EPF6016ATC100-3 - 16K Gate FLEX 6000 FPGA 81 I/O 100-TQFP | Intel
MPN: EPF6016ATC100-3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.2 | $162.00 |
| 100 | $14.5 | $1,450.00 |
| 500 | $12.8 | $6,400.00 |
| 1,000 | $11.4 | $11,400.00 |
EPF6016ATC100-3 Overview
FLEX 6000 is the product family classification for a category of SRAM-based, low-density FPGAs manufactured by Altera (now part of Intel). In the broader programmable logic taxonomy, FLEX 6000 sits below FLEX 8000/10K and above Classic EPLDs; FPGAs themselves are a sub-category of programmable logic devices (PLDs), which are digital semiconductors that can be reconfigured after manufacture to implement arbitrary logic functions. FLEX 6000 devices target glue-logic, bus-interface, and state-machine applications where higher-density FPGAs would be over-specified.
Key specifications include 81 available user I/O pins, 1,320 logic cells (LEs), 16,000 typical gates, 4 embedded Logic Array Blocks (LABs) per row with FastTrack interconnect, and an internal operating frequency of 142.86 MHz with a -3 speed grade. The device operates from a 3.3V supply and supports in-system programmability via the IEEE 1149.1 JTAG interface and the Altera ByteBlaster or BitBlaster configuration paths.
The EPF6016ATC100-3 uses a SRAM-based configuration memory, which means the design must be reloaded from a serial PROM or microcontroller at every power-up. The 0.42 µm process and 100-TQFP plastic package give it an industrial operating temperature of 0°C to 85°C. The architecture exposes dedicated carry chains for fast adders, a global clear signal, and an optimized 4-input LUT structure per logic element, which differentiates it from the smaller EPF6010 family.
Typical applications include peripheral bus bridges, industrial control glue logic, prototype ASIC emulation, legacy PCI interface bridging, and low-density DSP state machines. The 100-TQFP footprint is well suited to through-hole-friendly rework on legacy PCBs, and the JTAG-based configuration path supports ISP (in-system programming) on manufacturing lines.
When designing with this part, ensure the configuration PROM or microcontroller is sized for the EPF6016's bitstream, account for the SRAM volatility (no retention without power), and respect the 3.3V I/O bank limits when mixing with 5V peripherals. Designers migrating from the EPF6010 family gain extra I/O and logic capacity without changing the Quartus pin assignment flow.
This page synthesizes distributor pricing, drop-in alternatives, and design notes that supplement the manufacturer datasheet and Quartus device handbook for the FLEX 6000 family.
Drop-in alternatives for EPF6016ATC100-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF6016ATC100-3 (same form factor and footprint) — differing in Operating Temperature, Package, Speed Grade, Logic Array Blocks (LABs), Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF6016ATC100-2
✅ Drop-In✓ In Stock
$22.49 / Unit
View Datasheet →EPF6016ATC100-1
✅ Drop-In✓ In Stock
$28.83 / Unit
View Datasheet →EPF6016ATC100-2N
✅ Drop-In✓ In Stock
$15.95 / Unit
View Datasheet →EPF6010ATC100-3
✅ Drop-In✓ In Stock
$18.9 / Unit
View Datasheet →EPF6010ATC100-3N
✅ Drop-In✓ In Stock
$9.95 / Unit
View Datasheet →EPF6010ATC100-2
✅ Drop-In✓ In Stock
$14.2 / Unit
View Datasheet →EPF6016ATC100-3 Maximum Ratings & Electrical Characteristics
| Family | FLEX 6000 |
| Device Type | FPGA (Field Programmable Gate Array) |
| Logic Elements (LEs) | 1320 |
| Typical Gates | 16000 |
| User I/Os | 81 |
| Internal Frequency | 142.86 MHz |
| Process Technology | 0.42 µm CMOS SRAM |
| Supply Voltage (Core) | 3.3 V |
| Speed Grade | -3 |
| Package | 100-pin TQFP |
| Pin Count | 100 |
| Operating Temperature | 0°C to 85°C |
| Configuration Method | SRAM, JTAG (IEEE 1149.1), ByteBlaster/BitBlaster |
| Mounting Type | Surface Mount |
EPF6016ATC100-3 100-pin tqfp Pin Configuration Guide
Pin configuration for EPF6016ATC100-3 (100-pin tqfp package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF6016ATC100-3.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF6016ATC100-3 is suitable for 6 applications: Legacy Peripheral Bus Bridge, Industrial Control Glue Logic, Prototype ASIC Emulation, PCI Interface Bridging, Low-Density DSP State Machines, Legacy Board Repair and Field Replacement.
Legacy Peripheral Bus Bridge
The EPF6016ATC100-3's 1,320 logic elements and 81 user I/Os make it well suited as a bus bridge between legacy peripherals (ISA, PCI, VME) and modern processors. Its 3.3V LVTTL I/O can directly interface with older 5V peripherals through external resistive dividers, while the 142 MHz internal frequency supports bus arbitration at full speed. Place the FPGA between the host CPU and the legacy bus with the configuration bitstream stored in a serial EPC2 PROM. Compared to discrete glue-logic, the FLEX 6000 device reduces board area and accelerates design iteration via Quartus HDL flow.
