input LUT architecture supports efficient multiply-accumulate structures, while dedicated fast-carry chains in each LAB accelerate adder trees required for filter taps. The -3 speed grade sustains the timing closure needed for 16-bit filter implementations at audio rates. Engineers should note that for higher sample rates or wider datapaths, a dedicated DSP block in a Cyclone-series FPGA would be more area- and power-efficient than implementing DSP in general-purpose FLEX 6000 LUTs.
Recommended
Legacy System TTL Replacement
The EPF6016AQC208-3S is a textbook replacement for legacy designs built from dozens of 74LS, 74HC, and 74FTTL logic packages, condensing wide bus decoders, muxes, and counters into a single programmable device. With 132 LABs and 171 user I/O pins, the EPF6016AQC208-3S can absorb up to 200+ discrete gates worth of glue logic, drastically reducing PCB layer count and improving signal integrity by eliminating inter-IC trace stubs. The 208-PQFP package drops into existing through-hole-to-SMD adapter footprints, accelerating retrofits. Engineers performing TTL-to-FPGA migration should re-validate timing because the FLEX 6000 LUT delay (~3 ns at -3 speed grade) is faster than LS-TTL but slower than F-TTL at high fanout.
Recommended
Prototype and Evaluation Boards
The EPF6016AQC208-3S with 0.5 mm pitch 208-PQFP is convenient for prototype and university lab environments because the package is hand-solderable with proper tooling and easy to inspect under a microscope. Combined with Quartus II Web Edition (legacy free toolchain) and an EPC2 configuration PROM, students and engineers can implement complete 8-bit microcontrollers, state machines, and bus interfaces within a single lab session. The 171 user I/O pins expose plenty of breadboard-friendly test points through breakout boards. Note that Quartus II support for FLEX 6000 is in legacy mode and newer MAX II / Cyclone toolchains may not synthesize FLEX 6000 designs.
Recommended
Recommended Products Summary
Engineering reference data for EPF6016AQC208-3S — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF6016AQC208-3N | EPF6016AQC208-3 | EPF6016AQC208-2N | EPF6016AQC208-2 | EPF6016AQC208-1 |
|---|---|---|---|---|---|---|
| Package | 208-PQFP (28x28 mm, 0.5 mm pitch) | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Series | FLEX 6000 | FLEX 6000 - same | FLEX 6000 - same | FLEX 6000 - same | FLEX 6000 - same | FLEX 6000 - same |
| Speed Grade | -3 (fastest) | -3 (same) | -3 (same) | -2 (~15% slower) | -2 (~15% slower) | -1 (~30% slower) |
| Logic Elements | 1,320 | 1,320 | 1,320 | 1,320 | 1,320 | 1,320 |
| User I/O Pins | 171 | 171 | 171 | 171 | 171 | 171 |
| Typical Gates | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 |
| Operating Voltage | 3.0V to 3.6V (3.3V nominal) | 3.0V to 3.6V - same | 3.0V to 3.6V - same | 3.0V to 3.6V - same | 3.0V to 3.6V - same | 3.0V to 3.6V - same |
| Lifecycle Status | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL |
Key Differentiators
- Pin-compatible with all FLEX 6000 -3/-2/-1 speed-grade variants in 208-PQFP (vs EPF6016AQC208-1)
- Highest user I/O count for the FLEX 6000 16K-gate die (vs EPF6010ATC144-3 (144-pin TQFP))
- Compatible with Quartus II legacy toolchain for stable design re-synthesis (vs EPF10K30AQC208-3 (FLEX 10K family in same package))
Design Notes
The EPF6016AQC208-3S requires four separate power rails: VCC (3.3V core), VCCIO (3.3V I/O), VREF (if using GTL+ or SSTL I/O standards), and VPP (typically tied to VCC for FLEX 6000). Place 0.1 uF ceramic decoupling capacitors within 5 mm of every VCC/GND pin pair and bulk 10-100 uF tantalum or polymer capacitors on each rail near the device. Estimated: at 33 MHz toggle rate with 50% I/O utilization, the EPF6016AQC208-3S draws approximately 200-400 mA from VCC; use a regulator with at least 1 A headroom for inrush during configuration.
The 208-PQFP package has 0.5 mm pitch gull-wing leads; route escape using 0.15 mm (6 mil) traces with 0.2 mm spaces between leads. Use a 4-layer PCB with continuous ground plane on layer 2 directly under the PQFP to provide a low-impedance return path for high-speed signals. Estimated: with continuous ground plane, signal-integrity is acceptable up to ~100 MHz LVCMOS; above 100 MHz, consider an FBGA package variant for shorter lead inductance.
Do not power up the EPF6016AQC208-3S without a valid configuration bitstream on the configuration pins - the I/O pins default to tri-state but JTAG chain and global clock networks may be in undefined states. Always connect MSEL0/MSEL1 to the correct configuration mode (typically active serial with EPC2 for fastest boot). Configuration time for the EPF6016 is approximately 20-40 ms depending on the EPC2 clock; ensure your system reset controller holds downstream devices in reset for at least 100 ms after VCC stable.
Estimated: the EPF6016AQC208-3S in 208-PQFP has theta_JA of approximately 35-40 C/W (still-air, 2-layer PCB). At 0.5 W dissipation, junction temperature rises ~20C above ambient, well within the 85C TJ limit. Above 1 W dissipation, switch to a 4-layer PCB with ground plane and copper pour under the exposed pad region to reduce theta_JA to ~25 C/W.
Compliance Information
Compliance status not documented in verified web data. The -S suffix typically denotes standard (non-Pb-free) finish; the -N suffix (e.g. EPF6016AQC208-3N) denotes Pb-free matte-tin. Verify RoHS compliance with the distributor before placing orders into regulated markets.
