EPF6016TC144-3U - FLEX 6000 FPGA 16K Gates 1320 Cells TQFP-144 | Altera
MPN: EPF6016TC144-3U ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.9 | $2,890.00 |
| 500 | $23.4 | $11,700.00 |
| 1,000 | $19.8 | $19,800.00 |
EPF6016TC144-3U Overview
An FPGA (Field Programmable Gate Array) is a programmable logic device that allows designers to implement custom digital logic circuits after manufacturing. The FLEX 6000 architecture belongs to the broader taxonomy of programmable logic devices (PLDs), which also includes CPLDs (Complex Programmable Logic Devices) and SPLDs (Simple Programmable Logic Devices). FPGAs are distinguished from CPLDs by their SRAM-based configuration memory, finer-grained logic elements, and higher gate count, making them suitable for glue logic, bus interfacing, and moderate-complexity state machines.
The device contains 1,320 Logic Elements (LEs) organized into Logic Array Blocks (LABs), 16 embedded Logic Array Blocks, and embedded memory structures that enable efficient implementation of FIFOs, shift registers, and small state machines. Configuration is loaded from an industry-standard EPC1/EPC2 configuration PROM or via JTAG (IEEE 1149.1 Boundary-Scan). Each I/O pin supports 3.3 V LVTTL and 5.0 V PCI interfaces, with slew-rate control and tri-state buffering.
Typical applications include glue logic replacement, bus interfacing (PCI, ISA), DSP co-processing front-ends, industrial control logic, and telecommunications line cards. The 117 available I/Os make it suitable for parallel bus bridges, memory controllers, and legacy peripheral aggregation in embedded systems. The TQFP-144 package is a fine-pitch surface-mount format (0.5 mm pitch) that supports prototype and small-to-medium volume production.
When designing with this part, observe the I/O bank supply voltage constraints (VCCIO must match driven logic levels), and verify JTAG chain configuration before relying on boundary-scan testing. Configuration data is volatile: the device must be re-configured at every power-up. Use the Altera MAX+PLUS II or Quartus design tools with FLEX 6000 device support to generate programming files. The 'U' suffix indicates an industrial temperature grade and tray packaging.
Drop-in alternatives for EPF6016TC144-3U — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF6016TC144-3U (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Configuration Method, Internal Frequency.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF6016TC144-3N
✅ Drop-In✓ In Stock
$10.5 / Unit
View Datasheet →EPF6016TC144-3
✅ Drop-In✓ In Stock
$9.85 / Unit
View Datasheet →EPF6016ATC144-3
✅ Drop-In✓ In Stock
$9.85 / Unit
View Datasheet →EPF6016ATC144-3N
✅ Drop-In✓ In Stock
$12.4 / Unit
View Datasheet →EPF6016ATC144-3S
✅ Drop-In✓ In Stock
$18.1 / Unit
View Datasheet →EPF6016ATI144-3N
✅ Drop-In✓ In Stock
$22.1 / Unit
View Datasheet →EPF6016TC144-3U Maximum Ratings & Electrical Characteristics
| Family | FLEX 6000 |
| Series | EPF6016 |
| Device Type | FPGA - Field Programmable Gate Array |
| Logic Elements (LEs) | 1320 |
| Total Logic Cells | 1320 |
| Typical Gates | 16000 |
| Maximum Gates | 24000 |
| User I/Os | 117 |
| Package | TQFP-144 (TC144), 0.5 mm pitch |
| Pin Count | 144 |
| Speed Grade | -3 |
| Pin-to-Pin Logic Delay | 4 ns (speed grade -3) |
| Internal Frequency | 172 MHz (max) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant (verified by 'U' suffix marking convention) |
| Configuration Method | SRAM-based, EPC1/EPC2 PROM or JTAG (IEEE 1149.1) |
EPF6016TC144-3U tqfp-144 (tc144), 0.5 mm pitch Pin Configuration Guide
Pin configuration for EPF6016TC144-3U (tqfp-144 (tc144), 0.5 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF6016TC144-3U.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF6016TC144-3U is suitable for 6 applications: PCI Bus Bridge and Interface Logic, Industrial Control and Glue Logic Replacement, Telecommunications Line Card Logic, DSP Co-Processor Front-End Logic, Legacy Peripheral Aggregation and Memory Controllers, Prototype and Educational FPGA Development Platform.