Recommended
Industrial Control Glue Logic
Industrial controllers often need flexible state machines, encoder interfaces, and timing generators that off-the-shelf CPLDs cannot easily handle. The EPF6016ATC100-3's 16K gate capacity and 4-input LUTs provide enough headroom for multi-axis motion-control state machines, while its 0°C to 85°C industrial temperature range tolerates factory-floor environments. The 100-TQFP package supports through-hole-friendly rework on legacy PLC boards. Designers can prototype with MAX+PLUS II or Quartus II Web Edition and migrate to MAX II for production cost reduction.
Recommended
Prototype ASIC Emulation
The EPF6016ATC100-3 serves as a low-cost ASIC emulator for pre-silicon validation of small to medium ASIC designs. With 1,320 logic elements and predictable FastTrack routing delays, engineers can map RTL into the FPGA and iterate on functionality before committing to mask tooling. The JTAG configuration interface supports rapid bitstream reload during verification, and the 100-TQFP package allows manual socket-based testing on bench fixtures. For designs that exceed the EPF6016 capacity, the EPF10K series in the same Altera tool flow provides migration paths.
Recommended
PCI Interface Bridging
The 81 user I/Os of the EPF6016ATC100-3 cover the full 32-bit PCI bus plus control signals, enabling legacy bridge implementations between PCI and local buses. The 3.3V LVTTL I/O standard and the 142 MHz internal frequency meet PCI 33 MHz timing requirements with margin. Place the FPGA as a transparent or non-transparent bridge with the configuration bitstream in an EPC2 serial PROM. The 100-TQFP package fits on standard PCI add-in card form factors.
Recommended
Low-Density DSP State Machines
DSP control logic such as filter sequencers, sample-rate converters, and audio codec interfaces fits comfortably within the EPF6016ATC100-3's 16K gate budget. The dedicated carry chains in each logic element enable fast adders and accumulators that handle fixed-point arithmetic in audio sample pipelines. With 81 I/Os, the FPGA can connect to multiple parallel ADC/DAC channels. The 0.42 µm CMOS process and 3.3V supply give it low static power consumption suitable for always-on consumer audio equipment.
Recommended
Legacy Board Repair and Field Replacement
Many industrial and military systems designed in the late 1990s and early 2000s used FLEX 6000 FPGAs as their main logic element. The EPF6016ATC100-3 in 100-TQFP remains the authentic replacement for these legacy designs, ensuring pin-for-pin compatibility with original layouts. The NRND status still allows distributor inventory to support field service, and the JTAG configuration interface allows in-system bitstream updates without desoldering. For new designs, engineers should migrate to MAX V or Cyclone families.
Recommended
Recommended Products Summary
Engineering reference data for EPF6016ATC100-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF6016ATC100-2 | EPF6016ATC100-1 | EPF6016ATC100-2N | EPF6010ATC100-3 | EPF6010ATC100-3N | EPF6010ATC100-2 |
|---|---|---|---|---|---|---|---|
| Package | 100-TQFP | 100-TQFP - same | 100-TQFP - same | 100-TQFP - same | 100-TQFP - same | 100-TQFP - same | 100-TQFP - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 1320 | 1320 | 1320 | 1320 | 880 | 880 | 880 |
| Typical Gates | 16000 | 16000 | 16000 | 16000 | 10000 | 10000 | 10000 |
| User I/Os | 81 | 81 | 81 | 81 | 71 | 71 | 71 |
| Speed Grade | -3 | -2 (faster) | -1 (slowest) | -2 (faster) | -3 | -3 | -2 |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Configuration Memory | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) |
Key Differentiators
- Highest-density 100-TQFP member of the FLEX 6000 family (vs EPF6010ATC100-3)
- Identical pinout to faster speed grade for second sourcing (vs EPF6016ATC100-2)
- SRAM-based in-system programmability via JTAG (vs EPC2 configuration PROM)
Design Notes
The EPF6016ATC100-3 requires a stable 3.3V core supply with a 100 mV tolerance. Place 10 µF tantalum and 0.1 µF ceramic decoupling capacitors near each VCC pin pair. The device draws higher inrush current during configuration; a soft-start circuit on the 3.3V regulator prevents supply sag. Estimate: at 100% toggle rate with 81 I/Os switching, dynamic current may reach 200-300 mA above quiescent.
Route all JTAG signals (TCK, TMS, TDI, TDO, nCONFIG, nSTATUS, CONF_DONE) as short traces with 4.7 kΩ pull-up resistors on nCONFIG and nSTATUS per Altera application note AN-83. The 100-TQFP package has a 0.5 mm pitch; use 4-mil traces and 4-mil spaces with microvia-in-pad if BGA breakouts are required elsewhere on the same board. Reserve a 1 mm clearance under the TQFP body for the exposed die paddle.
Do not assume the EPF6016ATC100-3 retains its configuration through power cycles - the SRAM is volatile and the bitstream must be reloaded from a configuration PROM (EPC1, EPC2) or microcontroller. Mixing 3.3V and 5V signals requires a level shifter or series resistor because the I/O banks are 5V-tolerant only when VCCIO = 3.3V. Exceeding 100 MHz on global clock networks without adequate ground shielding introduces jitter.
Compliance Information
RoHS/lead-free status for FLEX 6000 family varies by date code and suffix. The N-suffix variants (e.g., EPF6016ATC100-2N) are explicitly lead-free per Altera ordering information. Original EPF6016ATC100-3 parts may have non-RoHS date codes - verify with distributor before Pb-free reflow assembly. AEC-Q100 not applicable for this commercial-grade FPGA.