PCI Bus Bridge and Interface Logic
The EPF6016TC144-3U fits PCI bus bridge designs because it integrates 1,320 logic elements and supports 117 user I/Os across four I/O banks, with VCCIO configurable to 5.0 V for PCI signaling compliance. The 4 ns pin-to-pin logic delay in speed grade -3 meets PCI 33 MHz timing budgets with comfortable margin. Used in legacy motherboards, add-in cards, and industrial backplanes, the device replaces multiple discrete 74-series logic packages with a single programmable chip. Compared to a discrete glue-logic implementation, the FPGA reduces board area by 60-70% and enables late-stage logic changes without PCB rework. The TQFP-144 0.5 mm pitch package is suitable for both prototype and low-volume production.
Recommended
Industrial Control and Glue Logic Replacement
The EPF6016TC144-3U is well suited for industrial control logic replacement, where its 1,320 logic elements and SRAM-based reconfigurability allow designers to consolidate 5-15 discrete TTL/CMOS packages into a single FPGA. Industrial temperature grade ('U' suffix) supports factory-floor environments. The 117 user I/Os accommodate sensor multiplexing, actuator control, and communication interfaces. SRAM-based configuration enables field firmware updates via JTAG, simplifying maintenance. The TQFP-144 package (22 mm × 22 mm) fits standard 4-layer industrial control PCBs. With 4 ns logic delay, the part comfortably handles 50 MHz control loop rates in motor drives and process controllers.
Recommended
Telecommunications Line Card Logic
The EPF6016TC144-3U serves telecommunications line card logic applications where 117 I/Os support T1/E1 framer interfacing, HDLC controllers, and time-slot interchangers. The 1,320 logic elements implement protocol state machines, scrambling/descrambling, and error correction logic. SRAM-based configuration allows protocol upgrades without hardware changes. Operating from 3.3 V core with 3.3 V/5.0 V I/O, the device interfaces with legacy 5 V telecom ASICs and modern 3.3 V processors. Speed grade -3 timing (4 ns logic delay) supports DS1/E1 line rates up to 2.048 MHz with substantial timing margin. The TQFP-144 industrial-grade variant meets telecom equipment temperature and reliability requirements.
Recommended
DSP Co-Processor Front-End Logic
The EPF6016TC144-3U works as a DSP co-processor front-end, pre-processing data streams before they reach a host DSP. Its 1,320 logic elements implement FFT bit-reversal, data alignment, DMA address generation, and dual-port memory arbitration. With 117 I/Os the FPGA can fan out to multiple parallel ADC/DAC channels. Speed grade -3 timing handles data rates up to 172 MHz internally. SRAM configuration enables algorithm parameter updates in the field. Compared to a discrete FIFO/address-generator solution, the FPGA reduces component count from 8-12 chips to a single device. The TQFP-144 industrial-grade package handles temperature swings in defense and aerospace embedded systems.
Recommended
Legacy Peripheral Aggregation and Memory Controllers
The EPF6016TC144-3U aggregates legacy peripherals and implements small memory controllers in embedded motherboards and industrial PCs. The 1,320 logic elements support ISA-to-PCI bridges, IDE disk controllers, and parallel-port emulation. With 117 user I/Os across four I/O banks, the FPGA can interface with multiple buses operating at different voltages. SRAM configuration allows firmware updates without EPROM swaps. Speed grade -3 timing supports ISA bus cycles at 8 MHz and PCI at 33 MHz with margin. The TQFP-144 surface-mount package fits standard 4-layer motherboard designs. This application is increasingly rare as modern systems integrate these functions into single-chip SoCs.
Recommended
Prototype and Educational FPGA Development Platform
The EPF6016TC144-3U functions as a low-cost entry point in FPGA education and prototype development. Its 1,320 logic elements teach students Verilog/VHDL synthesis, finite state machine design, and timing closure without overwhelming complexity. The TQFP-144 0.5 mm package is hand-solderable with care, supporting university lab courses. Quartus II Web Edition (free, legacy) supports FLEX 6000 device compilation. Speed grade -3 timing is fast enough for educational examples including UART controllers, VGA signal generation, and simple CPU cores. The industrial temperature grade and SRAM configuration let students experiment freely without chip replacement. For modern curricula, instructors often pair this part with newer Cyclone devices for comparison.
Recommended
Recommended Products Summary
Engineering reference data for EPF6016TC144-3U — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF6016TC144-3N | EPF6016TC144-3 | EPF6016ATC144-3 | EPF6016ATC144-3N | EPF6016ATC144-3S | EPF6016ATI144-3N |
|---|---|---|---|---|---|---|---|
| Package | TQFP-144 (TC144) | TQFP-144 (TC144) | TQFP-144 (TC144) | TQFP-144 (TC144) | TQFP-144 (TC144) | TQFP-144 (TC144) | TQFP-144 (TI144) |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Speed Grade | -3 (4 ns logic delay) | -3 | -3 | -3 | -3 | -3 | -3 |
| Logic Elements | 1320 | 1320 | 1320 | 1320 | 1320 | 1320 | 1320 |
| User I/Os | 117 | 117 | 117 | 117 | 117 | 117 | 117 |
| Die Revision | Original FLEX 6000 die | Original FLEX 6000 die | Original FLEX 6000 die | FLEX 6000A revised die | FLEX 6000A revised die | FLEX 6000A revised die | Industrial grade variant |
| Lead-Free / RoHS | Marking per 'U' suffix convention | Yes (N suffix = lead-free RoHS5/6) | Standard | Standard | Yes (N suffix = lead-free) | S suffix variant | Yes (N suffix = lead-free) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Industrial temperature grade with tray packaging ('U' suffix) (vs EPF6016TC144-3N)
- Revised die revision (FLEX 6000A) with same TQFP-144 package (vs EPF6016ATC144-3)
- 117 user I/Os across four I/O banks (vs EPF6010ATC144-3)
Design Notes
The EPF6016TC144-3U requires separate VCCINT (3.3 V core) and VCCIO (3.3 V or 5.0 V I/O bank) supplies, plus a VREF pin if using differential I/O standards. Decoupling requires at minimum one 0.1 µF ceramic capacitor per VCC pin and bulk 33 µF tantalum on each supply rail. Power-on reset is automatic but nCONFIG must be held high after VCC stabilizes for proper configuration. Use a low-impedance ground plane with the TQFP-144 thermal pad connection to improve power dissipation and reduce ground bounce.
TQFP-144 package has 0.5 mm lead pitch, requiring surface-mount assembly with solder paste stencil and reflow. Hand-soldering is feasible with care, hot air, and fine-point iron. Route all 117 user I/Os on inner signal layers with controlled impedance (50 Ω single-ended typical). Keep JTAG signals (TDI, TDO, TMS, TCK) short and away from switching signals to avoid programming errors. Provide test points for nCONFIG, nSTATUS, and CONF_DONE to aid configuration debugging.
SRAM-based configuration is volatile - the device must be reconfigured at every power-up using an external EPC1/EPC2/EPC4/EPC8/EPC16 PROM or via JTAG. Failing to connect configuration PROMs correctly is the most common design error. The -3 speed grade timing is the fastest available; substituting -2 or -1 grades requires timing re-verification. The TQFP-144 footprint is NOT pin-compatible with the TQFP-100 (TC100) or BGA packages in the same family. For new designs, consider the Cyclone series as a modern alternative.
Compliance Information
RoHS compliance inferred from 'U' suffix per Altera marking convention; REACH and conflict mineral status not verified in available data sources.
